TW200829667A - Composition and method for stripping organic coatings - Google Patents

Composition and method for stripping organic coatings Download PDF

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TW200829667A
TW200829667A TW96100419A TW96100419A TW200829667A TW 200829667 A TW200829667 A TW 200829667A TW 96100419 A TW96100419 A TW 96100419A TW 96100419 A TW96100419 A TW 96100419A TW 200829667 A TW200829667 A TW 200829667A
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coating film
composition
organic coating
group
compound
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TW96100419A
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Chinese (zh)
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TWI338026B (en
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Li-Ying Wang
Kuo-Chen Su
Shen-Hung Tu
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Basf Electronic Materials Taiwan Ltd
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Priority to TW96100419A priority Critical patent/TWI338026B/en
Priority to PCT/EP2008/050080 priority patent/WO2008081045A1/en
Priority to KR1020097013729A priority patent/KR20090122181A/en
Priority to JP2009543488A priority patent/JP2010514875A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D9/00—Chemical paint or ink removers
    • C09D9/005—Chemical paint or ink removers containing organic solvents

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  • Paints Or Removers (AREA)
  • Environmental & Geological Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
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Abstract

The invention relates to a composition for stripping organic coatings from a substrate, which comprises about 5 wt% to about 90 wt% of polar solvents, about 0.01 wt% to about 50 wt% of alkaline compounds, and about 100 ppm to about 15 wt% of metal corrosion inhibitors, based on the total weight of the composition. The composition of the invention can effectively remove the organic coatings without damaging the surface of metal substrates.

Description

200829667 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種有機塗㈣離❹合物，且特別關於 用=剝離液晶顯示器及半導體元件中作為保護膜或絕緣膜 之哨機塗膜的組合物及其方法。 【先前技術】 姓刻製程可說是整個液晶顯示器及半導體產業的微影製 程中取重要的步驟之…―般而言，光阻遮罩上的元件圖 案，是先藉著微影製程而轉移到光阻上，然後再利用钱刻 製程’來完成整個圖案轉移到薄膜的最終目的。這芦 微影與㈣的薄膜，將成為液晶顯示器或半導體元件:― 部份。 舉例來說’在液晶顯示器之製造上，通常於包含金屬電 極之玻璃基板上形成聚酿巧脫彳 . 7 Μ不亞胺（p〇lyimide; ρι)先質的有機 塗膜，在此有機塗膜上形成圖案化光阻遮罩’再對非光阻 L· 遮罩部分之有機塗膜進行姓刻，接著，在玻璃基板上採用 光阻剝離液，以清除光阻遮罩，並製造出經光刻之聚醯亞 胺先質。然後’進行聚醯亞胺先質之加熱處理，以製得聚 醯亞胺塗膜。聚醢亞胺是用途極廣的财高溫塑料，4作為 絕緣塗料，也可保護基板上之金屬層不易被氧化。. 當以此光刻法製造加工屮》。， 表I加工出缺品時，如半導體封裝製程 中銘導線上之保護膜的厚度太薄或太厚’或是可導電線寬 太窄或：寬時’可將該保護膜移除，以便重新形成保護 膜，使付包合金屬電極之玻璃基板可以繼續回收再利用。 113765.doc 200829667 」知在此玻璃基板上之經光刻的有機塗膜，係以加熱的 氫氧化納水溶液或聯胺水溶液等危險性強的驗液，來進^ 有機塗膜之剝離。雖'然使用此強驗液可完全剝離有機: 膜’但是卻受到剝離時間條件所支配。此外，某些破璃美 板種類會ϋ㈣液而使得玻璃基板溶出，及造成 蝕等問題發生。 曰腐 【發明内容】200829667 IX. INSTRUCTIONS OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to an organic coating (tetra) ion conjugate, and in particular to a whistle coating film as a protective film or an insulating film in a dicing liquid crystal display and a semiconductor element. Composition and method therefor. [Prior Art] The process of surname engraving can be said to be an important step in the lithography process of the entire liquid crystal display and semiconductor industry... In general, the component pattern on the photoresist mask is transferred by the lithography process. Go to the photoresist, and then use the money engraving process to complete the entire pattern transfer to the final purpose of the film. This lithography and (4) film will become a liquid crystal display or semiconductor component: - part. For example, in the manufacture of a liquid crystal display, a poly-acrylic coating film is usually formed on a glass substrate containing a metal electrode. The organic coating film of the precursor of the imine (p〇lyimide; ρι) is organically coated here. Forming a patterned photoresist mask on the film and then engraving the organic coating film of the non-resistive L·mask portion, and then using a photoresist stripping solution on the glass substrate to remove the photoresist mask and fabricating Photolithographic polyimine precursor. Then, heat treatment of the polyimine precursor is carried out to obtain a polyimide film. Polyimide is a highly versatile high-temperature plastic, 4 as an insulating coating, which also protects the metal layer on the substrate from oxidation. When manufacturing this process by photolithography. Table I When processing a defective product, such as the thickness of the protective film on the wire in the semiconductor packaging process is too thin or too thick 'or the conductive line width is too narrow or wide: 'The protective film can be removed to re- A protective film is formed so that the glass substrate to which the metal electrode is coated can be continuously recovered and reused. 113765.doc 200829667 The photolithographic organic coating film on the glass substrate is subjected to a highly hazardous test solution such as a heated aqueous solution of sodium hydroxide or an aqueous solution of hydrazine to remove the peeling of the organic coating film. Although 'the use of this strong liquid can completely strip the organic: film' but is subject to the peeling time conditions. In addition, some types of glazed glazings will cause the glass substrate to dissolve and cause problems such as corrosion.曰腐 【Contents】

為了改善上述現有的限制及缺弊，本發明之主要目的在 於提供一種有機塗膜剝離用組合物，其可以安全、有效地 移除塗佈纟玻璃基板之有機塗膜，並且不會對金屬基板表 面造成損傷。 本發明之又一目的在於提供一種剝離有機塗膜之方法， 其包括將一包含有機塗膜之金屬基板與本發明之有機塗膜 表J離用、、且合物接觸以自該基板移除有機塗膜，並且不會對 金屬基板表面造成損傷之步驟。 【實施方式】 本發明之有機塗膜剝離用組合物包含，以組合物總重量 计，約5重量。/〇至約90重量％之極性溶劑、約0〇1重量％至 勺重里。/()之驗性化合物及約100 ppm至約15重量％之金屬 腐蝕抑制劑。 適合使用本發明有機塗膜剝離用組合物來剝離之有機塗 膜’例如但不限於聚醯亞胺塗膜，由丙烯基、紛酸清漆、 %氧化物或聚乙醯基醇等樹脂形成之塗膜，較佳為聚醯亞 胺塗膜。 U3765.doc 200829667 . 本發明所使用之極性溶劑，係為與有機塗膜具有優異的 . 親和性之溶劑，較佳為非質子性水性有機溶劑，例如但不 限於二醇類化合物、N_甲基咯啶酮（N-methyl pyrr〇iid〇ne; • NMP)、 N，N-—甲基乙醯胺（dimethylacetamide; DMAC)、 Ν，Ν·二甲基甲醯胺（dimethyf〇rmamide; DMF)、二曱基亞石風 (dimethyl sulfoxide; DMSO)或其混合物。 適用於本發明中作為極性溶劑之二醇類化合物，較佳係 卡必醇（carbito1)及其衍生物，例如但不限於，單丁醚一縮 貳[乙一醇](diethylene glycol monobutyl ether; BDG)、單 乙醚一縮貳[乙二醇]、二甲醚一縮貳[乙二醇]、二乙醚一 細貳[乙二醇]、二丁醚一縮貳[乙二醇]、醋酸單丁醚一縮 家[乙《_辱]或其混合物。 本發明所使用之極性溶劑的含量，以組合物總重量計為 約5重量◦/❹至約9〇重量％，較佳為約2〇重量％至約85重量 % 〇 ^ 本發明所使用之鹼性化合物較佳係選自由胺醇化合物、 四級胺化合物及其混合物所組成之群組。 適用於本發明中作為鹼性化合物之胺醇化合物，較佳係 選自由單乙醇胺（m〇n〇ethanolamine; MEA)、N-甲基乙醇 胺、N，N-二甲基乙醇胺、N-乙基乙醇胺、N•甲基，N_乙基 乙醇版 N，N- —乙基乙醇胺及其混合物所組成之群組。 適用於本發明中作為鹼性化合物之四級胺化合物，較佳 自由氣氧化三甲基苯胺（trimethylanilinium ^ ide)基二甲基氫氧化銨（benzyltrimethylammonium 113765.doc 200829667 hydroxide)、氫氧化膽鹼（choline hydroxide)、四甲基氫氧 • 化銨（tetramethylammonium hydroxide; TMAH)、四丙基氫 氧化銨（tetrapropylammonium hydroxide)及其混合物所組成 .之群組。 本發明所使用之鹼性化合物的含量，以組合物總重量計 為約0.01重量％至約50重量％，較佳為約〇」重量％至約5〇 重量％。 本發明所使用之金屬腐蝕抑制劑較佳係選自由苯并三唑 (benzotriaz〇le)衍生物、糖醇類衍生物、有機酚類化合物 及其混合物所組成之群組。 適用於本發明中作為金屬腐蝕抑制劑之糖醇類衍生物， 較佳係選自由麥芽糖醇（maltit〇1)、聚葡萄糖 (P〇lydextrose)、木糖醇（xym〇1)、乳糖醇（lactit〇l)、甘露 醇（mannitol)、麥芽糖醇糖漿、異麥芽糖醇（is〇mahit〇i)、 山糸醇（sorbitol)及其混合物所組成之群組。 I 適用於本發明中作為金屬腐蝕抑制劑之有機酚類化合物 較佳係兒茶驗（catechol)。 曰本發明所使用之金屬腐蝕抑制劑的含量，以組合物總重 量計為約100 ppm至約15重量％，較佳為約5〇〇 ppm至約12 重量％。 本么明之有機塗膜剝離用組合物可視需要進一步包含此 技術領域中具有通常知識者所熟知之其他組份，例如可使 表面張力變低或防止有機塗膜向基板再附著之界面活性 劑。 113765.doc 200829667 • 由於極性溶劑及鹼性化合物與有機塗膜具有優異的親和 - 性，因此可有效地將有機塗膜自玻璃基板剝離。此外，為 避免玻璃基板上之金屬層被蝕刻，本發明組合物包含金屬 ^ 腐蝕抑制劑，其可免除對金屬基板表面造成損傷，使得經 _ 有機塗膜剝離後的金屬基板可以再回收利用。 本發明另提供一種剝離有機塗膜之方法，其包括將一包 含有機塗膜之金屬基板與本發明之有機塗膜剝離用組合物 Γ； 接觸以自該基板移除有機塗膜之步驟，其不會對金屬基板 表面造成損傷。 上述方法之處理條件，較佳的剝離處理溫度是在約艺 至約90°C，較佳的剝離處理時間為約5分鐘至約3〇分鐘。 以下實施例係用於對本發明作進一步說明，唯非用以限 制本赉明之範圍。任何熟悉此項技藝之人士可輕易達成之 修飾及改變均包括於本案說明書揭示内容及所附申請專利 範圍之範圍内。 I) 實施例 (1)有機塗膜剝離效果測試： A.分別配置如表i之本發明有機塗膜剝離用組合物； 表1 貝施例 TMAH DMSO 膽驗 「MEA 甘露醇 1 r\ 46% 50% 4% -3-~ Lli% 1 66% ~~58%^ 30% 5% τ* /0 4% ------ LI1%Zj B.如表2所示，將含有經光刻聚醯亞胺之金屬基板，浸 潰於此聚醯亞胺剝離組合物約5分鐘至約3〇分鐘，温度約 113765.doc •10- 200829667 40°C 至約 90°C。 表2 實施例1至3 浸潰溫度 40〜65度 65〜90度 浸漬時間 5〜15分鐘 0 0 15〜30分鐘 0 0 C.用去離子水清洗。 D·以掃目苗式電子顯微鏡（Scanning Electron Microscope; SEM)觀察金屬基板上是否有聚醯亞胺的殘留。 〇 圖1至圖3為掃瞄式電子顯微鏡照片。圖1顯示在基板上 之經光刻的聚醯亞胺；圖2為圖1之聚醯亞胺以習知組合物 移除後的狀態，此照片顯示經光刻之聚醯亞胺未完全被去 除；圖3為圖1之聚醯亞胺以實施例1組合物移除後的狀 態’此照片清楚顯示良好的聚醯亞胺去除能力。 (2)金屬蝕刻測試： 刀別配置含有金屬腐餘抑制劑（如糖醇類衍生物或有 機酚類化合物）和不含金屬腐蝕抑制劑之聚醯亞胺剝離用 〇 組合物。 :δ有、、二光刻之聚醯亞胺的金屬基板，浸潰於此等聚 ^亞胺剝離組合物約5分鐘至約％分鐘，溫度約它至 90°C。 ' C·用去離子水清洗。 一、4探針方式檢測基板上之金屬導體之#刻率。 實驗結果如 _In order to improve the above-mentioned limitations and disadvantages, the main object of the present invention is to provide an organic coating film peeling composition which can safely and effectively remove an organic coating film coated with a glass substrate without causing a metal substrate. The surface causes damage. It is still another object of the present invention to provide a method of peeling off an organic coating film comprising: separating a metal substrate comprising an organic coating film from the organic coating film table J of the present invention, and contacting the composition to remove from the substrate An organic coating film that does not cause damage to the surface of the metal substrate. [Embodiment] The composition for peeling off the organic coating film of the present invention contains about 5 parts by weight based on the total weight of the composition. /〇 to about 90% by weight of a polar solvent, about 0.1% by weight to the weight of the spoon. /() an organic compound and from about 100 ppm to about 15% by weight of a metal corrosion inhibitor. An organic coating film suitable for peeling off using the organic coating film peeling composition of the present invention, such as, but not limited to, a polyimide film, is formed of a resin such as acryl, acid varnish, % oxide or polyethyl decyl alcohol. The coating film is preferably a polyimide film. U3765.doc 200829667. The polar solvent used in the present invention is a solvent having excellent affinity with an organic coating film, preferably an aprotic aqueous organic solvent such as, but not limited to, a glycol compound, N-A N-methyl pyrr〇iid〇ne; • NMP), N,N-methylacetamide (DMAC), hydrazine, dimethyf〇rmamide; DMF ), dimethyl sulfoxide (DMSO) or a mixture thereof. A glycol compound suitable as a polar solvent in the present invention is preferably carbito1 and a derivative thereof such as, but not limited to, diethylene glycol monobutyl ether (BDG). ), monoethyl ether - condensed oxime [ethylene glycol], dimethyl ether - condensed oxime [ethylene glycol], diethyl ether monofine oxime [ethylene glycol], dibutyl ether condensed oxime [ethylene glycol], acetic acid single Ding ether shrinks home [B "_ humiliation] or a mixture thereof. The polar solvent used in the present invention is present in an amount of from about 5 parts by weight to about 9% by weight, preferably from about 2% by weight to about 85% by weight based on the total weight of the composition. The basic compound is preferably selected from the group consisting of an amine alcohol compound, a quaternary amine compound, and a mixture thereof. The amine alcohol compound suitable as the basic compound in the present invention is preferably selected from the group consisting of monoethanolamine (MEA), N-methylethanolamine, N,N-dimethylethanolamine, and N-ethyl. A group consisting of ethanolamine, N•methyl, N-ethylethanol, N,N-ethylethanolamine, and mixtures thereof. A quaternary amine compound suitable for use as a basic compound in the present invention, preferably freely oxidized trimethylanilinium dimethyl hydroxy hydroxide (benzyltrimethylammonium 113765.doc 200829667 hydroxide), choline hydroxide ( A group consisting of choline hydroxide, tetramethylammonium hydroxide (TMAH), tetrapropylammonium hydroxide, and mixtures thereof. The basic compound used in the present invention is contained in an amount of from about 0.01% by weight to about 50% by weight based on the total weight of the composition, preferably from about 5% by weight to about 5% by weight. The metal corrosion inhibitor used in the present invention is preferably selected from the group consisting of benzotriaz〇le derivatives, sugar alcohol derivatives, organic phenolic compounds, and mixtures thereof. The sugar alcohol derivative which is suitable as the metal corrosion inhibitor in the present invention is preferably selected from the group consisting of maltitol (1, 3, 1), polydextrose (Pylydextrose), xylitol (xym〇1), and lactitol ( A group consisting of lactit〇l), mannitol, maltitol syrup, isomalt (i〇mahit〇i), sorbitol, and mixtures thereof. I. An organic phenolic compound suitable as a metal corrosion inhibitor in the present invention is preferably a catechol. The metal corrosion inhibitor used in the present invention is present in an amount of from about 100 ppm to about 15% by weight, based on the total weight of the composition, preferably from about 5 〇〇 ppm to about 12% by weight. The organic coating film peeling composition of the present invention may further contain other components known to those skilled in the art as needed, such as a surfactant which can lower the surface tension or prevent the organic coating film from reattaching to the substrate. 113765.doc 200829667 • Since the polar solvent and the basic compound have excellent affinity with the organic coating film, the organic coating film can be effectively peeled off from the glass substrate. Further, in order to prevent the metal layer on the glass substrate from being etched, the composition of the present invention contains a metal corrosion inhibitor which can eliminate the damage to the surface of the metal substrate, so that the metal substrate after the peeling of the organic film can be recycled. The present invention further provides a method for peeling off an organic coating film, comprising: a metal substrate comprising an organic coating film and a composition for peeling off the organic coating film of the present invention; and a step of contacting the organic coating film from the substrate, Does not cause damage to the surface of the metal substrate. The processing conditions of the above method, preferably the peeling treatment temperature is from about 约 to about 90 ° C, and the preferred stripping treatment time is from about 5 minutes to about 3 minutes. The following examples are intended to be illustrative of the invention and are not intended to limit the scope of the invention. Modifications and variations that may be readily made by those skilled in the art are included within the scope of the disclosure of the present disclosure and the scope of the appended claims. I) Example (1) Organic film peeling effect test: A. The organic coating film peeling composition of the present invention as shown in Table i was separately disposed; Table 1 Shell Example TMAH DMSO Bile test "MEA Mannitol 1 r\ 46% 50% 4% -3-~ Lli% 1 66% ~~58%^ 30% 5% τ* /0 4% ------ LI1%Zj B. As shown in Table 2, it will contain photolithography A metal substrate of polyimine, impregnated with the polyimideimide stripping composition for about 5 minutes to about 3 minutes, at a temperature of about 113765.doc • 10 - 200829667 40 ° C to about 90 ° C. Table 2 Examples 1 to 3 Immersion temperature 40 to 65 degrees 65 to 90 degrees immersion time 5 to 15 minutes 0 0 15 to 30 minutes 0 0 C. Wash with deionized water D. Scanning Electron Microscope; SEM) Observe the presence of polyimine on the metal substrate. Figure 1 to Figure 3 are scanning electron micrographs. Figure 1 shows the photolithographic polyimine on the substrate; Figure 2 is Figure 1. The polyimine is in a state after removal of the conventional composition, this photograph shows that the photolithographic polyimine is not completely removed; FIG. 3 is the polyimine of FIG. 1 removed as the composition of Example 1. Post state 'this The photo clearly shows good polyimine removal ability. (2) Metal etching test: The knife is equipped with a metal corrosion inhibitor (such as a sugar alcohol derivative or an organic phenolic compound) and a metal corrosion inhibitor-free polymer. a bismuth imide stripping ruthenium composition: a δ-, bis-lithographic polyimine metal substrate, impregnated with the polyimine stripping composition for about 5 minutes to about % minutes, at a temperature of about 90 ° C. ' C · Wash with deionized water. One or four probe method to detect the metal engraving rate on the substrate. The experimental results are as _

那下表3所示，相較於使用不含金屬腐蝕抑制 劑之組合物 _ 市J ’便用含有金屬腐蝕抑制劑之組合物來剝離右 機塗臈可右Μ π ^ 放IV低對於金屬基板之蝕刻率，以避免造成金 113765.doc 200829667 屬基板表面之損傷。 ^10 --- >10000" 劑 雖然本發明已以一 7ΤΓ ~' ' 一~ 一'一~ 曰—^ 叙佺貫施例揭露如上，然其並非用以 限疋本發明，任何孰羽 …白此技藝者，在不脫離本發明之精神 與範圍内，當可做些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。As shown in Table 3 below, compared to the use of a composition containing no metal corrosion inhibitors, the composition of the metal corrosion inhibitor is used to strip the right machine. The right side is coated with a right Μ π ^ The etching rate of the substrate is to avoid damage to the surface of the substrate of gold 113765.doc 200829667. ^10 --- >10000" Agent Although the present invention has been disclosed above by way of example, it is not intended to limit the invention, any feather It is to be understood that the scope of the present invention is defined by the scope of the appended claims.

【圖式簡單說明】 圖1顯示在基板上之經光刻的聚醯亞胺。 圖2顯示圖1之聚醯亞胺以習知組合物移除後的狀態。 圖3顯示圖1之聚醯亞胺以實施例1組合物移除後的狀 態。 〇 113765.doc -12-BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a photolithographic polyimine on a substrate. Figure 2 shows the state of the polyimine of Figure 1 after removal of the conventional composition. Figure 3 shows the state of the polyimine of Figure 1 after removal of the composition of Example 1. 〇 113765.doc -12-

Claims (1)

200829667 十、申請專利範圍： ，以組合物總重量 0.01至約50重量％ %之金屬腐餘抑制 1 · 一種有機塗膜剝離用組合物，其包含 e十’約5至約9 0重量％之極性溶劑、約 之驗性化合物及約100 ppm至約1 5重量 劑0 2.如請求項1之有機塗膜剝離用組合物’其中該有機塗膜 係聚酿亞胺塗膜。 P 3,如明求項1之有機塗膜剝離用組合物，其中該極性溶劑 係選自由二醇類化合物、N-甲基吡咯啶酮（N_methyl pyrr〇lid〇ne; NMP) 、 N，N•二甲基乙醯胺 (dimethylacetamide; DMAC)、N，N-二曱基甲醯胺 (dimethyf〇rmamide; DMF)、二曱基亞颯⑷咖师 sulfoxide; DMSO)及其混合物所組成之群組。 4·如請求項3之有機塗膜剝離用組合物，其中該二醇類化 合物係選自由單丁醚一縮貳[乙二醇](diethylene glyc〇1 ( monobWy! ether; BDG)、單乙醚一縮貳[乙二醇]、二甲 醚一縮貳[乙二醇]、二乙醚一縮貳[乙二醇]、二丁醚一 縮貳[乙二醇]、醋酸單丁醚一縮貳[乙二醇]及其混合物 所組成之群組。 5 _如明求項1之有機塗膜剝離用組合物，其中該驗性化合 物係選自由胺醇化合物、四級胺化合物及其混合物所組 成之群組。 6.如明求項5之有機塗膜剝離用組合物，其中該胺醇化合 物係選自由單乙醇胺（monoethanolamine; MEA)、N-甲基 113765.doc 200829667 乙醇胺、N，N-二甲基乙醇胺、N-乙基乙醇胺、N-曱 基，N-乙基乙醇胺、N，N-二乙基乙醇胺及其混合物所組成 之群組。 7. 如請求項5之有機塗膜剝離用組合物，其中該四級胺化 合物係選自由氫氧化三甲基苯胺（trimethylanilinium hydroxide)、 爷 基三 甲基氫 氧化錄 (benzyl trimethyl ammonium hydroxide)、氫氧化膽生会 (choline hydroxide)、 四 甲基氫 氧化銨 (tetramethylammonium hydroxide)、四丙基氫氧化銨 (tetrapropylammonium hydroxide)及其混合物所組成之群 組。 8. 如請求項1之有機塗膜剝離用組合物，其中該金屬腐蝕 抑制劑係選自由苯并三嗤（benzotriazole)衍生物、糖醇類 衍生物、有機酚類化合物及其混合物所組成之群組。 9. 如請求項8之有機塗膜剝離用組合物，其中該糖醇類衍 生物係選自由麥芽糖醇（mahitol)、聚葡萄糖 (polydextrose)、木糖醇（xylitol)、乳糖醇（lactitol)、甘露 醇（mannitol)、麥芽糖酵糠漿、異麥芽糖醇（isomaltitol)、 山梨醇（sorbitol)及其混合物所組成之群組。 10 ·如請求項8之有機塗膜剝離用組合物，其中該有機酚類 化合物係兒茶驗（catechol)。 11 · 一種剝離有機塗膜之方法，其包括將一包含有機塗膜之 金屬基板與如請求項1至9中任一項之有機塗膜剝離用組 合物接觸，以自該基板移除有機塗膜。 113765.doc 200829667 七、指定代表圖·· (一) 本案指定代表圖為：第（1 )圖。 (二) 本代表圖之元件符號簡單說明： (無元件符號說明） f 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式： (無） 113765.doc 200829667 …一 币uy〇iuu419號專利申請案 中文說明書替換頁(96年5月） 二、發明人•（共3人） 姓名：（中文/英文） 1. 王儷穎 WANG，LI-YING 2. 蘇國禎 SU，KUO-CHEN 3. 涂勝宏 TU，SHEN-HUNG Ο 國籍：（中文/英文） 1. 中華民國 R.O.C. 2. 中華民國 R.O.C. 3-中華民國 R.O.C. 113765-960502.doc 200829667·“ ⑽ ------l419 5虎專利申請案 ‘ 、 中文說明書替換頁(97年1月） ^ 白知在此玻璃基板上之經光刻的有機塗膜，係以加熱的 • 氫氧化鈉水溶液或聯胺水溶液等危險性強的鹼液，來進行 有機塗膜之剝離。雖然使用此強鹼液可完全剝離有機塗 膜，但是卻受到剝離時間條件所支配。此外，某些玻璃基 板種類會因強鹼液而使得玻璃基板溶出，及造成金屬層腐 钱專問題發生。 【發明内容】 為了改善上述現有的限制及缺弊，本發明之主要目的在 於提供一種有機塗膜剝離用組合物，其可以安全、有效地 移除塗佈在玻璃基板之有機塗膜，並且不會對金屬基板表 面造成損傷。 本發明之又一目的在於提供一種剝離有機塗膜之方法， 其包括將一包含有機塗膜之金屬基板與本發明之有機塗膜 剝離用組合物接觸以自該基板移除有機塗膜，並且不會對 金屬基板表面造成損傷之步驟。 【實施方式】 本發明之有機塗膜剝離用組合物包含，以組合物總重量 計，約5重量％至約90重量。/。之極性溶劑、約〇.〇1重量％至 約50重量％之鹼性化合物及約1〇〇 ppm至約15重量％之金屬 腐蝕抑制劑。 適合使用本發明有機塗膜剝離用組合物來剝離之有機塗 膜，例如但不限於聚醯亞胺塗膜，由丙烯基、酚醛清漆、 環氧化物或聚乙烯基醇等樹脂形成之塗膜，較佳為聚醯亞 胺塗膜。 113765-970104.doc 200829667 -……419號專利申請索 中文說明書替換頁(97年1月） 本發明所使用之極性溶劑，係為與有機塗膜具有優異的 親和性之溶劑，較佳為非質子性水性有機溶劑，例如但不 限於二醇類化合物、N-甲基叶b略唆酮（N-methyl pyrrolidone; NMP)、 N，N-二甲基乙醯胺（dimethylacetamide; DMAC)、 N，N-二甲基甲醯胺（dimethyformamide; DMF)、二甲基亞石風 (dimethyl sulfoxide; DMSO)或其混合物。 適用於本發明中作為極性溶劑之二醇類化合物，較佳係 卡必醇（carbitol)及其衍生物，例如但不限於，單丁醚一縮 家[乙二醇](diethylene glycol monobutyl ether; BDG)、單 乙醚一縮貳[乙二醇]、二甲醚一縮貳[乙二醇]、二乙醚一 縮貳[乙二醇]、二丁醚一縮貳[乙二醇]、醋酸單丁醚一縮 貳[乙二醇]或其混合物。 本發明所使用之極性溶劑的含量，以組合物總重量計為 約5重量％至約90重量％，較佳為約20重量％至約85重量 % 〇 本發明所使用之鹼性化合物較佳係選自由胺醇化合物、 四級胺化合物及其混合物所組成之群組。 適用於本發明中作為鹼性化合物之胺醇化合物，較佳係 選自由單乙醇胺（monoethanolamine; MEA)、N-曱基乙醇 胺、N，N-二甲基乙醇胺、N-乙基乙醇胺、N·甲基，N-乙基 乙醇胺、N，N-二乙基乙醇胺及其混合物所組成之群組。 適用於本發明中作為驗性化合物之四級胺化合物，較佳 係選自由氫氧化三曱基苯胺（trimethylanilinium hydroxide)、苄基三甲基氫氧化銨（benzyltrimethylammonium 113765-970104.doc --———— 419號專利申請索 ‘ 中文申請專利範圍替換本(97年1月） 十、申請專利範圍： 1. 一種有機塗膜剝離用組合物，其包含，以組合物總重量 計，約5至約90重量％之極性溶劑、約0.01至約50重量％ 之鹼性化合物及約100 ppm至約15重量°/。之金屬腐蝕抑制 劑。 2. 如請求項1之有機塗膜剝離用組合物，其中該有機塗膜 係聚醯亞胺塗膜。 3. 如請求項1之有機塗膜剝離用組合物，其中該極性溶劑 ( 係選自由二醇類化合物、N-甲基p比洛咬酮（N-methyl pyrrolidone; NMP) 、 N，N-二曱基 乙醯胺 (dimethylacetamide; DMAC) 、N，N-二甲基甲醯胺 (dime thy for mam ide; DMF)、二甲基亞石風（dimethyl sulfoxide; DMSO)及其混合物所組成之群組。 4. 如請求項3之有機塗膜剝離用組合物，其中該二醇類化 合物係選自由單丁醚一縮家[乙二醇](diethylene glycol monobutyl ether; BDG)、單乙醚一縮家[乙二醇]、二曱 ( 醚一縮貳[乙二醇]、二乙醚一縮貳[乙二醇]、二丁醚一 縮貳[乙二醇]、醋酸單丁醚一縮貳[乙二醇]及其混合物 所組成之群組。 5. 如請求項1之有機塗膜剝離用組合物，其中該鹼性化合 物係選自由胺醇化合物、四級胺化合物及其混合物所組 成之群組。 6. 如請求項5之有機塗膜剝離用組合物，其中該胺醇化合 物係選自由單乙醇胺（monoethanolamine; MEA)、N-曱基 113765-970104.doc 200829667 乙醇胺、N，N-二甲基乙醇胺、N-乙基乙醇胺、N-甲 基，N-乙基乙醇胺、N，N-二乙基乙醇胺及其混合物所組成 之群組。 7. 如請求項5之有機塗膜剝離用組合物，其中該四級胺化 合物係選自由氳氧化三甲基苯胺（trimethylanilinium hydroxide)、 爷基三 甲基氫 氧化銨 (benzyltrimethylammonium hydroxide)、氫氧化膽生会 (choline hydroxide)、 四 甲基氫 氧化銨 (tetramethy 1 ammonium hydroxide)、四丙基氫氧 4匕銨 (tetrapropy 1 ammonium hydroxide)及其混合物所組成之群 組。 8. 如請求項1之有機塗膜剝離用組合物，其中該金屬腐蝕 抑制劑係選自由苯并三唾（benzotriazole)衍生物、糖醇類 衍生物、有機酚類化合物及其混合物所組成之群組。 9. 如請求項8之有機塗膜剝離用組合物，其中該糖醇類衍 生物係選自由麥芽糖醇（maltitol)、聚葡萄糖 (polydextrose)、木糖醇（xylitol)、乳糖醇（lactitol)、甘露 醇（mannitol)、麥芽糖醇糖漿、異麥芽糖醇（isomaltitol)、 山梨醇（sorbitol)及其混合物所組成之群組。 10. 如請求項8之有機塗膜剝離用組合物，其中該有機酚類 化合物係兒茶紛（catechol)。 11. 一種剝離有機塗膜之方法，其包括將一包含有機塗膜之 金屬基板與如請求項1至10中任一項之有機塗膜剝離用 組合物接觸，以自該基板移除有機塗膜。 113765-970104.doc200829667 X. Patent application scope: 0.1% to about 50% by weight of the total weight of the composition of the metal corrosion inhibition 1 · An organic coating film peeling composition comprising e 10 'about 5 to about 90% by weight The polar solvent, about the test compound, and about 100 ppm to about 15 weight agent 0. The organic film peeling composition of claim 1, wherein the organic coating film is a polyimide coating film. P 3, wherein the composition for organic film peeling according to claim 1, wherein the polar solvent is selected from the group consisting of glycol compounds, N-methyl pyrrolidone (NMP), N, N • Groups of dimethylacetamide (DMAC), N,N-dimethyf〇rmamide (DMF), dimercaptopurine (4) sulfoxide; DMSO) and mixtures thereof group. 4. The composition for peeling off an organic coating film according to claim 3, wherein the diol compound is selected from the group consisting of monoethylene glycol oxime [ethylene glycol] (diethylene glyc 〇 1 (monobWy! ether; BDG), monoethyl ether A condensed oxime [ethylene glycol], dimethyl ether condensed hydrazine [ethylene glycol], diethyl ether condensed hydrazine [ethylene glycol], dibutyl ether condensed hydrazine [ethylene glycol], acetic acid monobutyl ether The composition of the organic film peeling composition of the present invention, wherein the test compound is selected from the group consisting of an amine alcohol compound, a quaternary amine compound, and a mixture thereof. 6. The organic coating film peeling composition according to claim 5, wherein the amine alcohol compound is selected from the group consisting of monoethanolamine (MEA), N-methyl 113765.doc 200829667 ethanolamine, N, a group consisting of N-dimethylethanolamine, N-ethylethanolamine, N-mercapto, N-ethylethanolamine, N,N-diethylethanolamine, and mixtures thereof. 7. Organic coating as in claim 5 a film peeling composition, wherein the quaternary amine compound is selected from the group consisting of trimethylanilinium hydroxi De), benzyl trimethyl ammonium hydroxide, choline hydroxide, tetramethylammonium hydroxide, tetrapropylammonium hydroxide and The composition of the mixture of the organic coating film according to claim 1, wherein the metal corrosion inhibitor is selected from the group consisting of a benzotriazole derivative, a sugar alcohol derivative, and an organic phenol. The composition of the compound of the present invention and the mixture thereof. The composition for peeling off the organic film according to claim 8, wherein the sugar alcohol derivative is selected from the group consisting of maltitol, polydextrose, and xylose. a group consisting of xylitol, lactitol, mannitol, maltose mash, isomaltitol, sorbitol, and mixtures thereof. The organic coating film peeling composition, wherein the organic phenolic compound is catechol. 11 · A method of peeling off an organic coating film, comprising: including The metal substrate and the coating machine such as an organic coating film release request entries in contact with a composition of 1 to 9, in order to remove the organic coating film from the substrate. 113765.doc 200829667 VII. Designation of Representative Representatives (1) The representative representative of the case is: (1). (2) A brief description of the symbol of the representative figure: (No description of the symbol of the component) f 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (none) 113765.doc 200829667 ... one coin uy〇iuu419 No. Patent Application Replacement Page (May 96) 2. Inventor • (3 in total) Name: (Chinese/English) 1. Wang Yuying WANG, LI-YING 2. Su Guozhen SU, KUO-CHEN 3. Tu Shenghong TU, SHEN-HUNG Ο Nationality: (Chinese / English) 1. ROC ROC 2. ROC ROC 3- ROC ROC 113765-960502.doc 200829667·“ (10) ------l419 5 Tiger Patent Application ' , Chinese manual replacement page (January 97) ^ The lithographic organic coating film on this glass substrate is a dangerous lye such as heated aqueous solution of sodium hydroxide or aqueous hydrazine solution. The organic coating film is peeled off. Although the organic coating film can be completely peeled off by using the strong alkali liquid, it is subject to the peeling time condition. In addition, some glass substrate types may dissolve the glass substrate due to strong alkali liquid. SUMMARY OF THE INVENTION In order to improve the above-mentioned limitations and disadvantages, the main object of the present invention is to provide an organic coating film peeling composition which can be safely and effectively removed. The organic coating film coated on the glass substrate does not cause damage to the surface of the metal substrate. Another object of the present invention is to provide a method for peeling off an organic coating film, comprising: a metal substrate comprising an organic coating film and the invention The organic coating film peeling composition is contacted to remove the organic coating film from the substrate without causing damage to the surface of the metal substrate. [Embodiment] The composition for peeling off the organic coating film of the present invention comprises the composition From about 5% by weight to about 90% by weight of the polar solvent, from about 1% by weight to about 50% by weight of the basic compound and from about 1% by weight to about 15% by weight of metal corrosion inhibition An organic coating film suitable for peeling off using the organic coating film peeling composition of the present invention, such as, but not limited to, a polyimide film, from a propylene group, a novolac A coating film formed of a resin such as an epoxide or a polyvinyl alcohol, preferably a polyimide film. 113765-970104.doc 200829667 - ... 419 Patent Application Replacing Chinese Manual Replacement Page (January 97) The polar solvent used in the present invention is a solvent having an excellent affinity with an organic coating film, preferably an aprotic aqueous organic solvent such as, but not limited to, a glycol compound, N-methyl leaf b-xanthone (N-methyl pyrrolidone; NMP), N,N-dimethylacetamide (DMAC), N,N-dimethylformamide (DMF), dimethyl sulfoxide ; DMSO) or a mixture thereof. The diol compound suitable as the polar solvent in the present invention is preferably carbitol and a derivative thereof, such as, but not limited to, diethylene glycol monobutyl ether; BDG), monoethyl ether monohydrazine [ethylene glycol], dimethyl ether monohydrazine [ethylene glycol], diethyl ether monohydrazine [ethylene glycol], dibutyl ether monohydrazine [ethylene glycol], acetic acid Monobutyl ether-hydrazine [ethylene glycol] or a mixture thereof. The polar solvent used in the present invention is contained in an amount of from about 5% by weight to about 90% by weight, based on the total weight of the composition, preferably from about 20% by weight to about 85% by weight. Preferably, the basic compound used in the present invention is preferably used. It is selected from the group consisting of an amine alcohol compound, a quaternary amine compound, and a mixture thereof. The amine alcohol compound suitable as the basic compound in the present invention is preferably selected from the group consisting of monoethanolamine (MEA), N-mercaptoethanolamine, N,N-dimethylethanolamine, N-ethylethanolamine, N· A group consisting of methyl, N-ethylethanolamine, N,N-diethylethanolamine, and mixtures thereof. The quaternary amine compound suitable for use as an inspective compound in the present invention is preferably selected from the group consisting of trimethylanilinium hydroxide and benzyltrimethylammonium 113765-970104.doc --- —— Patent Application No. 419 'Replacement of Chinese Patent Application Scope (January 97) X. Patent Application Range: 1. An organic coating film peeling composition comprising, based on the total weight of the composition, about 5 to About 90% by weight of a polar solvent, about 0.01 to about 50% by weight of a basic compound, and about 100 ppm to about 15% by weight of a metal corrosion inhibitor. 2. The organic film peeling composition according to claim 1 The organic coating film is a polyimide film coating composition. The organic coating film peeling composition according to claim 1, wherein the polar solvent is selected from the group consisting of glycol compounds and N-methyl p. N-methyl pyrrolidone (NMP), N,N-dimethylacetamide (DMAC), N,N-dimethylformamide (DMF), dimethyl Dimethyl sulfoxide (DMSO) and its mixture 4. The organic coating film peeling composition according to claim 3, wherein the glycol compound is selected from the group consisting of diethylene glycol monobutyl ether (BDG), Monoethyl ether, agglutination [ethylene glycol], diterpene (ether-anthracene [ethylene glycol], diethyl ether mono-hydrazine [ethylene glycol], dibutyl ether-hydrazine [ethylene glycol], acetic acid monobutyl The composition of the organic film peeling composition of claim 1, wherein the basic compound is selected from the group consisting of an amine compound, a quaternary amine compound, and The composition of the mixture of the organic coating film according to claim 5, wherein the amine alcohol compound is selected from the group consisting of monoethanolamine (MEA), N-mercapto 113765-970104.doc 200829667 ethanolamine a group consisting of N,N-dimethylethanolamine, N-ethylethanolamine, N-methyl, N-ethylethanolamine, N,N-diethylethanolamine, and mixtures thereof. The organic coating film peeling composition, wherein the quaternary amine compound is selected from the group consisting of trimethylaniline oxide (trimethylanilinium hydroxide), benzyltrimethylammonium hydroxide, choline hydroxide, tetramethy 1 ammonium hydroxide, tetrapropylammonium hydroxide A group consisting of tetrapropy 1 ammonium hydroxide) and mixtures thereof. 8. The composition for peeling off an organic coating film according to claim 1, wherein the metal corrosion inhibitor is selected from the group consisting of a benzotriazole derivative, a sugar alcohol derivative, an organic phenol compound, and a mixture thereof. Group. 9. The composition for peeling off an organic coating film according to claim 8, wherein the sugar alcohol derivative is selected from the group consisting of maltitol, polydextrose, xylitol, lactitol, A group consisting of mannitol, maltitol syrup, isomaltitol, sorbitol, and mixtures thereof. 10. The composition for peeling off an organic coating film according to claim 8, wherein the organic phenolic compound is catechol. A method of peeling off an organic coating film, comprising: contacting a metal substrate comprising an organic coating film with an organic coating film peeling composition according to any one of claims 1 to 10 to remove the organic coating material from the substrate membrane. 113765-970104.doc
TW96100419A 2007-01-05 2007-01-05 Composition and method for stripping organic coatings TWI338026B (en)

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KR1020097013729A KR20090122181A (en) 2007-01-05 2008-01-07 Composition and method for stripping organic coatings
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113736466A (en) * 2020-05-29 2021-12-03 新应材股份有限公司 Etchant composition, adhesion promoter, alkaline solution, method for removing polyimide and etching process
US11851597B2 (en) 2020-05-29 2023-12-26 Echem Solutions Corp. Etchant composition, tackifier, alkaline solution, method of removing polyimide and etching process

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101957565B (en) * 2010-08-28 2012-05-23 汕头超声印制板（二厂）有限公司 Organic film removing agent
CN103468052B (en) * 2013-09-27 2014-11-05 国家电网公司 Remover of electric porcelain insulator surface failure paint
JP2017197589A (en) * 2014-09-04 2017-11-02 横浜油脂工業株式会社 Peeling agent for ultraviolet-curable paints
CN111630117B (en) * 2018-01-19 2023-04-04 Mti株式会社 Stripping agent for stripping protective coating agent for cutting process
CN112230520A (en) * 2020-11-24 2021-01-15 合肥普庆新材料科技有限公司 Water-based PI film stripping liquid and PI film glass method thereof
CN112255899A (en) * 2020-11-24 2021-01-22 合肥普庆新材料科技有限公司 Water-based PI film stripping liquid and preparation method thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
JP2906590B2 (en) * 1990-06-14 1999-06-21 三菱瓦斯化学株式会社 Surface treatment agent for aluminum wiring semiconductor substrate
US7205265B2 (en) * 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US5753601A (en) * 1991-01-25 1998-05-19 Ashland Inc Organic stripping composition
JP3160344B2 (en) * 1991-01-25 2001-04-25 アシュランド インコーポレーテッド Organic stripping composition
US5496491A (en) * 1991-01-25 1996-03-05 Ashland Oil Company Organic stripping composition
US5988186A (en) * 1991-01-25 1999-11-23 Ashland, Inc. Aqueous stripping and cleaning compositions
JP3302120B2 (en) * 1993-07-08 2002-07-15 関東化学株式会社 Stripper for resist
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6268323B1 (en) * 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6319884B2 (en) * 1998-06-16 2001-11-20 International Business Machines Corporation Method for removal of cured polyimide and other polymers
JP2000129177A (en) * 1998-10-21 2000-05-09 Dainippon Toryo Co Ltd Peeling agent for polyimide resin-based orientation film
JP2000162787A (en) * 1998-11-27 2000-06-16 Sumitomo Bakelite Co Ltd Method for removing meat-resistant polymer protective film
US6319835B1 (en) * 2000-02-25 2001-11-20 Shipley Company, L.L.C. Stripping method
US6531436B1 (en) * 2000-02-25 2003-03-11 Shipley Company, L.L.C. Polymer removal
JP4661007B2 (en) * 2001-08-23 2011-03-30 昭和電工株式会社 Side wall remover

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113736466A (en) * 2020-05-29 2021-12-03 新应材股份有限公司 Etchant composition, adhesion promoter, alkaline solution, method for removing polyimide and etching process
US11851597B2 (en) 2020-05-29 2023-12-26 Echem Solutions Corp. Etchant composition, tackifier, alkaline solution, method of removing polyimide and etching process

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