200829399 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種切割異向性導電膜的裝置，更特別的 疋’係關於一種可避免損失依附於面板以結合驅動晶片於面板 之異向性導電膜，且可減少異向性導電膜依附於面板處理時間 之切割裝置。200829399 IX. Description of the Invention: [Technical Field] The present invention relates to a device for cutting an anisotropic conductive film, and more particularly to an inevitable loss of attachment to a panel for bonding a wafer to a panel The conductive film and the cutting device capable of reducing the anisotropic conductive film attached to the panel processing time.
【先前技術】 般而吕’液晶顯示(LCD)面板包含一個設置驅動裝置(如 薄膜電晶體(TFTs))之下(後)基板、—個設置濾、光層之上㈤基 板、將上基板及下基板結合在—起的黏著劑、以及位於上基^ 及下基板之間的液晶(LC)層。上基板、下基板與比層構成一 單元面板(爾後稱為面板），·且驅動顯示器的驅動晶片亦提供於 面板上。 當透過驅動晶片在下(後)基板的驅動裝置上施加電源時， 驅動裝置即可運作，且進而控制Lc層的Lc分子的位向二 此’控過LC層的光量，㈣在咖裝置塌_訊错 如圖1及2所示’係為所謂之 粒玻璃接合(C〇G地術中， 6 200829399 的邊緣’進而與面板的驅動 驅動晶片C係直接依附於面板p 裝置相連。 為使驅動晶片C依附於面板P，作為晶粒及面板間之黏著 物及導電橋之異向性導賴(ACF)1係施加在面板P上。接著， 驅動晶片c會被設置在面板p上的異向性導電膜i上。 圖3係部麵示在LCD面板上施加異向料電膜的機器 的示意圖。 如圖所不’旋轉兩個相離鏈齒4及5時，依附於防塵膜2 、/、向ί±導電膜3，係在放置於兩鏈齒4及$的狀態下被移 轉。在此’設置於異向輯賴3 “端_# 4 _為人 :端鍵齒，而設置於異向性導電膜3拉出端的鏈齒5係稱為 出口端鏈齒。 切告·早心係設置於供應異導麵3之供應輪(未圖 不)與入口端鏈齒4之間。侧單元6係根據依附在面❹之 驅動晶片c的大小異向性導麵3為預定長度。 7 200829399[Prior Art] The general liquid crystal display (LCD) panel includes a substrate (such as thin film transistors (TFTs)) under the (back) substrate, a set of filters, a light layer (5) substrate, the upper substrate And an adhesive attached to the lower substrate and a liquid crystal (LC) layer between the upper substrate and the lower substrate. The upper substrate, the lower substrate and the specific layer constitute a unit panel (hereinafter referred to as a panel), and a driving wafer for driving the display is also provided on the panel. When a power source is applied to the driving device of the lower (rear) substrate through the driving wafer, the driving device can operate, and thereby control the position of the Lc molecule of the Lc layer to control the amount of light passing through the LC layer, and (4) collapse in the coffee device. The error is shown in Figures 1 and 2, which is the so-called granule glass joint (C〇G, the edge of 6 200829399) and then connected to the panel drive device C directly connected to the panel p device. C is attached to the panel P, and is applied to the panel P as an adhesion between the die and the panel and an anisotropic guide (ACF) 1 of the conductive bridge. Then, the driving wafer c is placed on the panel p in the opposite direction. Figure 3 is a schematic view showing a machine for applying an anisotropic film on an LCD panel. When the two opposing elements 4 and 5 are not rotated, they are attached to the dustproof film 2, /, to ί ± conductive film 3, is placed in the state of the two-chain teeth 4 and $ is transferred. Here 'set in the opposite direction 3 "end_# 4 _ is the person: the end key teeth, and The sprocket 5 disposed at the pull-out end of the anisotropic conductive film 3 is referred to as an exit end sprocket. The supply wheel 3 (FIG does not) between the inlet end of the fastener 4. The line-side unit 6 attached to the surface of the drive ❹ c wafer size anisotropy guide surface 3 of predetermined length. 7200829399
支撐面板P的支禮單元7係設置於異向性導電膜3下，位 於亡口端鏈齒4與出口端鏈齒5之間。結合頭8係設置於異向 膜3之上’位於人口端鏈齒4與出口端鏈齒$之間。D 以下詳述異向性導電膜3依附於面板卩之作業。 首先，旋轉入口端鏈齒4以及出口端鏈齒5，藉此以預設 ^離移轉依瞻防細2上載於兩個鏈齒4與5的異向性導 电膜3。異向性導f膜3係崎應將依附於面板p之驅動晶片 c士長度(大小)的預設轉作移轉。每#移轉異向性導電膜3 時切副單6會作線性往復運動，進而切割異向性導電膜3。 接著，由切割單元6以預設長度所切割而成的異向性導電膜3 膜片’會隨著位於兩鏈齒4與5間的結合頭8重複上下移動的 =時’依附於面板P的姐。#支撐單元7支伽板p的同 時’其亦會以舰的雜作義，使異向性導賴3的膜片依 附於面板P的位置’此位置係鶴晶# C將要依附的位置。 將異向性導電膜3之膜片！所依附的面板p移轉至另一機 盗。接著，在另_機器，分別將驅動晶片c依附於依附在面 板P上之異向性導電膜3的膜片丨上。 8 200829399 然而’上述裝置具有以下缺失。 由於依眺面板p的驅動晶片c具有不同長度，因此切 割早兀6所切割的異向性導電膜3膜片需要對應不同長度。在 此’由於切割單元6係設置於供應輪與入口端鏈齒*之間，因 • 此會發生損失異向性導電膜3的情況。再者，由於移轉損失的 異向性$電膜3需要時間，因此會増加整體處理時間。 叭收罝於面板Ρ上的驅 U Α具有2Gmm的長度，而三彳_直方式放置於面板ρ 據=ΓαΒ具有15随的長度時，異向性導電膜3需根 Κ 卿侧销，料性導電膜3 =動Β啦權作_。_，貞責將_ W膜3的切顧片依附於面板p的結合頭δ的 同於負責切割異向性導電膜3之切割單元6的位置。不 異向性導触3係在移轉 料 b’ A作切宝|J。接“± 收6對應四飢驅動晶片 性導帝膜3的彳 據驅動晶片A的長度作切割的異向 切割單元：:口以透過結合頭8依附㈣^ 曰、一個驅動晶片B切割異向性導電膜3。在 9 200829399 驅動晶片A的異向性導電_由結合頭_於面板p P對應驅動晶片B的異向性導電膜膜片會根據預設的距離 而被移轉到結合頭。在此，關設輯移翻異向性導電膜膜 片則會被浪費掉，且亦會浪f移轉此則的時間。 【發明内容】The support unit 7 of the support panel P is disposed under the anisotropic conductive film 3 between the dead end sprocket 4 and the exit end sprocket 5. The joint head 8 is disposed above the anisotropic film 3 between the population end sprocket 4 and the outlet end sprocket $. D The following is a detailed description of the operation of the anisotropic conductive film 3 attached to the panel. First, the inlet end sprocket 4 and the outlet end sprocket 5 are rotated, whereby the anisotropic conductive film 3 which is carried on the two sprocket teeth 4 and 5 by the shift prevention 2 is preset. The anisotropic conductive film 3 is intended to shift the preset of the drive wafer c-length (size) attached to the panel p. When the # anisotropic conductive film 3 is transferred, the cut-off sheet 6 linearly reciprocates, thereby cutting the anisotropic conductive film 3. Then, the anisotropic conductive film 3, which is cut by the cutting unit 6 at a predetermined length, is attached to the panel P as the bonding head 8 located between the two sprocket teeth 4 and 5 repeatedly moves up and down. Sister. #Support unit 7 gauge p at the same time' It will also use the ship's miscellaneous sense, so that the diaphragm of the anisotropic guide 3 is attached to the position of the panel P. This position is the position where the crane C #C will be attached. The diaphragm of the anisotropic conductive film 3! The attached panel p is moved to another pirate. Next, on the other machine, the drive wafer c is attached to the diaphragm of the anisotropic conductive film 3 attached to the face plate P, respectively. 8 200829399 However, the above device has the following drawbacks. Since the driving wafers c depending on the panel p have different lengths, it is necessary to cut the anisotropic conductive film 3 which is cut as early as 6 to have different lengths. Here, since the cutting unit 6 is disposed between the supply wheel and the inlet end sprocket*, the loss of the anisotropic conductive film 3 occurs. Furthermore, since the anisotropy of the transfer loss takes time, the overall processing time is increased. The drive U Α on the panel Α has a length of 2Gmm, and the three-turn _ straight mode is placed on the panel ρ = Γ α Β has a length of 15, the anisotropic conductive film 3 needs to be 侧 侧 侧 ,, Conductive film 3 = Β Β 作 _. _, it is the responsibility of attaching the dicing sheet of the _W film 3 to the bonding head δ of the panel p at the same position as the cutting unit 6 responsible for cutting the anisotropic conductive film 3. The anisotropic guide 3 series is used as a cutting material | Connected to the "±6" corresponding to the four hunger-driven wafer-oriented film 3, according to the length of the driving chip A for cutting the opposite direction cutting unit:: port through the bonding head 8 attached (four) ^ 曰, a driving wafer B cutting anisotropic Conductive film 3. The anisotropic conduction of the driving wafer A at 9 200829399 _ the anisotropic conductive film diaphragm corresponding to the driving wafer B by the bonding head _ the panel p P is transferred to the bonding head according to the preset distance Here, the turn-over of the anisotropic conductive film is shut down, and the time is also shifted. [Summary of the Invention]
因此’本翻之—目的係在提供—财避免損失依附於面 反以依附畴晶片於面板上之導電膜，以及可減短將導電膜依 附面板上之處理時間的異向性導電膜之切割裝置。 >為達壯歧其他優勢，健本發明之目的，如在此所實 及廣我&述’係提供—翻㈣向性導電麟裝置，其包含 移轉異向性導電膜的移轉褒_置、負責依附異向性導電膜之膜片 φ 乂將某膜片依附於面板的結合頭之依附工具、以及將移轉單元 所移轉而來的異向性導麵切縣具有某長度之則且係位 於結合頭依附工具與移轉單元之間的切割單元。 伴Ik圖式及以下本發明之詳述，熟此技藝者當更易明瞭本 發明之上述及其他目的、特徵、面向及伽。 、 200829399 【實施方式】 其範例係以伴隨圖式作 以下將詳述本發明之較佳實施例， 描述。 此後’本發明之異向_賴切難置將伴_式詳述如 下。 圖5與6係分別顯示本發明之一般異向性導電膜切㈣置 用以將異向性導電麟合於LCD面板的機器之側視與前視 圖0 如圖所示，結合異向性導電膜於LCD面板之機器係包含 底板100、設置於底板100上並具有支撐面板p之上表面的支 ⑩ 撐單元200、以及設置於支撐單元200上表面後端與支撐單元 200 —起支撐面板P之面板台3〇〇。 結合頭400係設置於支撐單元2〇〇之上。提供移轉單元， 以負責在結合頭4〇〇與支撐單元200間移轉異向性導電膜30。 結合頭400包含垂直移動頭410,以及設置於頭部構件410 200829399 附工具，其係可移動以接觸異向性導電膜30。 移車π單元包3兩個相隔的鏈齒⑽與別，以及分別旋轉 鏈齒510與520的旋轉驅動單元511。結合頭·係設置賤 齒510與鏈齒520之間。設置於異向性導電膜3〇之入口端且 朝向結合頭400的鏈齒510係稱為入口端鏈齒，而設置於入口 _ 端鏈齒510對面的鏈齒52〇係稱為出口端鍵齒。 身又而吕，導電膜30係異向性導電膜(ACF)，用以將驅 動曰曰片C依附於面板ρ。異向性導電膜3〇係依附於防塵膜加， 且係以在供應輪(未圖示)上轉動的狀態下設置於機器上。在供 應輪上轉動的異向性導電膜3〇可停止轉動，以載於兩個鍵齒 _/、520 ’而在與面板結合期間，分離人^^後所剩下的保護 # ^轉動到亦提供於機器上之捲繞輪(未圖示）。在此，異向性 $兒膜30係在結合頭4〇〇與支撐單元2㈨間作移轉。 ^垂直支撐框600係位於底板100後端，而支撐架010係固 定於支撐框600。切割異向性導電膜3〇的切割單元7〇〇係設 置於支撐架610。 12 200829399 如圖7所示，切割單元包含一主體71〇、兩個可移動 地輕接主體710的支撐钳72〇、72卜驅動兩支撐鉗72〇、721 的第一驅動單元74G、具有某長度且耦接支撐钳720、721之 一較低支撐鉗721的切割器730、以及於垂直於切割器73〇長 度方向的方向穿越主體71〇的第二驅動單元75()、以及以切割 器730的長度方向移動主體71〇的第三驅動單元76〇。 兩個支撐鉗720、721係耦接主體71〇前表面，以上下移 動而接近或離開彼此。十刀割器73(M系固定式耦接較低的支樓鉗 721。 第二驅動單元75G包含-引導單元’其具有兩個軌道751 -以及移動於執道上的滑動件(Slider)752，使滑動件乃2作往復 運動的滾珠螺桿753，以及旋轉滾珠螺桿753的馬達乃4。 第三驅動單元760包含兩個設置於第二驅動單元75〇之滑 動件752的執道761、可滑動地耦接執道761並固定式耦接主 體710的滑動件762，使滑動件762作往復運動的滾珠螺桿 763、以及旋轉滾珠螺桿763的馬達764。 13 200829399 切吾彳單元700係設置於結合頭4〇〇與移轉單元之間。當移 轉單元包含兩個鏈齒510與520時，切割單元7〇〇係設置於入 口端鏈齒510與結合頭400之間。較佳地，切割單元7〇〇的切 割器73(H系設置於結合頭400之依附工具42㈣一端，並與其 對背。當結合頭400的依附工具42〇被新的依附工具所替換 時’切割器730會移動而與結合頭4〇〇的新依附工具42〇的一 • 端對齊。依附工具420的一端係異向性導電膜30的入口端。 阿1固叉得鉗720 …一 1示田弟一驅動单元740以彼此相反 、向垂直於切副單元7〇〇的前表面之方向移動。主體彻 於其上的滑動件762，係由第三驅動單元·的馬達764 :者兩個執道761作移動。同時，主體710係以切割器73〇 方長度方向作往復運動(係相對於切财元縣_方向作往 體710與第三驅動單元76〇設置於其上的滑動件说， 時，弟—驅動單元75〇的馬達7M沿兩個軌道π作移動。同 導電 ^單TL7GG可以許多不同的機制實施， % 3〇的相同方向、上下方向、以及前後方向作移動 以朝移轉異向性 14 200829399 接著，將描述本發明之LCD面板異向性導電膜切割裝置 的作業。 切割單元700的第二驅動單元75〇移動切割單元7〇〇的主 體710 ’使切杳j态730設置於結合頭4〇〇依附工具一端之同一 _ 線上。 接著，由移轉單元移轉非固定式地依附於防塵膜的異向性 導電膜30。在移轉單元包含兩個鏈齒的情況下，負載異向性 ‘電膜30的兩個鏈齒會作旋轉，而以預設的距離移轉異向性 導電膜30。在此，異向性導電膜3〇所移轉的預設距離，係等 ， ^於欲依附於面板P之驅動晶片C的長度。爾後，將根據先 ⑩ ㈣轉單元包含兩個鏈齒训與52〇的情況作詳細描述。 一旦異向性導電膜3〇以預設距離作移轉，接著，第三驅 動單元760將主體71〇向前移動。藉此，異向性導電膜3〇係 設置於主體710的支撐钳720、721之間。同時，切割單元7〇() 的第一驅動單元74Θ移動兩個支撐鉗72〇、721。藉此，設置 於較低支撐鉗721的切割器730會切割異向性導電膜3〇。 15 200829399 旦切剔盗730切割異向性導電膜3 0，第-驅動單元740 分開兩個支擇钳720、72卜而第三驅動單元76〇將主體71〇 向後移動(收回）。 接著，兩個鏈齒因而旋轉，而再次以預設距離移轉異向 • 性導電膜30。依照上述程序，切割器730會將異向性導電膜 30切割成預設長度。 同時，結合頭400向下移動，結合頭400的依附工具420 將異向性導電膜的切割膜片依附於支撐單元2〇〇上的面板ρ 上。 隨著切割單元700的切割作業與結合頭4〇〇結合作業之重 複運作，異向性導電膜的切割膜片會依附於面板ρ。 苓照圖8,當欲依附於面板Ρ的驅動晶片c具有不同長度 % ’切割單兀700所切割的異向性導電膜之膜片會對應不同的 長度。亦即’異向性導電膜切割膜片的長度分別對應依附於面 板Ρ之對應驅動晶片Α之長度，接著小於晶片a之對應驅動 16 200829399 晶片B長度㈣向性導電膜_則會依附於面板p。在此情 況下’異向性導電膜30會由移轉單元以對應驅動晶片a之距 離作移轉。接著，由切割器別切割異向性導電膜3〇。接著， 移動面板P，祕合頭亦向下移動。#結匈·向下移 動時，結合頭働驗附工具42〇會將切割為驅動晶片A長 度之異向性導電膜的膜片依附於面板p。隨著上述程序的重複 作業’對應鷄g A峨量的異向性導魏之則幻係依 附於面板。 ” 然後’異向性導電膜30以對應驅動晶片B之長度的距離 作移轉，姆應73〇切_向轉賴。接著，移動面板 P且向下移動結合頭_。當向下移動結合頭時’从頭Therefore, the purpose of the present invention is to provide a conductive film that adheres to the surface of the wafer on the panel, and to cut the anisotropic conductive film that can reduce the processing time of the conductive film on the panel. Device. > In order to achieve other advantages of Zhuang Zhuang, the purpose of the invention is as described herein, and the method of providing a turn-over (four) directional conductive device comprising shifting the transfer of anisotropic conductive film褒_Set, responsible for the diaphragm of the anisotropic conductive film φ 依 attaching a film to the bonding head of the panel, and the anisotropic guiding surface The length is also the cutting unit between the bonding head attachment tool and the transfer unit. The above and other objects, features, aspects and advantages of the present invention will become apparent to those skilled in the <RTIgt; [Embodiment] The following is a description of the preferred embodiments of the present invention in the accompanying drawings. Hereinafter, the inversion of the present invention will be described in detail below. 5 and 6 respectively show a general anisotropic conductive film of the present invention. (4) A side view and a front view of a machine for anisotropic conductive bonding to an LCD panel. As shown in the figure, combined with anisotropic conduction The machine for filming the LCD panel comprises a bottom plate 100, a support 10 disposed on the bottom plate 100 and having a surface supporting the upper surface of the panel p, and a rear end surface provided on the upper surface of the support unit 200 together with the support unit 200 to support the panel P The panel is 3 〇〇. The bonding head 400 is disposed above the support unit 2A. A transfer unit is provided to transfer the anisotropic conductive film 30 between the bonding head 4 and the supporting unit 200. The bonding head 400 includes a vertical moving head 410, and is attached to the head member 410 200829399 with a tool that is movable to contact the anisotropic conductive film 30. The shifting π unit pack 3 has two spaced apart sprocket teeth (10) and a rotary drive unit 511 that rotates the sprocket teeth 510 and 520, respectively. The joint head is disposed between the teeth 510 and the sprocket 520. The sprocket 510 disposed at the entrance end of the anisotropic conductive film 3〇 and facing the bonding head 400 is referred to as an inlet end sprocket, and the sprocket 52 disposed opposite the inlet _ end sprocket 510 is referred to as an exit end key. tooth. The body is also fused, and the conductive film 30 is an anisotropic conductive film (ACF) for attaching the driving cymbal C to the panel ρ. The anisotropic conductive film 3 is attached to the dustproof film and is placed on the machine in a state of being rotated on a supply wheel (not shown). The anisotropic conductive film 3 turns rotated on the supply wheel to stop rotating to be carried on the two key teeth _/, 520', and during the bonding with the panel, the remaining protection #^ is rotated to A winding wheel (not shown) is also provided on the machine. Here, the anisotropic film 30 is transferred between the bonding head 4〇〇 and the supporting unit 2 (9). The vertical support frame 600 is located at the rear end of the bottom plate 100, and the support frame 010 is fixed to the support frame 600. A cutting unit 7 that cuts the anisotropic conductive film 3A is placed on the support frame 610. 12 200829399 As shown in FIG. 7, the cutting unit comprises a main body 71〇, two supporting clamps 72〇, 72 for movably connecting the main body 710, 72, and a first driving unit 74G for driving the two supporting jaws 72〇, 721, having a certain a cutter 730 having a length and coupled to one of the lower support jaws 721 of the support jaws 720, 721, and a second drive unit 75 () passing through the body 71〇 in a direction perpendicular to the length direction of the cutter 73〇, and a cutter The third drive unit 76A of the main body 71 is moved in the longitudinal direction of the 730. The two support jaws 720, 721 are coupled to the front surface of the body 71 and are moved up and down to approach or separate from each other. a cutter cutter 73 (M system is fixedly coupled to the lower branch clamp 721. The second drive unit 75G includes a guide unit having two rails 751 - and a slider 752 that moves on the road, The ball screw 753 for reciprocating the slider 2 and the motor for rotating the ball screw 753 are 4. The third driving unit 760 includes two 761 slidable 761 disposed on the slider 752 of the second driving unit 75, slidable The coupling mechanism 761 is fixedly coupled to the sliding member 762 of the main body 710, the ball screw 763 for reciprocating the sliding member 762, and the motor 764 for rotating the ball screw 763. 13 200829399 The cutting unit 700 is disposed in combination Between the head 4 〇〇 and the shifting unit. When the shifting unit comprises two sprocket 510 and 520, the cutting unit 7 is disposed between the inlet end sprocket 510 and the coupling head 400. Preferably, the cutting The cutter 73 of the unit 7 (H is disposed at one end of the attachment tool 42 (four) of the joint head 400 and is opposite thereto. When the attachment tool 42 of the joint head 400 is replaced by a new attachment tool, the cutter 730 moves. And the new attachment tool 4 with the head 4 One end of the attached tool 420 is attached to the inlet end of the anisotropic conductive film 30. A 1 fixed fork 720 ... - 1 shows that the drive unit 740 is opposite to each other, perpendicular to the cut pair The direction of the front surface of the unit 7〇〇 is moved. The slider 762 on which the main body passes is moved by the motor 764 of the third driving unit: the two lanes 761. At the same time, the body 710 is driven by the cutter 73. The reciprocating motion of the length direction of the crucible (relative to the slider of the cutting body _ direction 710 and the third driving unit 76 说), when the motor 7M of the driving unit 75 沿The trajectory π is moved. The same TL7GG can be implemented in many different mechanisms, and the same direction, the up and down direction, and the front and rear direction of %3〇 are moved to shift the anisotropy. 14 200829399 Next, the LCD of the present invention will be described. The operation of the panel anisotropic conductive film cutting device. The second driving unit 75 of the cutting unit 700 moves the body 710' of the cutting unit 7 to set the cutting state 730 to the same end of the bonding head 4 Online. Next, by transfer The meta-transfer is attached to the anisotropic conductive film 30 of the pellicle film in a non-fixed manner. In the case where the transfer unit includes two sprocket teeth, the two sprocket teeth of the load-anisotropy 'electro-membrane 30 are rotated, and The anisotropic conductive film 30 is transferred at a predetermined distance. Here, the predetermined distance at which the anisotropic conductive film 3 is transferred is, for example, the length of the driving wafer C to be attached to the panel P. This will be described in detail based on the case where the first 10 (four)-turn unit includes two sprocket and 52 。. Once the anisotropic conductive film 3 移 is shifted by a predetermined distance, then the third driving unit 760 slid the main body 71 Move forward. Thereby, the anisotropic conductive film 3 is provided between the support jaws 720, 721 of the main body 710. At the same time, the first driving unit 74 of the cutting unit 7〇() moves the two supporting jaws 72〇, 721. Thereby, the cutter 730 provided to the lower support jaw 721 cuts the anisotropic conductive film 3A. 15 200829399 The thief 730 cuts the anisotropic conductive film 30, the first driving unit 740 separates the two supporting tongs 720, 72, and the third driving unit 76 移动 moves the main body 71 〇 backward (retracted). Then, the two element teeth are thus rotated, and the anisotropic conductive film 30 is again transferred by a predetermined distance. According to the above procedure, the cutter 730 cuts the anisotropic conductive film 30 into a predetermined length. At the same time, the bonding head 400 is moved downward, and the attaching tool 420 of the bonding head 400 attaches the cutting film of the anisotropic conductive film to the panel p on the supporting unit 2''. As the cutting operation of the cutting unit 700 and the bonding operation of the bonding head 4 are repeated, the dicing film of the anisotropic conductive film is attached to the panel ρ. Referring to Fig. 8, when the driving wafer c to be attached to the panel 具有 has a different length % ′, the diaphragm of the anisotropic conductive film cut by the single cymbal 700 may correspond to different lengths. That is, the length of the anisotropic conductive film dicing film corresponds to the length of the corresponding driving chip 依 attached to the panel ,, and then is smaller than the corresponding driving of the wafer a 16 200829399 The length of the wafer B (four) directional conductive film _ will be attached to the panel p. In this case, the anisotropic conductive film 30 is transferred by the transfer unit at a distance corresponding to the drive wafer a. Next, the anisotropic conductive film 3 is cut by a cutter. Then, moving the panel P, the secret head also moves downward. #结匈· When moving downward, the film of the anisotropic conductive film cut to drive the length of the wafer A is attached to the panel p in conjunction with the head inspection tool 42. With the repetitive operation of the above procedure, the illusion is attached to the panel corresponding to the anisotropy of the chicken g A峨. Then, the anisotropic conductive film 30 is shifted by the distance corresponding to the length of the driving wafer B, and then the substrate is moved. Then, the panel P is moved and the bonding head _ is moved downward. Head from the beginning
的依附工具物將切割為驅動晶片B長度之異向性導電膜 的版片32依附於面板P。隨著上述程序的重複作業，對應驅 動晶片B之數频異向性導電叙則32係依·面板上。 由於切割器730係設置於用以結合異向性導電膜機器的 谓工具42〇 一端的同一線上，若欲將異向性導電膜切割為不 同大小，則改變異向性導電膜3〇的移轉距離。接著，㈣里 向性導電膜3G，而異向性導電膜的_膜片則依附於面板卜 200829399 異向性導電膜的膜片所依附的面板，接著 機器或機台’其中驅動晶片係依附於異向性導電膜^ -個 而異向性導電膜的則係依附於面板p。％片上’ ^據她，切割單元係設置於結合物與 兀^間嘯此’當欲將異向性導賴3G切割為不同長度的膜 片…係改變異向性導電膜的移轉距離。接著，由結彻 將獅導麵的_職瞻谢,，本發口明得以 性彻_，梅观異向峨膜所需的時 間。特別疋當切割單元的切割器73G係設置於結合頭伽 之依附工具的―端關—線上時，_的異向性導電膜不合有 不必要的膜片。藉此，得以避免浪費異向性導賴，且減対 轉異向性導電膜的時間。 再者切』單元7〇〇的主體71〇與切割器73〇係相對於立 前表面的水平方向、垂直方向、前後方向移動，使切割器別 的位置得以根據結合頭彻的依附工具種類作自由的變化。 如上述’根據本發明異向性導電膜可簡單且快速地根據需 18 200829399 求切割為不同大小’且異向性導電膜的切瓶片可依附於面板 上而不浪費膜或4間。藉此，異向性導電膜的使用量會 降低，而減少製造成本。再者，由於本發明避免習知技術移轉 異向性導電膜所花費的時間，因而縮短將異向性導電膜依附於 面板的整體處理時間，進而增加生產率。 上述實施例及優點僅供範例之用，並非用以限制本發明。 X月田可以其他姻之|置實施。在此的描麵供闊明之 私心不限制以下申睛專利範圍之範脅。熟知此技藝者當知本 :月可作許多替換、改變及_。在此所述之特徵、架構、方 j及其他特徵可以任何方式作結合，以包含其他額外的示範實 :知相是’本發明可以料獅實施， 破，因此除非特別明+ L ⑽雕具特 節，且應以廣Μ…迷實施例並不受限於前述的任何細 u "V域方式解釋申請專利範圍所定義之鱗，所有 、㈣及變化與其類似者皆落人中請專利範圍内。7 圖式簡單說明】 伴隨圖式係用以進， 步描述本發明，且作為本說明 書之一 19 200829399 部分，其圖式繪示本發明之各實施例，並同時與以下插述一同 解釋本發明之原則。 圖1係顯示習知技術之LCD面板的平面圖。 圖2係顯示驅動晶片依附於LCD面板之狀態的剖面圖。 圖3係部分顯示習知切割異向性導電膜之裝置所使用將異 向性導電膜結合於LCD面板的機器之前視圖。 _ 目4係顯示異向性導電膜之膜片依附於LCD面板之狀態 的平面圖。 "" 圖5與6係分別顯示本發明之異向性導電膜切割裝置用以 :“向料賴結合於LCD面板的鋪之侧視與前視圖。 圖7係顯tf本發明之異向性導電膜域裝置的切割單元的 透視圖。 _目c/縣&明之異触導賴_懷置的作餘態的前視 【主要元件符號說明】 C驅動晶片 P面板 1暝片 2防塵膜 20 200829399 3異向性導電膜 4入口端鍵齒 5出口端鏈齒 6切割單元 7支撐單元 8結合頭 A驅動晶片 B驅動晶片 20防塵膜 30異向性導電膜 31異向性導電膜膜片 32異向性導電膜膜片 100底板 200支撐單元 300面板台 400結合頭 410垂直移動頭 420依附工具 510鏈齒 520鏈齒 200829399 垂直支撐框 支撐架 切割單元 主體 支撐鉗 支撐钳 切割器 第一驅動單元 第二驅動單元 執道 滑動件 滾珠螺桿 馬達 第三驅動單元 執道 滑動件 滾珠螺桿 馬達 22The attachment tool cuts the plate 32, which is an isotropic conductive film that drives the length of the wafer B, to the panel P. With the repeated operation of the above procedure, the number-frequency anisotropic conductive pattern 32 corresponding to the driving wafer B is on the panel. Since the cutter 730 is disposed on the same line of the end of the tool 42 for bonding the anisotropic conductive film machine, if the anisotropic conductive film is to be cut into different sizes, the anisotropic conductive film 3 is changed. Transfer distance. Next, (4) the directional conductive film 3G, and the _ film of the anisotropic conductive film is attached to the panel to which the diaphragm of the anisotropic conductive film of the panel 200829399 is attached, and then the machine or the machine 'in which the driving chip is attached The anisotropic conductive film is attached to the panel p. % On the film, according to her, the cutting unit is disposed between the conjugate and the 兀^. When the azimuth is to be cut into 3G films of different lengths, the shifting distance of the anisotropic conductive film is changed. Then, by the completion of the lion's guide, the clarification of the fascination, the hair of the hair is _, the time required for the ecstasy. In particular, when the cutter 73G of the cutting unit is disposed on the "off-off" line of the bonding tool, the anisotropic conductive film of _ does not have an unnecessary film. Thereby, it is possible to avoid wasting the anisotropy and reducing the time of turning the anisotropic conductive film. Further, the main body 71〇 of the unit 7〇〇 and the cutter 73 are moved in the horizontal direction, the vertical direction, and the front-rear direction with respect to the front surface, so that the position of the cutter can be made according to the type of the attached tool. The change of freedom. As described above, the anisotropic conductive film according to the present invention can be cut into different sizes simply and quickly according to the requirements 18 200829399 and the cut-off sheets of the anisotropic conductive film can be attached to the panel without wasting the film or the four. Thereby, the amount of use of the anisotropic conductive film is lowered, and the manufacturing cost is reduced. Furthermore, since the present invention avoids the time taken for the conventional technique to transfer the anisotropic conductive film, the overall processing time for attaching the anisotropic conductive film to the panel is shortened, thereby increasing productivity. The above embodiments and advantages are for illustrative purposes only and are not intended to limit the invention. X Yuetian can be implemented in other marriages. The self-explanation in this section is not limited to the scope of the following patent scope. Those skilled in the art are aware of this: many replacements, changes, and _ can be made in the month. The features, architectures, aspects and other features described herein may be combined in any manner to include other additional exemplary embodiments: the phase is 'the invention can be implemented by a lion, broken, so unless specifically stated + L (10) The special section, and should be ambiguous, the embodiment is not limited to any of the aforementioned fine u "V domain methods to explain the scale defined by the scope of the patent application, all, (4) and the changes and similarities are in the middle of the patent Within the scope. 7 BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are used to describe the present invention in a step-by-step manner, and as a part of this specification 19 200829399, the drawings illustrate various embodiments of the present invention, and at the same time interpret the present explanation together with the following The principle of invention. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing a conventional LCD panel. 2 is a cross-sectional view showing a state in which a driving wafer is attached to an LCD panel. Fig. 3 is a front view partially showing a machine for bonding an anisotropic conductive film to an LCD panel using a conventional apparatus for cutting an anisotropic conductive film. _ Head 4 is a plan view showing a state in which the diaphragm of the anisotropic conductive film is attached to the LCD panel. "" Figures 5 and 6 respectively show the anisotropic conductive film cutting device of the present invention for: "Side view and front view of the tile bonded to the LCD panel. Figure 7 shows the difference between the present invention and the present invention. A perspective view of a cutting unit of a directional conductive film field device. _Mc/County& Ming zhi zhi _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Dust film 20 200829399 3 Anisotropic conductive film 4 Inlet end Key 5 Outlet end sprocket 6 Cutting unit 7 Support unit 8 Bonding head A Driving wafer B Driving wafer 20 Dust film 30 Anisotropic conductive film 31 Anisotropic conductive film Diaphragm 32 anisotropic conductive film diaphragm 100 bottom plate 200 support unit 300 panel table 400 joint head 410 vertical moving head 420 attached tool 510 chain teeth 520 chain teeth 200829399 vertical support frame support frame cutting unit main body support pliers support pliers cutter A driving unit, a second driving unit, a track, a ball screw motor, a third driving unit, a ball, a ball screw motor 22