200823139 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種將膠帶精度良好地定位於基板之特定 位置之膠帶黏貼裝置。 【先前技術】 如圖5所示，先前之膠帶黏貼裝置具備：支持基板2之基 板支持部3，膝▼供給部21 ’其係向由基板支持部3所支持 之基板2上供給膠帶1者；加壓部5，其係與基板支持部3對 向配置’並對從膠帶供給部21向由基板支持部3所支持之 基板2上供給之膠帶1進行按壓，使之壓合者；及膠帶捲取 部22，其係對於基板支持部3設置於供給捲筒21之相反 侧，捲取壓合後之膠帶1者。 又，如圖5及圖6所示，在基板支持部3之兩側面設置有 一對將膠帶1引導至基板2之特定位置予以定位之膠帶導執 7、7。另外，圖6係將圖5所示之膠帶黏貼裝置從yj方向所 視之放大侧面圖。 如圖5及圖6所示，各膠帶導軌7包括配置於基板支持部3 之側面之爪基座12和藉由螺釘8固定於該爪基座12上，且 一端具有凹部9之爪部40。 【發明内容】 [發明所欲解決之問題] 且說藉由加壓部5按壓在基板2上之膠帶丨存在各種寬度 者。因此，每當採用不同寬度之膠帶丨時，都必須更換具 有與該膠帶1寬度相符之凹部9之爪部4〇。 121089.doc 200823139 更換爪部40之具體方法如下。即，首先拆下將爪部4〇固 定在爪基座12上之螺釘8。然後選定具有與所引導之膠帶1 寬度相符之凹部9之爪部40。然後將所選定之爪部4〇藉由 螺釘8固定於爪基座12上。 然而，每當使用不同寬度之膠帶1時，用該種方法更換 . 爪部40非常耗費時間，膠帶黏貼裝置之運轉率大幅下降。 - 本發明係考慮如此問題而完成者，其目的在於提供一種 ^ 將具有各種寬度之膠帶精度良好地定位於基板之特定位置 且運轉率高之膠帶黏貼裝置。 [解決問題之技術手段] 本發明之膠帶黏貼裝置，其特徵為具備：支持基板之基 板支持部’膠帶供給部，其係向由基板支持部所支持之基 板上供給膠帶者；加壓部，其係與基板支持部對向配置， 並對從膠帶供給部向由基板支持部所支持之基板上供給之 膠帶進行按壓，使之壓合者；及一對膠帶導執，其係設於 U &板支持部之兩側面’將膠帶定位於基板之特定位置上； 且各膠帶導軌至少具有寬度互不相同之第一凹部與第二凹 部。 . 藉$上述之構成，不僅可將具有各種寬度之膠帶精度良 好地疋位於基板之特定位置，且可提高膠帶黏貼裝置之運 轉率。 本發明之膠帶黏貼裝置，其特徵為：各膠帶導軌包括配 置於基板支持部之側面之爪基座及旋轉自如地保持在該爪 基座上之爪部，爪部至少在一端具有上述第-凹部，而在 121089.doc 200823139 另一端具有上述第二凹部。 本發明之膠帶黏貼裝置，其特徵為··各膠帶導軌包括配 置於基板支持部之側面之爪基座及滑動自如地保持在該爪 基座上之爪邛，爪部至少具有上述第一凹部及對於上述第 一凹部配置於爪部之滑動方向上之上述第二凹部。 本發明之膠帶黏貼裝置，其特徵為··各膠帶導軌具有： 爪基座，其係配置於基板支持部之側面者；第1爪部，其 、 係經由第一氣缸而伸縮自如地設於該爪基座上，並具有上 述第一凹部者，·及第2爪部，其係經由第二氣缸而伸縮自 如地設於上述爪基座上，並具有上述第二凹部者。 本發明之膠帶黏貼裝置，其特徵為：在第一氣缸及第二 氣缸分別連接有控制第一氣缸及第二氣缸之伸縮之控制 部。 藉由如此之構成，由於可自動地切換使用寬度互不相同 之第一凹部與第二凹部，故無須操作者作業，即可將膠帶 丨定位於基板之特定位置。 本發明之膠帶黏貼裝置，其特徵為：膠帶導執與基板支 持部一體設置。 [發明之效果] 基於本發明，可提供一種膠帶黏貼裝置，其係藉由應用 具有寬度互不相同之第一凹部及第二凹部之膠帶導執，將 具有各種寬度之膠帶精度良好地定位於基板之特定位置， 且運轉率高者。 【實施方式】 121089.doc 200823139 第1實施形態 以下’參照圖式說明太 月本發明之膠帶黏貼裝置之第1實施 形態。於此，圖1及圖2孫酿一丄々 ^ 間2係顯不本發明之第1實施形態之 圖。另外，圖2係將圖1所 嫌 厅不之膠π黏貼裝置從I方向所視 之放大側面圖。 首先，應用圖2簡單# M i 1 早說月精由膠帶黏貼裝置向貼合基板 (基板）2壓合之ACF膠帶（膠帶。 ΟBACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape sticking apparatus for accurately positioning a tape at a specific position of a substrate. [Prior Art] As shown in Fig. 5, the conventional tape attaching device includes a substrate supporting portion 3 for supporting the substrate 2, and the knee supplying portion 21' is supplied to the substrate 2 supported by the substrate supporting portion 3 The pressurizing portion 5 is disposed opposite to the substrate supporting portion 3 and presses the tape 1 supplied from the tape supplying portion 21 to the substrate 2 supported by the substrate supporting portion 3 to press it; and The tape take-up portion 22 is provided on the opposite side of the supply roll 21 to the substrate support portion 3, and the pressure-bonded tape 1 is taken up. Further, as shown in Figs. 5 and 6, on the both side faces of the substrate supporting portion 3, a pair of tape guides 7 and 7 for guiding the tape 1 to a specific position of the substrate 2 are provided. Further, Fig. 6 is an enlarged side view showing the tape sticking device shown in Fig. 5 as viewed from the yj direction. As shown in FIGS. 5 and 6, each of the tape guides 7 includes a claw base 12 disposed on a side surface of the substrate support portion 3, and a claw portion 40 fixed to the claw base 12 by a screw 8 and having a concave portion 9 at one end. . SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] It is to be noted that the tape 按压 which is pressed against the substrate 2 by the pressurizing portion 5 has various widths. Therefore, each time a tape 不同 of a different width is used, the claw portion 4 having the concave portion 9 corresponding to the width of the tape 1 must be replaced. 121089.doc 200823139 The specific method of replacing the claws 40 is as follows. That is, first, the screw 8 that fixes the claw portion 4 to the claw base 12 is removed. The claw portion 40 having the recess 9 corresponding to the width of the guided tape 1 is then selected. The selected claw portion 4 is then fixed to the pawl base 12 by screws 8. However, whenever the tape 1 of a different width is used, it is replaced by this method. The claws 40 are very time consuming, and the operation rate of the tape sticking device is drastically lowered. The present invention has been made in view of such a problem, and an object thereof is to provide a tape sticking device which has a tape having various widths accurately positioned at a specific position of a substrate and has a high operation rate. [Means for Solving the Problems] The tape sticking device of the present invention is characterized in that the substrate supporting portion of the support substrate is a tape supply portion that supplies a tape to a substrate supported by the substrate supporting portion, and a pressurizing portion. It is disposed opposite to the substrate supporting portion, and presses the tape supplied from the tape supply portion to the substrate supported by the substrate supporting portion to press it; and a pair of tape guides are attached to the U The two sides of the & board support portion 'position the tape on a specific position of the substrate; and each of the tape guides has at least a first recess and a second recess having different widths from each other. By the above-mentioned constitution, not only the tape having various widths can be accurately placed at a specific position of the substrate, but also the running rate of the tape pasting device can be improved. The tape sticking device of the present invention is characterized in that each tape guide includes a claw base disposed on a side surface of the substrate support portion and a claw portion rotatably held on the claw base, and the claw portion has the first portion at least at one end - The recess has the second recess described above at the other end of 121089.doc 200823139. The tape sticking device of the present invention is characterized in that each of the tape guides includes a claw base disposed on a side surface of the substrate support portion and a claw slidably held by the claw base, and the claw portion has at least the first concave portion And the second recessed portion disposed in the sliding direction of the claw portion with respect to the first recessed portion. The tape sticking device of the present invention is characterized in that each of the tape guides has a claw base that is disposed on a side surface of the substrate support portion, and a first claw portion that is expandably and retractably provided via the first cylinder. The claw base includes the first recessed portion and the second claw portion, and is provided on the claw base by a second cylinder, and has the second recessed portion. The tape sticking device of the present invention is characterized in that a control portion for controlling the expansion and contraction of the first cylinder and the second cylinder is connected to each of the first cylinder and the second cylinder. According to this configuration, since the first concave portion and the second concave portion having different widths can be automatically switched, the tape cassette can be positioned at a specific position of the substrate without an operator's work. The tape sticking device of the present invention is characterized in that the tape guide is integrally provided with the substrate supporting portion. [Effects of the Invention] According to the present invention, it is possible to provide a tape sticking apparatus which accurately positions a tape having various widths by applying a tape guide having first and second recesses having different widths from each other. The specific position of the substrate, and the operation rate is high. [Embodiment] 121089.doc 200823139 First Embodiment Hereinafter, a first embodiment of the tape sticking apparatus of the present invention will be described with reference to the drawings. Here, the first embodiment of the present invention is not shown in Fig. 1 and Fig. 2; In addition, Fig. 2 is an enlarged side view showing the glue π sticking device of Fig. 1 as viewed from the I direction. First, apply the simple #M i 1 of Fig. 2 to say that the AEF tape (tape tape) is pressed by the tape bonding device to the bonding substrate (substrate) 2.
如圖2所示’ ACF膠帶丨包含剝離紙u和設於剝離紙^上 之ACFlb(異方性導電膜），且从⑽對於剝離紙u配置於 貼合基板2側。 其次，應用圖2簡單說明壓合ACF膠帶iiACFu之貼合 基板2。 如圖2所示，貼合基板2包含：由玻璃構成之上基板32; 同樣由玻璃構成之下基板31 ;及設置於上基板32與下基板 31之間之金屬佈線35。另外，如圖2所示，該金屬佈線35 之一部分設置於下基板31上，且自上基板32之外緣突出。 其次，應用圖1及圖2說明本實施形態之膠帶黏貼裝置。 如圖1所示，膠帶黏貼裝置具備：基板支持部3，其係支 持貼合基板2者；供給捲筒（膠帶供給部）21，其係向由基板 支持部3所支持之貼合基板2上供給ACF膠帶1者；加壓部 5，其係與基板支持部3對向配置，並將從供給捲筒2丨供給 至由基板支持部3所支持之貼合基板2上之ACF膠帶1按壓 在貼合基板2上，藉由加熱將ACFlb壓合者；及捲取捲筒 (膠帶捲取部）22，其係對於基板支持部3設置於供給捲筒21 121089.doc 200823139 之相反側，並捲取壓合ACF lb後之剝離紙la者。 又，如圖1所示，在基板支持部3之兩側面設置有一對膠 帶導執7、7，其將ACF膠帶1定位於貼合基板2之特定位 置，即在下基板31上且自上基板32之外緣突出設置之金屬 佈線35上（參照圖2)。 又，如圖1所示，各膠帶導執7具有寬度互不相同之第一 凹部9a和第二凹部9b。具體而言，如圖1及圖2所示，各膠 、 帶導軌7包含配置於基板支持部3之側面之爪基座12及在旋 轉軸10周圍旋轉自如地保持在該爪基座12上之爪部4〇。並 且，該爪部40在一端具有第一凹部9a，而在另一端具有寬 度較第一凹部9a更窄之第二凹部9b。 另外，如圖2所示，爪部40具有向爪基座12方向突出之 突出部40a，該突出部40a與設於爪基座12上之嵌合部12a 相嵌合。 又，如圖2所示，上述之旋轉軸1〇經由彈簧丨丨與爪部4〇 Q 相連接。又，該旋轉軸10插通設於爪部40之突出部4(^之 大約中心之開口孔40b及設於爪基座12之嵌合部12&之大約 中心之開口部12b。 第二孔部401。並且 爪基座12具有插通該第一As shown in Fig. 2, the ACF tape 丨 includes a release paper u and an ACFlb (isomeric conductive film) provided on the release paper, and is disposed on the side of the bonded substrate 2 from the (10) release paper u. Next, the bonded substrate 2 of the ACF tape iiACFu is simply described with reference to Fig. 2 . As shown in Fig. 2, the bonded substrate 2 includes an upper substrate 32 made of glass, a lower substrate 31 made of glass, and a metal wiring 35 provided between the upper substrate 32 and the lower substrate 31. Further, as shown in FIG. 2, a part of the metal wiring 35 is provided on the lower substrate 31 and protrudes from the outer edge of the upper substrate 32. Next, the tape sticking apparatus of this embodiment will be described with reference to Figs. 1 and 2 . As shown in FIG. 1, the tape sticking device includes a substrate supporting portion 3 that supports the bonded substrate 2, and a supply reel (tape supply portion) 21 that is attached to the bonded substrate 2 supported by the substrate supporting portion 3. The ACF tape 1 is supplied upward; the pressurizing portion 5 is disposed opposite to the substrate supporting portion 3, and the ACF tape 1 is supplied from the supply reel 2 to the bonded substrate 2 supported by the substrate supporting portion 3. Pressing on the bonded substrate 2, pressing the ACFlb by heating; and winding the reel (tape take-up portion) 22 to the substrate support portion 3 on the opposite side of the supply reel 21 121089.doc 200823139 And take the peeling paper la after pressing ACF lb. Further, as shown in FIG. 1, a pair of tape guides 7, 7 are provided on both side faces of the substrate supporting portion 3, which position the ACF tape 1 at a specific position of the bonding substrate 2, that is, on the lower substrate 31 and from the upper substrate. The outer edge of 32 is provided on the metal wiring 35 (see FIG. 2). Further, as shown in Fig. 1, each tape guide 7 has a first recess 9a and a second recess 9b having mutually different widths. Specifically, as shown in FIGS. 1 and 2 , each of the glue and the tape guide 7 includes a claw base 12 disposed on a side surface of the substrate support portion 3 and rotatably held around the rotary shaft 10 on the claw base 12 . The claws are 4〇. Further, the claw portion 40 has a first recessed portion 9a at one end and a second recessed portion 9b having a narrower width than the first recessed portion 9a at the other end. Further, as shown in Fig. 2, the claw portion 40 has a projecting portion 40a that protrudes in the direction of the claw base 12, and the projecting portion 40a is fitted to the fitting portion 12a provided on the claw base 12. Further, as shown in Fig. 2, the above-mentioned rotating shaft 1〇 is connected to the claw portion 4〇Q via a spring 丨丨. Further, the rotating shaft 10 is inserted into the opening portion 40b of the protruding portion 4 (the center of the claw portion 40) and the opening portion 12b provided at the approximate center of the fitting portion 12& of the claw base 12. a portion 401. And the claw base 12 has the first inserted
通第二孔部401。 又，如圖2所示，爪部40對於突出部4〇a在第一凹部％側 具有第一孔部40k，並對於突出部4〇a在第二凹部外側具有 一孔部40k及 固定銷13a插The second hole portion 401 is passed through. Further, as shown in FIG. 2, the claw portion 40 has a first hole portion 40k on the first concave portion % side with respect to the protruding portion 4A, and a hole portion 40k and a fixing pin on the outside of the second concave portion with respect to the protruding portion 4A. 13a plug
121089.doc 200823139 具4。並且，若加壓部5之熱壓合工具*向下方移動，則 ACFlb經由剝離紙la—邊按壓至設於下基板η上，且自上 基板32之外緣突出之金屬佈線35(參照圖2)上一邊進行加 熱，藉此將其壓合。 σ 其-人’敍述包含如此構成之本實施形態之作用。 f Ο 首先例如如圖2所示，考量藉由爪部4〇之第一凹部^ 引導ACF膠帶i之情形。該情形下，首先，第一凹部％配 置成來到第二凹部补之正上方，在第一凹部％内引導 膠帶1。另外，此時，爪基座12之固定銷13a插通爪部4〇之 第二孔部40卜又，藉由彈簧n之彈力向爪基座匕之嵌合 部12a按壓爪部40之突出部4〇a，使之與該嵌合部嵌 合0 然後，從供給捲筒21向由基板支持部3所支持之貼合基 板2上供給ACF膠帶1(參照圖1)。 然後，加壓部5之熱壓合工具4向下方移動，經由剝離紙 la—邊按壓一邊加熱ACFlb(參照圖丨）。藉此，將acf膠帶 1之ACFlb向貼合基板2上壓合。 此時，如上所述，藉由各膠帶導軌7之爪部4〇之第一凹 部9a，可將具有特定寬度之ACF膠帶i精度良好地定位於 貼合基板2之特定位置（設於貼合基板2之下基板^上，且 自上基板32之外緣突出之金屬佈線35上）（參照圖。 可以精度良好地將 因此，藉由加壓部5之熱壓合工具4, ACF膠帶1之ACFlb壓合在設於下基板31上，且自上基板32 之外緣突出之金屬佈線35上。 121089.doc -10- 200823139 然後，考量引導比由爪部40之第一凹部9a引導之ACF膠 帶1寬度更窄之ACF膠帶1之情形。首先，將爪部4〇拉向與 爪基座12相反側（圖2之箭頭方向）後，將爪部4〇旋轉18〇。， 第二凹部9b配置成來到第一凹部9&之正上方。然後，將爪 部40返回至爪基座12側，並在爪部4〇之第二凹部外内引導 ACF膠帶1。此時，爪基座12之固定銷13a插通爪部4〇之第 一孔部40k，而爪部40之突出部40a藉由彈簧丨丨之彈力按壓 向爪基座12之欲合部12a，使之與該嵌合部i2a被合。 然後，與上述相同，從供給捲筒21向由基板支持部3所 支持之貼合基板2上供給ACF膠帶1(參照圖丨）。 然後，加壓部5之熱壓合工具4向下方移動，經由剝離紙 la—邊按壓一邊加熱ACFlb(參照圖1)。藉此，將ACF膠帶 1之ACF lb向貼合基板2上壓合。 此時，如上所述，藉由各膠帶導軌7之爪部4〇之第二凹 部9b，可將比由爪部40之第一凹部9a引導之ACF膠帶1寬 度更窄之ACF膠帶1精度良好地定位於貼合基板2之特定位 置（没於貼合基板2之下基板31上’且自上基板μ之外緣突 出之金屬佈線35上）（參照圖2)。 因此’藉由加壓部5之熱壓合工具4,可以精度良好地將 ACF勝帶1之ACF lb壓合在設於下基板31上，且自上基板32 之外緣突出之金屬佈線35上。 如此’配合ACF膠帶1之寬度，藉由使爪部4〇在爪基座 12之旋轉軸10周圍旋轉’可容易地切換使用寬度互不相同 之弟一凹部9a與第一凹部9b。因此，不僅可以精度良好地 121089.doc -11 - 200823139 將具有各種t度之ACF膠t π位於貼合基板2之特定位置 (設於下基板31上，且自上基板32之外緣突出之金屬佈線 35上），且可提高膠帶黏貼裝置之運轉率。 另外，以上應用與基板支持部3分體構成之膠帶導執7、 7進行了說明’但不限於此，膠帶導執7、7亦可與基板支 持部3 —體設置。 第2實施形態 f, 其次，基於圖3說明本發明之第2實施形態。圖3所示之 帛2實施形態之膠帶導執7、7分別包含配置於基板支持部3 之側面之爪基座12及滑動自如地保持在該爪基座12上之爪 部40。該爪部40具有··第一凹部9a ;和對於該第一凹部％ 配置於爪部40之滑動方向且爪基座12之相反侧，比第一凹 口P9a見度窄之第二凹部9b，。$夕卜，圖3係相當於第^實施形 態之圖2之放大側面圖。 又，如圖3所示，在爪部40設置有插通固定螺釘51之第 (J 開口孔4〇C及第一開口孔40d。並且，爪基座12上設置有 插通固定螺釘51之開口部12c。另外，在圖3中，固定螺釘 51插通第一開口孔4〇c及開口部12c。 又，如圖3所示，爪部40具有··第一孔部4〇m ;及第二 孔部40η，其係對於第一孔部4〇m設置於第一凹部及第二 凹部9b之相反侧者。並且，爪基座12具有插通該第一孔部 40m或第二孔部4〇11之固定銷13b。另外，在圖3中，固定銷 13 b插通第一孔部4 0 m。 其他構成與圖1及圖2所示之第丨實施形態大體相同，在 121089.doc -12- 200823139 圖3所示之第2實施形態中，在與圖丨及圖2所示之第丨實施 形態之相同部分附上同一符號，並省略其詳細說明。 以下說明包含如此構成之本實施形態之作用。 首先，例如如圖3所示，考量藉由爪部4〇之第二凹部9b 引導acf膠帶丨之情形。該情形下，首先，如圖3所示，將 爪基座12之固定銷13b插通爪部4〇之第一孔部4〇m，將固定 螺釘51插通爪部40之第一開口孔4〇c及爪基座12之開口部 12c。此時，如圖3所示，第二凹部外定位於設於貼合基板 之下基板31上，且自上基板32之外緣突出之金屬佈線35 上。 然後，從供給捲筒21向由基板支持部3所支持之貼合基 板2上供給ACF膠帶1(參照圖。 然後，加壓部5之熱壓合工具4向下方移動，經由剝離紙 la—邊按壓一邊加熱ACFlb(參照圖丨）。藉此，將acf膠帶 1之ACFlb向貼合基板2上壓合。 此時，如上所述，藉由各膠帶導軌7之爪部4〇之第二凹 部9b ’可將具有特定寬度之ACF膠帶！精度良好地定位於 貼合基板2之特定位置（設於貼合基板2之下基板η上，且 自上基板32之外緣突出之金屬佈線35上）（參照圖3)。 因此，藉由加麼部5之熱麼合工具4 ’可以精度良好地將 ACF膠帶1之ACFlb壓合在設於下基板31上，且自上基板μ 之外緣突出之金屬佈線35上。 然後，考量引導比由第二凹部9b引導之acf膠帶i寬卢 更寬之ACF膠帶1之情形。將插通爪部之第一開口孔^ 121089.doc •13- 200823139 與爪基座12之開口部12c之固定螺釘51拔出後，擡起爪部 40，移動至貼合基板2側（圖3之箭頭方向）。然後，將固定 螺釘51插通爪部40之第二開口孔40(1及爪基座12之開口部 12c，且將爪基座12之固定銷13b插通爪部4〇之第二孔部 40η。此時，第一凹部9a定位於設於貼合基板2之下基板^ 上’且自上基板32之外緣突出之金屬佈線35上。 然後，與上述相同，從供給捲筒21向由基板支持部3所 支持之貼合基板2上供給ACF膠帶1(參照圖1)。 然後，加壓部5之熱壓合工具4向下方移動，經由剝離紙 la邊私7壓一邊加熱ACF 1 b。藉此，將ACF膠帶1之ACF lb 向貼合基板2上壓合（參照圖丨）。 此時’如上所述’藉由各膠帶導執7之爪部4〇之第一凹 部9a，可將比由爪部40之第二凹部9b引導之ACF膠帶丨寬 度更寬之ACF膠帶1精度良好地定位於貼合基板2之特定位 置（设於貼合基板2之下基板3 1上，且自上基板32之外緣突 出之金屬佈線35上）（參照圖3)。 因此’藉由加壓部5之熱壓合工具4，可以精度良好地將 ACF膠帶1之ACFlb壓合在設於下基板31上，且自上基板32 之外緣突出之金屬佈線35上。 如此’配合ACF膠帶1之寬度，藉由在爪基座12上滑動 爪部40，可容易地切換使用寬度互不相同之第一凹部％與 第二凹部9b。因此，不僅可以精度良好地將具有各種寬度 之ACF膠帶1定位於貼合基板2之特定位置（設於下基板31 上’且自上基板32之外緣突出之金屬佈線35上），且可提 121089.doc •14- 200823139 高膠帶黏貼裝置之運轉率。 第3實施形態 其次’基於圖4說明本發明之第3實施形態。圖4所示之 第3實施形恶之膠帶導軌7、7分別具有：配置於基板支持 部3之側面之爪基座12;第一爪部4〇r，其係經由第一氣缸 14a伸縮自如地設置於爪基座12上，並具有第一凹部％ _ 者；及第二爪部40s，其係經由第二氣缸14b伸縮自如地設 置於爪基座12上，並具有第二凹部9b者。 又如圖4所示，在弟一氣缸14a及第二氣缸i4b分別連 接有控制第一氣缸14a與第二氣缸14b之伸縮之控制部6〇。 其他構成與圖1及圖2所示之第丨實施形態大體相同，在 圖4所示之第3實施形態中，在與圖丨及圖2所示之第1實施 形態相同部分附上同一符號，並省略其詳細說明。 以下說明包含如此構成之本實施形態之作用。 首先，例如如圖4所示，考量藉由第一爪部4〇r之第一凹 t 部9a引導ACF膠帶1之情形。該情形下，首先，根據有關 用於貼合基板2之ACF膠帶!寬度之生產資訊，自動地，由 ㈣部60將各膠帶導軌7之第—氣缸14a向下方㈣。㈢ 然後，從供給捲筒21向由基板支持部3所支持之貼合美 板2上供給AC：F膠帶1(參照圖4)。 σ 土 ，經由剝離紙 ’將ACF膠帶 然後’加壓部5之熱壓合工具4向下方移動 la—邊按壓一邊加熱ACFlb(參照圖4)。藉此 1之ACFlb向貼合基板2上壓合。 此時，如上所述，#由各膠帶導軌7之第_爪部條之第 121089.doc 200823139 一凹部9a，可將具有特定寬度之acf膠帶1精度良好地定 位於貼合基板2之特定位置（設於貼合基板2之下基板3 i 上，且自上基板32之外緣突出之金屬佈線35上）。 因此’藉由加壓部5之熱壓合工具4，可以精度良好地將 ACF膠帶1之ACF1b壓合在設於下基板31上，且自上基板32 之外緣突出之金屬佈線35上。 然後，在引導比由第一爪部4〇r之第一凹部9a引導之ACF 膠帶1寬度更窄之ACF膠帶1之情形，根據有關該ACF膠帶i 寬度之生產資訊，藉由控制部6〇自動地將各膠帶導軌7之 第一氣缸l4a向上方驅動，且將各膠帶導執7之第二氣缸 14b向下方驅動。 然後，與上述相同，從供給捲筒21向由基板支持部3所 支持之貼合基板2上供給ACF膠帶1(參照圖4)。 然後，加壓部5之熱壓合工具4向下方移動，經由剝離紙 la—邊按壓一邊加熱ACFlb。藉此，將Acf膠帶1之ACFlb 向貼合基板2壓合（參照圖4)。 此時，如上所述，藉由各膠帶導執7之第二爪部4〇s之第 二凹部9b，可將比由第一爪部4〇r之第一凹部9a引導之acf 膠帶1寬度更窄之ACF膠帶1精度良好地定位於貼合基板2 之特定位置（設於貼合基板2之下基板3丨上，且自上基板32 之外緣突出之金屬佈線35上）。 因此，藉由加壓部5之熱壓合工具4，可以精度良好地將 ACF膠帶iiACFib壓合在設於下基板31上，且自上基板32 之外緣突出之金屬佈線35上。 121089.doc -16- 200823139 如此，配合ACF膠帶i之寬度，可容易且自動地切換使 用見度互不相同之第一凹部9a與第二凹部9b。因此，不僅 可將具有各種寬度之ACF膠帶1精度良好地定位於貼合基 板2之特定位置（設於下基板31上，且自上基板32之外緣突 出之金屬佈線35上），且可提高膠帶黏貼裝置之運轉率。 又’由於可根據有關用於貼合基板2之Acf膠帶1寬度之 生產資訊’藉由控制部6〇自動地驅動第一爪部4〇Γ之第一 氣缸14a及弟一爪部4〇s之第二氣缸14b各個，故無須操作 者作業’即可將ACF膠帶1定位於貼合基板2之特定位置。 另外，在上述各個實施形態中，應用具有2個寬度不同 之第一凹部9a及第二凹部9b之爪部40進行了說明，但不限 於此，爪部40亦可具有2個以上寬度不同之凹部（第一凹部 9a、第二凹部9b、第三凹部、第四凹部.......）。 【圖式簡單說明】 圖1係顯示本發明之膠帶黏貼裝置之第1實施形態之整體 側面圖。 圖2係將圖1所示之膠帶黏貼裝置從I方向所視之放大侧 面圖。 圖3係在本發明之膠帶黏貼裝置之第2實施形態中，相當 於圖2之放大侧面圖。 圖4係顯示本發明之膠帶黏貼裝置之第3實施形態之整體 側面圖。 圖5係顯示先前之膠帶黏貼裝置之整體側面圖。 圖6係將圖5所示之膠帶黏貼裝置從¥1方向所視之放大侧 121089.doc •17- 200823139 面圖。 【主要元件符號說明】 1 ACF膠帶 la 剝離紙 lb 異方性導電膜 2 貼合基板 3 基板支持部 4 熱壓合工具 5 加壓部 7 膠帶導執 8 螺釘 9 凹部 9a 第一凹部 9b 第二凹部 10 旋轉轴 11 彈簧 12 爪基座 12a 嵌合部 12b 、 12c 開口部 13a、13b 固定銷 14a 第一氣缸 14b 第二氣缸 21 膠帶供給部 22 膠帶捲取部 121089.doc - 18 - 200823139 31 下基板 32 上基板 35 金屬佈線 40 爪部 40a 突出部 40b 開口孔 40c 第一開口孔 40d 第二開口孔 40k、40m 第一孔部 401 > 40n 第二孔部 40r 第一爪部 40s 第二爪部 51 固定螺釘60 121089.doc -19-121089.doc 200823139 has 4. When the hot pressing tool* of the pressurizing unit 5 moves downward, the ACFlb is pressed to the metal wiring 35 which is provided on the lower substrate η and protrudes from the outer edge of the upper substrate 32 via the release paper la (refer to the figure). 2) The upper side is heated to press it. The σ-person's narrative includes the role of the present embodiment thus constituted. f Ο First, as shown in FIG. 2, for example, the case where the ACF tape i is guided by the first recessed portion of the claw portion 4 is considered. In this case, first, the first recessed portion % is disposed so as to come directly above the second recessed portion, and the tape 1 is guided in the first recessed portion. Further, at this time, the fixing pin 13a of the claw base 12 is inserted into the second hole portion 40 of the claw portion 4, and the protrusion of the claw portion 40 is pressed toward the fitting portion 12a of the claw base portion by the elastic force of the spring n. The portion 4A is fitted into the fitting portion. Then, the ACF tape 1 is supplied from the supply reel 21 to the bonded substrate 2 supported by the substrate supporting portion 3 (see Fig. 1). Then, the thermal compression tool 4 of the pressurizing unit 5 moves downward, and the ACFlb (see FIG. 加热) is heated while being pressed by the release paper la. Thereby, the ACFlb of the acf tape 1 is pressed against the bonded substrate 2. At this time, as described above, the ACF tape i having a specific width can be accurately positioned at a specific position of the bonded substrate 2 by the first concave portion 9a of the claw portion 4 of each of the tape guides 7. The substrate 2 is on the lower surface of the substrate 2, and the metal wiring 35 protrudes from the outer edge of the upper substrate 32. (Refer to the figure. Therefore, the thermal compression tool 4 by the pressurizing portion 5, the ACF tape 1 can be accurately performed. The ACFlb is press-fitted on the metal wiring 35 provided on the lower substrate 31 and protruding from the outer edge of the upper substrate 32. 121089.doc -10- 200823139 Then, the guiding guide is guided by the first recess 9a of the claw portion 40. When the ACF tape 1 has a narrower width of the ACF tape 1. First, the claw portion 4 is pulled toward the opposite side of the claw base 12 (in the direction of the arrow in Fig. 2), and then the claw portion 4 is rotated by 18 inches. The recess 9b is disposed directly above the first recess 9&. Then, the claw 40 is returned to the pawl base 12 side, and the ACF tape 1 is guided outside the second recess of the claw 4〇. At this time, the claw The fixing pin 13a of the base 12 is inserted into the first hole portion 40k of the claw portion 4, and the protruding portion 40a of the claw portion 40 is spring-loaded by the spring The engaging portion 12a of the claw base 12 is pressed to be engaged with the fitting portion i2a. Then, similarly to the above, the ACF is supplied from the supply reel 21 to the bonded substrate 2 supported by the substrate supporting portion 3. The tape 1 (see Fig. 丨). Then, the thermocompression tool 4 of the pressurizing unit 5 moves downward, and the ACFlb (see Fig. 1) is heated while being pressed by the release paper la. Thereby, the ACF lb of the ACF tape 1 is taken. Pressing is performed on the bonded substrate 2. At this time, as described above, the ACF tape 1 guided by the first concave portion 9a of the claw portion 40 can be made by the second concave portion 9b of the claw portion 4 of each of the tape guides 7. The ACF tape 1 having a narrower width is accurately positioned at a specific position of the bonded substrate 2 (on the metal wiring 35 which is not on the substrate 31 below the bonded substrate 2 and protrudes from the outer edge of the upper substrate μ) (refer to the figure) 2) Therefore, the ACF lb of the ACF wins 1 can be accurately pressed onto the lower substrate 31 by the thermal press tool 4 of the pressurizing portion 5, and protrudes from the outer edge of the upper substrate 32. On the metal wiring 35. Thus, the width of the ACF tape 1 is matched, and the claw portion 4 is rotated around the rotary shaft 10 of the claw base 12 to accommodate It is easy to switch between the concave portion 9a and the first concave portion 9b which are different in width from each other. Therefore, it is possible to accurately set the ACF adhesive t π having various t degrees to the specificity of the bonded substrate 2 not only accurately 121089.doc -11 - 200823139 The position (on the lower substrate 31 and the metal wiring 35 protruding from the outer edge of the upper substrate 32), and the operation rate of the tape pasting device can be improved. In addition, the above-mentioned application and the substrate support portion 3 are separately formed as a tape guide. The descriptions 7 and 7 have been described 'but are not limited thereto, and the tape guides 7 and 7 may be provided integrally with the substrate supporting portion 3. Second Embodiment f Next, a second embodiment of the present invention will be described based on Fig. 3 . The tape guides 7, 7 of the embodiment shown in Fig. 3 include a claw base 12 disposed on the side surface of the substrate supporting portion 3, and a claw portion 40 slidably held by the claw base 12, respectively. The claw portion 40 has a first concave portion 9a and a second concave portion 9b which is disposed on the opposite side of the claw base 12 in the sliding direction of the claw portion 40 and which is narrower than the first recess P9a. ,. $ 夕, Fig. 3 is an enlarged side view of Fig. 2 corresponding to the second embodiment. Further, as shown in FIG. 3, the claw portion 40 is provided with a first insertion hole fixing mechanism 51 (J opening hole 4A) and a first opening hole 40d. Further, the claw base 12 is provided with a fixing screw 51. In the opening portion 12c, the fixing screw 51 is inserted into the first opening hole 4〇c and the opening portion 12c. Further, as shown in Fig. 3, the claw portion 40 has a first hole portion 4〇m; And the second hole portion 40n is disposed on the opposite side of the first hole portion and the second recess portion 9b with respect to the first hole portion 4〇m. And, the claw base 12 has the first hole portion 40m or the second hole portion The fixing pin 13b of the hole portion 4〇11. In Fig. 3, the fixing pin 13b is inserted into the first hole portion 40m. The other configuration is substantially the same as that of the first embodiment shown in Figs. 1 and 2 . In the second embodiment shown in FIG. 3, the same portions as those in the second embodiment shown in FIG. 2 and FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted. The action of the present embodiment is configured. First, for example, as shown in Fig. 3, the case where the acf tape 引导 is guided by the second concave portion 9b of the claw portion 4 is considered. First, as shown in FIG. 3, the fixing pin 13b of the claw base 12 is inserted into the first hole portion 4〇m of the claw portion 4, and the fixing screw 51 is inserted into the first opening hole 4〇c of the claw portion 40. And the opening portion 12c of the claw base 12. At this time, as shown in FIG. 3, the second concave portion is positioned outside the metal substrate 35 which is disposed on the lower substrate 31 of the bonding substrate and protrudes from the outer edge of the upper substrate 32. Then, the ACF tape 1 is supplied from the supply reel 21 to the bonded substrate 2 supported by the substrate supporting portion 3 (see the drawing. Then, the thermal pressing tool 4 of the pressing portion 5 moves downward, via the release paper la - The ACFlb is heated while pressing (see Fig. 。). Thereby, the ACFlb of the acf tape 1 is pressed against the bonded substrate 2. At this time, as described above, the claw portion 4 of each tape guide 7 is used. The two recessed portions 9b' can accurately position the ACF tape having a specific width at a specific position of the bonded substrate 2 (the metal wiring provided on the substrate η below the bonded substrate 2 and protruding from the outer edge of the upper substrate 32) 35)) (Refer to Fig. 3) Therefore, the ACF tape 1 ACF1 can be accurately performed by adding the heat-receiving tool 4' of the portion 5. b is press-fitted on the metal wiring 35 provided on the lower substrate 31 and protruding from the outer edge of the upper substrate μ. Then, it is considered to guide the ACF tape 1 which is wider than the acf tape i which is guided by the second concave portion 9b. In the case where the first opening hole of the insertion claw portion is formed, and the fixing screw 51 of the opening portion 12c of the claw base 12 is pulled out, the claw portion 40 is lifted up and moved to the side of the bonded substrate 2 (the direction of the arrow in Fig. 3.) Then, the fixing screw 51 is inserted into the second opening hole 40 of the claw portion 40 (1 and the opening portion 12c of the claw base 12, and the fixing pin 13b of the claw base 12 is inserted into the claw The second hole portion 40n of the portion 4〇. At this time, the first concave portion 9a is positioned on the metal wiring 35 which is provided on the lower surface of the substrate 2 and protrudes from the outer edge of the upper substrate 32. Then, similarly to the above, the ACF tape 1 is supplied from the supply reel 21 to the bonded substrate 2 supported by the substrate supporting portion 3 (see Fig. 1). Then, the thermal compression tool 4 of the pressurizing portion 5 is moved downward, and the ACF 1 b is heated while being pressed by the release paper la. Thereby, the ACF lb of the ACF tape 1 is pressed against the bonded substrate 2 (see FIG. 丨). At this time, as described above, the accuracy of the ACF tape 1 which is wider than the width of the ACF tape guided by the second concave portion 9b of the claw portion 40 can be made by the first concave portion 9a of the claw portion 4 of each tape guide 7. It is well positioned at a specific position of the bonded substrate 2 (on the substrate 3 1 under the bonded substrate 2 and on the metal wiring 35 protruding from the outer edge of the upper substrate 32) (see FIG. 3). Therefore, the ACF1 of the ACF tape 1 can be press-fitted onto the metal wiring 35 which is provided on the lower substrate 31 and protrudes from the outer edge of the upper substrate 32 by the thermal pressing tool 4 of the pressurizing portion 5. Thus, by fitting the width of the ACF tape 1, by sliding the claw portion 40 on the claw base 12, the first concave portion % and the second concave portion 9b having different widths can be easily switched. Therefore, not only the ACF tape 1 having various widths can be accurately positioned at a specific position of the bonding substrate 2 (on the metal substrate 35 protruding from the lower substrate 31 and protruding from the outer edge of the upper substrate 32), and提121089.doc •14- 200823139 High tape adhesive device operating rate. Third Embodiment Next, a third embodiment of the present invention will be described based on Fig. 4 . The third embodiment of the adhesive tape guides 7 and 7 shown in Fig. 4 each have a claw base 12 disposed on a side surface of the substrate support portion 3, and a first claw portion 4〇r that is expandable and contractible via the first cylinder 14a. Provided on the claw base 12 and having a first recessed portion _; and a second claw portion 40s which is telescopically provided on the claw base 12 via the second cylinder 14b and has a second recessed portion 9b . Further, as shown in Fig. 4, a control unit 6 that controls the expansion and contraction of the first cylinder 14a and the second cylinder 14b is connected to the first cylinder 14a and the second cylinder i4b, respectively. The other configuration is substantially the same as that of the first embodiment shown in Figs. 1 and 2, and in the third embodiment shown in Fig. 4, the same reference numerals are attached to the same portions as those of the first embodiment shown in Fig. 2 and Fig. 2 And a detailed description thereof is omitted. The following description explains the operation of the embodiment configured as described above. First, for example, as shown in Fig. 4, the case where the ACF tape 1 is guided by the first concave portion 9a of the first claw portion 4〇r is considered. In this case, first, the first cylinder 14a of each of the tape guides 7 is turned downward (four) from the (four) portion 60 in accordance with the production information on the width of the ACF tape to be bonded to the substrate 2. (3) Then, the AC:F tape 1 is supplied from the supply reel 21 to the bonding sheet 2 supported by the substrate supporting portion 3 (see Fig. 4). In the σ soil, the ACF tape is moved by the ACF tape and then the hot pressing tool 4 of the pressurizing portion 5 is moved downward to heat the ACFlb (see Fig. 4). Thereby, the ACFlb of 1 is pressed against the bonded substrate 2. At this time, as described above, the acf tape 1 having a specific width can be accurately positioned at a specific position of the bonded substrate 2 by the recessed portion 9a of the first and second claw strips of the respective tape guides 7. (on the substrate 3 i under the bonding substrate 2 and on the metal wiring 35 protruding from the outer edge of the upper substrate 32). Therefore, the ACF 1b of the ACF tape 1 can be press-fitted onto the metal wiring 35 which is provided on the lower substrate 31 and protrudes from the outer edge of the upper substrate 32 by the thermal compression tool 4 of the pressurizing portion 5. Then, in the case of guiding the ACF tape 1 having a narrower width than the ACF tape 1 guided by the first concave portion 9a of the first claw portion 4〇r, according to the production information on the width of the ACF tape i, the control portion 6〇 The first cylinders 14a of the respective tape guides 7 are automatically driven upward, and the second cylinders 14b of the respective tape guides 7 are driven downward. Then, similarly to the above, the ACF tape 1 is supplied from the supply reel 21 to the bonded substrate 2 supported by the substrate supporting portion 3 (see Fig. 4). Then, the thermal compression tool 4 of the pressurizing portion 5 moves downward, and the ACFlb is heated while being pressed by the release paper la. Thereby, the ACFlb of the Acf tape 1 is pressed against the bonded substrate 2 (refer to FIG. 4). At this time, as described above, the width of the acf tape 1 guided by the first concave portion 9a of the first claw portion 4〇r can be made by the second concave portion 9b of the second claw portion 4〇s of each tape guide 7. The narrower ACF tape 1 is accurately positioned at a specific position of the bonded substrate 2 (on the substrate 3A under the bonded substrate 2 and on the metal wiring 35 protruding from the outer edge of the upper substrate 32). Therefore, the ACF tape iiACFib can be accurately pressed against the metal wiring 35 provided on the lower substrate 31 and protruding from the outer edge of the upper substrate 32 by the thermal compression tool 4 of the pressurizing portion 5. 121089.doc -16- 200823139 Thus, by matching the width of the ACF tape i, the first concave portion 9a and the second concave portion 9b having different visibility can be easily and automatically switched. Therefore, not only the ACF tape 1 having various widths can be accurately positioned at a specific position of the bonded substrate 2 (on the lower substrate 31 and on the metal wiring 35 protruding from the outer edge of the upper substrate 32), and Improve the operation rate of the tape sticking device. Further, since the production information of the width of the Acf tape 1 for bonding the substrate 2 can be automatically driven, the first cylinder 14a and the first claw portion 4's of the first claw portion 4 are automatically driven by the control portion 6A. Since the second cylinders 14b are each, the ACF tape 1 can be positioned at a specific position of the bonded substrate 2 without the need for the operator to operate. Further, in each of the above embodiments, the claw portion 40 having the first concave portion 9a and the second concave portion 9b having two different widths has been described. However, the present invention is not limited thereto, and the claw portion 40 may have two or more different widths. a recess (first recess 9a, second recess 9b, third recess, fourth recess...). BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing the entire first embodiment of a tape sticking device of the present invention. Fig. 2 is an enlarged side elevational view of the tape applying device shown in Fig. 1 as viewed from the direction I. Fig. 3 is a perspective view showing an enlarged side view of Fig. 2 in a second embodiment of the tape applying device of the present invention. Fig. 4 is a side view showing the entire third embodiment of the tape applying device of the present invention. Figure 5 is an overall side view showing a prior art tape sticking device. Fig. 6 is a plan view showing the tape sticking device shown in Fig. 5 as viewed from the direction of ¥1, 121089.doc • 17-200823139. [Explanation of main component symbols] 1 ACF tape la release paper lb anisotropic conductive film 2 bonded substrate 3 substrate support portion 4 thermocompression tool 5 pressurizing portion 7 tape guide 8 screw 9 recess 9a first recess 9b second Recessed portion 10 Rotary shaft 11 Spring 12 Claw base 12a Fitting portion 12b, 12c Opening portion 13a, 13b Fixing pin 14a First cylinder 14b Second cylinder 21 Tape supply portion 22 Tape take-up portion 121089.doc - 18 - 200823139 31 Substrate 32 Upper substrate 35 Metal wiring 40 Claw portion 40a Projection portion 40b Opening hole 40c First opening hole 40d Second opening hole 40k, 40m First hole portion 401 > 40n Second hole portion 40r First claw portion 40s Second claw Part 51 Fixing Screws 60 121089.doc -19-