200835418 九、發明說明： 【發明所屬之技術領域】 本發明涉及印刷電路板的導通孔孔壁、焊接位 ^ 冤路板局部線路加 厚錢層或鐘不同金屬層相關工藝。 【先前技術】 現印刷電路板導通孔金屬化及電路圖型成型工藏 ☆ 又面多層及軟性電 路板的工藝爲：覆鋼錢料—鑽孔—表面磨板（表面鋼料⑹一200835418 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a via hole wall of a printed circuit board, a soldering location, a local circuit of a circuit board, and a thick metal layer or a different metal layer. [Prior Art] Current printed circuit board via hole metallization and circuit pattern forming work ☆ The process of multilayer multi-layer and flexible circuit board is: steel-coated money-drilling-surface grinding plate (surface steel material (6) one
路板化學鍍孔金屬化—電路板面電鑛絲面電料鋼—表面磨板—Z 刷感光油墨或貼感光膜―電路圖型雜曝光— 口心縯衫〜板面除油— 圖形電_—圖形電賴—電路圖型去膜—電路板齡卜電路板板 面與孔内賴或退去板祕路與孔_保_光幹^雜清^入印刷 阻烊油墨。 ^ 現電路板生產工藝技術所存在的缺點： •⑴、現電路板生產工序中：爲了導通孔内的鋼加厚，在經過化學沈銅的 電路板上爲了使電路板上的導通孔的孔内的銅金屬鑛層達到4厚度· m〜25卵鋼厚’ _覆銅板工作塊或電路板關表面的原摘12136 鋒銅厚銅_鑛時和導通孔同時一起再電鑛孔銅的部分和超出孔銅的 部分的鋼層，電路板導通孔的表面積約是電路板表面積的議—2〇%，因現 工藝中無法解決只電鍍導通孔而不電鑛電路板面的技術難題，所以使孔銅 達到一定的孔鋼厚度而對覆銅板銅箱上再次鐘銅，造成電路板在電路圖形 敍刻時_、侧不淨、導通孔孔鋼触斷 '孔細制題，影響電路板 5 200835418 的品質，造成銅資源的浪費。 、 生產工藝中’在製作精密細線路時，爲了導通孔的孔銅厚 度達到一定的銅厚，要 k過減蝕線，先將覆鋼板表面的銅箔減蝕薄，減蝕 後電路減達到_的財厚度，經化學沈崎的導通孔與電路板表面— 起電鑛’再將雜過的轉電路板上再電鍍一層銅。 所以銅貢源浪費較高，制 + 、门1作精欲細線路時難度高，工序繁瑣。 (3) 生産％即多。在用感光線路油制電路圖形時還需加鍍純錫保護 層而在餘刻出私路圖形後還要將電鍍的純錫保護層用確酸型退錫液將錫 層ϋ掉即浪費了貝重金屬又因使用強紐確酸型退錫液，增加了廢水排 放置，及造成了環境污染。 ⑷、特別是在對電路板上需要鍍金、錄、錫等貴金屬層時，現工藝是全 电路板電賴型及導軌表面讀貴金屬層，制是賴保護雜刻後還 要再腐轉或是電路板電路關表面及導祕表聽金、絲健刻保護 層，造成貴金屬及化學藥品的極大浪費，污染環境。 【發明内容】 本發明的目的在於，針對現有電路板製造中，因對導通孔的孔内鋼層 加厚，而産生的銅資源的浪費和貴金屬等不必要浪費，能耗高、工序複雜、 環境污染、製造精密線路板報廢率高等的不足；設計一種工藝簡單，可極 大的節約銅錫等金屬材料，減少貴金屬的消耗、減少使用化學藥品，污染 少’製作精密線路板成品率高的印刷電路板掩膜露孔電鍍成型工藝。 本發明的目的可以通過以下技術方案實現：印刷電路板掩膜露孔電鍍 6 200835418 成型工藝包括以下步驟： ⑴、選料職诚焊触城線路部份局部要加厚的，已按電路要求 鑽好導通孔，並該導通孔已金屬化的覆銅板塊，或導通孔已金屬化並已設 有導電電路圖形的電路板； (2)、對導通孔已金屬化並使導通孔内金屬層與覆銅板塊的覆銅面或與電 •路板驗崎路已導通_峨«電域印佩光油藏職光幹膜， 並使感光油墨乾燥； 鲁⑶、用已光緣好的導通孔孔位或焊接位元或線路部份局部要加厚的菲 林，與印刷有感光油墨或貼感光幹膜的覆銅板塊或電路板對位曝光； ⑷、對曝光後的_板塊或電路板進行顯影，顯影露出轉光光固後的 導通孔孔位或焊接位元或線路雜局部要加厚崎f的纽或焊接位； (5) 、進行掩麟孔，即在經顯露出的覆峨塊或電路板的空位或谭 接位元上電鍍金屬，至所需的厚度； (6) 、經掩酸孔的覆鋼板塊或電路板去除表面掩蓋的油錢感光幹膜， _ 得騎減減焊触元或翁部份局部要加厚的_板塊或電路板。 所述的印刷電路板掩膜露孔電鍍成型工藝中，經掩膜鍍孔的電路板去 除表面掩蓋的油墨或感光幹職’對電路板進行舰，除去電路板表面除 加厚部位在導通孔金屬化過程中由於化學沈銅卫藝所殘留在表面線路間隙 的化學鍍銅層，還原出電路板的電路圖型。 所述的印刷電路板掩膜露孔電鍍成型工藝中，對電路板進行微蝕，微蝕 劑分爲酸性微蝕劑和鹼性微蝕劑，酸性微蝕適用於導通孔或焊接位元或線 7 200835418 路部份局部已加厚的電路板的局部鍍鎳、金、銀的金屬層。酸性微钱劑爲 硫酸加過硫_，«度爲95_酸稀釋至濃度爲2_8%，在每_ 升稀釋至濃度爲2-8%的硫酸稀釋液中加過硫酸納3卜6()克，室溫，時間 40-60秒。祕觀適麟導軌鱗接位域線路雜局部已加厚的電 路板的局部麟的金麟，微_由氨水溶液加氯化錄，㈣度娜― 3⑽氨水調製體積溶液PH值8—9，銅離子含量爲每㈣—25克氯離子含 ϊ母升150-175克，溫度45-50度，微姓時間3〇_5〇秒，即可。 所述的印刷電路板掩膜露孔電鍍成.藝中，在用已光繚好的導通孔 孔位菲林，對位曝光顯影露出導通孔孔位所需的空位的工藝中；其導通孔 孔位菲林"孔徑躲或大於在_板塊或電路板上依據電路板的設計要 求開出的導通孔孔徑。 所述的印刷電路板掩膜露孔電鍍成虹#中，對覆銅板塊或電路板電 子元件焊接位元或插接位元等局部鑛金'銀、鎳、錫等金屬層時，可 通過以下步驟實現： (1) 、f先對已去除表面掩蓋的油墨或感光幹膜的覆鋼板塊或電路板印刷 感光油墨或貼感光幹膜，並使感光油墨乾燥； (2) 、用已光繪好的覆鋼板塊或電路板局部需電錢金、銀、錄、錫等金屬 層的菲林，與覆鋼板塊或電路板對位曝光； (3) '對曝光後的覆鋼板塊或電路板進行顯影，顯影露出經曝光光固後的 需電鍍金、銀、鎳、鱗金屬層的電子元件焊接位元或插接位空位； (4) 進行掩膜鍍工位，即在經顯影顯露出的覆銅板塊或電路板的空位電 8 200835418 锻金、銀、鎳、錫等金屬層，至所需的厚度； (5)、經掩膜鍍空位的覆鋼 ^ ^ 兒路板去除表面掩篕的油墨或感先幹 膜，付空位额有所需金屬層的覆鋼_或電路板。 所賴_魏板掩_闕喊心藝巾，在麵影顯露出的 電路板的空位或焊接位元上雷供兩 、又斤而金屬至所需的厚度，在經顯影顯露出 的電路板的錄電链金 '銀、鋅 阻焊油墨 /、踢4金屬層至所需厚度的電路板，印刷 本馳無有技術她’在現魏板生紅藝流財，爲了使導通孔 的孔銅导度達到需糊準孔_厚爲18卵—心巾，在電鍵導通孔 的孔銅¥也將㈣覆峨的卫作__上或電路_銅面上再電鑛盘孔 銅相等或比孔銅厚的銅層，現在電路板設計佈線密集度較高，電路板導通 4 U u lmm—〇· 6晒’現電路板電鍵工藝電鍍時電流密度分佈不 均、電鑛銅溶液電鑛時均鑛能力與深鍍能力分佈不均等因素造成導通孔的 孔銅厚度及电路板表面電錢銅層厚度不均，使導通孔電鑛的孔銅厚度低於 覆銅板工作塊表面電鑛鋼層厚度與電路板電路圖型表面的電鑛鋼層厚度， 現工藝電路板電鱗鋼麵關型電賴只是聽導軌關電鑛加厚而 又在鋼紅電鍍—層比孔銅厚的電鍍鋪，由於電路板表面電鑛層的厚度 不均勻’在製作電關型線料紐纖或因關過度等因素造成的精密 細線路的包路板生絲造難度大，良品率低，成本高，而原覆鋼板的銅箱 厚度比較-致’ 製作電路顏，現王難造流財餘證導通孔的孔 銅厚度又在原銅落上加厚錢銅在钱刻製作電路圖型問題較多。所以原覆鋼 200835418 板上厚度較—致_f|在現工藝㈣路_制粒藝中無法被充分利用， 現電路板圖型及導通孔孔銅電鍍時因麵錫及錄、金等保護層的品質問題 或因感光幹_孔的品制祕料油解觀_層被侧掉，而造 成電路板無咖咖。㈣购刪_撕嶋電路板線 路圖形_面和導通録面電或加_鲜貴金屬層作_刻伴罐 層’而_出電關型後又將賴層經強腐_俩性退錫液中退洗掉， 造成大量錫等不可再生資源的浪f和貴金屬的消耗，成品電路板電子元件 焊接位元麵再歸熱平賴和化學_、轉賴 '化學沈銀、化 學沈鎳、金的卫藝處理，卫序繁多，過多的使用化工原料，造成環境污染。 而本發明解決了以上的不足。 【實施方式】 具體實施例 ， 實例1 : • 狀印刷電路板的生産工藝，接合本發明的技術，其整套工藝技術可 包括以下步驟： ⑴覆銅板開料，開出所需尺寸的覆銅板塊，在開出的覆銅板塊上據電路 板的設計要求用CNC (數控鑽機）鑽出導通孔。 (2) 表面磨刷，去除表面鑽孔時導通孔邊的毛刺。 (3) 在鑽孔後的覆鋼板塊雙面印刷感光油墨或貼感光膜或印刷電路圖 形，並使感光油墨或印刷的電路圖型油墨乾燥。 ⑷按電路圖形的設計原理，配製作好的光繪電路圖型菲林，對覆銅板 200835418 塊電路圖型曝光。 (5) 對曝光後的覆鋼板塊進行顯影，顯影經曝光光固後的電路圖型的咸光 油墨圖型或感光幹膜圖型。 (6) 經餘刻出以曝光光固後覆銅板塊面感光油墨或感光幹膜掩附的電路 圖型，並除去表面覆銅板塊電路圖型鋼箔表面掩附的感光油墨或感光幹膜 ， 或印刷的電路圖型油墨。 ‘ (7)對已有電路圖型的電路板導通孔除膠渣、化學沈鋼使導通孔内與板面 馨沈錢很薄一層鋼金屬層，化學鑛銅層的銅層厚度約〇· 3-〇· 5 _ ;化學賴 層在本工蟄中對蝕刻後的電路板的線路之間不導通的線路與導通孔連通， 在電錢導通孔時起到導電連接作用。 (8)對化學_後的桃板及着洗烘紐印猶光油墨或感光幹膜，並 使感光油墨⑽’用已光繪好的導通孔孔位雜，對位曝光顯影露出導通 孔孔位或所需的焊接位或焊接位或插接位。 4 鲁⑼在經顯影顯露出的電路板導通孔孔位及所需的焊接位上電錢鋼至所 而的導通孔孔鋼厚度，此時電路板的表面_一9〇%表面已被掩蓋感光油墨 或感光幹臈，只有約而—15%導通孔及焊接位需電鍍銅，或對所需電鑛其 他金屬的焊接位元電鍍需要的金屬層。 (1〇)經掩膜電鑛導通孔或電鍍其他金屬位元的電路板去除表面掩蓋的 油墨或感光幹臈。 (^)所趣掩難孔㈣路板去除表面掩蓋的油墨錢光幹膜後，由於 在導通孔金屬化過程中電路板表面線路間隙間與導通孔連通的化學沈銅金 11 200835418 屬層使不導通的線路與導通孔連通導電，便於掩麟孔電錢時電路板導 包，或對電子元件焊接位元或插接位元需電鍍其他金屬鍍層時的導電作 用’由於化學沈鋼層的鋼層極薄〇· 3—〇.5//m，易被微飿掉，在完成掩膜露 孔工蟄後對電路板進行難，以微絲去導通孔金屬化過財由於化學沈 鋼工_殘留在表面線路_:和導通孔與線路_間中的化雜銅層，還 原出掩難孔導通孔f鍍導_f路關電路板，或在電子元件焊接位元 或接插位元已鍍其他金屬鍍層的電路板。 (12)研磨電路板，在導通孔掩膜露孔電鑛孔時，導通孔的孔邊高於電路 板的線路_，_補難微研鮮輒邊凸㈣—部分後鱗加錢其 他焊接金屬層位元的電路板顧化學清洗後轉人現工藝印雛焊油墨等其 他工序。 ^ (13)經研磨或清洗後的電路板，轉入現工藝印刷阻悍油墨。 (!4)成型後成品檢測，成品出貨。 實例2 : 對導通孔已金屬化並已設有導電電路圖形的電路板，其對電路板空位或 知接位70或線路局部上電鍍金屬，至所需的厚度的工藝技術可包括以下= 驟： ⑴、對已有電路圖型的電路板導通孔除膠邊、化學沈鋼使導通孔内與板 面沈鍍很薄-層銅金屬層，化學_層_層厚度約Q. 3—q. ;化學贫 銅層在本工藝帽侧後的電路板的線路之間不導通的線路與導通= 通，在電鍍導通孔時起到導電連接作用。 12 200835418 ()、對化予軸後的電路板及時清洗烘乾後印概光油墨域光幹膜， 亚使感光，用已光繪好的導通減位絲，對⑽絲影露出導 通孔孔位或所需的焊接位或焊齡或插接位。 (3)、在經顯影顯露出的電路板導通孔孔位及所需的焊接位上電錢鋼至所 、孔孔鋼厚度’此日守電路板的表面80%-90%表面已被掩蓋感光油墨 或感光幹膜’"、有約1G%—15%導通孔及焊接位需電賴，或對所需電鑛其 • 他金屬的焊接位元電鍍需要的金屬層。 • (4)、經掩臈電鍍導通孔或電鑛其他金屬位元的電路板去除表面掩蓋的油 墨或感光幹膜。 (5)、所物賊鍍孔的電路板去除表面掩蓋的油墨或感光幹膜後，以微 敍方法除去導通孔金屬化過程巾由於化學沈鋼玉藝所殘留在表面線路間隙 和導通孔與線路間關中的化學鍍鋼層，還原出掩膜露孔導通孔電錢導通 •的電路_電路板，或在電子元件焊接位元或接插位元已料他金屬鍍層 • 的電路板。 3 ⑻、研磨板，在導通孔掩麟孔電鍍孔時，導通孔的孔邊高於電路 板的線路鋼面，經用研磨機輕微研磨導通孔邊凸出的一部分後或對加鍍其 他焊接金屬層位元的電路板_化學清洗後轉人現工藝印·焊油墨等其 他工序。 (7) 、經研磨清洗後的電路板，轉入現工藝印刷阻焊油墨。 (8) 、成型後成品檢測，成品出貨。 實例3 : 13 200835418 對已按電路要求鑽好導通孔，並該導通孔已金屬化的覆銅板塊上電鍵金 屬至所品的厚度的工藝技術可包括以下步驟： (1)、對覆鋼板塊上的導通孔除膠渣； 寸覆鋼板塊清洗烘乾後印刷感光油墨或感光幹膜，並使感光油墨乾 &用已光料料通孔孔位菲林，對㈣光顯影露出導通孔孔位或所需 的焊接位或焊接位或插接位。 (3)在經頒影顯露出的電路板導通孔孔位及所需的焊接位上電鍍銅至所 而的通孔孔銅厚度’或對所需電鍍其他金屬的焊接位元電鍍需要的金屬 層。 ⑷Ί掩膜麵導通孔或電鍍其他金屬位元的細板塊，去除表面掩蓋 的油墨或感光幹膜。 (5) 、在經掩膜電鍍導通孔或電鍍其他金屬，去除表面掩蓋的油墨或感光 幹膜的覆鋼板塊，雙面印概光油墨或貼感細或印刷電路圖形，並使感 光油墨或印刷的電路圖型油墨乾燥。 (6) 、按電路圖形的設計原理，用已製作好的光繪電路圖型菲林，對覆銅 板塊進行電路圖型曝光。 (7) 、對曝光後的覆鋼板塊進行顯影，顯影經曝光光固後的電路圖型的感 光油墨圖型或感光幹膜圖型。 (8) 、蝕刻出以曝光光固後覆銅板塊面感光油墨或感光幹膜掩附的電路圖 i並除去表面覆銅板塊電路圖型銅箔表面掩附的感光油墨或感光幹膜或 印刷的電路圖型油墨。 14 200835418 (9) 、印刷阻焊油墨。 (10) 成型後成品檢測，成品出貨。 本工㈣印刷電路板導通孔金屬化掩麟孔紐·卫藝，是在已鑽 導通孔的覆鋼板工作塊上先通職刻，製作出電路板電路圖形，或對已鑽 孔後有電路圖形的電路板的表面和導通孔化學沈銅金屬化，對導通孔直接 私鑛銅&已电鑛銅金屬化的導通孔不再經過敍刻電路圖型工藝，不存在 籲導通孔無銅、不導通的現象啦藝在對導通孔孔_㈣，因對電 路板上的原銅财再電鍍銅’對需要4鋼厚的電路圖型或局部需要達到 一定銅厚的電路圖型魏導通孔時㈣實現，拉藝有較大的製作靈活 性，本工藝保持了原銅fl的鋼厚均勻性，製作精密細線路電路板時不受電 鍍銅層厚薄不均的因素影響，充分糊原覆鋼板上厚度較_致的銅箱，製 作精在細線路更;^，並具有顯著的效果，線路精准度高，製作電路圖形 時受影響因素小，減小了因_因素造成的報廢，降低成本、節約原 材料。 1 拉藝在對電路板導通孔直接電㈣，魏板導通孔的總表面積要小 於電路板總表面積，導通孔的孔表面積約是電路板表面積的灌—咖，更 易使導通孔電鑛時的孔銅厚度達到需要的孔鋼厚度，而且導通孔的孔邊電 鍍後略大於導通孔的孔徑，並略高於電路板的鋼面，使導通孔的連通性能 更加可靠，滿足達到電路板線路設計要求。 本工藝在解舰脑魏時，H機—概右的導通孔孔面積 電鑛銅，消耗的電能是現工藝電路板電錄鋼時的電能消耗的僅—20%左 15 200835418 右’本工蟄v通孔孔銅電錢時游耗的鱗銅也只有現工藝電路板板面或電錢 電路圖型和導通孔時的雇_2⑽，使用本玉藝可節省大量的電能，可節约 近80%左右的電链用碟鋼，本工藝在製作電路圖型與導通孔孔銅電鍍時，不 需對電路®形解通孔加賴_、金#金屬層作爲侧時料通孔和電 路圖型保護層’不使用強顧型退錫液節約㈣源減少貴金屬的消耗，節Road plate chemical plating hole metallization - circuit board surface electric wire surface electric steel - surface grinding plate - Z brush photosensitive ink or paste photosensitive film - circuit pattern type miscellaneous exposure - mouth show shirt ~ board degreasing - graphic electricity _ -Graphic electric ray - circuit type film removal - circuit board age board circuit board surface and hole in the hole or retreat board secret road and hole _ Bao _ light dry ^ miscellaneous ^ into the printing resistance ink. ^ The shortcomings of the current circuit board production process technology: • (1), the current circuit board production process: in order to thicken the steel in the via hole, in the hole on the electroless copper plate to make the via hole on the circuit board The inner copper metal ore layer reaches 4 thickness · m~25 egg steel thick ' _ copper clad plate work block or circuit board off the surface of the original pick 12136 front copper thick copper _ mine and the through hole at the same time re-electrical hole copper part And the steel layer of the portion beyond the copper of the hole, the surface area of the via hole of the circuit board is about 2% of the surface area of the circuit board, because the technical problem of only plating the via hole and not the surface of the electric circuit board cannot be solved in the current process, Make the hole copper reach a certain thickness of the hole steel and the copper on the copper clad copper box again, causing the circuit board to be etched in the circuit pattern _, the side is not clean, the through hole hole steel is broken, the hole is fine, and the circuit board is affected. 5 The quality of 200835418 caused a waste of copper resources. In the production process, when making precision fine lines, in order to achieve a certain thickness of copper in the via hole, it is necessary to k reduce the corrosion line, first reduce the copper foil on the surface of the coated steel sheet, and reduce the circuit after the reduction. _ The thickness of the _, through the chemical sinking hole and the surface of the board - from the mine - and then the plating board is re-plated with a layer of copper. Therefore, the source of copper tribute is high, and the system + and the door 1 are difficult to make fine lines, and the process is cumbersome. (3) More than % production. In the circuit pattern of the photosensitive line oil, it is necessary to add a pure tin protective layer. After the private circuit pattern is left, the plated pure tin protective layer is also wasted by removing the tin layer by the acid-type tin-removing liquid. The heavy metal of the shellfish has also increased the drainage of the waste water and caused environmental pollution due to the use of the strong acid-type tin-removing liquid. (4) Especially when it is necessary to plate gold, recording, tin and other precious metal layers on the circuit board, the current process is to read the precious metal layer on the whole circuit board and the surface of the guide rail, and the system is to be rotted after the protection The circuit board circuit closes the surface and the guide table to listen to the gold and silk care layer, which causes great waste of precious metals and chemicals and pollutes the environment. SUMMARY OF THE INVENTION An object of the present invention is to reduce the waste of copper resources and unnecessary waste of precious metals caused by thickening a steel layer in a hole of a via hole in the manufacture of a conventional circuit board, and has high energy consumption and complicated processes. Environmental pollution, high defect rate of manufacturing precision circuit boards; design a simple process, can greatly save metal materials such as copper and tin, reduce the consumption of precious metals, reduce the use of chemicals, less pollution, and produce high precision printing of precision circuit boards. Circuit board mask open hole plating process. The object of the present invention can be achieved by the following technical solutions: Printed circuit board mask open-hole plating 6 200835418 The molding process includes the following steps: (1) Partially thickened part of the selected material contact line, which has been drilled according to circuit requirements a conductive via, a metallized copper clad block having the via hole, or a circuit board having a via hole and having a conductive circuit pattern; (2) the via hole has been metallized and the metal layer in the via hole With the copper-clad surface of the copper-clad plate or the electric circuit board, the Qisaki Road has been turned on _峨«Electric-area 印 peguang reservoir light dry film, and the photosensitive ink is dried; Lu (3), with good light edge conduction A hole in the hole or a soldering part or a part of the line to be thickened, and a copper plate or a printed circuit board printed with a photosensitive ink or a photosensitive dry film; (4), the exposed plate or circuit board Performing development, developing the exposed via hole position after the light-transfer curing or the solder bit or the wiring part to be thickened, or the soldering position; (5), performing the masking hole, that is, the exposed layer Electroplating gold on the vacancy or tandem of the block or board Dependent, to the required thickness; (6), the oil-coated plate or circuit board through the acid-masking hole to remove the surface of the oil-coated photosensitive film, _ riding the reduction welding contact or the part of the Weng part to be thickened _ plate or board. In the printed circuit board mask exposed hole plating process, the mask plated hole is removed from the surface of the printed circuit board to remove the ink or the photosensitive dry work' on the circuit board, and the surface of the circuit board is removed except for the thickened portion in the through hole During the metallization process, the electroless copper plating layer remaining in the surface line gap due to the chemical copper sinking technology restores the circuit pattern of the circuit board. In the printed circuit board mask exposed hole plating process, the circuit board is micro-etched, the micro-etching agent is divided into an acid micro-etching agent and an alkaline micro-etching agent, and the acid micro-etching is suitable for the via hole or the solder bit or Line 7 200835418 Partially thickened circuit board partially nickel, gold, silver metal layer. Acidic micro-money agent is sulfuric acid plus sulfur _, «degree is 95_ acid diluted to a concentration of 2 8%, in each liter of diluted to a concentration of 2-8% sulfuric acid dilution solution added sodium sulfate 3 3 () Gram, room temperature, time 40-60 seconds. The secret view of the lining guide rail scale connection field line miscellaneous partially thickened circuit board of the local Lin Jinlin, micro_ by ammonia solution plus chloride record, (four) degree Na - 3 (10) ammonia water volume solution pH value of 8-9, The copper ion content is 150-175 grams per 1/4 gram of chloride ion containing strontium, the temperature is 45-50 degrees, and the micro-time is 3 〇 5 seconds. The printed circuit board mask is exposed to the hole in the process, in the process of using the well-formed via hole film, the alignment exposure develops the vacancy required to expose the via hole; the via hole The position of the film is larger than the aperture of the via hole that is opened on the board or circuit board according to the design requirements of the board. The printed circuit board mask is exposed to the hole in the rainbow#, and the copper layer or the electronic component of the circuit board is soldered or the metal layer such as silver, nickel, tin, etc. The following steps are achieved: (1), f first printing the photosensitive ink or the photosensitive dry film on the coated steel plate or circuit board of the ink or the photosensitive dry film which has been removed from the surface, and drying the photosensitive ink; (2) The painted steel plate or circuit board requires a film of metal such as gold, silver, magnet, tin, etc., and the exposed steel plate or circuit board is exposed; (3) 'The exposed steel plate or circuit after exposure The plate is developed and developed to expose the electronic component soldering bit or the vacancy bit of the electronic component to be plated with gold, silver, nickel or scale metal after exposure to light; (4) performing a mask plating station, that is, revealing in development The vacancy of the copper-clad plate or circuit board 8 200835418 Forging gold, silver, nickel, tin and other metal layers to the required thickness; (5) Covering the vacant plate by masking the surface of the plate Masking the ink or feeling the dry film, the vacant position has the required metal layer of the steel _ or the circuit . The _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Recording electric chain gold 'silver, zinc solder resist ink /, kick 4 metal layer to the required thickness of the circuit board, printing Benchi no technology she's in the current Wei board red art flow, in order to make the hole of the hole copper guide Degree to reach the need to paste the hole _ thickness of 18 eggs - heart towel, in the hole of the key hole of the hole copper ¥ will also (four) cover the 卫 _ _ or circuit _ copper surface and then the electric ore hole copper equal or specific hole Copper thick copper layer, the circuit board design wiring density is now higher, the circuit board is turned on 4 U u lmm - 〇 · 6 drying 'current circuit board electric key process plating uneven current density distribution, electric ore copper solution electric mine The uneven distribution of mineral capacity and deep plating ability causes the copper thickness of the via hole and the thickness of the copper layer on the surface of the circuit board to be uneven, so that the copper thickness of the via hole is lower than that of the surface of the copper clad work block. The thickness of the electric ore steel layer on the surface of the circuit diagram of the circuit board, the current circuit board electric scale steel surface type Lai only listened to the rails off the mine and thickened and in the steel red plating - the layer is thicker than the hole copper plating, due to the uneven thickness of the electro-mineral layer on the surface of the circuit board - in the production of electric-off type wire material or excessive The fine-grained board of the precision fine line is difficult to produce raw silk, the yield is low, and the cost is high, and the thickness of the copper box of the original coated steel plate is relatively - resulting in the production of the circuit, and it is difficult for the king to make the flow of the certificate. The thickness of the copper in the hole is thickened on the original copper. Therefore, the thickness of the original coated steel 200835418 board is less than that of the _f| in the current process (four) road _ granulation art, the current circuit board pattern and through hole copper plating due to surface tin and recording, gold and other protection The quality problem of the layer or the solution of the photosensitive material due to the photosensitive _ hole is _ layer is side off, resulting in no circuit board. (4) purchase and delete _ tearing circuit board circuit graphics _ surface and conduction recording surface electric or add _ fresh metal layer for _ engraved with the tank layer 'and _ power-off type and then the Lai layer through strong rot _ two sex retreat The washback is removed, causing a large amount of non-renewable resources such as tin and the consumption of precious metals. The soldering of the electronic components of the finished circuit board is returned to the heat and chemical _, and the chemical slab silver, chemical nickel, gold Weiyi treatment, a large number of orders, excessive use of chemical raw materials, causing environmental pollution. The present invention solves the above deficiencies. [Embodiment] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Example 1: The production process of a printed circuit board, which incorporates the technology of the present invention, may include the following steps: (1) CCL boarding, opening a copper clad block of a desired size On the copper clad plate that is opened, the through hole is drilled by CNC (CNC drilling rig) according to the design requirements of the circuit board. (2) Surface rubbing to remove burrs on the side of the through hole when drilling the surface. (3) Printing the photosensitive ink or the photosensitive film or printed circuit pattern on both sides of the coated steel sheet after drilling, and drying the photosensitive ink or the printed circuit pattern ink. (4) According to the design principle of the circuit pattern, with the well-made photo-electric circuit diagram type film, the copper-clad board 200835418 block circuit pattern exposure. (5) Developing the exposed steel clad block to develop a salty ink pattern or a photosensitive dry film pattern of the circuit pattern after exposure to light. (6) Exceeding the circuit pattern of the photosensitive ink or the photosensitive dry film covered by the copper-clad surface after exposure to light, and removing the photosensitive ink or photosensitive dry film adhered on the surface of the copper-clad plate circuit pattern steel foil, or printing Circuit pattern ink. ' (7) For the circuit board type of the existing circuit pattern, except for the slag and the chemically sinking steel, the inside of the through hole and the surface of the board are thin and thin, and the thickness of the copper layer of the chemical ore layer is about 〇·3. - 〇 · 5 _ ; The chemical lysate layer communicates with the via hole in the process of the non-conducting line between the etched circuit board lines, and plays an electrically conductive connection when the electric money conducts the through hole. (8) For the chemical _ after the peach plate and the washing and baking, the opaque ink or the photosensitive dry film is printed, and the photosensitive ink (10)' is used with the light-drawn via holes, and the alignment exposure is exposed to expose the via holes. Bit or required weld or weld or plug. 4 Lu (9) on the board through hole position and the required soldering position revealed by the development of the wire to the thickness of the through hole hole steel, at this time the surface of the board _ -9% of the surface has been covered Photosensitive ink or sensitized dry enamel, only about 15% of the vias and soldering sites need to be plated with copper, or the metal layer needed for the soldering of the other metal of the required ore. (1) The surface masked ink or sensitized dry enamel is removed through a masked electric ore via or a board plated with other metal lands. (^) The masking hole (4) After removing the surface of the ink film by the surface film, the chemical copper-plated gold is connected to the via hole between the line gaps on the surface of the via hole during the metallization process of the via hole. The non-conducting line is electrically connected to the via hole, which is convenient for the circuit board guide package when the money is sealed, or the conductive effect when the electronic component soldering bit or the plug bit needs to be plated with other metal plating 'because of the chemical steel layer The steel layer is extremely thin 〇·3—〇.5//m, which is easy to be smashed off. It is difficult to make the circuit board after the completion of the mask venting process, and the microwire is used to guide the through-hole metallization. Surface line _: and the copper layer in the via hole and the line _, the reduction of the hole hole through hole f plating _f way off the circuit board, or in the electronic component soldering bit or the plug bit has been plated other Metal coated circuit board. (12) Grinding the circuit board, when the via hole mask is exposed to the electric ore hole, the hole side of the through hole is higher than the circuit board _, _ 补 补 micro 辄 辄 ( ( 四 四 四 四 四 四 四 四 四 四The circuit board of the metal layer bit is processed by the chemical cleaning and then transferred to other processes such as printing ink and ink. ^ (13) The polished or cleaned circuit board is transferred to the current process printing resist ink. (!4) Finished product inspection after molding, finished product shipment. Example 2: A circuit board in which a via hole has been metallized and has a conductive circuit pattern, and a process technique for plating a metal to a board vacancy or a known junction 70 or a line to a desired thickness may include the following = (1), for the existing circuit pattern of the board through-hole removal of the edge, the chemical sinking steel makes the via hole and the plate surface is very thin - layer of copper metal layer, chemical _ layer _ layer thickness about Q. 3 - q. The line of non-conducting between the lines of the circuit board of the chemical copper-depleted layer on the side of the circuit board of the process is electrically connected to the conductive via. 12 200835418 (), after the board is turned on and off, the board is cleaned and dried in time, and the ink is dried in the ink field. The sub-sensing is light-sensitive, and the light-drawn conductive lead-reducing wire is used to expose the through hole of the (10) wire shadow. Bit or required weld position or weld age or plug position. (3) 80%-90% of the surface of the circuit board is covered by the surface of the board through the hole and the required soldering position. Photosensitive ink or photosensitive dry film '", having about 1G%-15% vias and soldering pads, or a metal layer required for electroplating of the desired metal ore. • (4) Remove the surface-covered ink or photo-drying film by masking the plated vias or other metal-level circuit boards. (5) After removing the ink or photosensitive dry film covered by the surface of the thief plated hole, the metallization process towel of the via hole is removed by micro-synthesis method. The surface line gap and the via hole and the line remain in the surface of the chemical sinking steel jade art. The chemically plated steel layer in the gap is restored to the mask of the open-hole via hole. The circuit board, or the board in which the electronic component is soldered or the patch is already coated with metal plating. 3 (8), the grinding plate, in the hole of the through hole hole plating hole, the hole side of the through hole is higher than the line steel surface of the circuit board, after grinding a part of the protruding side of the through hole with a grinder or other welding The circuit board of the metal layer bit _ chemical cleaning and transfer to the existing process printing, welding ink and other processes. (7) After the grinding and cleaning of the circuit board, transfer to the current process printing solder resist ink. (8), finished product inspection after molding, finished product shipment. Example 3: 13 200835418 The process technology for drilling the via hole and the thickness of the metal on the copper clad plate which has been metallized according to the circuit requirement to the thickness of the product may include the following steps: (1) The upper via hole is removed from the slag; the inch-coated steel sheet is washed and dried to print the photosensitive ink or the photosensitive dry film, and the photosensitive ink is dried & the light-filled material is used to pass through the hole, and the (four) light development is exposed to the through hole. Bit or required weld or weld or plug. (3) Electroplating of copper to the desired via hole in the via hole of the board and the required soldering position, or the metal required for plating the soldering of other metals required for electroplating. Floor. (4) Ί Mask surface vias or plated fine plates of other metal bits to remove the surface masked ink or photosensitive dry film. (5), in the plating through hole or plating other metal, remove the surface of the covered ink or the coating of the dry film, double-sided printing ink or paste fine or printed circuit graphics, and make the photosensitive ink or The printed circuit pattern ink is dried. (6) According to the design principle of the circuit pattern, the circuit pattern exposure of the copper clad plate is performed by using the already-made photo-electric circuit diagram type film. (7) Developing the exposed steel plate after exposure, and developing a photosensitive ink pattern or a photosensitive dry film pattern of the circuit pattern after exposure to light. (8) etching the circuit diagram i exposed by the exposure light-solidified copper-clad panel surface photosensitive ink or photosensitive dry film i and removing the photosensitive ink or photosensitive dry film or printed circuit diagram of the surface copper-clad plate circuit pattern copper foil surface Type ink. 14 200835418 (9), printing solder mask ink. (10) Finished product inspection after molding, finished product shipment. The workmanship (4) printed circuit board through-hole metallization 麟 孔 孔 · 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫 卫The surface of the printed circuit board and the via hole are chemically copper-plated and metallized, and the via hole of the copper or the metallized copper metallization of the via hole is no longer subjected to the etched circuit pattern process, and there is no copper hole for the through hole. The phenomenon of non-conduction is in the case of the via hole _ (four), because the original copper on the circuit board is re-plated copper 'to the need for 4 steel thick circuit pattern or partial need to reach a certain copper thick circuit pattern type Wei through hole (4) Realization, pull art has greater flexibility in production. This process maintains the uniformity of steel thickness of the original copper fl. When manufacturing precision fine circuit boards, it is not affected by the uneven thickness of the electroplated copper layer. The thickness of the copper box is better than that of the thin copper wire. It has a remarkable effect, and the circuit has high precision. The factors affecting the circuit pattern are small, which reduces the scrap caused by the _ factor and reduces the cost. Save raw materials. 1 Layi is directly connected to the through hole of the circuit board. (4) The total surface area of the via hole of the Wei board is smaller than the total surface area of the board. The surface area of the hole of the via hole is about the surface area of the board, which is easier to make the via hole. The thickness of the hole copper reaches the required thickness of the hole steel, and the hole edge of the through hole is slightly larger than the hole diameter of the through hole, and is slightly higher than the steel surface of the circuit board, so that the connection performance of the through hole is more reliable, and meets the circuit board design requirements. . When the process is unwrapped, the H-machine-to-right conduction hole area is electric ore copper, and the electric energy consumed is only 20% of the electric energy consumption of the current circuit board electro-recording steel. Left 15 200835418 Right 'Work蛰v through hole hole copper electricity money when the consumption of scale copper is only the current process board board surface or electric money circuit diagram and through hole when the employment _2 (10), the use of this jade can save a lot of power, can save near 80% of the electric chain is made of disc steel. This process does not need to solve the through hole _, gold # metal layer as the side material through hole and circuit pattern when making the circuit pattern and the via hole copper plating. The protective layer 'does not use the strong type of anti-tin liquid to save (four) source to reduce the consumption of precious metals, section
約化工原料，在生産製造_上節_㈣、減少污染源，本工藝在對電 路板導通孔錢電㈣可«職上所_烊接位直接麵所需的金电 銀、鎳，焊接電子元件所f料金顧，在权針直接完成，或不使 用現工_的熱平_卫#及化學沈銀 '化學 電子元件焊触絲减理工“ 〃對私路板 環境m * ’本工*節約能耗、降低生產成本、利於 兄保4付合迴圈經濟生産特徵。 16 200835418 【圖式簡單說明】 無 【主要元件符號說明】 無About chemical raw materials, in the production and manufacturing _ the last section _ (four), reduce pollution sources, the process in the circuit board through hole hole money (four) can be used in the position of the _ 烊 烊 directly to the required gold, silver, nickel, welding electronic components The material of the material, the direct completion of the right needle, or the use of the current work _ the heat _ _ # and the chemical Shen Yin 'chemical electronic components welding wire reduction technology 〃 〃 私 私 私 私 私 私 私 私 私 私 私 私Energy consumption, lower production cost, and favorable economic production characteristics of the brother-in-law 4 pay-in loop. 16 200835418 [Simple diagram description] No [Main component symbol description] None