KR200420975Y1 - Apparatus for attaching coverlay for flexible printed circuit board - Google Patents

Abstract

According to the present invention, a first uncoiler for continuously unwinding and supplying a dynamic laminated plate mounted in a roll form in a temporary welding apparatus for welding a dynamic laminated sheet and a coverlay film having a plurality of holes formed at regular intervals along both sides of a longitudinal edge. Wow; A second uncoiler to which an adhesive is applied to the rear surface to continuously release and supply the coverlay film mounted in a roll shape; The coverlay film supplied from the first uncoiler and the coverlay film supplied from the second uncoiler are overlapped, and both sides of the longitudinal edges of the overlapped dynamic laminate and the coverlay film are continuously heated and pressed to A hot-roller unit for welding both sides of the longitudinal edge to the dynamic laminated plate; A hot wire press for heating and pressing the front surface of the dynamic layer plate and the coverlay film to which both sides of the longitudinal edges are welded by the hot wire roller unit to weld the coverlay film to the front surface of the dynamic layer plate; And a recoiler for winding up and receiving a dynamic layer plate to which a coverlay film is welded by the hot wire press. According to the disclosed FPCB coverlay welding apparatus, there is an effect of reducing the manpower and time required for the welding process, and improve the productivity of the entire production process.

FPCB, Semiconductor Package, Dynamic Laminate, Coverlay Film, Welded

Description

Applitus for attaching coverlay for flexible printed circuit board

1 is a front view showing the overall configuration of the coverlay welding apparatus for FPCB according to a preferred embodiment of the present invention,

Figure 2 is a perspective view of the dynamic layer plate and coverlay film sheet shown in Figure 1,

3 is a perspective view of the hot wire roller unit shown in FIG. 1.

<Explanation of symbols for the main parts of the drawings>

100 ... Futurelay Cover for FPCB

110 ... first uncoiler 120 ... second uncoiler

130 Release paper separator 131 Release paper separation roller

132 Release Geocoil 140 Heat Roller

141 ... sprocket 142 ... heat roller

150 ... heat press 160 ... recoiler

The present invention relates to a welding device, and more specifically, a coverlay film (Flexible Copper Clad Laminate (FCCL)) is completed during the manufacturing process of the flexible printed circuit board (FPCB), the etching is completed to form a pattern on the substrate (FCCL) The present invention relates to a coverlay welding apparatus for FPCB to weld a coverlay film).

Recently, with the rapid development of electronic technology, electronic devices are becoming smaller, lighter and more functional, and semiconductor packages used for them are also being developed.

One type of semiconductor package is an FPCB type semiconductor package, which is manufactured using a film for a semiconductor package that is a flexible printed circuit board (FPCB) instead of a lead frame or a printed circuit board (PCB). It is widely applied to display driving ICs and camera CCD chips used.

Generally, the pattern which has electroconductivity which comprises a circuit is printed on the board | substrates, such as an FPCB type semiconductor package. In order to protect this pattern, a coverlay film such as a polyimide film is brought into contact with the surface of a dynamic layer plate (FCCL) in the manufacturing process of the substrate. In this case, an adhesive is applied to the surface of the coverlay film. This adhesive melts under heat and adheres to the surface of the dynamic laminate. The adhesive of such a coverlay film is protected by a release paper, and the coverlay sheet which consists of a coverlay film, an adhesive agent, and a release paper is wound and manufactured by the roll.

Temporary joining of the coverlay film as mentioned above is performed by the worker's manual operation. That is, the worker peels off the release paper of the coverlay sheet in a state in which the dynamic laminate and the coverlay sheet are cut to match the required panel size, aligns the coverlay film with the surface of the dynamic laminate, and then irons. The coverlay film is welded to the surface of the dynamic layer plate by applying heat to the coverlay film using the film.

However, such a conventional coverlay welding method requires a lot of manpower and time, thereby greatly increasing the production cost of the substrate and lowering the productivity. In addition, the operator should visually align the mark with the coverlay film while looking at the mark displayed on the dynamic laminated plate with the naked eye. Poor attaching of OH interferes with mounting electronic components on the board. In particular, the temporary welding process of the coverlay film becomes a bottleneck process that delays production in the entire manufacturing line of the substrate, which is the biggest cause of impeding the improvement of productivity.

The present invention was created in order to solve the above-mentioned problems, and it is possible to reduce production costs and improve productivity by automatically performing the coverlay film welding process without generating product defects by precisely aligning and attaching the coverlay film to the dynamic layer plate. The purpose of the present invention is to provide a coverlay welding apparatus for an FPCB that can improve the productivity of the entire substrate manufacturing line.

Other objects and advantages of the present invention will be described below and will be appreciated by the embodiments of the present invention. In addition, the objects and advantages of the present invention can be realized by means and combinations shown in the utility model registration claims.

The FPCB coverlay welding device of the present invention for achieving the above object is a welding device for welding a dynamic layer plate and a coverlay film formed with a plurality of holes at regular intervals along both sides of a longitudinal edge, and mounted in a roll form. A first uncoiler for continuously releasing the supplied dynamic layer plate and supplying it; A second uncoiler to which an adhesive is applied to the rear surface to continuously release and supply the coverlay film mounted in a roll shape; The coverlay film is formed by overlapping the coverlay film supplied from the first uncoiler and the coverlay film supplied from the second uncoiler, and continuously heating and pressing both sides of the overlapping dynamic layer plate and the coverlay film in the longitudinal direction. A hot wire roller unit for welding both sides of the longitudinal edge of the dynamic layer plate; A hot wire press that heats and presses the front surface of the dynamic layer plate and the coverlay film to which both sides of the longitudinal edges are welded by the hot wire roller unit to weld the coverlay film to the front surface of the dynamic layer plate; And a recoiler for winding up and receiving a dynamic layer plate in which a coverlay film is welded by the hot wire press.

Here, the hot wire roller portion, the sprocket hole and the pattern groove and the cover formed in the dynamic laminated plate while rotating in engagement with the sprocket holes formed in the dynamic layer plate supplied from the first uncoiler and the coverlay film supplied from the second uncoiler, respectively. A sprocket for overlapping the dynamic layer plate and the coverlay film so that the sprocket hole and the pattern groove formed in the ray film coincide with each other; And it is preferable to include a hot-rolled roller to press both sides of the dynamic layer plate and the coverlay film superimposed by the sprockets to weld both sides of the longitudinal edge of the coverlay film to the dynamic layer plate.

In addition, the release paper is attached to the back surface of the coverlay film supplied from the second uncoiler, it is preferable to further comprise a release paper separating unit for separating the release paper from the coverlay film supplied from the second uncoiler to the hot wire roller portion. .

In addition, the release paper separation unit, a release paper separation roller for separating the release paper from the coverlay film; And it is preferable to include a release geography coiler for winding the release paper separated from the release paper separation roller.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to their usual or dictionary meanings, and the inventors will have to properly interpret the concept of terms in order to best explain their own design. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical ideas of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a front view showing the overall configuration of the coverlay welding apparatus for FPCB according to a preferred embodiment of the present invention.

Referring to the drawings, the FPCB coverlay welding apparatus 100 according to a preferred embodiment of the present invention, the first uncoiler 110, the second uncoiler 120, the release paper separating unit 130, And a hot wire roller unit 140, a hot wire press 150, and a recoiler 160.

First, as the first uncoiler 110 supplies the dynamic layer plate 10, the first uncoiler 110 continuously unwinds the dynamic layer plate 10 mounted in a roll form and supplies the heat layer roller unit 140. The first uncoiler 110 is installed to be driven by a motor so that the dynamic layer plate 10 mounted in a roll form is released according to the driving of the motor, and the hot wire roller part 140 and the first uncoiler 110 are provided. In order to provide the moving layer 10 with a buffer 111 and a plurality of rollers 112 to provide tension to the moving layer 10, the dynamic layer 10 is smoothly supplied.

Next, as the second uncoiler 120 supplies the coverlay film sheet 20, the second uncoiler 120 continuously unloads the coverlay film sheet 20 mounted in the form of a roll and supplies it to the hot wire roller unit 140. The second uncoiler 120, like the first uncoiler 110, is installed to be driven by a motor so that the coverlay film sheet 20 mounted in a roll form is released according to the motor drive. The coverlay film is provided between the hot wire roller unit 140 and the second uncoiler 120 by providing a buffer 121 and a plurality of rollers 122 to provide tension to the moving coverlay film sheet 20. The sheet 20 is smoothly supplied.

At this time, the coverlay film sheet 20 supplied from the second uncoiler 120 includes a coverlay film 21 and a release paper 22, and the coverlay film 21 is made of a material such as polyimide. It may be formed as an adhesive may be applied to the back surface, the release paper 22 is attached to the back surface of the coverlay film 21, the adhesive is applied.

Next, the release paper separator 130 separates the release paper 22 from the coverlay film sheet 20 supplied from the second uncoiler 120, and the release paper separation means 131 and the release geography coiler ( 132).

The release paper separating means 131 is disposed in close contact with the sprocket 141 of the hot wire roller unit 140 to be described later, the coverlay film sheet supplied from the second uncoiler 120 to the hot wire roller unit 140 ( The release paper 22 is separated from the sheet 20 and only the coverlay film 21 is supplied to the hot roller unit 140.

The release paper 22 separated from the release paper separating means 131 is transferred to the release geography coil 132 via a plurality of rollers 133, and the release geography coil 132 is separated from the release paper separating means 131. The release paper 22 separated and transported is recovered and wound up.

FIG. 2 is a perspective view illustrating the dynamic layer plate and the coverlay film sheet shown in FIG. 1.

Referring to the drawings, a plurality of sprocket holes 10a are formed in the dynamic laminated sheet 10 along both sides of the longitudinal edge at regular intervals, and inside the dynamic laminated sheet 10, a pattern groove 10b having a predetermined shape is formed. Formed.

In addition, in the coverlay film 21 and the release paper 22 of the coverlay film sheet 20, a plurality of sprocket holes 21a, 22a are formed at regular intervals along both sides of the longitudinal edge thereof, and the coverlay film sheet Also in the coverlay film 21 and the release paper 22 of the (20), pattern grooves 21b and 22b having a predetermined shape are formed. At this time, the sprocket holes 21a and 22a and the pattern grooves 21b and 22b formed in the coverlay film 21 and the release paper 22 of the coverlay film sheet 20 overlap with the dynamic layer plate 10. The sprocket hole 10a and the pattern groove 10b formed in the dynamic layer plate 10 should be formed so as to correspond exactly with each other.

3 is a perspective view of the hot wire roller unit 140 shown in FIG. 1.

Referring to the drawings, the hot-roller unit 140 overlaps the coverlay film supplied from the second uncoiler 120 to the dynamic layer plate 10 supplied from the first uncoiler 110, and the longitudinal edge thereof. As the two sides are welded, it includes a sprocket 141 and the hot roller 142.

The sprocket 141 is a sprocket hole 10a and a pattern groove 10b formed in the dynamic layer plate 10 shown in FIG. 2 and a sprocket hole 21a and a pattern groove 21b formed in the coverlay film 21. It serves to overlap the dynamic layer plate 10 and the coverlay film 21 to match each other, preferably formed in a cylindrical shape.

1 to 3, the coverlay film 21 separated from the release paper 22 by the release paper separating unit 131 of the release paper separating unit 130 and transferred to the sprocket 141, Sprocket holes 21a formed at both side edges are engaged with the protrusions 141a formed at both ends of the sprockets 141, and are engaged with the sprockets 141 in accordance with the rotation of the sprockets 141. In addition, in the dynamic layer plate 10 supplied from the first uncoiler 110 and transferred to the sprocket 141, the sprocket hole 10a has a protrusion 141a of the sprocket 141, similar to the coverlay film 21. ) And overlaps the coverlay film 21 which is engaged with the sprocket 141 and moves at the same time. At this time, the dynamic layer plate 10, the pattern groove 10b formed therein is overlapped so as to exactly match the pattern groove 21b formed in the coverlay film 21, the overlapping dynamic layer plate 10 and the cover The ray film 21 meshes with the sprocket 141 and moves along with the rotation of the sprocket 141.

That is, the sprocket grooves 10a and 21a formed in each of the dynamic layer plate 10 and the coverlay film 21 are engaged with the protrusions 141a of the sprocket 141 to be coupled to the dynamic layer plate 10 and the coverlay film 21. By guiding the movement of the guide plate, the dynamic layer plate 10 and the coverlay film 21 are guided so that the pattern grooves 10b and 21b respectively formed therein can be superimposed in exactly the same state and move on the sprocket 141. It plays a role.

The hot-roller 142 is to contact both sides of the longitudinal edge of the dynamic layer plate 10 and the coverlay film 21 superimposed by the sprocket 141, as described above, the overlapped dynamic layer plate 10 and the cover The reason of only welding the edges of the ray film 21 is that the cover layer film 21 during the folding process, ie, the welding process, may occur when the entire overlapping dynamic layer plate 10 and the coverlay film 21 are directly welded together. This is to prevent the phenomenon of being stuck out of position by being pushed by the temporary welding means without being adhered to the dynamic layer plate 10 accurately.

Here, the hot wire roller 142 is in the form of a cylindrical roller made of a metal material with a built-in hot wire, it is preferable that the pressing projection 142a formed along the outer peripheral surface protrudes on both ends of the outer peripheral surface. In addition, the hot wire roller 142 is disposed on the upper side of the sprocket 141, and rotates in a direction opposite to the rotation direction of the sprocket 141, the pressing projection 142a protruding along the outer circumferential surface and the outer circumferential surface of the sprocket 141. Can come in contact.

The hot wire roller 142 heats and pressurizes both sides of the longitudinal edge in a state of being in close contact with the overlapping dynamic layer plate 10 and the coverlay film 21. That is, when the dynamic layer plate 10 and the coverlay film 21 which overlap and move according to the rotation of the sprocket 141 are introduced between the sprocket 141 and the hot roller 142, the hot roller 142 rotates together. The pressing protrusion 142a continuously heats and presses both sides of the overlapping dynamic layer plate 10 and the longitudinal edges of the coverlay film 21. At this time, the crimping projection 142a continuously heats and pressurizes the dynamic layer plate 10 and the coverlay film 21 that are overlapped and moved while being heated by a heating wire embedded in the hot wire roller 142. By dissolving the adhesive applied on the back surface of the film 21 to be attached to the dynamic layer plate 10, both sides of the longitudinal edge of the coverlay film 21 is welded to the dynamic layer plate 10.

According to the hot-roller unit 140 of the coverlay welding apparatus 100 for FPCB according to a preferred embodiment of the present invention as described above, by automatically overlapping the coverlay film 21 on the dynamic layer plate 10, In addition to reducing the manpower and time required to align the coverlay film 21 to the dynamic layer plate 10, there is an advantage that no product defects occur.

 Next, the hot wire press 150 is a second hot welding of the dynamic layer plate and the coverlay film 30 first welded by the hot wire roller unit 140, and the upper press 151 and the lower press 152. It includes.

The upper press 151 and the lower press 152, the heater block 151a, 152a with a built-in heating wire, respectively, is mounted on the secondary press while heating and pressing the first dynamic sheet plate coverlay film 30 to be mutually again. It is encountered.

According to the hot wire press 150 of the coverlay welding apparatus 100 for FPCB according to a preferred embodiment of the present invention, the coverlay film cut in the same shape on the dynamic layer plate cut to a predetermined size one by one manually Unlike the conventional method of contacting, by continuously welding the dynamic layer plate 10 and the coverlay film 21 supplied in the form of a roll, the effect of reducing the manpower and time required for the welding process, and improve the productivity of the entire production process There is.

Finally, the recoiler 160 continuously winds and accommodates the dynamic layer plate coverlay film 30 which is secondly welded by the hot wire press 150.

The recoiler 160 is installed to be driven by a motor similarly to the first and second uncoilers 110 and 120, so that the secondary welded dynamic layer plate and the coverlay film 30 are continuously wound in accordance with the motor driving. For example, a feeder 161 and a buffer 162 and a plurality of rollers 163 intermittently pulling the secondary laminated welded dynamic sheet coverlay film 30 between the hot wire press 150 and the recoiler 160. By being provided, the secondary welded dynamic layer plate coverlay film 30 is smoothly wound.

Meanwhile, reference numerals 153 and 154 which are not described in FIG. 1 denote buffers and a plurality of rollers provided between the hot wire roller unit 140 and the hot wire press 150, respectively.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Various modifications and variations are possible, of course, within the equivalent scope of the utility model registration claims to be described.

According to the FPCB coverlay welding apparatus of the present invention, by automatically superimposing the coverlay film on the dynamic lamination board, not only can reduce the manpower and time required to align the coverlay film on the dynamic lamination board, There is an advantage that can be reduced.

In addition, by continuously welding the dynamic layer plate and the coverlay film supplied in a roll form in a roll-to-roll manner, it reduces the manpower and time required for the welding process and improves the productivity of the entire production process. .

Claims (4)

In the welding apparatus for welding a dynamic layer plate and a coverlay film formed with a plurality of holes at regular intervals along both sides of the longitudinal edge, A first uncoiler for continuously unwinding and supplying a dynamic laminated plate mounted in a roll shape; A second uncoiler to which an adhesive is applied to the rear surface to continuously release and supply the coverlay film mounted in a roll shape; The coverlay film is formed by overlapping the coverlay film supplied from the first uncoiler and the coverlay film supplied from the second uncoiler, and continuously heating and pressing both sides of the overlapping dynamic layer plate and the coverlay film in the longitudinal direction. A hot wire roller unit for welding both sides of the longitudinal edge of the dynamic layer plate; A hot wire press that heats and presses the front surface of the dynamic layer plate and the coverlay film to which both sides of the longitudinal edges are welded by the hot wire roller unit to weld the coverlay film to the front surface of the dynamic layer plate; And A coverlay welding apparatus for an FPCB comprising a recoiler for winding up and receiving a dynamic layer plate to which a coverlay film is welded by the hot wire press. The method of claim 1, wherein the hot wire roller portion, A sprocket hole formed in the dynamic layer plate and a sprocket hole formed in the dynamic layer plate, the sprocket hole formed in the dynamic layer plate, and the sprocket hole formed in the cover layer film, respectively, rotating while being engaged with the dynamic layer plate supplied from the first uncoiler and the coverlay film supplied from the second uncoiler; Sprockets for superimposing the dynamic layer plate and the coverlay film to match the pattern grooves; And And a hot-roller roller pressurizing and heating the dynamic layer plate and the coverlay film superimposed by the sprocket to weld both sides of the longitudinal edge of the coverlay film to the dynamic layer plate. The method of claim 1, Release paper is attached to the back surface of the coverlay film supplied from the second uncoiler, FPCB characterized in that it further comprises a release paper separating unit for separating the release paper from the coverlay film supplied from the second uncoiler to the hot wire roller portion Coverlay welding device for According to claim 3, The release paper separator, Release paper separation roller from which the release paper is separated from the coverlay film; And A coverlay welding apparatus for an FPCB comprising a release geography coiler for winding a release paper separated from the release paper separation roller.

Images