TW200826211A - Wafer-level test module and method of image sensor chip - Google Patents

Wafer-level test module and method of image sensor chip Download PDF

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Publication number
TW200826211A
TW200826211A TW095146509A TW95146509A TW200826211A TW 200826211 A TW200826211 A TW 200826211A TW 095146509 A TW095146509 A TW 095146509A TW 95146509 A TW95146509 A TW 95146509A TW 200826211 A TW200826211 A TW 200826211A
Authority
TW
Taiwan
Prior art keywords
optical
wafer
image sensing
layer
level test
Prior art date
Application number
TW095146509A
Other languages
English (en)
Chinese (zh)
Other versions
TWI320213B (enExample
Inventor
Sheng-Feng Lu
Wei-Hua Lee
Original Assignee
Visera Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Visera Technologies Co Ltd filed Critical Visera Technologies Co Ltd
Priority to TW095146509A priority Critical patent/TW200826211A/zh
Priority to US11/730,813 priority patent/US7414423B2/en
Publication of TW200826211A publication Critical patent/TW200826211A/zh
Priority to US12/219,087 priority patent/US7589033B2/en
Application granted granted Critical
Publication of TWI320213B publication Critical patent/TWI320213B/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N17/00—Diagnosis, testing or measuring for television systems or their details
    • H04N17/002—Diagnosis, testing or measuring for television systems or their details for television cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW095146509A 2006-12-12 2006-12-12 Wafer-level test module and method of image sensor chip TW200826211A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW095146509A TW200826211A (en) 2006-12-12 2006-12-12 Wafer-level test module and method of image sensor chip
US11/730,813 US7414423B2 (en) 2006-12-12 2007-04-04 Wafer-level test module for testing image sensor chips, the related test method and fabrication
US12/219,087 US7589033B2 (en) 2006-12-12 2008-07-16 Fabrication of wafer-level test module for testing image sensor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095146509A TW200826211A (en) 2006-12-12 2006-12-12 Wafer-level test module and method of image sensor chip

Publications (2)

Publication Number Publication Date
TW200826211A true TW200826211A (en) 2008-06-16
TWI320213B TWI320213B (enExample) 2010-02-01

Family

ID=39497203

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095146509A TW200826211A (en) 2006-12-12 2006-12-12 Wafer-level test module and method of image sensor chip

Country Status (2)

Country Link
US (2) US7414423B2 (enExample)
TW (1) TW200826211A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115201537A (zh) * 2021-04-12 2022-10-18 晶英科技股份有限公司 运用半导体制程成形于晶圆基板的电性检测装置

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5054949B2 (ja) * 2006-09-06 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN101172281B (zh) * 2006-11-03 2010-09-29 鸿富锦精密工业（深圳）有限公司 清洗治具
US7868630B2 (en) * 2007-06-26 2011-01-11 Micron Technology, Inc. Integrated light conditioning devices on a probe card for testing imaging devices, and methods of fabricating same
KR101572531B1 (ko) * 2008-09-02 2015-11-27 삼성전자주식회사 조립시 중심 맞춤되는 부품, 웨이퍼 레벨 부품 조립체, 웨이퍼 레벨 부품 조립체의 제조장치 및 제조방법
JP2011186306A (ja) * 2010-03-10 2011-09-22 Fujifilm Corp ウェハレンズユニットおよびウェハレンズユニットの製造方法
CN105302286B (zh) * 2014-06-04 2020-03-03 昇佳电子股份有限公司 光感测装置及安排感光组件的方法
WO2016033303A1 (en) * 2014-08-28 2016-03-03 Seek Thermal, Inc. Radiometric test and configuration of an infrared focal plane array at wafer probe
CN106331693B (zh) * 2015-07-03 2018-06-19 群光电子股份有限公司 测试系统及测试方法
CN106483126B (zh) * 2015-08-27 2019-12-24 京元电子股份有限公司 半导体元件影像测试装置及其测试设备
CN111031310B (zh) * 2019-12-30 2021-04-06 重庆盛泰光电有限公司 手机摄像模组用砂尘试验装置
CN117723930B (zh) * 2023-11-22 2024-10-18 深圳米飞泰克科技股份有限公司 一种cis晶圆测试系统及方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060284631A1 (en) * 2005-05-31 2006-12-21 Hamren Steven L Imaging test socket, system, and method of testing an image sensor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115201537A (zh) * 2021-04-12 2022-10-18 晶英科技股份有限公司 运用半导体制程成形于晶圆基板的电性检测装置

Also Published As

Publication number Publication date
US20080280382A1 (en) 2008-11-13
US7589033B2 (en) 2009-09-15
US7414423B2 (en) 2008-08-19
TWI320213B (enExample) 2010-02-01
US20080136434A1 (en) 2008-06-12

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