200827737 九、發明說明： 【發明所屬之技術領域】 短败種T用各機構之時序搭配作動，而有效縮 以提相峨_子__裝置。 測試口=第i圖：其係為台灣專利申請第91105851號『ic 有供料崎』卩如11Q前端分別裝設 幹出in的触，輸岐13係可細分不同等級之 4瘅1 4^、_3b、1 3c，以儲放完測之不同等級IC，數侧 1右㈣機台1Q之後端，各測解1 4内平行排列設置 猶板1 6，以及於測試板1 6前端各設有一 待測lc方疋轉緩衝台1 7及完測1C旋轉緩衝台！ 8，另一 1(：輸 =構1 9係移載於供觀/升降器工工、各測試蜂工4及輸出匿 ㈣=^131^，以負責各機構間之IC輸送工作，以及 :曰叹預…、匣2 0，以對待測之ic於測試前進行預埶的作業； ^^試健時，細魏1 6之峨座U 向 =Q升降器11内㈣置方向相同時，則係直接先以1C輸 f構1 9將供料升降器i i上之待測IC取出，並分別輸送 放置於^則試座1 5内，於完成測試後，再纟ic輸送機構工9分 ^將測试座1 5内完測之ig取出，並依制試結果將完測之Ic =^輸岐1 3 a、1 3 b、1 3 c置放；若測試板丄6之測試 座1 5的1C放置方向與供料匣/升降器1丄内1(：放置方向不同時 ，則係先以Ic輸送機構1 9將供料匣/升降器1 1上之待測IC取 ，，並分別輸送放置於待測1C旋轉緩衝台1 γ上，轉動待測Ic 旋轉緩衝台1 7之方向，使IC角位相同於各測試座1 5後，再以 1C輸送機構1 9將ic放入各測試座1 5内，於完成測試後，再由 5 200827737 1C輸送機構χ 9分別將測試座i 5内完測之扣取 測1C旋轉緩衝台i 8上，使IC角位相同於輸出匣i 3a、丄3 = 、、、ϋ接著再由IC輸送機構1 9依據測試結果將完測之1C輸 Ϊ架'、1 3 C置放;惟’該測試處理機之設 1 ·该測試處理機不論其測試座15的1(：放置方向與供料匣/ 1内1C放置方向是否相同’其均有賴單l：jc輸送機 將供料E/升降器1 1上之待測IC分別輸送放置於各 ^座1 5，而完測之1C亦有賴該IC輸送機構丄9輸送至 1 出ί 1 3a、1补、1 3C置放，亦即該IC輸送機構 ^ 以-對多的㈣及較遠的運動行程移載於各測試座 料E/升降器11及輸出g13a、13b、13c間 安^^1〇輸送機構1 9工作負荷過多，而無法依據時序 ίΓ=進行1c的輸送作業，此即產生部份測試埠待機的 障形’而降低測試作業的生產效率。 2 · 二降f 1 1使用f畢之㈣料盤，係由IC輸送機 工匣/升降态1 2處收置，由於空匣/升降器200827737 IX. Description of the invention: [Technical field to which the invention belongs] Short-term genre T is actuated by the timing of each institution, and is effectively reduced to the phase ____ device. Test port = the i-th picture: it is the Taiwan patent application No. 91105851 "ic has the supply of raw materials", such as the 11Q front end installed separately in the touch, the transmission 13 series can be subdivided into different levels of 4瘅1 4^ , _3b, 1 3c, to store the measured different levels of IC, the number side 1 right (four) machine 1Q rear end, each test solution is arranged in parallel within 14 4, and at the front end of the test board 16 There is a lc square to turn to the buffer table 1 7 and the 1C rotation buffer table! 8, another 1 (: transmission = structure 1 9 series transferred to the observation / lifter workers, each test beeman 4 and output secret (four) = ^ 131 ^, to be responsible for the IC transport work between the agencies, and: Awkward pre-, 匣 2 0, to pre-test the ic to be tested before the test; ^^ when the test is healthy, the fine Wei 1 6 squat U direction = Q lifter 11 (four) set the same direction, Then, the IC to be tested on the feeder lifter ii is taken out first by 1C, and then placed in the test stand 15 respectively. After the test is completed, the ic transport mechanism is 9 minutes. ^ Take out the ig in the test stand 1 5 and place the completed Ic = ^ 岐 1 3 a, 1 3 b, 1 3 c according to the test results; if the test board 丄 6 test seat When the 1C placement direction of 1 5 is different from the supply 匣/lifter 1 (1 (: the placement direction is different, the IC to be tested is first taken by the Ic transport mechanism 1 9 on the supply hopper/lifter 1 1 , And respectively placed on the 1C rotary buffer table 1 γ to be tested, and rotate the direction of the Ic rotary buffer table to be tested, so that the IC corner position is the same as that of each test socket, and then the IC is placed in the 1C transport mechanism. Into each test stand 1 5, after the test is completed, 5 200827737 1C transport mechanism χ 9 respectively, the test socket i 5 is measured and the 1C rotary buffer table i 8 is measured, so that the IC corner position is the same as the output 匣i 3a, 丄3 = , , , and then by the IC The conveying mechanism 19 places the completed 1C turret '1' and 1 3 C according to the test result; but 'the test processor's setting 1 · The test processor regardless of the test seat 15's 1 (: placement direction and supply Whether the 1C placement direction in the material / 1 is the same 'it depends on the single l: jc conveyor to feed the IC to be tested on the E/lifter 1 1 and place it in each block, and the 1C is also completed. It depends on the IC transport mechanism 丄9 transported to 1 output ί 1 3a, 1 complement, 1 3C placement, that is, the IC transport mechanism ^ is transferred to each test seat E by -to-multiple (four) and far moving motion / The lifter 11 and the output g13a, 13b, 13c between the transport mechanism 1 9 have too much work load, and can not carry out the 1c transport operation according to the timing , =, which results in a partial test 埠 standby obstacle ' Reduce the production efficiency of the test operation. 2 · Two drops f 1 1 Use the F (4) tray, which is collected by the IC conveyor machine/lifting position, due to the empty/lifting
13a 作動’並無法自動輸出空的料盤，當輸出E 充於輪屮兩Ί rtf 12内之空料盤取出’再補 ，之當上：接續盛置完測之丨C’ ::事; I 〜九研創出一種可利用各機構之時序棵SfM七叙 . 短測試作業之整體製料間，動’而有效縮 類裝置，此即為本發明:計^升似產此之電子元件測試分 6 200827737 【發明内容】 之轉運機構，各轉運機構係具有供料載台及收 么# 台之換料處及各測試座間縣運送待測及完 二=可於機 送機構係移載於供料£、收料匣及轉運機構 一輸 完測之雷早开^杜，Θ W移载待測及 本發明之目的一係提供一種電子元件測試分 位於機台前端之供料E、收料岐空£，而機台後$ 個具測試座及下壓測試頭之測試區，數個對庫=係叹有稷數 之韓運機槿，夂鏟運搶堪在乱亡糾土、丨此則試區測試座 完測之電子元件，並可於供料匣、收料匣及 的料盤；藉此，可利用各機構之時序搭 以移載空 測試作業時間，達到提升測試產能之目的1 乂有效縮短整體 本發明之目的二係提供一種電子元件測試分類 位於機台前端之供料匣、收料匣、空匣、複數個且、二八I 3 ，頭之測試區，數鑛應於各峨 及2 運機構係具有供料载台及收料載台，而可’各轉 試座間承^!送制及完狀電子元件，」各測 ”、收料ϋ及轉運機翻，用轉_极完:供 ^程t機台之換料處對應各轉運機構輸 :而移動至測試區，達到提升移载電子元件 产目70 位於絲。，其包含 载送輸入堆疊，收·係可於暫置區將料盤 水平往復輸出、人降及於暫置區與堆疊區間 空E及轉運機構間，用 ^J移載於供料®、收料®、 藉此，射料財接錄電奸似么料盤； 達到有效提升作業便利成收觀之空料盤補充作業， 7 200827737 【實施方式】 眘#f審查委員對本發明作更進—步之瞭解，跡一較佳 實靶例並配合圖式，詳述如后： 二參閱第3圖所示，本發明包含位於機台前端之供料匣3 〇 /1收二!131&、31卜31〇:、31(1、空1 2 3 4 5 6 7 8 932、近機台換料 處之輸运機構3 3、複數個測試區3 4a、3 4b、3 4c、3 4d、 3 4e 3 4 f、3 4g、3 4h，以及對應各測試區3 4a、3 4b、 、3 4d、3 4e、3 4f、3 4g、3 4h 之數個轉運機構 3 5 ’而各轉運機構3 5之侧方則可視測試作業所需增設對應之 預熱匣3 6，其中，該供料匣3〇係設有堆疊區3()1及暫置區 3 0 2，係可於堆疊區3 〇1將盛裝有待測電子元件之料盤升降 位移，並於下方將料盤由堆疊區3 〇丄載送輸出至暫置區3 〇 2 以供取料，收料匣可細分不同等級之收料匣3 la、31b、3ic、 3 1 d ’ 各收料 £ 3ia、3!b、31c、31(H_w—；^^^ 不同等級電子元件，並設有堆疊區3 1 la、3工lb、3工lc、 i. 8 1 1 Id 及暫置區 3 12a、3 12b、3 12c、3 1 2d，而可於 2 ^置區3 1 2a、3 1 2b、3 1 2c、3 1 2d載送輸人盛滿完測 3 電子件之料盤至堆疊區3 ；[ la、3 1 ib、3 1 lc、3工ld， 且於堆疊區3 1 la、3 1 lb、3 1 le、3 1 Id將料盤升降位 移堆疊收置，空匣3 2亦設有堆疊區3 21及暫置區3 2 2，係 可於暫置區3 2 2接收由供料匣3 0使用完之空料盤，並將空剩^ 4 盤由暫置& 3 2 2載送輸入至堆疊區3 21，而於堆疊區3 21 5 將空料盤升降位移堆疊收置，亦可依需要將堆疊區3 ^ i收置之 6 空料盤頂置下降，並由堆疊區3 21將空料盤載送輸出至暫置區 7 3 2 2，以供補充於各收料匣3 la、31b、31c、3ld用2 8 收料，一設置於機台換料處之輸送機構3 3，係移载於供料匣 9 30、收料 E 3 la、3 1b、3 1c、3 Id、空E3 2 及各轉運 機構3 5間，其係具有複數個取放器331、332、333、 200827737 334、335,其中，二取放器3 3丄、3 3 2係用以取放待 測之電子元件，另二取放器3 3 3、3 3 4係用以取放完測之電 子元件，而取放器3 3 5則用以移載空的料盤，數個測試區 34a、34b、34c、34d、34e、34f、34g、34h， 其中，測試區 3 4a、3 4b、3 4C、3 4d、3 4e、3 係平 行排列設置於機台前端位置，而測試區3 4g、3 4h則分置於機 台兩侧位置，且測試區3 4g、3 4h與平行排列設置之測試區 3 4a、3 4b、3 4c、3 4d、3 4e、3 4f 呈反向設置，另各 測試區34a、34b、34c、34d、34e、34f、34g、 3 4h分別设有具測試座3 4 i之測試板3 4 2，並於機台上方對 應，試座3 4 1〃位置裝設有可升降之下壓測試頭3 4 3，該下壓 =頭3 4 3係可為具升降之取放n或下義，數個轉運機構 ^ 置於對應各測試區之測試座3 4 1位置，各轉運機 料載台3 51、3 5 2及二收料載台3 5 3、 3 5 4，，、一i、料載台 3 5 丄、3 5 2 未：_ ;前 度以利測試作業，前仍保持在適當測試溫 待測及:41間以轉運 3〇、收料E 3 la、If ^故構3 3只需移動於供料11 小區域範圍内，毋♦弒^、3 lc、3 Id及轉運機構35間之 3 3 2 3 3 3 = 動至測試區3 41，使取放器3 3 i、 暢的進行IC的輸送Λ4 于程，依據時序安排順 而對待測之電子元件進行預另熱：；乍預業、、卫3 6可供視測試作業价 凊參閱第4圖，以—測試區3 4 a為例，於進行作業時，係 9 200827737 於測減座3 4 1 a内置人制之電子树4 ^ 3 4 3 a壓抵電子元件41而執行測w ^ . 令#M4# ^ q h 1 a1 ς d 忒作業，轉運機構3 5 3係 4、枓載口351a、352a滑移至機台之換料 ϊί之電子元件，而供舰3 0係已將堆疊區3 0 1之盛裝符測 疋件的料盤51升降位移，並由堆疊區3 Q1將料盤51載13a does not automatically output an empty tray. When the output E is filled in the rim, the empty tray in the rtf 12 is taken out and replenished, and then it is added: after the completion of the test, C' :: I ~ Jiuyan created a sequence of SfM seven-synthesis that can be used by various institutions. The short test operation of the overall material room, the dynamic 'and effective shrinking device, this is the invention: the test of electronic components Sub-item 6 200827737 [Summary of the Invention] The trans-shipment mechanism, each trans-shipment mechanism has a feeding platform and a refueling station for receiving the #台台, and the test room between the test stations is to be tested and the second is to be transferred to the machine mechanism. Feeding material, receiving material and transporting mechanism, after the completion of the test, the lightning is opened, the ΘW transfer is to be tested, and the purpose of the present invention is to provide an electronic component test, which is located at the front end of the machine. It is short-selling, and after the machine, there is a test area with a test seat and a test head, and several pairs of libraries=there are a number of Han Yunji 槿 槿 夂 抢 抢 抢 抢 抢 抢In this test area, the tested electronic components are tested and can be used in the feeding and receiving trays. The timing of the structure is used to transfer the test time and achieve the purpose of improving the test capacity. 乂 Effectively shorten the overall purpose of the present invention. Secondly, provide an electronic component test classification, which is located at the front end of the machine. , a plurality of, two eight I 3, the test area of the head, the number of mines should have a feeding platform and a receiving platform in each of the two transport agencies, and can be sent to each test room. Finished electronic components, "measurement", receiving hoppers and transfer machines, use _ extreme: for the refueling station of the machine, corresponding to each transport mechanism: and move to the test area to achieve lifting transfer The electronic component product 70 is located in the wire. It contains the carrier input stack. The receiving system can horizontally reciprocate the tray in the temporary area, and drop the person between the temporary area and the stacking interval space E and the transfer mechanism. J is transferred to the Feeding®, Receipt®, and thereby, the shot material is recorded as an electric tray. The empty tray is replenished to achieve an effective lifting operation. 7 200827737 [Embodiment] The review committee made a more in-depth understanding of the present invention, and traced a better target. The drawing is detailed as follows: 2. Referring to Figure 3, the present invention includes a supply 匣 3 〇 / 1 at the front end of the machine; 131 & 31 31 〇: 31 (1) 2 3 4 5 6 7 8 932, transport mechanism 3 in the refueling station of the near machine, 3 test areas 3 4a, 3 4b, 3 4c, 3 4d, 3 4e 3 4 f, 3 4g, 3 4h, And a plurality of transfer mechanisms 3 5 ′ corresponding to the test areas 34 4a, 3 4b, 3 4d, 3 4e, 3 4f, 3 4g, 3 4h and the side of each transport mechanism 3 5 can be added for visual test operations. Corresponding preheating crucible 3 6, wherein the feeding crucible 3 is provided with a stacking zone 3 () 1 and a temporary zone 3 0 2, which can hold the material of the electronic component to be tested in the stacking zone 3 〇1 The disc is moved up and down, and the tray is transported from the stacking area 3 〇丄 to the temporary area 3 〇 2 for reclaiming, and the receiving 匣 can subdivide different levels of receiving 匣 3 la, 31b, 3ic, 3 1 d ' Each receipt £ 3ia, 3!b, 31c, 31 (H_w-;^^^ different grades of electronic components, and with stacking area 3 1 la, 3 lb, 3 lc, i. 8 1 1 Id and the temporary zone 3 12a, 3 12b, 3 12c, 3 1 2d, and can be located in the 2 ^ zone 3 1 2a, 3 1 2b, 3 1 2c, 3 1 2d carrying the input tray of the 3 electronic components to the stacking area 3; [ la, 3 1 ib, 3 1 lc, 3 ld, and in the stacking area 3 1 la, 3 1 Lb, 3 1 le, 3 1 Id stack the tray lifting and lowering, and the empty space 3 2 also has a stacking area 3 21 and a temporary area 3 2 2, which can be received by the temporary area 3 2 2匣3 0 used empty tray, and the empty tray 4 is input from the temporary & 3 2 2 to the stacking area 3 21, and the empty tray is moved up and down in the stacking area 3 21 5 The 6 empty trays that are stacked in the stacking area can be topped down as needed, and the empty trays are carried by the stacking area 3 21 to the temporary area 7 3 2 2 for supplementation. The material 匣3 la, 31b, 31c, 3ld is harvested by 2 8 , and the conveying mechanism 3 3 disposed at the refueling station of the machine is transferred to the feeding 匣 9 30, the receiving material E 3 la, 3 1b, 3 1c, 3 Id, empty E3 2 and each transfer mechanism 35, which has a plurality of pick and placeers 331, 332, 333, 200827737 334, 335, wherein the two pick and place devices 3 3 丄, 3 3 2 To pick up and place the electronic components to be tested, and the other two pick and place devices 3 3 3, 3 3 4 are used to pick up and drop the measured electronic components. And the picker 3 3 5 is used to transfer the empty tray, a plurality of test areas 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h, wherein the test area 34a, 3 4b, 3 The 4C, 3 4d, 3 4e, and 3 series are arranged in parallel at the front end of the machine, while the test areas 34g and 34h are placed on both sides of the machine, and the test areas 34g, 34h and parallel are arranged. The test areas 3 4a, 3 4b, 3 4c, 3 4d, 3 4e, 3 4f are arranged in reverse, and the other test areas 34a, 34b, 34c, 34d, 34e, 34f, 34g, 3 4h are respectively provided with test seats. 3 4 i test board 3 4 2, and corresponding to the top of the machine, the test stand 3 4 1〃 position is equipped with a lower pressure test head 3 4 3, the lower pressure = head 3 4 3 can be The lifting and lowering of the lifting or lowering, a number of transfer mechanisms ^ placed in the test seat corresponding to each test area 34, 1 position, each transfer material loading platform 3 51, 3 5 2 and two receiving platforms 3 5 3, 3 5 4,,, i, material carrier 3 5 丄, 3 5 2 not: _; before the test, the test is still in the appropriate test temperature to be tested and: 41 to transfer 3 〇, receipt E 3 la, If ^Architecture 3 3 only needs to move in the supply 11 small area Within the circumference, 毋♦弑^, 3 lc, 3 Id and the transfer mechanism 35 3 3 2 3 3 3 = move to the test area 3 41, so that the pick-and-placer 3 3 i, the smooth IC transfer Λ 4 According to the timing arrangement, the electronic components to be tested are preheated separately:; 乍 pre-operation, wei 3 6 can be regarded as the test operation price 凊 refer to the 4th figure, taking the test area 3 4 a as an example, At the time, the system 9 200827737 is used to measure the weight of the electronic tree 4 ^ 3 4 3 a built-in artificial system 4 ^ 3 4 3 a to the electronic component 41 and perform the test w ^ . Let #M4# ^ qh 1 a1 ς d 忒 operation, transport The mechanism 3 5 3 series 4, the 枓 port 351a, 352a slides to the electronic component of the refueling device of the machine, and the ship 30 has lifted the tray 51 of the loading area of the stacking area 310 Displacement, and the tray 51 is carried by the stacking zone 3 Q1
St暫3 =以供取料，而輸送機構3 3係驅動二 為33 1、3 3 2作第-、二、三方向位移（x、y、z軸甸） 至供料E3 0之料盤51上方，以由料盤5丨巾取出 電 子元件4 2、4 3。 、 請參閱第5圖，該轉運機構3 5 a已驅動二供料載台 3 5 + a、3 5 2 a移動至機台之換料處以待置料，而輸送機構 3 3係驅動二取放器3 31、3 3 2將二待測之電子元件4 2、 4 3移載至機台之換料處，並位於轉運機構3 5 a之二供料載台 351a、352a上方，令二取放器3 31、3 3 2將二待測 之電子元件4 2、4 3置入於二供料載台351a、352a中 以待測試，由於輸送機構3 3只需移動至機台之換料處，而無需 移動至測試區3 4 a，可有效縮短移載電子元件時間。 請參閱第6圖，當測試區3 4 a之測試座3 41 a内的電子 元件41完成測試作業後，可驅動下壓測試頭3 4 3 a移載完測 之電子元件41上升位移，該轉運機構3 5 a即驅動一收料載台 3 5 3 a位移至下壓測試頭3 4 3 a之下方，該下壓測試頭 3 4 3 a即可將完測之電子元件41置入於收料載台3 5 3 a中 收置，而該輸送機構3 3則驅動二取放器3 31、3 3 2位移至 供料匣3 0之暫置區3 0 2處，並由暫置區3 0 2之料盤51中 取出二待測之電子元件4 4、4 5。 請參閱第7、8圖，該轉運機構3 5 a於收置完測之電子元 件41後，係驅動供料載台3 51 a位移至下壓測試頭3 4 3 a 之下方，供下壓測試頭3 4 3 a取出下一待測之電子元件4 2， 200827737St temporarily 3 = for reclaiming, and the transport mechanism 3 3 is driven by 33 1 , 3 3 2 for the first, second and third direction displacement (x, y, z axis) to the feed E3 0 tray Above the 51, the electronic components 4 2, 4 3 are taken out by the tray 5 wipes. Please refer to Fig. 5, the transport mechanism 35 a has driven the two feeding platforms 3 5 + a, 3 5 2 a to move to the refueling station of the machine to be placed, and the conveying mechanism 3 3 is driven to take The ejector 3 31, 3 3 2 transfers the two electronic components 4 2, 4 3 to be tested to the refueling station of the machine, and is located above the two feeding lands 351a, 352a of the transporting mechanism 35a, The pick-and-placers 3 31, 3 3 2 place the two electronic components 4 2, 4 3 to be tested into the two feeding stages 351a, 352a for testing, since the conveying mechanism 3 3 only needs to move to the machine At the material, without moving to the test area 34 4 a, the time for transferring electronic components can be effectively shortened. Referring to FIG. 6 , after the electronic component 41 in the test socket 3 41 a of the test area 34 4 a completes the test operation, the downward pressure test head 3 4 3 a can be driven to transfer the measured electronic component 41 to rise displacement. The transfer mechanism 3 5 a drives the receiving stage 3 5 3 a to be displaced below the pressing test head 3 4 3 a, and the pressing test head 3 4 3 a can place the completed electronic component 41 into the The receiving stage 3 5 3 a is housed, and the conveying mechanism 3 3 drives the two pick-and-place units 3 31, 3 3 2 to be displaced to the temporary area 3 0 2 of the feeding 匣 30, and is temporarily placed. The electronic components 4 4 and 4 5 to be tested are taken out from the tray 51 of the zone 3 0 2 . Referring to Figures 7 and 8, the transfer mechanism 35 5 a drives the supply stage 3 51 a to be displaced below the lower pressure test head 3 4 3 a after the electronic component 41 is received. The test head 3 4 3 a takes out the next electronic component to be tested 4 2, 200827737
而後供料載台3 51 a可退出測試座3 41 a，以便下壓測試頭 3 4 3 a將待測之電子元件4 2置入於測試座3 41 a中執^測 試作業，而轉運機構3 5b之二供料載台3 51b、3 5 位於機台之換料處，該輸送機構3 3係驅動二取放器3 3工、 3 3 2將二待測之電子元件44、45移载至機台之換料處，並 位於轉運機構3 5 b之二供料載台351b、352b上方，人 一取放器3 31、3 3 2將二待測之電子元件4 4、4 5置入於 二供料載台351b、352b中以待測試。 、 —請參閱第9圖，當測試區34 a之嫩式座3 4工a内的電子 元件4 2完成測試作業後，可驅動下壓測試頭3 4 3 a移載完測 之電子元件4 2上升位移，該轉運機構3 5 a即驅動收料載台 3 5 4 a由機台之換料處移動至下壓測試頭3 4 3 a之下方，今 下壓測試頭3 4 3 a即可將完測之電子元件4 2置人於收料載= 3 5 4 a中收置，而輸送機構3 3再驅動取放器3 3工、3 3 移動至供龍3 0之暫置區3 0 2處，而於暫㈣3 Q 2之料盤 51中取出二待測之電子元件4 6、4 7。 ，參閱第1 Q® ’該轉運機構3 5 a於收置完測之電子元件 4 2後’係驅動供料載台3 5 2 a位移至下壓測試頭3 4 3 a之 ::料dl, 3 4 V取出下一待測之電子元件4 3，而 可退出測試座3 4 1 a，以便下壓測試頭 3 4 3 a將侧之電子讀4 3置人於測試座3 4 i a中孰 試作業，而轉運機構3 5 c之二供料載台3 5工c、3 5 /已 位於機台之換料處，該輸送機構3 3係 電子7^件46、47移载錢台之換 位於轉運機構3 5 c之二供料載台3 5丄 a ^ ; 3 3 2將f寺測之電子元件4 6、4 7置二 -供枓载台351c、352。中以待測★式。 請參閱第11圖，當轉運機構35a°之二收料載台3 5 3 a 11 200827737Then, the feeding stage 3 51 a can exit the test seat 3 41 a, so that the test head 3 4 3 a is pressed down, and the electronic component 4 2 to be tested is placed in the test seat 3 41 a to perform the test operation, and the transfer mechanism 3 The 5b bis feeding platform 3 51b, 3 5 is located at the refueling station of the machine table, and the conveying mechanism 3 3 drives the two pick and place devices 3 3 , 3 3 2 to transfer the two electronic components 44 , 45 to be tested To the refueling station of the machine, and located above the feeding station 351b, 352b of the transfer mechanism 3 5 b, the human pick-and-place 3 31, 3 3 2 will place the two electronic components 4 4, 4 5 to be tested Entered into the two feed stations 351b, 352b for testing. - Please refer to Figure 9, when the electronic component 4 in the test chamber 34a's tender seat 3 4a completes the test operation, it can drive the lower pressure test head 3 4 3 a to transfer the finished electronic component 4 2 ascending displacement, the transport mechanism 3 5 a drives the receiving stage 3 5 4 a to move from the refueling position of the machine to the lower part of the lower pressure test head 3 4 3 a, and now the test head 3 4 3 a The completed electronic component 4 2 can be placed in the receiving load = 3 5 4 a, and the conveying mechanism 3 3 drives the pick and place device 3 3 , 3 3 to move to the temporary zone of the supply dragon 30 At the 3 0 2, the electronic components 4 6 and 4 7 to be tested are taken out from the tray 51 of the temporary (4) 3 Q 2 . , refer to 1st Q® 'The transfer mechanism 3 5 a after the electronic component 4 2 is completed.' Drive the feeding stage 3 5 2 a Displacement to the lower pressure test head 3 4 3 a:: material dl , 3 4 V takes out the next electronic component 4 3 to be tested, and can exit the test socket 3 4 1 a, so as to press the test head 3 4 3 a to place the side electronic reading 4 3 in the test seat 3 4 ia孰 test operation, and the transfer mechanism 3 5 c bis feeding platform 3 5 workers c, 3 5 / has been located in the refueling station of the machine, the transport mechanism 3 3 is the electronic 7 ^ 46, 47 transfer The change is located in the transport mechanism 3 5 c of the two-stage feeding stage 3 5丄a ^ ; 3 3 2 sets the electronic components 4 6 and 4 7 of the f-ji measurement to the supply stage 351c, 352. In the middle of the test. Please refer to Figure 11, when the transfer mechanism is 35a ° two receiving platform 3 5 3 a 11 200827737
、3 5 4 a均已盛置完測之電子元件41、4 2後，係令二供料 載台351a、352a及二收料載台353a、354a滑^多 至機台之換料處，而輸送機構3 3亦驅動各取放器3 3 ^、 332、333、33 4移動至機台之換料處，並分別位於轉 機構3 5 a之二供料載台351a、352a及二收料載么 3 5 3 a、3 5 4 a上方，令二取放器3 3 3、3 3 4將二收^ 載台353a、354a中之完測電子元件41、4 2取出，並 以二取放器3 31、3 3 2將由供料匣3 0料盤51中取出之^ 待測電子元件4 8、4 Θ置入於二供料載台3 5 a、3 5 一 中，使轉運機構3 5 a於機台之換料處完成完測電子元件 4 2及待測電子元件4 8、4 9之交換作業。 請參閱第12圖，該收料匣31 a之暫置區312 a已晉姑 有空的料盤5 2供置放完_子元件，而輸送機構3 ^ ^動^取放器3 3 3、3 3 4位移至收舰3 i a 3 處，而將完測之電子元件41、42置入於料盤 5 2中收置，而完成測試分類作業。 、請參閱第13圖，當供料£30料盤5丄中之待 3用^畢後，輸送機構3 3即驅動取放器】 3 0之暫置區3 〇 2處’並以取放器3 3 的料盤5 1移載至空£3 2之暫置區3 2 2處暫 = 暫置區3 2 2之糾料盤5 1载送輸人至堆疊區°3巧】21 堆疊區3 21將空的料盤51升降位銘始晶丨々j 21處，並於 3 1 a暫置區3 1 2 a之料般5 2在盛、卜宜欠置’另該收料匣 收料E 3 1 a即將料盤5 2 X暫gfC電子元件後’該 3 i 1 a，，區 3 1 1 a 將料盤 5 2 ;:二=區 以元成收置完測電子元件及空料盤作業。 且彳置 請參閱第1 4圖，當收料匣3 之勒 的料盤收置完軸子元㈣’ 200827737 空的料盤5 3升降位移，並於下方由堆疊區3 21載送輸出至暫 置區3 2 1 ’而輸送機構3 3即驅動取放器3 3 5位移至空£ 3 0之暫置區3 21，並以取放器3 3 5自動化將暫置區3 21 之空的料盤5 3補充於收料匣31 a之暫置區312 a處，以供 便利接續收料。 、 據此’本發明可利用各機構之時序搭配作動，而快速執行待 測及完測之電子元件置換，並可便利自動化於供、收料匣處收置 及補充空料盤，以有效提升測試產能，實為一深具實用性及進步 性之設計’然未見有相同之產品及刊物公開，從而允符發明專利 申請要件，爰依法提出申請。 【圖式簡單說明】 第1圖：係為台灣專利申請第91105851號『IC測試處理機』專 々 利案之配置示意圖。 第2圖：係為台灣專利申請第911〇5851號『IC測試處理機』專 ★ 利案之部分外觀示意圖。 ，3圖：本發明之架構示意圖。 ^4圖：本發明執行測試作業之使用示意圖（一）。 ，5圖··本發明執行測試作業之使用示意圖（二）。 第6圖：本發明執行測試作業之使用示意圖（三）。 f 7圖：本發明執行測試作業之使用示意圖（四）。 f 8圖：本發明執行測試作業之使用示意圖（五）。 第9圖：本發明執行測試作業之使用示意圖（六）。 f 1 0圖：本發明執行測試作業之使用示意圖（七）。 f 1 1圖：本發明執行測試作業之使用示意圖（八）。 第1 2圖：本發明執行測試作業之使用示意圖（九）。 f13圖：本發明將供料匣處之空料盤收置於空匣之示意圖。 第14圖：本發明將空匣之空料盤補充於收料匣之示意圖。 13 200827737 【主要元件符號說明】 / 〔習式〕 1 〇 :機台 11:供料匣/升降器 1 2 :空匣/升降器 °° 13、13a、13b、13c··輸出匣 14 :測試埠 1 5 :測試座 1 6 ·測試板 1 7 :待測1C旋轉緩衝台 1 8 :完測1C旋轉緩衝台 1 9 : 1C輸送機構 2 0 :預熱匣 〔本發明〕 3 0 :供料匣 3 01 :堆疊區 3 0 2 :暫置區 31a、31b、31c、31d:收料匣 311a、311b、311c、311d:堆疊區 312a、312b、312c、312d:暫置區 32·空匿 321·堆豐區 322:暫置區 3 3 :輸送機構 331、332、333、334、335:取放器 34a、34b、34c、34d、34e、34f、34g、 •測試區 " 3 41、3 41 a :測試座 3 4 2 :測試板 3 4 3、3 4 3 a :下壓測試頭 35、35a、35b、35c··轉運機構 351、 351a、351b、351c:供料載台 352、 352a、352b、352c:供料載台 3 5 3、3 5 3 a :收料載台 354、354a·收料載台 3 6 :預熱匣 14 200827737 4 1、4 2、 子元件 5 1、5 2、 43、44、45、46、47、48、49:電 5 3 :料盤 15After the electronic components 41 and 42 have been installed, the two feeding stages 351a and 352a and the two receiving stages 353a and 354a are slid to the refueling place of the machine. The transport mechanism 3 3 also drives the pick and place devices 3 3 ^, 332, 333, and 33 4 to move to the refueling portion of the machine, and is respectively located at the two feeding stations 351a, 352a and the second receiving unit of the rotating mechanism 35a. Above the load, 3 5 3 a, 3 5 4 a, the second pick-and-place device 3 3 3, 3 3 4 takes out the electronic components 41, 4 2 of the two receiving stations 353a, 354a, and takes two The pick-and-placer 3 31, 3 3 2 puts the electronic components to be tested 4 8 , 4 取出 taken out from the tray 51 30 of the feed 匣 30 into the two feeding stages 3 5 a, 3 5 for transporting The mechanism 3 5 a completes the exchange operation of the electronic component 4 2 and the electronic components to be tested 4 8 , 4 9 at the refueling station of the machine. Referring to Figure 12, the temporary storage area 312a of the receiving container 31a has been placed in the tray 5 2 for the placement of the sub-component, and the conveying mechanism 3 ^ ^ ^ pick-and-place 3 3 3 3 3 4 is displaced to the receiving ship 3 ia 3 , and the completed electronic components 41 , 42 are placed in the tray 5 2 to complete the test classification operation. Please refer to Figure 13, when the feed 3030 tray 5 is used for 3, the transport mechanism 3 3 drives the pick-and-placer 3 3 temporary area 3 〇 2 ' and pick and place The tray 5 1 of the device 3 3 is transferred to the temporary area of the space £3 2 2 2 2 temporary = temporary area 3 2 2 the correction plate 5 1 carrying the input to the stacking area °3] 21 stacking Area 3 21 lifts the empty tray 51 to the position of the first floor, and at the 3 1 a temporary area 3 1 2 a, the material is 5 2 in the Sheng, Bu Yi owed 'the other receiving 匣Receipt E 3 1 a will be the tray 5 2 X after the gfC electronic components 'the 3 i 1 a,, the zone 3 1 1 a will be the tray 5 2 ;: 2 = zone to complete the measurement of electronic components and Empty tray operation. Please refer to Figure 14 for the arrangement. When the tray of the receipt 匣3 is finished, the shaft element (4) '200827737 empty tray 5 3 lifting displacement is carried out, and the output is carried by the stacking area 3 21 below. The temporary area 3 2 1 ', and the conveying mechanism 3 3 drives the pick-and-placer 3 3 5 to the temporary area 3 21 of the empty space of 30, and automatically unloads the temporary area 3 21 with the pick-up unit 3 3 5 The tray 5 3 is replenished at the temporary area 312 a of the receiving cassette 31 a for convenient connection and receiving. According to this, the present invention can utilize the timing matching of various institutions to quickly perform the electronic component replacement to be tested and completed, and can facilitate the automatic collection and replenishment of empty trays at the supply and receiving points to effectively improve The test of production capacity is actually a practical and progressive design. However, the same products and publications have not been disclosed, so that the requirements for invention patent applications are allowed, and applications are filed according to law. [Simple description of the diagram] Fig. 1 is a schematic diagram of the configuration of the "IC Test Processor" for Taiwan Patent Application No. 91105851. Figure 2: The Taiwan Patent Application No. 911〇5851 “IC Test Processor” is a part of the appearance of the case. 3 is a schematic diagram of the architecture of the present invention. ^4 Figure: Schematic diagram of the use of the test work performed by the present invention (1). Figure 5 is a schematic diagram of the use of the test work performed by the present invention (2). Figure 6: Schematic diagram of the use of the test work performed by the present invention (3). Figure f 7: Schematic diagram of the use of the test work performed by the present invention (4). Figure 8: Schematic diagram of the use of the test work performed by the present invention (5). Figure 9: Schematic diagram of the use of the test work performed by the present invention (6). f 1 0 Figure: Schematic diagram of the use of the test work performed by the present invention (7). f 1 1 Figure: Schematic diagram of the use of the test work performed by the present invention (8). Figure 12: Schematic diagram of the use of the test work performed by the present invention (9). F13Fig.: The schematic diagram of the invention for placing the empty tray at the feed raft in an open space. Figure 14: Schematic diagram of the present invention for replenishing an empty empty tray to a receiving bowl. 13 200827737 [Description of main component symbols] / [Law] 1 〇: Machine 11: Feeder/lifter 1 2: Open/lifter °° 13, 13a, 13b, 13c·· Output 匣 14: Test埠1 5 : Test stand 1 6 · Test board 1 7 : 1C rotary buffer table to be tested 1 8 : Complete 1C rotary buffer table 1 9 : 1C conveying mechanism 2 0 : Preheating 匣 [Invention] 3 0 : Feeding匣3 01 : stacking area 3 0 2 : temporary area 31a, 31b, 31c, 31d: receiving area 311a, 311b, 311c, 311d: stacking area 312a, 312b, 312c, 312d: temporary area 32 · occlusion 321 · Stacking area 322: temporary area 3 3 : conveying mechanism 331, 332, 333, 334, 335: pickers 34a, 34b, 34c, 34d, 34e, 34f, 34g, • test area " 3 41, 3 41 a : test stand 3 4 2 : test board 3 4 3, 3 4 3 a : lower pressure test head 35, 35a, 35b, 35c··transport mechanism 351, 351a, 351b, 351c: supply stage 352, 352a , 352b, 352c: feeding stage 3 5 3, 3 5 3 a : receiving stage 354, 354a · receiving stage 3 6 : preheating 匣 14 200827737 4 1 , 4 2 , sub-component 5 1 , 5 2, 43, 44, 45, 46, 47, 48, 49: electricity 5 3: tray 15