TW200832605A - Substrate fixing device and substrate fixing method - Google Patents

Abstract

To provide a substrate fixing device which can prevent occurrence of positional shift even when the moving acceleration of an XY table is high without contaminating a glass mask. The substrate fixing device comprises an XY stage, a support pin for supporting the periphery on the backside of a substrate, a fixing pin for pressing the first side face of the substrate, a push pin for pressing the second side face opposing the first side face, and a means for moving the push pin in the direction perpendicular to the side face and fixing the substrate in place. The support pin may include first and second support pins for supporting the both ends of one side of the periphery on the backside of the substrate, and a third support pin for supporting the center of the periphery on the backside opposing the one side of the periphery on the backside. The fixing means has a drive means for moving the push pin and a pin drive control means for controlling the drive means, and the pin drive control means may control the drive means to stop movement of the push pin when it is judged that a pressure for pressing the substrate has reached a predetermined level.

Description

[Technical Field] The present invention relates to a substrate fixing device 5 and a substrate fixing method in a pattern measuring device, and particularly relates to a substrate which can stably mount a substrate without contaminating the substrate. Substrate fixing device and substrate fixing method. Background Art In the manufacture of a semiconductor device, a glass light cover having various shapes is used, and the line width of the pattern is observed or measured using a pattern measuring device using an electron microscope. When the measurement is performed by the pattern measuring device, the glass substrate is placed on the XY table so as to be movable in the horizontal direction, and the measurement point is moved in the field of view of the pattern measuring device. Fig. 1 shows a conventional method of holding a glass mask 1 on an XY table. The glass reticle 1 is placed on three pins 2a, 2b, 2c disposed on the XY table, and the three pins 2a, 2b, 2c are located at the peripheral portion of the glass reticle, two of which are located in the glass reticle 1 At both ends of one of the sides, the other side is located at the center of the peripheral portion of the side with respect to the one side. The glass mask 1 is placed on the three pins 2a, 2b, 2c, and is fixed by the friction between the glass cover 1 and the pin, 2b, 2c. Various techniques for fixing a substrate to a χγ table as described above have been made. The techniques related to these studies are the sample platforms disclosed in Patent Document and Patent Document 2, in which the sample platform can be used to fix a substrate having a different thickness or size to a platform without using a cassette. Further, Patent Document 3 discloses a device for holding a glass substrate by a load method using a spring and a lever or a bellows member. As described above, when measuring the pattern size formed on the glass mask ,, the XY table is moved, and the measurement point is set in the field of view of the pattern measuring device. 5 When moving the XY table, the movement acceleration on the XY table is small, and it can be fixed by the friction between the three pins 2a, 2b, 2c and the glass mask 1. However, in the case of rapidly moving the measuring point and increasing the moving acceleration, the glass mask 丨 may slide in the horizontal direction and have a positional shift. Since the position of the glass mask is shifted, the alignment of the measurement points is performed one more time, which causes a problem of lowering the processing speed of the measurement processing. In order to prevent the sample from shifting when the moving acceleration of the χγ table is large, it is considered to use vacuum suction or electrostatic chuck. However, since the inside of the pattern measuring device is in a vacuum state, the use of vacuum adsorption does not produce an effect. In addition, when using an electrostatic chuck, it is necessary to make the electrode contact the wide range under the sample. 'When the electrode is in contact with the wafer, the wafer will not have a problem, but in the case where the glass mask or the like must not touch the sample. , you cannot use the electrostatic chuck. Further, in the sample fixing method disclosed in Patent Documents 1 and 2, the peripheral portion of the sample is sandwiched and fixed by the upper and lower sides, and at this time, the upper portion of the pattern may be contaminated. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei 9-205131 (Patent Document No. Hei. No. Hei. No. Hei. No. Hei. The object of the present invention is to provide a substrate-based device that does not contain glass, and prevents the position of the glass mask from shifting even when the moving acceleration of the χγ table is large. By.

10 15

The above problem can be solved by a substrate fixing device comprising: a ΧΥ table for mounting a substrate; a support pin for supporting the peripheral portion of the substrate; a fixing pin, And a pressing pin for pressing the second side surface of the first side surface and the fixing mechanism, wherein the pressing pin is movable in a direction perpendicular to the side surface to fix the foregoing Substrate. In the substrate-fixed nest of the above-described type, the support pin may include: first and second support pins for supporting both ends of the inner peripheral edge portion of the substrate; and a third support pin The fixing mechanism may include: a driving mechanism for moving the pinch pin; and a pin driving control mechanism for controlling the driving mechanism of the month side with respect to the center of the inner peripheral edge portion of the side of the peripheral portion of the eccentric surface The front camouflage drive control mechanism may stop the drive mechanism from moving the press pin when it is determined that the pressure of pressing the reference substrate has reached a predetermined pressure. In the present invention, the substrate is supported at three points of the inner peripheral portion, and the opposite side of the substrate is pressed. The base plate is fixed by press-fitting at the opposite ends (four) at the opposite ends (four). The pin is moved by a pin drive mechanism in the vertical direction on the side of the substrate by 7200832605, and the substrate is fixed by applying a load according to the moving acceleration of the χγ table. Thereby, it is possible to prevent the substrate from being displaced in the horizontal direction by the movement of the χγ table, and the amount of processing of the measurement process can be increased. Further, the position at which the pressing force is applied to the substrate is the side surface of the substrate, and the peripheral portion of the inside of the substrate is supported in the vertical direction. In this way, the member for fixing the substrate does not contact the surface of the substrate, so that the base can be suppressed as much as possible.

The board produces pollution. Further, the above problem can be solved by a substrate fixing method in which a substrate fixing device is used, and the substrate fixing device includes: a mounting table for mounting a substrate; and a support pin; The fixing pin is for pressing the first side surface of the substrate; the pressing pin is for pressing the second side surface of the first side surface; and the driving mechanism The method of fixing the press pin, and the method of fixing the substrate includes the following steps: the front side of the substrate on which the front pin is placed on the support pin; and the pressure on the side of the substrate is determined When the pressure is predetermined, the aforementioned drive mechanism is stopped to drive the press pin. In the method of fixing the substrate according to the above (4), the support pin may include the two ends of the inner peripheral edge portion of the substrate and the third support pin 'and the third support (4). The fixing pin may have a first and a third pin that presses both ends of the magic side surface, and the pressing pin may press the center of the second side surface. In the substrate fixing method of the present invention, after the substrate is placed on the support pin 8 200832605, the fixing pin and the press pin press the opposite side surfaces of the substrate to be fixed. When the substrate is placed on the support pin, since the accuracy is low, it is not necessarily placed at the correct position. At this time, the substrate can be moved in the horizontal direction by the pin to be placed at the correct position. Further, by applying a predetermined pressing force to the substrate, the substrate can be prevented from shifting in the horizontal direction.

Further, the position at which the pressing force is applied to the substrate is the side surface of the substrate, and the peripheral portion of the inside of the substrate is supported in the vertical direction. In this way, the member for fixing the substrate does not come into contact with the surface of the substrate, so that the substrate can be contaminated as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(4) and the structure of the substrate held by the caps

Fig. 2 is a view showing the constitution of the substrate to which the present invention is applied. Fig. 3(b) Fig. 3(a) is a cross-sectional view of the substrate of the present invention, which is shown in Fig. 3(a). Fig. 4 is a block diagram of a substrate fixing device of the present invention. Fig. 5 is a view showing the configuration of a specific example of the substrate fixing device of the present invention. Figures 6(a) to (d) are diagrams illustrating the substrate fixing process. Fig. 7 is a flow chart showing an example of substrate fixing processing. Fig. 8 is a view showing a configuration of a specific example of a substrate fixing device according to a modification. C. Embodiment BEST MODE FOR CARRYING OUT THE INVENTION 9 200832605 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the pattern measuring device using the substrate fixing device of the present invention will be described. Next, the structure and operation of the substrate fixing device will be described. Next, a method of fixing the substrate by the substrate fixing device will be described. (Structure of pattern measuring device) Fig. 2 is a view showing the configuration of a pattern measuring device using the substrate fixing device of the present embodiment. The pattern measuring device 1 is roughly divided into an electronic scanning unit 110, a signal processing unit 130, an image display unit 140, a memory unit 150, and a controllable electronic scanning unit 10, a signal processing unit 130, an image display unit 14, and a memory unit. The control unit 120 of each part of 150. The electronic scanning unit 11 is composed of an electron tube tube portion 15 and a sample chamber 16. The electron tube barrel portion 15 has an electron grab 11, a condensing lens 12, a deflection coil 13 and a counter lens 14, and the sample chamber 16 has a χγ table 2A and a sample support portion (support pin) 21 composed of an insulator 15. . The sample chamber 16 is connected to a motor (not shown) for moving the crucible table 20, and a vacuum exhausting fruit (not shown) for holding a predetermined decompressed atmosphere in the sample chamber 16. The electron beam 19 irradiated by the electron beam 11 passes through the collecting lens 12, the deflection 20 coil 13, and the objective lens 14, and is irradiated onto the sample 17 on the crucible table 20. The amount of secondary electrons or reflected electrons emitted from the sample 17 by the electron detector 18 composed of a scintillator or the like is detected by the electron detector 18, and the signal is converted by the AD converter. The digits are stored in the memory unit 15() as image poor materials. The image data is converted into brightness information 200832605 and displayed on the image display unit 140. Further, the image data also includes information such as the range of the acquired image or the magnification of the pattern measuring device. - The control unit 120 controls the electronic offset vector of the deflection coil 13 and the image scanning amount of the display unit 140. 5 The control unit 120 is composed of a microcomputer and stores programs for performing measurement lengths such as pattern lines. Further, the control unit 12 can determine the acceleration private voltage of the electron beam 19 to apply an acceleration voltage to the electronically connected electronic components. (Structure and Operation of Substrate Fixing Device) Next, the structure and operation of the substrate fixing device 30 will be described. 1(a) is a plan view showing the substrate fixing device 3A in a state in which the substrate is fixed, and Fig. 3(b) is a cross-sectional view taken along line 3 (a) of Fig. 3(a). Further, in the present embodiment, a rectangular glass reticle having a side length of 152 [mm] and a thickness of 6 35 [mm] will be described as an example of a substrate. The substrate fixing device 30 is composed of a stage 31, support pins (32a, 32b, 320, 15 fixing pins (33a, 33b), a pressing pin 33c, and a pin driving portion 35. The φ platform 31 is a part of the XY table, The substrate mounting portion 3U and the pin driving mechanism portion 31b are formed. Various patterns are formed on the surface of the glass mask 34 by, for example, chromium. When the line width of the pattern is measured, the glass mask 34 is mounted. The substrate mounting portion 31a of the sample chamber 16. The glass mask 34 is placed on the three support pins 32a, 32b, 32c disposed on the substrate mounting portion 31 & the three support pins 32a, 32b, The 32c is placed in advance on the substrate mounting portion 31 in accordance with the size of the glass mask 34. In the peripheral portion of the glass mask 34, support pins 32a and 32b are disposed to support 11 200832605, and the support shaft 32 (10) is arranged for the side. At both ends of the circumference, the center rubbing force at the edge portion of the edge portion can make the moving acceleration of the glass n table small, by the contact portions of the support pins 32a, 32b, 32c and the glass mask 34. The reticle 34 does not shift but the movement acceleration of the XY table becomes large. , The risk may be offsets in the horizontal direction. In order to prevent the offset, the present inventors focused

Use the side of the glass reticle. The glass mask 34 can be fixed by pressing the two sides perpendicular to the side supported by the support locks 32a and 32 in the horizontal direction as the horizontal side and pressing the side surface as the horizontal side from both sides. At both ends of one of the side faces W, the fixing pins 33a, 33b which are placed on the platform 31 by δ are pressed, and the center portion of the side surface 37b with respect to the side faces is pressed by the pressing pin 33c. Further, the tip shapes of the support pins 32a, 32b, 32c and the fixing pins 33a and 33b and the press pins 15 33c may be spherical or conical. Next, referring to Figs. 4 to 6, the pin driving mechanism for pressing the pressing pin 33 at the most appropriate pressure for fixing the glass mask 34' on the side will be described. Fig. 4 is a block showing the pin driving portion 35 of the substrate fixing device 30. As shown in Fig. 4, the pin drive unit 35 is composed of a press pin 41, a drive unit 42, a pressure information supply unit 43, a pin drive control unit 44, and a memory unit 45. The press pin 41 is in contact with the glass mask. The glass mask 34 is pressed by the side surface of the 34. The driving portion 42 is constituted by, for example, an ultrasonic linear motor, and the movable pressing pin 4 is 12, 200832605. The pressure communication providing portion 43 can detect the pressure at which the pressing pin 41 presses the glass mask 34. And the above information is notified to the pin drive control unit 44. - The pin drive control unit 44 can stop the drive when the predetermined pressure is changed based on the pressure information of the glass mask 34 notified by the pressure information supply unit 43. The memory unit 45 is composed of, for example, a hard disk, and stores an optimum pressure value for pressing the glass mask 34. In the pin driving unit 35 as described above, the pin driving control unit 44 is in the glass light. Cover 34 is placed on the support pin After 32a, 32b, 32c, the drive unit 10 42 is instructed to move the press pin 41 in the direction of the glass mask 34. The drive unit 42 moves the press pin 41 at a predetermined speed, and then the pin drive control unit 44 is pressed from the pressure. The information providing unit 43 obtains the pressure information of the glass mask “pressing the pressure pin 41. When the pressure is appropriate, the driving unit 42 is stopped. Here, the size of the glass mask 34 and the movement of the χγ table are accelerated in advance. The appropriate pressure is determined, and the above information is stored in the memory unit 45. φ Next, a specific example of fixing the glass mask 34 will be described with reference to Fig. 5 which is an example of a specific structure of the display pin driving unit 35. The pin drive unit 35 is configured to include a press pin 33c, a drive rod (5la, 51b) connected to the press pin 33c to move the press pin 33c, and a drive through the movable drive rod (51a, 51b). The linear motor 42a of the portion; and the pin drive control portion 44 that stops driving when the glass mask 34 is appropriately pressed by the press pin 33c to press the glass mask 34. The guide member 53 is connected to the drive rod 51a, and the platform 31 is attached. There is a mechanical limit 54. The movement range of the rod 51a is such that the guiding member 53 is limited to the range of the mechanical limit 54 of the machine 13 200832605. Thereby, it is possible to prevent an abnormal force from being applied from the press pin to the glass mask 34. Further, the driving rod 51a is connected The spring 52 is moved in the direction of the glass mask 34 by the driving rod S1a, and the spring 52 is contracted. The relationship between the pressure of the magazine 52 5 and the force of the pressing pin 33c pressing the glass mask is determined in advance, and The aforementioned relationship is stored in the memory unit 45. The pressure information providing unit 43 detects the amount of compression of the spring 52 and notifies the pin drive control unit 44. In Fig. 5, a specific example of the pressure information providing unit 43 is shown. The pressure information providing unit 43 is provided with a connection portion 55 that connects the drive bars 51a and 51b, and connects the connection portion 55 and the spring 52. The connecting portion 55 has a space inside, and the driving rod 51a moves into the inside of the connecting portion 55 as the connecting portion 55 moves in the direction of the glass mask 34. The relationship between the amount of movement of the connecting portion % and the amount of compression of the spring 52 corresponding to the pressure of the glass mask 34 is determined in advance, and when the connecting portion 55 moves the distance corresponding to the most appropriate pressure, the 15 information is notified to the pin drive. Control unit 44. Further, a switching mechanism directly coupled to the connecting portion 55 may be provided, and when the connecting portion 55 is moved by a predetermined distance, the switch is set to 〇FF to stop the driving of the linear motor 42a. The operation of the pin driving unit 35 having the above configuration will be described with reference to Figs. 5 and 6 . When the glass mask 34 is placed on the support pin 32, the pin drive control unit 44 instructs the linear motor 42a to move the press pin 33c in the direction of the glass mask 34 upon receiving an instruction to start the substrate fixing process from the control unit 120. For example, as shown in Fig. 6(a), the glass mask 34 is placed on the support pins 14 200832605 32 with a distance (for example, 500 [μηη]) between the fixing pins 33a and 33b within a predetermined allowable range. The pin drive control 44 drives the ultrasonic linear motor 42a to move the drive rod 51b and move the coupling portion 55 in the direction of the glass mask 34. Thereby, the driving rod 51a is moved in the direction of the glass mask 34 by the spring 52, and the pressing pin 33c5 is moved in the direction of the glass mask 34. Soon, as shown in Fig. 6(b), the press pin 33c abuts against the side surface of the glass mask 34. In Fig. 6(b), since the glass mask 34 is not in contact with the fixing pins 33a, 33b, the pressing force of the pressing pin 33c is smaller than a predetermined predetermined pressure, and the linear motor 42a is continuously driven. 10 Then, it becomes the state of the 6th (c) figure. The state of Fig. 6(c) is a state in which the glass mask 34 is in contact with both of the fixing pins 33a and 33b and the pressing pin 33c. At this stage, the glass mask 34 is moved to a predetermined position in the horizontal direction, and the support pin 32 supports the peripheral portion of the substrate. In the state of Fig. 6(c), since the pressing force of the press pin 33c with respect to the glass reticle 34 is less than a predetermined pressure, the linear motor 42a is further driven to follow the direction of the connecting portion 55 toward the glass reticle 34. Move, compress spring 52. The pin drive control unit 44 stops the driving of the linear motor 42a when the predetermined pressing force of the substrate is pressed from the relationship between the amount of spring compression and the force obtained by using the magazine. The predetermined pressing force does not strain the glass reticle and sufficiently maintains the pressure of the glass reticle 34. As described above, in the substrate fixing device of the present embodiment, the peripheral portion of the inside of the substrate is supported at three points, and the side surface of the substrate is pressed by the force 15 200832605 which does not cause strain on the substrate. Thereby, even if the movement acceleration of the χγ table becomes large, the substrate does not shift in the horizontal direction, and the measurement flux of the reticle pattern formed on the substrate can be improved. Further, in the present embodiment, the substrate is supported by the three support pins 32, but the number of the substrates is not limited to three, and four may be four, and the number of the substrates may be appropriately changed. In the present embodiment, the number of the press pins 33c is one. However, the number of the press pins 33c is not limited to one, and may be two, and the number of the pins may be appropriately changed. (Substrate fixing method) Next, a method of attaching the glass mask 34 to 10 χγ operations will be described with reference to Fig. 7 . First, in step S11, receiving an instruction from the control unit 120, the pin drive control unit 44 instructs the drive unit 42 to move the press pin 33 away from the substrate mounting portion 31a. That is, the press pin 33c is moved away from the glass mask 34 to secure the space in which the glass mask 34 is placed. 15 At the next step 812, the glass mask 34 is placed on the support pin 32 of the substrate mounting portion 31a. For example, the control unit 12A instructs to place the glass mask 34 on the three support pins 32&, 32b, 32c on the χγ table with the robot arm. The robot arm supports the glass reticle to hold the glass reticle 34 inside and is placed on the three support pins 32a, 32b, 32c. Then, the 20 mechanical arm leaves the glass mask 34 and is retracted from the space between the table and the glass mask 34. In addition, the accuracy of the horizontal position of the position placed by the robot arm is several tens [μπι] to several hundred [μιη], and it cannot be placed at a predetermined position with high precision. Therefore, the glass mask 34 is placed on the support pin 32 from the fixed pins 33a, 33b5, and the right side 16 200832605. In the next step S13, the pin drive control unit 44 that acquires the information on which the glass mask 34 is placed is controlled by the pin drive unit 42 to move the press pin 33c in the direction of the glass mask 34. Further, the height from the land surface of the XY table to the press pin 33C is set to be equal to the height from the land surface of the table to the side surface of the glass mask 34. In the next step S14, it is determined whether or not the pressure of the press pin 33c with respect to the glass mask 34 is a predetermined value. If it is determined to be the predetermined value, the process proceeds to step S10. If it is determined that the value is not the predetermined value, the process returns to step S13, and the press pin 33c continues to move in the direction of the glass mask 34. The pressure of the press pin 33a with respect to the glass mask 34 is determined by the amount of compression of the spring 52 attached to the drive rod 51a of the drive press pin 33c. The relationship between the amount of compression of the spring and the force is obtained in advance, and the above relationship is stored in the memory unit 45. The distance from the pressure pin 33c to the direction of the glass mask 34 (i.e., the amount of compression of the spring) is obtained from the pressure-poor supply unit 43 to determine whether or not the predetermined value has been reached. In the next step S15, when the amount of compression of the spring 52 becomes a predetermined value and it is determined that the pressure applied to the glass mask 34 has reached a predetermined value, the linear motor 42a is stopped, and the movement of the press pin 33c is stopped to terminate the main processing. 20 In order to take out the glass mask 34 from the XY table, the press pin 33c is moved away from the glass mask 34, and then the robot arm is inserted between the χ 卫 卫 table and the glass mask 34, and the glass mask is read. Take it out inside. As described above, in the substrate fixing method of the present embodiment, after the glass mask 34 is placed on the support, the side opposite to the glass mask 34 is pressed by the fixing pin 33a and the 17 200832605 pressing pin 33c. And fix it. When the glass mask 34 is placed on the support pin 32, since the accuracy is low, it is not necessarily carried at the front position. At this time, the glass mask 34 can be moved horizontally by the press pin 33. And placed in the right place. Further, by applying a predetermined pressing force to the glass illuminator 34 of a predetermined size, the glass reticle 34 can be prevented from shifting in the horizontal direction in response to the moving acceleration of the XY table. • In addition, a pressing force is applied to the side of the glass mask 34 to the side of the glass mask %, and the peripheral portions of the inside of the mask 34 are supported by the three supporting pins 32a, 32b, 32c in the vertical direction. As described above, the member for fixing the glass mask does not come into contact with the surface of the glass mask 34, and therefore, contamination of the glass mask 34 can be suppressed as much as possible. (Modification) In the above embodiment, the press pin 33c is moved by driving the linear motor 42a to fix the glass mask 34. In the present modification, a method of moving the press pin 33c by a mechanism for driving the XY table will be described. Fig. 8 is a view showing the configuration of a substrate fixing device according to a modification. More than 20 include: χγ table (platform) 31; control rods 71a, 71b, pressure tribute supply unit 43; drive rod 71c: press pin 33c; pin drive control unit 42; memory unit 45; and χ γ table drive unit 42b . When the XY table 31 is moved to the left in the eighth drawing, the control rod m hits the side wall 72 of the sample chamber 16, and the reaction force transmits the driving rod 71c in the direction of the glass mask 34 by the reaction force. The spring is attached to the drive rod 71c as described in the above embodiment, and the relationship between the amount of compression of the magazine and the force of pressing the glass mask 34 is first measured, and the relationship is stored in the memory unit 45. When the pin drive control unit 42 acquires the amount of compression of the spring from the pressure information providing unit 43, it is determined whether or not the predetermined amount of spring compression has been reached. When the predetermined value is reached, 5 the driving of the XY table driving unit 42b is stopped. Thereby, the glass mask 34 can be fixed at the most appropriate pressing pressure. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(a) and (b) are diagrams showing an example of conventional substrate holding.

Fig. 2 is a view showing the configuration of a pattern measuring device 10 using the substrate fixing device of the present invention. Fig. 3(a) is a plan view of the substrate fixing device of the present invention, and Fig. 3(b) is a cross-sectional view taken along line I-Ι of Fig. 3(a). Fig. 4 is a block diagram showing the structure of the substrate fixing device of the present invention. Fig. 5 is a view showing the configuration of a specific example of the substrate fixing device of the present invention. 15 Figures 6(a) to (d) are diagrams illustrating the substrate fixing process. Fig. 7 is a flow chart showing an example of substrate fixing processing. Fig. 8 is a view showing a configuration of a specific example of a substrate fixing device according to a modification. [Description of main component symbols] 1.. Glass reticle 2a, 2b, 2c. · Pin 11···Electronic gun 12... Condenser lens 13.. Bias coil 14... Optotype lens 15...Electronic lens barrel Part 16. "Sample chamber 17...Xie 18...Electronic detector 19 200832605 19...Electrobeam 43...Pressure information providing unit 20...XY table 44...Pin drive control unit 30...Substrate fixing device 45...memory unit 31...platform 51a, 51b.. drive rod reverse mounting portion 52···spring 3 lb...pin drive mechanism portion 53...guide member 32a,32b,32c···support pin 54...mechanical limit 33a, 33b...fixing pin 55...coupling portion 33c...house pin 71a,wb...control bar 34...glass mask 71c.·drive bar 35...pin drive unit 72...side walls 37a, 37b ...side surface 110...Electronic scanning unit 41...Pushing pin 120...Control unit 42."Drive unit 130...Signal processing unit 42a...Linear motor 140...Image display unit 42b...XY table drive unit 150 ....Memory 20

Claims (1)

200832605 X. Patent application scope: 1. A substrate fixing device comprising: an XY table for mounting a substrate; a support pin for supporting a peripheral portion of the substrate; 5 fixing pin for Pressing the first side surface of the substrate; the press pin is for pressing the second side surface of the first side surface; and the fixing mechanism is configured to move the press pin in a direction perpendicular to the side surface to fix the substrate By. The substrate fixing device according to claim 1, wherein the support pin includes: first and second support pins, which support both ends of the inner peripheral edge portion of the substrate; and a third support pin, The center of the inner peripheral portion of the one side 15 of the inner peripheral portion is supported. 3. The substrate fixing device of claim 1, wherein the fixing mechanism comprises: a driving mechanism for moving the pressing pin; and a pin driving control mechanism for controlling the driving mechanism, 20 and the pin driving The control mechanism causes the drive mechanism to stop moving the press pin when it is determined that the pressure pressing the substrate has reached a predetermined pressure. 4. The substrate fixing device of claim 1, wherein the first side surface is in a direction perpendicular to one side of a periphery 21 200832605 of the substrate supported by the support pin. A pattern measuring device, which is the substrate fixing device according to any one of claims 1 to 4. 6. A substrate fixing method using a substrate fixing device, wherein the base 5 plate fixing device includes: an XY table for mounting a substrate; and a support pin for supporting a peripheral portion of the substrate. a fixing pin for pressing a first side surface of the substrate; a pressing pin for pressing a second side surface of the first side surface; and a driving mechanism for moving the pressing pin, 10 The substrate fixing method includes the steps of: pressing a side surface of the substrate placed on the support pin with the press pin; and stopping the driving force of the driving mechanism when the pressure pressing the side surface of the substrate is determined to be a predetermined pressure pin. The substrate fixing method according to claim 6, wherein the support pin includes: first and second support pins, which support both ends of the inner peripheral edge portion of the substrate; and a third support pin, It supports the middle of the peripheral portion of the peripheral portion. 8. The substrate fixing method according to claim 6, wherein the fixing pin has first and second fixing pins that press the both ends of the first side surface, and the pressing pin presses the center of the second side surface. 9. The substrate fixing method according to claim 6, wherein the side surface of the first 22 200832605 is perpendicular to a side of a peripheral portion of the substrate supported by the support pin. twenty three