TW200837509A - Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate - Google Patents

Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate Download PDF

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Publication number
TW200837509A
TW200837509A TW97104229A TW97104229A TW200837509A TW 200837509 A TW200837509 A TW 200837509A TW 97104229 A TW97104229 A TW 97104229A TW 97104229 A TW97104229 A TW 97104229A TW 200837509 A TW200837509 A TW 200837509A
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TW
Taiwan
Prior art keywords
substrate
temperature
support plate
wafer
measured
Prior art date
Application number
TW97104229A
Other languages
English (en)
Chinese (zh)
Inventor
Nak-Beom Sung
Original Assignee
Psk Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psk Inc filed Critical Psk Inc
Publication of TW200837509A publication Critical patent/TW200837509A/zh

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW97104229A 2007-02-12 2008-02-04 Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate TW200837509A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20070014263 2007-02-12

Publications (1)

Publication Number Publication Date
TW200837509A true TW200837509A (en) 2008-09-16

Family

ID=39757636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97104229A TW200837509A (en) 2007-02-12 2008-02-04 Detecting method of position of substrate, treating method of substrate and treating apparatus of substrate

Country Status (3)

Country Link
JP (1) JP2008199023A (ja)
CN (1) CN101246833A (ja)
TW (1) TW200837509A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474430B (zh) * 2011-07-29 2015-02-21 Semes Co Ltd 用以處理基板之裝置、系統及方法
US8974601B2 (en) 2011-07-29 2015-03-10 Semes Co., Ltd. Apparatuses, systems and methods for treating substrate

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101182502B1 (ko) * 2008-09-30 2012-09-12 도쿄엘렉트론가부시키가이샤 기판의 이상 배치 상태의 검지 방법, 기판 처리 방법, 컴퓨터 판독 가능한 기억 매체 및 기판 처리 장치
KR101042535B1 (ko) 2008-11-28 2011-06-17 세메스 주식회사 웨이퍼 감지 방법
US9887104B2 (en) * 2014-07-03 2018-02-06 Intel Corporation Electronic package and method of connecting a first die to a second die to form an electronic package
JP6823709B2 (ja) * 2017-03-28 2021-02-03 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
CN110850690B (zh) * 2019-11-19 2023-05-23 上海华力微电子有限公司 去胶设备、顶针监控方法和去胶工艺
CN114520172A (zh) * 2022-02-16 2022-05-20 北京北方华创微电子装备有限公司 晶圆放置状态检测方法、半导体工艺腔室和设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3577436B2 (ja) * 1999-02-16 2004-10-13 東京エレクトロン株式会社 処理装置、処理システム、判別方法及び検出方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI474430B (zh) * 2011-07-29 2015-02-21 Semes Co Ltd 用以處理基板之裝置、系統及方法
US8974601B2 (en) 2011-07-29 2015-03-10 Semes Co., Ltd. Apparatuses, systems and methods for treating substrate

Also Published As

Publication number Publication date
JP2008199023A (ja) 2008-08-28
CN101246833A (zh) 2008-08-20

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