WO2008087725A1 - Substrate fixing device and substrate fixing method - Google Patents

Substrate fixing device and substrate fixing method Download PDF

Info

Publication number
WO2008087725A1
WO2008087725A1 PCT/JP2007/050671 JP2007050671W WO2008087725A1 WO 2008087725 A1 WO2008087725 A1 WO 2008087725A1 JP 2007050671 W JP2007050671 W JP 2007050671W WO 2008087725 A1 WO2008087725 A1 WO 2008087725A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pin
backside
periphery
side face
Prior art date
Application number
PCT/JP2007/050671
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuhiro Arakawa
Minoru Soma
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2007/050671 priority Critical patent/WO2008087725A1/en
Priority to TW096142438A priority patent/TW200832605A/en
Publication of WO2008087725A1 publication Critical patent/WO2008087725A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Abstract

[PROBLEMS] To provide a substrate fixing device which can prevent occurrence of positional shift even when the moving acceleration of an XY table is high without contaminating a glass mask. [MEANS FOR SOLVING PROBLEMS] The substrate fixing device comprises an XY stage, a support pin for supporting the periphery on the backside of a substrate, a fixing pin for pressing the first side face of the substrate, a push pin for pressing the second side face opposing the first side face, and a means for moving the push pin in the direction perpendicular to the side face and fixing the substrate in place. The support pin may include first and second support pins for supporting the both ends of one side of the periphery on the backside of the substrate, and a third support pin for supporting the center of the periphery on the backside opposing the one side of the periphery on the backside. The fixing means has a drive means for moving the push pin and a pin drive control means for controlling the drive means, and the pin drive control means may control the drive means to stop movement of the push pin when it is judged that a pressure for pressing the substrate has reached a predetermined level.
PCT/JP2007/050671 2007-01-18 2007-01-18 Substrate fixing device and substrate fixing method WO2008087725A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/050671 WO2008087725A1 (en) 2007-01-18 2007-01-18 Substrate fixing device and substrate fixing method
TW096142438A TW200832605A (en) 2007-01-18 2007-11-09 Substrate fixing device and substrate fixing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/050671 WO2008087725A1 (en) 2007-01-18 2007-01-18 Substrate fixing device and substrate fixing method

Publications (1)

Publication Number Publication Date
WO2008087725A1 true WO2008087725A1 (en) 2008-07-24

Family

ID=39635734

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/050671 WO2008087725A1 (en) 2007-01-18 2007-01-18 Substrate fixing device and substrate fixing method

Country Status (2)

Country Link
TW (1) TW200832605A (en)
WO (1) WO2008087725A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010183077A (en) * 2009-02-05 2010-08-19 Asml Holding Nv Reticle support reducing reticle slippage
JP2011114314A (en) * 2009-11-30 2011-06-09 Nikon Corp Substrate-holding device, stage device, aligner, and method for manufacturing device
JP2012151371A (en) * 2011-01-20 2012-08-09 Nuflare Technology Inc Charged particle beam lithography apparatus and charged particle beam lithography method
JP2017067570A (en) * 2015-09-30 2017-04-06 学校法人金沢工業大学 Specimen holding/scanning mechanism, scanning probe microscope, and manufacturing method of probe
WO2020226065A1 (en) * 2019-05-07 2020-11-12 三菱電機株式会社 Optical module manufacturing apparatus and optical module manufacturing method
JP2023070516A (en) * 2021-11-09 2023-05-19 三益半導体工業株式会社 Wafer holding structure and holding method for both wafer and wafer stack

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313884A (en) * 2001-04-10 2002-10-25 Jeol Ltd Alignment mechanism of position of planar body
JP2002343850A (en) * 2001-05-15 2002-11-29 Nikon Corp Stage apparatus and exposure system
JP2006352115A (en) * 2005-06-08 2006-12-28 Asml Netherlands Bv Stage apparatus, lithographic apparatus and device manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002313884A (en) * 2001-04-10 2002-10-25 Jeol Ltd Alignment mechanism of position of planar body
JP2002343850A (en) * 2001-05-15 2002-11-29 Nikon Corp Stage apparatus and exposure system
JP2006352115A (en) * 2005-06-08 2006-12-28 Asml Netherlands Bv Stage apparatus, lithographic apparatus and device manufacturing method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010183077A (en) * 2009-02-05 2010-08-19 Asml Holding Nv Reticle support reducing reticle slippage
US9229341B2 (en) 2009-02-05 2016-01-05 Asml Holding N.V. Reticle support that reduces reticle slippage
JP2011114314A (en) * 2009-11-30 2011-06-09 Nikon Corp Substrate-holding device, stage device, aligner, and method for manufacturing device
JP2012151371A (en) * 2011-01-20 2012-08-09 Nuflare Technology Inc Charged particle beam lithography apparatus and charged particle beam lithography method
JP2017067570A (en) * 2015-09-30 2017-04-06 学校法人金沢工業大学 Specimen holding/scanning mechanism, scanning probe microscope, and manufacturing method of probe
WO2020226065A1 (en) * 2019-05-07 2020-11-12 三菱電機株式会社 Optical module manufacturing apparatus and optical module manufacturing method
JPWO2020226065A1 (en) * 2019-05-07 2021-10-14 三菱電機株式会社 Optical module manufacturing equipment and optical module manufacturing method
JP2023070516A (en) * 2021-11-09 2023-05-19 三益半導体工業株式会社 Wafer holding structure and holding method for both wafer and wafer stack
JP7376555B2 (en) 2021-11-09 2023-11-08 三益半導体工業株式会社 Wafer holding structure and holding method for both wafers and wafer stacks

Also Published As

Publication number Publication date
TW200832605A (en) 2008-08-01

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