200828468 九、發明說明 【發明所屬之技術領域】 本發明，係有關於在半導體安裝電路帶之製 管時，作爲共同捲繞所使用的間隔帶、以及其製 【先前技術】 近年，在個人電腦或是電視等之顯示器中， 化等的觀點而言，係要求有薄型化。因此，對於 器面板（LCD )等之平面面板顯示器的需求係提 驅動此些之平面面板顯示器，通常係使用有驅動 體，而多數之此種驅動用的半導體，係被安裝 TAB ( Tape Automated Bonding )或者是 COF Flex Circuit)之半導體安裝電路帶（以下，亦單 「電路帶」）上。 此些之電路帶的製造，通常係藉由以下之方 〇 首先，在聚醯亞胺樹脂等之塑膠薄膜帶上， 樹脂等之接著劑，並藉由衝孔而形成被稱作元件 部，而於此之上將銅箔藉由熱滾輪等來進行熱接 帶狀貼銅層積板，再進而於兩端部形成被稱作扣 (sprocket hole)之搬送用的連續孔。接下來， 銅鈾刻用感光性光阻劑之塗布、曝光、顯像、銅 阻劑剝離等，而形成電路，並形成用以保護該電 造或是保 造方法者 從省能源 液晶顯示 昇。爲了 用之半導 在被稱爲 〔Chip on 純記載爲 法而進行 塗布環氧 孔的開口 合以形成 鏈齒輪孔 若是藉由 蝕刻、光 路之保護 200828468 用光阻層，則可得到電路帶。 另外，電路帶的製造，係亦可藉由以下之方法而進行 〇 若是將在聚醯亞胺等之耐熱性薄膜上藉由濺鍍或電鍍 等之方法而形成有銅層的貼銅層積板、或是將在壓延銅箔 又或是電解銅箔上塗布有聚醯亞胺漆而形成有聚醯亞胺層 的貼銅層積板等之所謂無接著劑貼銅層積板作爲原材料而 使用，並對此些進行切縫加工而形成帶狀，而與上述相同 的，進行扣鏈齒輪孔的形成、電路的形成、並進而形成保 護用光阻層，則可以得到電路帶。 在此些之電路帶的製造中，通常，係採用使用有由鋁 或是塑膠等所作成之捲盤的被稱爲捲帶式（reel to reel) 之方式，並將各工程中之拉出以及捲入連續進行。 在捲帶式方式中，當將電路帶捲繞於捲盤上時，電路 帶彼此係會相互接觸，而會有在其表面上產生損傷的可能 性。於此，爲了不對電路帶造成損傷，而使用有間隔帶。 間隔帶，係由聚對苯二甲酸乙二醇酯或是聚醯亞胺等之塑 膠薄膜所成，並藉由於其兩端施加壓花處理，而規則地設 置有凸部者。故而，只要將間隔帶與電路帶共同捲繞，則 由於電路帶彼此係不會相互接觸，因此電路帶之表面係被 保護。 於圖9之（a ) 、（ b )中，展示此種被使用於與電路 帶之共同捲繞中的間隔帶之例。此間隔帶5，係藉由在塑 膠帶之兩端部施加壓花加工來形成突起6，而被製造。因 -5- 200828468 此，在塑膠帶之其中一側的面上，係被形成有突起6，另 一方面’在相反側之面上，係被形成有凹部6b。若是將具 有此種凹部之間隔帶5，與電路帶作共同捲繞，則在突起 6與凹部6b之位置重合時，突起6會和電路帶一起進入至 凹部6b中’其結果，在電路帶之端面上會產生波狀彎折 ，而會產生有：容易產生電路帶表面之損傷，或是在測試 銲墊、內導線、外導線等之接合部處容易產生損傷的問題 〇 爲了解決此種問題，在日本專利公開第2 0 0 3 - 6 8 8 0 2 號中’係提案有：在其中一面又或是在兩面被形成有突起 之晶片間隔物。此晶片間隔物，由於係將由聚丙烯、聚甲 醛、聚乙烯等之合成樹脂製的個片所成之間隔物用突起， 和聚對苯二甲酸乙二醇酯等之合成樹脂基材分開製作，再 藉由接著劑而將間隔物用突起接著於合成樹脂基材上，而 藉由超音波接著或者是溶著等的方法，來形成凸部者。然 而’此晶片間隔物，由於係爲藉由將分開製作之突起固定 接著於基材上的方法所製造者，因此除了生產性差之外， 亦會有間隔物之重量較重而使突起容易從基材上脫落等的 在處理上或者是耐久性上之問題。 又，在日本專利公開第2002- 1 848 1 8號中，係揭示有 :在帶之兩面上，沿著該帶之左右兩端，以一定之間隔來 塗布光硬化型樹脂並使其乾燥，而形成突起的間隔帶。此 間隔帶，在製造上係爲容易，而生產性係爲優良。然而， 此間隔帶，由於係僅是將由光硬化型樹脂所成之凸起固定 -6 - 200828468 接著在樹脂製的帶上，因此，係容易從帶上脫落，在處理 上以及耐久性上係有問題。 在此種狀況下，係期待能夠開發一種：製造爲容易、 生產性爲優良、且爲輕量而耐久性亦高之間隔帶。 【發明內容】 [發明所欲解決之課題] 本發明之目的，係在於提供一種：被使用於爲了進行 電路帶之製造或是保管的共同捲繞中之間隔帶，其係不會 對電路帶造成損傷，且製造爲容易，生產性亦爲優良。 [用以解決課題之手段] 若藉由本發明，則係提供一種半導體安裝電路帶用間 隔帶，其特徵爲：至少由塑膠製基底帶與至少2根之塑膠 製波狀帶所成，該波狀帶，係在將波之高度方向朝向基底 帶之表面的法線方向的同時，將波之行進方向朝向基底帶 之長度方向，而固定接著，該波狀帶之合計寬幅，係爲該 基底帶之最長寬幅的1/3以下。 又，本發明，係爲提供一種半導體安裝電路帶用間隔 帶之製造方法，其特徵爲：在長尺狀之塑膠製基底帶上， 將寬幅係爲基底帶之最長寬幅的1 /3以下的至少2根之塑 膠製波狀帶，在將波之高度方向朝向基底帶之法線方向的 同時，將波之行進方向朝向基底帶之長度方向，而連續地 固定接著。 200828468 [發明之效果] 本發明之半導體安裝電路帶間隔帶（以下，亦單獨僅 記載爲「間隔帶」），由於係將特定寬幅之波狀帶固定接 著於基底帶的長度方向上，因此，當將其與電路帶共同捲 繞時，係能夠防止間隔帶與電路帶之中心部相接觸，故而 ’係不會對被形成於電路帶上之導體電路等造成損傷，且 亦不會發生在電路帶邊緣上之波狀彎折等的問題。本發明 之間隔帶，若是係爲將基底帶與波狀帶藉由加熱溶著或者 是超音波溶著來加以固定接著者，則係成爲在耐熱性或耐 藥品性上更爲優良者。 本發明之間隔帶之製造方法，由於係將特定寬幅之波 狀帶在基底帶上連續地固定接著，因此能夠有效率地生產 間隔帶。此時，若是將波狀帶，藉由加熱溶著或是超音波 溶著而固定接著於基底帶上，則製造係爲容易，而能夠有 效率地作生產。又，藉由將該波狀帶以齒輪形狀之成形機 來成形爲波狀，而能夠有效率地生產形狀安定之間隔帶。 【實施方式】 本發明之半導體安裝電路帶用間隔帶，係至少由塑膠 製基底帶（以下，亦單純稱爲基底帶）與至少2根之塑膠 製波狀帶（以下，亦單純稱爲波狀帶）所成，該波狀帶， 係在將波之高度方向朝向基底帶之表面的法線方向的同時 ’將波之行進方向朝向基底帶之長度方向，而固定接著。 -8- 200828468 另外，在圖1、圖2中，1係代表間隔帶、2係代表基 底帶、3係代表波狀帶、3 a係代表波之山部、3 b係代表波 之山部的內部，3 c係代表波之谷部。 間隔帶1，係至少由基底帶2與至少2根之波狀帶3 所成，如圖1、圖2所示一般，波狀帶3，係在將波之高 度方向朝向基底帶2之表面的法線方向的同時，將波之行 進方向朝向基底帶2之長度方向，而固定接著。另外，波 狀帶3，從生產性以及對電路帶之保護的觀點來看，係以 在基底帶2之長度方向上連續地設置爲理想，但是，只要 是能夠對電路帶作保護，則就算是在某些部分被切斷亦可 〇 另外，在圖1、圖2中，雖係展示僅在基底帶2之單 面固定接著有波狀帶3時的圖面，但是，在本發明中，係 可將波狀帶3固定接著在基底帶之兩面。 在間隔帶中，由於係設置有2列以上之連續的波狀帶 3，因此，如圖3所示，在將其與電路帶4共同捲繞時， 係會防止間隔帶與電路帶之中心部相接觸。故而，對於被 形成在電路帶上之導體電路等，係不會造成損傷。進而， 波狀帶3，由於係被固定接著於基底帶2上，因此，當將 間隔帶1與電路帶4共同捲繞時，就算是波之山部3 a與 挾持著電路帶4而相鄰接之山部3a的位置重合，藉由平 滑之基底帶2的存在山部3a係並不會與電路帶4而一同 咬入至相鄰之山部3a的內部3b中。藉由此，能夠防止電 路帶4受到損傷。 -9 - 200828468 另外，在圖1 ( a )所示之間隔帶的情況，由於係被設 置有2列之連續的波狀帶3，因此，係在將1條的電路帶 插入至2列的波狀帶間之狀態下，來將電路帶與間隔帶作 共同捲繞。又，在圖2所示之間隔帶的情況，由於係被設 置有3列之連續的波狀帶3，因此，係在將2條的電路帶 ，分別插入至圖之左側的列與中央的列之間，以及右側的 列和中央的列之間的狀態下，來將電路帶與間隔帶作共同 捲繞。但是，本發明，係並不限定於2列、3列之波狀帶 〇 基底帶2之寬幅，係配合於所需要之間隔帶的寬幅而 被選擇，但是，通常係爲1〇〜3 5 0mm，更理想係爲35〜 3 5 0mm。若是寬幅爲1 0mm以上，便不會有因爲過於狹窄 而無法使用於電路帶的製造上之虞。另一方面，若是寬幅 爲3 5 0mm以下，便不會有在將其與電路帶共同捲繞時的 作業性變差之問題。 另外，從製造容易且處理性亦爲優良的觀點來看，基 底帶之寬幅，係以在長度方向成爲一定爲理想，但是，只 要是在不會對製造之容易性或是處理性造成障礙的程度下 ，則例如亦可藉由將端部形成爲波狀來使寬幅之長度變化 〇 在本發明中，波狀帶3之合計寬幅，係爲基底帶2之 最長寬幅的1/3以下，較理想係爲1/4以下，更理想係爲 1/6以下，又更理想係爲1/8以下，而又以1/10以下爲特 別理想。波狀帶之合計寬幅若是成爲超過基底帶2之最長 -10- 200828468 寬幅的 狀帶所 理性亦 能夠防 工亦爲 ，較理 別理想 另 看，係 之效果 波 之寬幅 3 0mm | 另 則該一 所變化 在 3 a的澤 理想。 10mm 隔d爲 目的。 帶之成 帶中的 1 /3，則相對於基底帶之可收容電路帶的部分，波 佔有之部分係爲過廣，而成爲不經濟，間隔帶之處 變差。波狀帶3之合計寬幅的下限，從使其具備有 止電路帶之電路部分與波狀帶相接觸之強度，且加 容易的觀點來看，係以基底帶之最長寬幅的 W200 想係爲1/100，更理想係爲1/50，而又以1/25爲特 〇 外，各個的波狀帶之寬幅，從製造容易性的觀點來 以成爲相同爲理想，但是，只要是能夠發揮所期望 ，則亦可爲相異。 狀帶3之合計寬幅的具體之値，雖係對應於基底帶 而變化，但是，係以0.5〜50mm爲理想，以1〜 S更理想，而又以2〜20mm爲更加理想。 外’所謂基底帶之最長寬幅，若是寬幅係爲一定， 定之寬幅係爲最長寬幅，若是寬幅係在長度方向有 ’則係爲變化之寬幅的長度中之最大寬幅。 波狀帶3中，於間隔帶之長度方向而相鄰接之山部 3隔d ( mm )，係以規則地以一定之長度來形成爲 此時’間隔d係以2.5〜15mm爲理想，以2.6〜 爲更理想’而又以2· 7〜6mm爲更加理想。若是間 1 5 mm以下，則能夠確實地達成對電路帶作保護之 另一方面’若是該間隔d係爲2 · 5 mm以上，則波狀 形係爲容易，且能夠確保有充分之在所得到之間隔 波之山部3 a與電路帶間之接觸面積，因此，不會 -11 - 200828468 有對電路帶造成損傷之虞。同時，由於能夠確保充分的波 之谷部3c與基底帶2間的接觸面積，因此，基底帶2與 波狀帶3間之固定接著亦爲堅固。 但是，只要是能夠對電路帶作保護，則相鄰接之山部 3 a的間隔d ( m m )，在嚴密的意義上，係並不需要規則 地設置，就算是有些許之不連續的部分亦無妨。又，就算 是相鄰接之山部3 a彼此間的間隔係爲相異，只要是對全 體而言係爲被規則地設置即可。 當被設置有2列之波狀帶的情況時，係如圖1 ( a )所 示一般，波狀帶3，係以設置於間隔帶1之兩端部近旁爲 理想，而，若是如圖4(a) 、（b)所示一般，以包含有 間隔帶1之兩端部的方式來設置，則亦爲理想。又，當設 置有3列之波狀帶3的情況時，係以將2列設置在兩端部 近旁（包含兩端部），而將其他之列以使寬幅方向之間隔 成爲相同的方式來設置於中央爲理想。若是使用設置有3 列（圖2 )或進而設置有4列以上之波狀帶的間隔帶，則 由於係能夠將其與多條之電路帶共同捲繞而使用，因此能 夠提昇電路帶之生產性，而爲理想。 在間隔帶1中，基底帶2與波狀帶3之谷部3 c，係可 以使用接著劑來固定接著，亦可藉由加熱溶著又或是超音 波溶著來固定接著。但是，當藉由接著劑來接著的情況時 ，爲了避免像是從接著劑所產生之釋氣（outgas )，或是 因接著劑之劣化所致的波狀帶之剝離等的問題，而以環氧 系或是聚醯亞胺系之接著劑爲理想。又，從耐熱性或是耐 -12- 200828468 藥品性係爲優良的觀點來看，係以藉由加熱溶著又或是超 音波溶著來固定接著爲理想。 波狀帶3之波的高度h，係以0.3〜3.0mm爲理想， 又以0.5〜2mm爲更理想。若是波之高度係爲0.3mm以上 ，則由於係能夠防止間隔帶與電路帶之中心部的接觸，因 此係不會有對被形成於電路帶上之導體電路等造成影響之 虞。另一方面，若是波狀帶3之高度係爲2.0mm以下，則 由於在捲繞於捲盤上時之全體的捲徑係不會變得過大，因 此係成爲電路帶之生產性係爲優良的間隔帶。 波狀帶3之波的形狀，係可爲於圖1 ( b )、圖2 ( b )、圖5中所示一般之平滑的正弦狀之波形，於圖6所示 一般之山部、谷部爲銳角狀者，或是於圖7中所示一般之 山部、谷部爲梯形者，又或是於圖8所示一般之山部、谷 部爲C字狀者。於此些之中，從對電路帶更加確實地作保 護的觀點來看，係以於圖7、圖8中所示一般之梯形或是 C字形爲理想。 構成基底帶2、波狀帶3之塑膠，係可使用任意之物 ，但是，從在強度上係爲優良而對耐熱性或是耐藥品性亦 爲優良的觀點來看，作爲可合適使用的塑膠，係可列舉出 聚對苯二甲酸乙二醇酯或聚萘二甲酸乙二醇酯等之聚酯， 聚醚醯亞胺、聚醯亞胺、聚苯硫等。特別是，從在將波狀 帶藉由加熱溶著或是超音波溶著而各定接著在基底帶上時 能夠得到強固之接著力的觀點而言，係以聚酯以及聚醚醯 亞胺爲更理想。特別是，若是使用聚醚醯亞胺，則就算是 -13- 200828468 在像是使被塗布在電路帶上之光阻劑硬化時一般的高溫下 來使用，間隔帶亦難以產生熱變形，而能夠防止電路帶之 變形或是半導體受到損傷等之問題的產生。 另外，基底帶2與波狀帶3，係可由相同之塑膠所形 成，亦可由相異之塑膠所形成。 又，在被使用於基底帶2與波狀帶之塑膠薄膜中，爲 了提昇帶強度或是潤滑性等的目的，係亦可添加塡料（ filler )等之添力卩劑。進而，爲了防止對帶表面之帶電或是 提昇接著性等之目的，亦可形成包含有導電性高分子、碳 黑、金屬等之導電性膜，或是施加電漿處理等之表面處理 。又，爲了得到更爲強固之接著力，亦可形成熱可塑性樹 脂或是熱硬化性樹脂等的接著劑層。 被使用於本發明中之基底帶2的厚度，係以25〜 500 μιη爲理想，而以50〜25 Ομηι爲更理想。若是間隔帶之 厚度爲500 μηι以下，則由於剛性係不會變得過高，因此能 夠容易地進行其與電路帶之共同捲繞。又，若是該厚度爲 2 5 μιη以上，則係具備有適度的剛性，而不會使剛性變得 過低，因此，在間隔帶之寬幅方向係不會產生彎曲，而能 夠防止間隔帶與電路帶相接觸。 被使用於本發明中之波狀帶3的厚度，係以25〜 5 00 μιη爲理想，而以50〜2 50 μιη爲更理想。若是波狀帶之 厚度爲500μιη以下，則不會使將其成形爲波狀時之作業性 惡化。又，若是該厚度爲25 μιη以上，則係具備有適度的 剛性，而不會使其之作爲用以達成間隔物之功能的波狀之 -14- 200828468 剛性變得過低，因此，能夠防止間隔帶與電路帶相接觸。 本發明之間隔帶，係藉由在被形成爲長尺狀之基底帶 上，將具備有該基底帶之最長寬幅的1/3以下之寬幅的至 少2根之波狀帶，在將波之高度方向朝向基底帶之法線方 向的同時，將波之行進方向朝向基底帶之長度方向，而連 續地固定接著，而能夠有效率地製造。 波狀帶，係藉由將塑膠帶送入至2個的齒輪之間，並 經由齒輪之齒來將其成形爲波形狀，而能夠安定地製造。 齒輪之齒的形狀係爲任意，可使用漸開線（involute )齒 形，亦可使用旋擺線（cycloid)齒形。又，亦可使用將兩 者之形狀作變形後的形狀。故而，能夠形成如圖5所示一 般之正弦狀的形狀，亦能夠形成如圖6所示一般將山部、 谷部成形爲銳角狀，亦能夠形成如圖7所示一般之山部、 谷部被成形爲爲梯形者，亦能夠形成如圖8所示一般之C 字狀。另外，爲了對電路帶作保護，最爲理想者，係爲波 之頭頂部爲平坦的梯形（圖7 )或是C字形（圖8 )的波 形狀。 對於基底帶與波狀帶之谷部間的固定接著方法’係並 不作限制，而可使用任意之方法，例如，可列舉有··藉由 熱溶著或是超音波溶著而固定接著的方法，或是藉由在基 底帶或波狀帶上塗布接著劑又或是貼附上接著薄片’而後 將波狀帶或是基底帶接著的方法等。當使用接著劑％情卞兄 時，爲了避免像是從接著劑所產生之釋氣（outgas ) ’或 是因接著劑之劣化所致的波狀帶之剝離等的問題’而Μ 1 -15- 200828468 用環氧系或是聚醯亞胺系等之耐熱性接著 爲了得到耐熱性或是耐藥品性係爲優良的 由加熱又或是超音波來固定接著爲理想。 本發明之間隔帶，係能夠防止：當在 ’將間隔帶作爲與電路帶之共同捲繞帶來 技術中係成爲問題的由於間隔帶之凸部咬 的在電路帶中之波狀彎折等的問題。進而 帶’由於係將基底帶與波狀帶分別製作， ’因此在機械情度上係亦爲優良。故而， ’係能夠顯著地減少電路帶之不良品，並 間隔帶而更加提昇耐久性。 [實施例] 以下，根據實施例，對本發明作具體 發明係並不被此些所限定。 實施例1 準備2根的將厚度188μηι之聚對苯二 膜（TOREY公司製LumirrorSlO)切割爲 膠帶。接下來，使用齒輪模具，而從被切 之塑膠帶，而形成於圖1(b)所示之波清 間隔 d = 3mm之波狀帶。與此分開而$ 188 μηι之聚對苯二甲酸乙二醇酯薄膜（ LumirrorSlO)所成之48mm寬幅的基底帶 劑爲理想。又， 間隔帶，係以藉 電路帶之製造中 使用時，在習知 入至凹部所造成 ，本發明之間隔 再將其固定接著 本發明之間隔帶 進而能較習知之 說明。但是，本 甲酸乙二醇酯薄 2mm寬幅後的塑 割爲 2mm寬幅 J h = 1 · 2 m m，波 寻外準備由厚度 TOREY公司製 ，並於其兩端， -16- 200828468 藉由超音波溶著來將波狀帶固定接著，而得到了圖1之（ a ) 、（ b )所示的間隔帶。 所得到之間隔帶的波狀帶與基底帶係被強固地接合。 接下來，將如圖3所示一般之間隔帶，和將由厚度 3 8 μπι之聚醯亞胺與厚度8μπι之銅所成的可撓性貼銅層積 板（住友金屬礦山公司製，S’PERFLEX )切割爲寬幅 48mm後的電路帶，交互重疊3層，並從上部施加200g之 重量且持續施加2小時，之後，對電路帶作確認，其結果 ，並未發現有在電路帶端部之波狀彎折或是間隔帶的痕跡 之類的問題。 實施例2 準備2根的將厚度188 μιη之聚醚醯亞胺薄膜（住友 Bakelite公司製FS- 1 450 )切割爲2mm寬幅後的塑膠帶， 並使用齒輪模具，而形成於圖8所示之波高h== 1.0mm， 波間隔d=3mm之波狀帶。與此分開而另外準備由厚度 188 μιη之聚醚醯亞胺薄膜（住友Bakelite公司製FS-1450 )所成之7〇mm寬幅的基底帶，並於其兩端，藉由超音波 溶著來將波狀帶固定接著，而得到了圖1之（a) 、( b ) 所示的間隔帶。 所得到之間隔帶的波狀帶與基底帶間係被強固地接合 〇 接下來，將所得到之間隔帶，和將在實施例1中所使 用之貼銅層積板切割爲寬幅70mm後的電路帶，交互重疊 -17- 200828468 3層，並從上部施加200g之重量且持續施加2小時，之後 ，對電路帶作確認，其結果，並未發現有在電路帶端部之 波狀彎折或是間隔帶的痕跡之類的問題。 實施例3 準備3根的將厚度188μπι之聚對苯二甲酸乙二醇酯薄 膜（TOREY公司製LumirrorSlO )切割爲2mm寬幅後的塑 膠帶。接下來，使用齒輪模具，而從被切割爲2mm寬幅 之塑膠帶，而形成於圖1 ( b )所示之波高h = 1.2mm，波 間隔 d = 3mm之波狀帶。與此分開而另外準備由厚度 125μιη之聚對苯二甲酸乙二醇酯薄膜（TOREY公司製 LumirrorSlO)所成之96mm寬幅的基底帶，並於其兩端以 及寬幅方向之中心，藉由超音波溶著來將波狀帶連續地固 定接著，而得到了圖2之（a ) 、（ b )所示的間隔帶。 所得到之間隔帶的波狀帶與基底帶間係被強固地接合 〇 接下來，將所得到之間隔帶，和將在實施例1中所使 用之貼銅層積板切割爲寬幅96mm後的電路帶，交互重疊 3層，並從上部施加2 0 0 g之重量且持續施加2小時，之後 ，對電路帶作確認，其結果，並未發現有在電路帶端部之 波狀彎折或是間隔帶的痕跡之類的問題。 實施例4 準備2根的將厚度188 μηι之聚對苯二甲酸乙二醇酯薄 -18- 200828468 膜（TOREY公司製LumirrorSlO)切割爲2mm寬幅後的塑 膠帶。接下來，使用齒輪模具，而從被切割爲2mm寬幅 之塑膠帶，而形成於圖8所示之波高h= 1.2mm，波間隔d = 3mm’且上面係爲平坦之波狀帶。與此分開而另外準備 由厚度188μιη之聚對苯二甲酸乙二醇酯薄膜（TOREY公 司製LumirrorSlO)所成之48mm寬幅的基底帶，並於其 兩端’藉由超音波溶著來將波狀帶固定接著，而得到了間 隔帶。 所得到之間隔帶的波狀帶與基底帶間係被強固地接合 〇 接下來，與實施例1相同的，將其與寬幅48mm的電 路帶，交互重疊3層，並從上部施加200g之重量且持續 施加2小時，之後，對電路帶作確認，其結果，並未發現 有在電路帶端部之波狀彎折或是間隔帶的痕跡之類的問題 比較例1 準備將厚度125 μιη之聚對苯二甲酸乙二醇酯薄膜（ TOREY公司製LumirrorSlO )切割爲48mm寬幅後的塑膠 帶。接下來，使用輸送裝置和用以形成突起之模具加壓裝 置，而在聚對苯二甲酸乙二醇酯之帶上，如圖9(a)、( b)所示一般，將高度h=1.2mm，下底部爲直徑D=5mm 之半球形的突起，以間隔d = 12mm來涵蓋全長的形成， 而得到間隔帶。 -19- 200828468 接下來，與實施例1相同的，將所得到之間隔帶與電 路帶重疊’並施加有200g之重量後，則係產生有被認爲 係造成間隔帶之凸部陷入凹部內之事態的原因之在電路帶 邊緣處的波狀彎折。 【圖式簡單說明】 以下，針對本發明之半導體安裝電路帶用間隔帶，使 用圖面而詳細作說明。圖中： 圖1 ( a )，係爲展示被設置有2列之連續的波狀帶之 本發明的間隔帶之其中一例的平面圖。 圖1(b)，係爲沿著同圖（a )中之I-Ι線的縱剖面 圖。 圖2 ( a )，係爲展示被設置有3列之連續的波狀帶之 本發明的間隔帶之其中一例的平面圖，圖2 ( b )，係爲沿 著圖2 ( a )之Π - Π線的縱剖面圖。 圖3，係爲展示將本發明之間隔帶與電路帶共同捲繞 的狀態之其中一例的說明圖。 圖4 ( a )，係爲展示將波狀帶以包含間隔帶的兩端部 之方式來設置的其中一例之平面圖，圖4 ( b )係爲其側面 圖。 圖5，係爲展示在基底帶上被設置有具備平滑之正弦 波形狀之波形的波狀帶時之模式圖。 圖6，係爲展示在基底帶上被設置有於山部、谷部具 備銳角狀之波形的波狀帶時之模式圖。 -20- 200828468 圖7，係爲展示在基底帶上被設置有於山部、谷部具 備梯形狀之波形的波狀帶時之模式圖。 圖8，係爲展示在基底帶上被設置有於山部、谷部具 字狀之波形的波狀帶時之模式圖。 圖9(a)，係爲習知之間隔帶的平面圖，圖9(Μ ’係爲沿著圖9 ( a )中之K - IX線的縱剖面圖。 【主要元件符號說明】 1 :間隔帶 2 ··基底帶 3 :波狀帶 3 a :波之山部 3 b :波之山部的內部 3 e :波之谷部 4 :電路帶 5 ·間隔帶 6 :突起 6b :凹部 -21 -200828468 IX. EMBODIMENT OF THE INVENTION [Technical Field] The present invention relates to a spacer tape used as a common winding in the manufacture of a semiconductor-mounted circuit tape, and a system thereof [Prior Art] In recent years, in a personal computer In the case of a display such as a television, it is required to be thinner. Therefore, the demand for a flat panel display such as a panel (LCD) is to drive such a flat panel display, usually using a driver, and most of the semiconductors for driving are installed TAB (Tape Automated Bonding). ) or the semiconductor mounting circuit tape of COF Flex Circuit (hereinafter, also referred to as "circuit tape"). The manufacture of such circuit strips is usually carried out by first means, on a plastic film tape of a polyimide film or the like, an adhesive such as a resin, and by punching, which is called an element portion. On the other hand, the copper foil is thermally bonded to the copper-clad laminate by a hot roller or the like, and further, a continuous hole called a sprocket hole is formed at both end portions. Next, the copper uranium engraved with a photosensitive photoresist, coating, exposure, copper resist, etc., to form a circuit, and formed to protect the electric or manufacturing method from the energy-saving liquid crystal display . In order to use the semi-conductor, it is called "Chip on the opening of the epoxy hole to form the sprocket hole. If it is protected by etching or optical path 200828468, the circuit layer can be obtained. Further, the production of the circuit ribbon can be carried out by a method in which a copper layer is formed by sputtering or plating on a heat-resistant film such as polyimide or a copper layer. A so-called non-adhesive copper-clad laminate such as a copper-clad laminate in which a polyimide film or a copper-clad laminate is formed on a rolled copper foil or an electrolytic copper foil to form a polyimide layer is used as a raw material. On the other hand, the strips are formed by slitting, and the circuit strips can be obtained by forming the fastener element holes, forming the circuit, and further forming the protective photoresist layer in the same manner as described above. In the manufacture of such circuit strips, generally, a reel to reel method using a reel made of aluminum or plastic is used, and the projects are pulled out. And the involvement is continuous. In the tape and reel type, when the circuit tape is wound on the reel, the circuit tapes are in contact with each other, and there is a possibility that damage occurs on the surface thereof. Here, in order not to damage the circuit tape, a spacer tape is used. The spacer tape is made of a plastic film such as polyethylene terephthalate or polyimine, and is regularly provided with a convex portion by embossing treatment applied to both ends thereof. Therefore, as long as the spacer tape is wound together with the circuit strip, the surface of the circuit strip is protected since the circuit strips do not contact each other. In (a) and (b) of Fig. 9, an example of such a spacer used in the co-winding with the circuit ribbon is shown. This spacer tape 5 is manufactured by applying embossing to both end portions of the plastic tape to form the projections 6. In the case of -5-200828468, the projections 6 are formed on one of the faces of the plastic belt, and the concave portion 6b is formed on the opposite side. If the spacer strip 5 having such a recess is wound together with the circuit strip, when the projection 6 and the recess 6b are coincident, the projection 6 will enter the recess 6b together with the circuit strip. As a result, in the circuit strip A wavy bend is formed on the end face, which may cause damage to the surface of the circuit strip or damage at the joint of the test pad, the inner wire, the outer wire, etc., in order to solve the problem. The problem is, in Japanese Patent Laid-Open No. 2 0 0 - 8 8 8 0, a proposal is made for a wafer spacer in which a protrusion is formed on one side or on both sides. This wafer spacer is formed by separately forming a spacer made of a synthetic resin such as polypropylene, polyacetal or polyethylene, and a synthetic resin substrate such as polyethylene terephthalate. Then, the spacer is adhered to the synthetic resin substrate by the adhesive, and the convex portion is formed by ultrasonic waves or dissolution. However, the wafer spacer is manufactured by a method in which the separately formed protrusions are fixed to the substrate. In addition to poor productivity, the spacers are heavier and the protrusions are easily removed. The problem of handling or durability in peeling off the substrate or the like. Further, in Japanese Patent Laid-Open Publication No. 2002-1848-18, it is disclosed that, on both sides of the belt, the photocurable resin is applied and dried at regular intervals along the left and right ends of the belt. The spacer strips are formed. This spacer is easy to manufacture and excellent in productivity. However, since the spacer is only fixed by the photocurable resin -6 - 200828468 and then on the resin tape, it is easy to fall off the tape, and is excellent in handling and durability. something wrong. Under such circumstances, it has been desired to develop a spacer tape which is easy to manufacture, is excellent in productivity, and is lightweight and has high durability. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] An object of the present invention is to provide a spacer tape for use in a common winding for manufacturing or storing a circuit tape, which does not Damage is caused, and manufacturing is easy, and productivity is also excellent. [Means for Solving the Problems] According to the present invention, there is provided a spacer tape for a semiconductor-mounted circuit board, characterized in that at least a plastic base tape and at least two plastic wavy tapes are formed, the wave The strip is oriented in a direction normal to the surface of the base strip, and the direction of travel of the wave is directed toward the length of the base strip, and is fixed, and the total width of the corrugated strip is The base strip has a maximum width of 1/3 or less. Moreover, the present invention provides a method for manufacturing a spacer tape for a semiconductor-mounted circuit board, characterized in that, in a long-sized plastic base tape, the wide width is 1/3 of the longest width of the base tape. In the following at least two plastic corrugated belts, the wave traveling direction is directed toward the normal direction of the base tape, and the traveling direction of the wave is directed toward the longitudinal direction of the base tape, and is continuously fixed. 200828468 [Effect of the Invention] The semiconductor-mounted circuit tape of the present invention has a spacer tape (hereinafter, simply referred to as a "spacer tape"), and since a specific wide wavy tape is fixed to the length direction of the base tape, When it is wound together with the circuit strip, it is possible to prevent the spacer from coming into contact with the center portion of the circuit strip, so that the conductor circuit formed on the circuit strip is not damaged and does not occur. A problem such as wavy bending on the edge of the circuit strip. The spacer tape of the present invention is more excellent in heat resistance and chemical resistance if the base tape and the wavy tape are fixed by heating or ultrasonically. In the method of manufacturing the spacer of the present invention, since a specific wide wave-like tape is continuously fixed on the base tape, the spacer can be efficiently produced. At this time, if the wavy tape is fixed by heating or ultrasonic cleaning and attached to the base tape, the manufacturing process is easy, and the production can be efficiently performed. Further, by forming the corrugated belt into a wave shape by a gear-shaped molding machine, it is possible to efficiently produce a spacer having a stable shape. [Embodiment] The spacer tape for a semiconductor-mounted circuit board of the present invention is at least a base tape made of plastic (hereinafter, simply referred to as a base tape) and at least two plastic wavy tapes (hereinafter, simply referred to as a wave) The wavy belt is formed such that the traveling direction of the wave is directed toward the longitudinal direction of the base tape while the height direction of the wave is directed toward the normal direction of the surface of the base tape, and is fixed. -8- 200828468 In addition, in Fig. 1 and Fig. 2, the 1 series represents the spacing zone, the 2 series represents the base zone, the 3 series represents the wavy zone, the 3 a represents the mountain of the wave, and the 3 b represents the mountain of the wave. Inside, the 3 c series represents the valley of the wave. The spacer strip 1 is formed of at least two base strips 2 and at least two corrugated strips 3, as shown in Fig. 1 and Fig. 2, generally in the direction of the height of the wave toward the surface of the base strip 2. At the same time as the normal direction, the traveling direction of the wave is directed toward the length direction of the base tape 2, and is fixed. Further, the wavy belt 3 is ideally provided in the longitudinal direction of the base tape 2 from the viewpoint of productivity and protection of the circuit tape, but as long as it can protect the circuit tape, In some cases, in FIG. 1 and FIG. 2, although the drawing is performed only on the one side of the base tape 2, and then the wavy band 3 is attached, in the present invention, The wavy strip 3 can be attached to both sides of the base strip. In the spacer, since two or more consecutive wavy strips 3 are provided, as shown in FIG. 3, when it is wound together with the circuit strip 4, the center of the spacer and the circuit strip are prevented. The department is in contact. Therefore, no damage is caused to the conductor circuit or the like formed on the circuit tape. Further, since the wavy belt 3 is fixed to the base tape 2, when the spacer tape 1 is wound together with the circuit tape 4, even if the wave mountain portion 3a holds the circuit tape 4, The positions of the adjacent mountain portions 3a coincide, and the presence of the smooth base belt 2 does not interfere with the circuit strip 4 into the interior 3b of the adjacent mountain portion 3a. Thereby, it is possible to prevent the circuit tape 4 from being damaged. -9 - 200828468 In addition, in the case of the spacer shown in Fig. 1 (a), since two consecutive wavy strips 3 are provided, one circuit strip is inserted into two rows. In the state between the wavy strips, the circuit strip is wound together with the spacer strip. Moreover, in the case of the spacer shown in FIG. 2, since three continuous wavy strips 3 are provided, two circuit strips are inserted into the column and the center of the left side of the figure. The circuit strip is wound together with the spacer strip in the state between the columns, and between the column on the right side and the column in the center. However, the present invention is not limited to the width of the undulating belt base belt 2 of two or three rows, and is selected in accordance with the width of the required spacing belt, but is usually 1 〇 〜 3 5 0 mm, more preferably 35 to 3 50 mm. If the width is more than 10 mm, it will not be too narrow to be used in the manufacture of the circuit strip. On the other hand, if the width is 350 mm or less, there is no problem in that the workability when it is wound together with the circuit tape is deteriorated. In addition, from the viewpoint of easy production and excellent handleability, the width of the base tape is preferably in the longitudinal direction, but it does not hinder the ease of manufacture or handling. To the extent that the length of the wide width can be varied, for example, by forming the end portion into a wave shape, the total width of the wavy belt 3 is the longest width of the base tape 2 It is more preferably 1/4 or less, more preferably 1/6 or less, and still more preferably 1/8 or less, and more preferably 1/10 or less. If the total width of the wavy belt is more than the longest length of the base belt 2-10-200828468, the width of the belt can be prevented by the rationality. It is better to look at the ideal, and the effect wave width is 3 0mm | In addition, the change is ideal for 3 years. 10mm is for the purpose of d. When the belt is 1 / 3 in the belt, the portion occupied by the wave with respect to the portion of the base tape that is accommodating the circuit strip is too wide, and it becomes uneconomical, and the gap is deteriorated. The lower limit of the total width of the wavy band 3 is based on the strength of the circuit portion in which the circuit strip is provided in contact with the wavy band, and the length of the base tape is W200. It is 1/100, more preferably 1/50, and it is 1/25. The width of each wavy band is ideal from the viewpoint of ease of manufacture, but as long as If you can achieve what you expect, you can be different. The specific width of the total width of the strips 3 varies depending on the base tape. However, it is preferably 0.5 to 50 mm, more preferably 1 to S, and more preferably 2 to 20 mm. The outermost length of the so-called base belt, if the width is constant, the width is the longest width, and if the width is in the length direction, it is the maximum width of the wide range of variation. In the wavy belt 3, in the longitudinal direction of the spacer belt, the adjacent mountain portions 3 are separated by d (mm), and are formed regularly with a certain length. At this time, the interval d is preferably 2.5 to 15 mm. It is more desirable to use 2.6~ as the more ideal' and 2·7~6mm. In the case of a distance of 15 mm or less, it is possible to surely protect the circuit strip. If the interval d is 2·5 mm or more, the wavy shape is easy, and it is possible to ensure sufficient presence. The contact area between the mountain portion 3 a of the interval wave and the circuit strip is obtained, and therefore, there is no damage to the circuit band caused by -11 - 200828468. At the same time, since the contact area between the valley portion 3c and the base tape 2 can be ensured, the fixing between the base tape 2 and the wavy tape 3 is also strong. However, as long as the circuit band can be protected, the interval d (mm) of the adjacent mountain portions 3 a does not need to be regularly arranged in a strict sense, even if there are some discontinuous portions. It doesn't matter. Further, even if the intervals between the adjacent mountain portions 3a are different, as long as they are regularly arranged for the whole body. When the undulating band of 2 rows is provided, as shown in Fig. 1 (a), the wavy band 3 is ideally disposed near the both end portions of the spacer tape 1, and if it is as shown in the figure It is also preferable that 4 (a) and (b) are provided so as to include both end portions of the spacer 1 . Further, when three rows of the wavy strips 3 are provided, two rows are provided in the vicinity of both end portions (including both end portions), and the other rows are arranged such that the intervals in the width direction are the same. It is ideal to set it in the center. If a spacer tape provided with three rows (Fig. 2) or further with four or more wavy tapes is used, it can be used by winding it together with a plurality of circuit strips, thereby improving the production of the circuit strip. Sex, but ideal. In the spacer tape 1, the base tape 2 and the valley portion 3c of the wavy tape 3 may be fixed by an adhesive or may be fixed by heating or ultrasonic solubilization. However, in the case of being followed by an adhesive, in order to avoid problems such as outgas generated from the adhesive or peeling of the wavy band due to deterioration of the adhesive, Epoxy or polyimide based adhesives are preferred. Further, from the viewpoint of heat resistance or resistance to -12-200828468, the drug system is excellent in that it is fixed by heating or supersonic dissolution. The height h of the wave of the wavy band 3 is preferably 0.3 to 3.0 mm, and more preferably 0.5 to 2 mm. If the height of the wave is 0.3 mm or more, since the contact between the spacer and the center portion of the circuit strip can be prevented, there is no possibility of affecting the conductor circuit or the like formed on the circuit strip. On the other hand, if the height of the wavy belt 3 is 2.0 mm or less, the entire winding diameter of the wavy belt 3 is not excessively large when it is wound around the reel, so that the productivity of the circuit ribbon is excellent. Spacer. The shape of the wave of the wavy band 3 can be a generally smooth sinusoidal waveform as shown in Fig. 1 (b), Fig. 2 (b), and Fig. 5, and is generally shown in Fig. 6. The portion having an acute angle is either a trapezoid in the general mountain portion or the valley portion as shown in Fig. 7, or a C-shaped portion in the general mountain portion and valley portion shown in Fig. 8. Among these, from the viewpoint of more sure protection of the circuit strip, it is preferable that the general trapezoidal or C-shape shown in Figs. 7 and 8 is preferable. The plastic constituting the base tape 2 and the wavy tape 3 may be any one, but it is excellent in terms of strength and excellent in heat resistance and chemical resistance. Examples of the plastics include polyesters such as polyethylene terephthalate or polyethylene naphthalate, polyether sulfimine, polyimine, and polyphenylene sulfide. In particular, polyester and polyether quinone are used from the viewpoint of obtaining a strong adhesion when the wavy band is melted by heating or supersonic and then adhered to the substrate tape. For the better. In particular, if polyetherimide is used, even if it is used at a high temperature such as hardening a photoresist coated on a circuit strip, the spacer tape is hard to be thermally deformed, and Prevents deformation of the circuit strip or damage to the semiconductor. Further, the base tape 2 and the wavy tape 3 may be formed of the same plastic or may be formed of a different plastic. Further, in the plastic film used for the base tape 2 and the wavy tape, an additive agent such as a filler may be added for the purpose of improving the strength or lubricity of the tape. Further, in order to prevent charging or lifting adhesion of the surface of the belt, a conductive film containing a conductive polymer, carbon black, metal or the like may be formed, or a surface treatment such as plasma treatment may be applied. Further, in order to obtain a stronger adhesive force, an adhesive layer such as a thermoplastic resin or a thermosetting resin may be formed. The thickness of the base tape 2 used in the present invention is preferably 25 to 500 μm, and more preferably 50 to 25 μm. If the thickness of the spacer is 500 μη or less, the rigidity does not become too high, so that it can be easily wound together with the circuit tape. Moreover, if the thickness is 25 μm or more, the rigidity is set to be moderate, and the rigidity is not excessively low. Therefore, the width of the spacer is not bent, and the spacer can be prevented. The circuit strips are in contact. The thickness of the wavy belt 3 used in the present invention is preferably 25 to 500 μm, and more preferably 50 to 2 50 μm. When the thickness of the wavy belt is 500 μm or less, the workability in forming the wavy shape is not deteriorated. In addition, if the thickness is 25 μm or more, the rigidity is set to be moderate, and the undulation of the wave-like shape of the -14-200828468, which does not function as a spacer, is prevented from being too low. The spacer strip is in contact with the circuit strip. In the spacer tape of the present invention, at least two corrugated strips having a width of 1/3 or less of the longest width of the base strip are formed on the base strip formed into a long strip shape. The height direction of the wave is directed toward the normal direction of the base tape, and the traveling direction of the wave is directed toward the longitudinal direction of the base tape, and is continuously fixed and then efficiently manufactured. The wavy belt can be stably produced by feeding a plastic tape between two gears and shaping it into a wave shape via the teeth of the gear. The shape of the teeth of the gear is arbitrary, and an involute tooth shape may be used, or a cycloid tooth shape may be used. Further, a shape obtained by deforming the shapes of both may be used. Therefore, it is possible to form a generally sinusoidal shape as shown in FIG. 5, and it is also possible to form the mountain portion and the valley portion into an acute angle as shown in FIG. 6, and it is also possible to form a mountain portion or a valley as shown in FIG. The portion is formed into a trapezoid, and a C-shape as shown in Fig. 8 can also be formed. Further, in order to protect the circuit strip, it is preferable that the top of the wave head has a flat trapezoidal shape (Fig. 7) or a C-shape (Fig. 8). The method of fixing the base tape to the valley portion of the wavy tape is not limited, and any method may be used. For example, it may be exemplified by heat dissolution or ultrasonic dissolution. The method is either a method of applying an adhesive on a base tape or a wavy tape or attaching a subsequent slab and then staking the wavy tape or the substrate. When using the adhesive % brother, in order to avoid the problem of outgases from the adhesive or the peeling of the wavy band due to the deterioration of the adhesive, Μ 1 -15 - 200828468 It is desirable to use heat resistance such as epoxy or polyimine, followed by heating or ultrasonic to obtain heat resistance or chemical resistance. The spacer tape of the present invention can prevent the wavy bending in the circuit strip due to the bite of the spacer strip which is a problem in the technique of co-winding the strip with the circuit strip. The problem. Further, since the tape is produced by separately forming the base tape and the wavy tape, it is also excellent in mechanical condition. Therefore, it is possible to significantly reduce the defective products of the circuit strip and to improve the durability by spacing the strips. [Examples] Hereinafter, the specific invention of the present invention is not limited by the examples according to the examples. Example 1 Two polyethylene terephthalate films (Lumirror S10, manufactured by TOREY Co., Ltd.) having a thickness of 188 μm were prepared and cut into tapes. Next, using a gear mold, a wavy belt having a wave-clearing interval d = 3 mm as shown in Fig. 1 (b) is formed from the cut plastic tape. Separately, a 48 mm wide base tape made of a polyethylene terephthalate film of 188 μηι (Lumirror S10) is desirable. Further, the spacer tape is formed by conventionally entering the recess when it is used in the manufacture of the circuit strip, and the interval of the present invention is fixed to the spacer of the present invention and can be described more conventionally. However, the polyethylene glycolate is 2mm wide and the plastic cut is 2mm wide J h = 1 · 2 mm, and the wave-seeking preparation is made by the thickness of TOREY, at both ends, -16- 200828468 by Ultrasonic waves are dissolved to fix the wavy band, and the spacer bands shown in (a) and (b) of Fig. 1 are obtained. The undulated band of the resulting spacer tape is strongly bonded to the base tape system. Next, a general spacer tape as shown in Fig. 3, and a flexible copper laminated plate made of copper having a thickness of 3 8 μm and a thickness of 8 μm (made by Sumitomo Metal Mining Co., Ltd., S' PERFLEX ) is cut into a circuit strip with a width of 48 mm, overlaps 3 layers alternately, and applies a weight of 200 g from the upper portion for 2 hours. After that, the circuit strip is confirmed. As a result, no end portion of the circuit strip is found. A problem such as a wavy bend or a trace of a spacer. Example 2 Two pieces of a 188 μm thick polyether quinone film (FS-1450 manufactured by Sumitomo Bakelite Co., Ltd.) were cut into 2 mm wide plastic tapes, and a gear mold was used, which was formed as shown in FIG. The wave height is h== 1.0mm, and the wave interval is d=3mm. Separately, a 7-inch wide base tape made of a 188 μm thick polyether quinone film (FS-1450 manufactured by Sumitomo Bakelite Co., Ltd.) was prepared, and ultrasonically dissolved at both ends thereof. To fix the wavy band, the spacer tapes shown in (a) and (b) of Fig. 1 are obtained. The wavy tape of the obtained spacer tape is strongly bonded to the base tape. Next, the obtained spacer tape, and the copper laminated plate used in the embodiment 1 are cut into a width of 70 mm. The circuit strips overlap -17-200828468 3 layers and apply a weight of 200g from the upper part for 2 hours. After that, the circuit strip is confirmed. As a result, no wavy bend at the end of the circuit strip is found. A problem such as a fold or a trace of a space strip. Example 3 Three polyethylene terephthalate films (Lumirror S10, manufactured by TOREY Co., Ltd.) having a thickness of 188 μm were prepared and cut into a 2 mm wide plastic tape. Next, a gear mold was used, and a wavy band having a wave height h = 1.2 mm and a wave interval d = 3 mm was formed from a plastic tape which was cut into a width of 2 mm and shown in Fig. 1 (b). Separately, a 96 mm wide base tape made of a polyethylene terephthalate film (manufactured by TOREY Co., Ltd., Lumirror S10) having a thickness of 125 μm was prepared, and at both ends thereof and at the center of the width direction, by The ultrasonic wave is dissolved to continuously fix the wavy band, and the spacer tapes shown in (a) and (b) of Fig. 2 are obtained. The wavy tape of the obtained spacer tape is strongly bonded to the base tape. Next, the obtained spacer tape, and the copper laminated plate used in the embodiment 1 are cut into a width of 96 mm. The circuit strips are overlapped by 3 layers, and a weight of 200 g is applied from the upper portion for 2 hours. After that, the circuit strip is confirmed, and as a result, no wavy bend at the end of the circuit strip is found. Or a problem like the traces of the interval. Example 4 Two sheets of polyethylene terephthalate having a thickness of 188 μm were prepared as a thin film of -18-200828468 (Lumirror S10, manufactured by TOREY Co., Ltd.), and cut into a 2 mm wide plastic tape. Next, a gear mold was used, and a plastic belt which was cut into a width of 2 mm was formed, and the wave height h = 1.2 mm shown in Fig. 8 and the wave interval d = 3 mm' and the upper surface was a flat corrugated belt. Separately, a 48 mm wide base tape made of a polyethylene terephthalate film (manufactured by TOREY Co., Ltd., Lumirror S10) having a thickness of 188 μm was prepared, and was ultrasonically dissolved at both ends thereof. The wavy band is fixed and the spacer is obtained. The wavy tape of the obtained spacer tape is strongly bonded to the base tape. Next, in the same manner as in the first embodiment, it is overlapped with the wide 48 mm circuit tape by three layers, and 200 g is applied from the upper portion. The weight was continuously applied for 2 hours, and then the circuit tape was confirmed. As a result, no problem such as wavy bending at the end of the circuit strip or trace of the spacer tape was found. Comparative Example 1 Preparation of a thickness of 125 μm The polyethylene terephthalate film (Lumirror SlO manufactured by TOREY Co., Ltd.) was cut into a plastic tape of 48 mm wide. Next, using a conveying device and a mold pressing device for forming a projection, on the polyethylene terephthalate tape, as shown in Figs. 9(a) and (b), the height h = 1.2 mm, the lower bottom is a hemispherical protrusion with a diameter D = 5 mm, covering the formation of the full length at intervals of d = 12 mm, resulting in a spacer. -19- 200828468 Next, in the same manner as in the first embodiment, the obtained spacer tape is overlapped with the circuit tape and a weight of 200 g is applied, and a convex portion which is considered to cause the spacer tape is trapped in the concave portion is generated. The reason for this is the wavy bend at the edge of the circuit strip. BRIEF DESCRIPTION OF THE DRAWINGS Hereinafter, a spacer tape for a semiconductor-mounted circuit board according to the present invention will be described in detail with reference to the drawings. In the drawings: Fig. 1 (a) is a plan view showing an example of a spacer tape of the present invention in which two consecutive rows of wavy belts are provided. Fig. 1(b) is a longitudinal sectional view taken along line I-Ι in the same figure (a). Figure 2 (a) is a plan view showing an example of the spacer tape of the present invention in which three consecutive rows of wavy tapes are provided, and Figure 2 (b) is along the line of Figure 2 (a) - Longitudinal section of the rifling. Fig. 3 is an explanatory view showing an example of a state in which the spacer tape of the present invention is wound together with a circuit tape. Fig. 4 (a) is a plan view showing an example in which the wavy belt is provided to include both end portions of the spacer, and Fig. 4 (b) is a side view thereof. Fig. 5 is a schematic view showing a wavy band provided with a waveform having a smooth sinusoidal shape on a base tape. Fig. 6 is a schematic view showing a wavy belt provided with a waveform having an acute angle in a mountain portion or a valley portion on a base tape. -20- 200828468 Fig. 7 is a schematic view showing a wavy belt provided with a waveform of a trapezoidal shape in a mountain or a valley on a base tape. Fig. 8 is a schematic view showing a wavy belt provided with a waveform of a shape of a mountain or a valley on a base tape. Fig. 9(a) is a plan view of a conventional spacer tape, and Fig. 9(Μ' is a longitudinal sectional view taken along line K-IX in Fig. 9(a). [Explanation of main component symbols] 1: Spacer zone 2 ·· Base belt 3 : Corrugated belt 3 a : The mountain part of the wave 3 b : The inside of the mountain part of the wave 3 e : The valley of the wave 4 : Circuit tape 5 · Spacer 6 : Protrusion 6 b : Concave part - 21