WO2008120587A1 - コンタクタ、プローブカード及びコンタクタの製造方法 - Google Patents

コンタクタ、プローブカード及びコンタクタの製造方法 Download PDF

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Publication number
WO2008120587A1
WO2008120587A1 PCT/JP2008/055252 JP2008055252W WO2008120587A1 WO 2008120587 A1 WO2008120587 A1 WO 2008120587A1 JP 2008055252 W JP2008055252 W JP 2008055252W WO 2008120587 A1 WO2008120587 A1 WO 2008120587A1
Authority
WO
WIPO (PCT)
Prior art keywords
contactor
manufacturing
probe card
base part
conductive layer
Prior art date
Application number
PCT/JP2008/055252
Other languages
English (en)
French (fr)
Inventor
Masanori Nakamura
Hidenori Kitazume
Shigeru Matsumura
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Publication of WO2008120587A1 publication Critical patent/WO2008120587A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

コンタクタ５０は、プローブ基板に固定されるベース部５１と、後端側がベース部５１に設けられ、先端側がベース部５１から突出している梁部５３と、梁部５３の表面に形成され、ＩＣデバイスの入出力端子２１０に電気的に接触する導電層５４と、を備えており、導電層５４の先端部分５５Ａは曲面状に形成されている。
PCT/JP2008/055252 2007-04-03 2008-03-21 コンタクタ、プローブカード及びコンタクタの製造方法 WO2008120587A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-097405 2007-04-03
JP2007097405 2007-04-03

Publications (1)

Publication Number Publication Date
WO2008120587A1 true WO2008120587A1 (ja) 2008-10-09

Family

ID=39808169

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055252 WO2008120587A1 (ja) 2007-04-03 2008-03-21 コンタクタ、プローブカード及びコンタクタの製造方法

Country Status (2)

Country Link
TW (1) TW200842370A (ja)
WO (1) WO2008120587A1 (ja)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727789A (ja) * 1993-07-09 1995-01-31 Nitto Denko Corp 回路配線板およびその製造方法
JPH09297154A (ja) * 1996-05-07 1997-11-18 Matsushita Electric Ind Co Ltd 半導体ウエハの検査方法
JPH09318663A (ja) * 1996-05-31 1997-12-12 Soushiyou Tec:Kk プローブユニット
JP2000155132A (ja) * 1998-09-14 2000-06-06 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2000180473A (ja) * 1998-12-16 2000-06-30 Soushiyou Tec:Kk プローブユニット
JP2001091539A (ja) * 1999-08-03 2001-04-06 Advantest Corp マイクロファブリケーションで形成するコンタクトストラクチャ
JP2001249144A (ja) * 1999-12-28 2001-09-14 Mitsubishi Materials Corp コンタクトプローブ、プローブ装置及びコンタクトプローブ製造方法
JP2003222638A (ja) * 2002-01-30 2003-08-08 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JP2004205511A (ja) * 2002-12-20 2004-07-22 Rosemount Aerospace Inc プローブフィンガ構造体及びその製造方法
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置
JP2007183250A (ja) * 2005-12-06 2007-07-19 Enplas Corp プローブチップ及びプローブカード

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727789A (ja) * 1993-07-09 1995-01-31 Nitto Denko Corp 回路配線板およびその製造方法
JPH09297154A (ja) * 1996-05-07 1997-11-18 Matsushita Electric Ind Co Ltd 半導体ウエハの検査方法
JPH09318663A (ja) * 1996-05-31 1997-12-12 Soushiyou Tec:Kk プローブユニット
JP2000155132A (ja) * 1998-09-14 2000-06-06 Toppan Printing Co Ltd 検査治具及びその製造方法
JP2000180473A (ja) * 1998-12-16 2000-06-30 Soushiyou Tec:Kk プローブユニット
JP2001091539A (ja) * 1999-08-03 2001-04-06 Advantest Corp マイクロファブリケーションで形成するコンタクトストラクチャ
JP2001249144A (ja) * 1999-12-28 2001-09-14 Mitsubishi Materials Corp コンタクトプローブ、プローブ装置及びコンタクトプローブ製造方法
JP2003222638A (ja) * 2002-01-30 2003-08-08 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JP2004205511A (ja) * 2002-12-20 2004-07-22 Rosemount Aerospace Inc プローブフィンガ構造体及びその製造方法
WO2007000799A1 (ja) * 2005-06-27 2007-01-04 Advantest Corporation コンタクタ、該コンタクタを備えたコンタクトストラクチャ、プローブカード、試験装置、コンタクトストラクチャ製造方法、及び、コンタクトストラクチャ製造装置
JP2007183250A (ja) * 2005-12-06 2007-07-19 Enplas Corp プローブチップ及びプローブカード

Also Published As

Publication number Publication date
TW200842370A (en) 2008-11-01

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