TW200820854A - Attaching apparatus and attaching method thereof - Google Patents

Abstract

An attaching apparatus is provided. The attaching apparatus comprises a stage used for loading a substrate. An attaching mechanism attaches an anisotropic conductive film (ACF) on the substrate. A long pressure head and a short pressure head are applied force on a substrate attached the anisotropic conductive film (ACF).

Description

200820854

达达编号·· TW2332PA % IX. Description of the Invention: [Technical Field] The present invention relates to an attachment device and a method of attaching the same, and more particularly to a moving long indenter and a short indenter A device for attaching an anisotropic conductive material to a substrate and a method of attaching the same are attached. [Prior Art] At present, the liquid crystal display industry uses a chip 〇n glass (COG) to attach a wafer to a glass substrate or a tape carrier package (TCP) or a chip lithography package (chip 〇n Film). , c〇F), etc. The wafer is carried on a circuit board of a tape or a thin film and then electrically connected to the substrate by a circuit board of a tape or film. Taking Tape Carrier Packing (TCP) and Chip 〇nFilm (COF) as an example, the wafer is carried on a circuit board of a tape or film and then anisotropic conductive material having conductive particles. After the anisotropic conductive film (ACF) is attached to the substrate, the circuit board carrying the wafer is pressed against the anisotropic conductive material by a hot pressing process, and the conductive particles in the anisotropic conductive material are electrically connected to the substrate and Wafer. Taking the glass flip chip process as an example, an anisotropic conductive film (ACF) having conductive particles is attached to the substrate, and then the wafer is pressed against the anisotropic conductive material by a hot pressing process. The conductive particles in the anisotropic conductive material are electrically connected to the substrate and the wafer. The traditional anisotropic conductive material attaching device can distinguish the length of the anisotropic conductive material or the number of wafers to be attached, and is divided into a long sticking device (a plurality of wafers can be attached) and a short sticking device (a small number can be attached) Wafers), for separation and respective 5 200820854

Sanda Number·· TW2332PA Machine that operates independently. The long stick device needs to be attached with a long anisotropic conductive material, and the short stick device needs to be attached with a short anisotropic conductive material. Since the indenters of the two devices are different, it is possible to save the working time required for the movement of the attaching mechanism when attaching different lengths of anisotropic conductive materials (different numbers of wafers). The long sticking device comprises an attaching mechanism with a roller set, which can be attached with a continuous long and different anisotropic conductive material at one time for attaching a plurality of wafers. However, if there is a gap between the substrate attachment points corresponding to the wafer, for example, when a space for a flexible printed circuit (FPC) is to be reserved, it needs to be attached in sections. If there are too many attached segments, a lot of time will be wasted on the movement of the attaching mechanism, and the long sticking device will not be applicable at this time. The short sticking device has a short indenter, which can be quickly attached to the short anisotropic conductive material, and can effectively shorten the time of the segment attachment. However, if the attachment area on the substrate is continuous and the length is long, the longer attachment device takes time. Therefore, if the number of attachment regions on a substrate is large and the length of each attachment region is extremely large, the existing attachment devices cannot perform the attachment operation efficiently. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide an anisotropic conductive material attaching device and a method thereof, and to manufacture a long indenter and a short indenter = one =: attaching efficiency ' Attach the attachment mechanism to each other or place the long head and the short head on the = side. And adjust the setting on the balance type, select one of the size of the substrate and the size of the attachment area to select the eight kings, so that the attached machine can be attached to the same machine with a long indenter and a short indenter. The organization can be attached to (4). The invention can be effective 6 200820854

Ξ达号·· TW2332PA Reduces the glass flip-chip process by attaching an anisotropic conductive material between the substrates, and assists in the operation of the number of wafers that need to be attached to the product. 7. A great help According to the object of the present invention, a substrate for placing a substrate is provided; a platform is included; and a long indenter and a short indenter are used to apply an external force to the substrate of the substrate. According to another object of the present invention, the two-way conductive method includes: placing the substrate on the platform; moving one: the attached side is attached with the anisotropic conductive material on the substrate; For attaching an external force to the substrate of the _ anisotropic conductive material: the substrate for the short roof is on the platform, the surface of the platform has a normal line, and a affixing mechanism is moved on the platform in the direction of placing a normal line. After attaching the vertical anisotropic conductive material to the substrate 1 , a long moving head is placed on the platform in a flat configuration so that the long indenter will have a plurality of crystals; On the substrate, in addition, the attaching mechanism of the moving-attaching mechanism attaches the short-distal anisotropic conductive material to the substrate. Then, the short indenter is moved on the platform in the direction of the T-line normal, so that the short indenter attaches a plurality of wafers or a circuit board carrying the wafer to the substrate. The attached mechanism and the short indenter may be attached to each other; or the long indenter and the short indenter are disposed adjacent to the platform. The above described objects, features, and advantages of the present invention will become more apparent. The following detailed description of the preferred embodiments, together with the accompanying drawings, will be described in detail as follows: 7 200820854

, Sanda No.: TW2332PA [Embodiment] This home is specially designed with a sticking device, which has a movable attaching mechanism for correspondingly attaching a long anisotropic conductive material and a short anisotropic conductive material. On the substrate. Moreover, the attaching device has two indenters, one being a long indenter and the other being a short indenter. Therefore, the attaching device of the present invention provides a wider elastic space when the anisotropic conductive material is attached to the substrate. It is indeed more effective than the traditional long stick device and short point device to reduce the attachment time. In this way, the attachment device of the present invention not only combines the functions of the conventional long-attach device and the short-attach device, but also enhances the need for the diversity of the anisotropic conductive material on the substrate. The long sticking process and the short sticking process of the attaching apparatus of the present invention will be described below with reference to the preferred embodiment, but the technique of the present invention is not limited thereto. Referring to Figures 1 to 5, there is shown a flow chart of the attachment device for attaching a long anisotropic conductive material (a plurality of wafers can be attached) to the substrate in accordance with a preferred embodiment of the present invention. First, referring to Fig. 1, the attaching device 100 of the present embodiment includes a platform 130, an attaching mechanism 110, a short indenter 12, a long indenter 160, a cutting mechanism 180, and a suction mechanism 170. The substrate 130 uses the I to place the substrate 140, for example, a thin film transistor substrate. The substrate 14 has a long bonding region 142 and a short bonding region 144 for chip-to-glass (COG) bonding of the wafer and the substrate 140. For the same reason, it can also be used for TCP and COF; the surface of the platform 130 has a normal 135. On both sides of the platform 130, a first position 192 and a second position 194 in which the attaching mechanism n〇 and the short indenter 12 are located in the attaching process are respectively defined. Attachment mechanism 110 and short ram 120 move back and forth between first position 192 and second position 194 in a vertical normal line 135. In this embodiment, attaching 8 200820854

The DK2332PA mechanism 110 and the short ram 120 are connected to each other; wherein the affixing mechanism 11 〇 and the short ram 120 move over the platform 130 when moving. The cutting mechanism ι8 is disposed outside the first position 192 for cutting an anisotropic conductive material of an appropriate size from the tape 150 having the anisotropic conductive material 154 and the release paper 152 for attachment. The suction mechanism 17 is located outside the second position 194, and the remaining release paper 152 is attached by the tape 150, and the release paper 152 is taken away from the attachment device 100. The long ram 16 〇 is placed on the platform such as = above. It can be moved back and forth in the direction of the parallel normal 135, and is close to or away from the platform 130. The attaching mechanism 110 includes a clamping unit 112 and a lower pressing unit' pressing unit such as a roller and a set. The clamping unit (1) is used for clamping at the first position 192 and driving the tape 15 to move to the second position. . The roller set 114 is moved in the direction of the parallel method and the line 135 to the non-pressing position and the pressing position, and presses the tape 15Q in the pressing position to complete the anisotropy during the movement of the attaching mechanism 110 and the short indenter 120. The point of the conductive material is attached. As shown in Fig. 1, the cutting mechanism 180 cuts and cuts the anisotropic conductive material 156 from the tape 15, and forms an aperture 157 with the remaining anisotropic conductive material mi. At this time, the mechanism 110 and the short head 12 are located at the first position 192 ' and the roller! and 114 are now in the non-pressing position. And r == element 112 clamping tape 15 ° 'and with the roller set ... and the short ram 12 〇 between the long ram 16 〇 and the platform 13 移 the anisotropic conductive material 156 is driven by the misalignment Mm, and Reach the y corresponding to the long post position. Then, the holding unit ιΐ2 rose = belt (9)' simultaneously attracts the mechanism 17_complete_after the paper 152. At this time, the attachment mechanism (10) and the short indenter can pass = 9 200820854

: The number is · TW2332PA area 142, but does not correspond to the long stick area 142. Next, the attaching mechanism 11 and the short ram 120 are moved back to the first position 192 to retreat, and the roller set 114 is moved to correspond to the starting point of the long-cut anisotropic conductive material 156. Then, the roller set 114 is lowered to the press tape 15A below the pressing position, so that the end of the long cut and the opposite conductive material 156 contacts the long attaching area 142 as shown in Fig. 2. First, the attachment mechanism 110 and the ram 120 are moved from the platform 13 to the second position 194 in the direction of the vertical normal 135. In the slinger 12G shifting (four) pin, the roller set 1H completely affixes the long-cut dissimilar conductive material 156 to the long attaching area 142, as shown in Fig. 3. The wheel set 114 is raised to the non-pressing position, and the attaching mechanism (10) and the head U0 are moved to the first position 192 to separate the release paper 152 from the cut/square conductive material 156 as shown in Fig. 4. Next, the wafer or the circuit board carrying the chip, such as the circuit board 146, is moved toward the platform 13〇 in the direction of the normal 135 of the memory map, 下θθ long cutting anisotropic conduction The material 156 is closely attached to the wafer, and 156' is placed on the substrate long bonding area 142. As shown in FIG. 5, the circuit of the one chip provides a 3Gt; ~ fine. c temperature adjustable thermal head ^ medium long head 160 The anisotropic conductive material 156 is attached to the work of the work of the 140. Please refer to the 6th to 9th drawings at the same time, which shows that the hair of the hairpin = Luo: The shell of the shell is attached to the short anisotropic conductive material. (Improve the flow chart of the preferred embodiment on the substrate. First, the cutting mechanism = a few wafers) cut the anisotropic conductive material 158, and with the rest of the different - short cut king conductive material 154 200820854

, Sanda number: TW2332PA forms a void 159, as shown in Figure 6. Then, the clamping unit U2 clamps the tape 150 again, and the attaching mechanism 11 and the short indenter 120 move between the long indenter 16 and the platform 13〇, so that the short-cut anisotropic conductive material 158 is located and short. The area 144 corresponds to one of the short positions. Then, the gripping unit 112 releases the tape 150, and the suction mechanism 17 sucks the remaining release paper 152 to which the tape 150 is attached, and pulls the release paper 152 away from the attaching device 1''. Then, after the roller group presses the tape, the attaching mechanism 110 and the short ram 12 移 are moved toward the second position 194, so that the short anisotropic conductive material 158 is attached to the short attaching region 144, such as the seventh. The figure shows. The roller set 114 then rises to a non-pressed position. The attachment mechanism 〇 and the short ram 120 are moved from the platform 13 to the first position 192 to separate the release paper 152 from the short cut anisotropic conductive material 158, as shown in FIG. Next, the wafer or the circuit board carrying the wafer, such as the circuit board 148 shown in Fig. 9, is placed correspondingly in the short bonding area 144. Then, the attaching mechanism and the short indenter 120 are moved on the platform 13A in the direction of the parallel normal line 135, so that the short indenter 120 is located above the short sticking area 144. Next, the short indenter 12 is pressed down to attach the circuit board 148 to the short bonding area 144 of the substrate 140, as shown in Fig. 9. The short indenter 120 provides a thermostat having an adjustable temperature of 30 ° C to 200 ° C. Then, the attaching mechanism 110 and the short indenter 120 return to the first position 192, and the attaching device 100 attaches the long-cut anisotropic conductive material 156 and the short-cut anisotropic conductive material 158 to the substrate 140. This is the end of the process. However, the technical field to which the present embodiment pertains has a general knowledge, and it can be understood that π 200820854

Sanda number: TW2332PA The technology of the present embodiment is not limited to the domain description and body content. For example, the long head (10) or the short head 12〇 further includes a gas pressure red-, and the short head 120 further includes a short head that can be raised and lowered. The long ram is 16 〇 and short, and the surface of the head 120 is more cushioned to avoid damage to the tape (10). Further, in the present embodiment, the simultaneous movement of the attaching mechanism 11 and the short indenter is taken as an example, and in fact, the two can be moved separately. That is, the read head 120 can be separately moved over the short attachment area 144 for attachment. Referring to Fig. 4, there is shown a schematic view of an attachment apparatus according to another embodiment of the present invention. The main difference between the embodiment and the attachment device 1 of the foregoing embodiment is that the long indenter 160a and the short indenter 12〇& are disposed adjacent to the flat 1/0, and the short indenter 12〇a does not. The attaching mechanisms are connected to each other. The platform 130 can also be designed as a 'tongue platform' that can be moved perpendicular to the direction of the normal line 135. The substrate can be moved to correspond to the long head 160a and the short head 120a. The anisotropic conductive disclosed in the above embodiment of the present invention The attaching method of the material attaching device 2 is that the long indenter and the short indenter are collectively set in the same machine α, and are attached by means of the attaching mechanism and the short indenter. Moreover, the long head and the short head of this embodiment are both hot heads for controlling temperature and pressure. The attaching device of this embodiment can select an appropriate attaching mechanism for attaching to the size of the attached substrate and the size of the attaching area. The use of a short indenter for the short attachment area saves the working time required for the mobile attachment mechanism; for the long 1 attachment area, the attachment mechanism can save the operation time required for the mobile attachment mechanism, and can also reduce Cut the segmentation work and save the attached materials. 12 200820854

。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Various changes and modifications may be made, and the scope of the invention is defined by the scope of the appended claims. 13 200820854

达达编号号: TW2332PA [Simplified Schematic Description] Figs. 1 to 5 are diagrams showing an operation of attaching a long anisotropic conductive material (most wafers) on a substrate according to a preferred embodiment of the present invention; 6 to 9 are diagrams showing an operation of attaching a device for attaching a short anisotropic conductive material (a few wafers) to a substrate according to a preferred embodiment of the present invention; and FIG. 10 is a view showing another embodiment of the present invention. Example of the attachment device 200820854

Sanda number: TW2332PA [Description of main component symbols] 100: Attachment device 110: Attachment mechanism 112: Clamping unit 114: Roller set 120, 120a: Short indenter 130: Platform 140: Substrate f 142: Long sticking area 144 : Short bonding area 146, 148: circuit board 150: tape 152: release paper 154: anisotropic conductive material 156: long-cut anisotropic conductive material 157, 159 · · aperture, 158: short cutting anisotropy Conductive material 160, 160a: long ram 170: suction mechanism 180: cutting mechanism 192 · • first position 194: second position 15

Claims (1)

200820854 Sanda number: TW2332PA X. Patent application scope: 1. A patching device comprising: a platform for placing a substrate; and an attaching mechanism for attaching an anisotropic conductive material to the substrate; A long indenter and a short indenter are used to apply an external force to the substrate to which the anisotropic conductive material is attached. 2. The device of claim 3, wherein the short indenter is interconnected with the attachment mechanism. The device of claim 1, wherein the short indenter and the long indenter are disposed adjacent to the platform. 4. The device of claim 1, wherein the short indenter and the attachment mechanism move back and forth perpendicular to the normal of the platform. 5. The device of claim 1, wherein the short indenter and the long indenter apply an external force to the substrate in a parallel normal to the platform. 6. The device of claim 5, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate. 7. The device of claim 1 of the patent scope, further comprising a cutting mechanism for cutting the anisotropic conductive material. 8. If f: the device of the third paragraph of the patent scope, the towel attachment mechanism is more fortune' The clamping unit is used for clamping or releasing the inclusion of a distraction, and the heterogeneous conductivity includes 9 2 3 The device of claim 1, wherein the attaching mechanism further moves the pressing unit in a direction parallel to the normal line. 16 200820854 ^ Sanda number: TW2332PA 10. The device of claim 9 of the patent scope, wherein the attaching device The press unit is a roller set. 11. The device of claim 1 further comprising a suction mechanism for attracting a release paper. 12. The device of claim 1 wherein the long head or The short indenter comprises a pneumatic cylinder. 13. The apparatus of claim 1, wherein the long indenter and the short indenter control temperature and pressure. 14. The apparatus of claim 1 is used. Attaching a wafer or a circuit board carrying the chip to the substrate. 15. A method for attaching, comprising: placing a substrate on a platform; moving an attaching mechanism for attaching an anisotropic conductive Material on the substrate, and using a long indenter and a short The method for applying an external force to the substrate to which the anisotropic conductive material is attached. The method of claim 15, wherein the short indenter is connected to the attaching mechanism. The method of claim 15, wherein the long head is disposed adjacent to the platform in the vicinity of the platform. The method of claim 15, wherein the short head is perpendicular to the attaching mechanism 19. The method of applying the normal to the platform. 19. The method of claim 15, wherein the short head and the long head apply an external force to the substrate in parallel with the normal of the platform. 17 200820854 Sanda number: TW2332PA 20. The method of claim 19, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate when the pressing head is depressed. The method of claim 15, wherein the step of attaching the anisotropic conductive material to the substrate further comprises: cutting a tape from the tape having the anisotropic conductive material and a release paper Cut the anisotropic conductive material. 22. If applying The method of claim 21, wherein the attaching mechanism f further comprises a clamping unit, and after the step of cutting the anisotropic conductive material, the method further comprises: pressing the tape with the attaching mechanism to make the cutting The anisotropic conductive material is attached to the substrate. 23. The method of claim 22, after the step of attaching the cut anisotropic conductive material to the substrate, further comprising: a plurality of wafers or A circuit board carrying the chip is placed on the substrate to which the cut anisotropic conductive material is attached. 24. The method of claim 23, wherein the wafer or the circuit board carrying the chip is placed After the step of attaching the substrate to the anisotropic conductive material, the method further comprises: moving the cutting anisotropic conductive material with a long pressing head toward the platform. 25. The method of claim 23, wherein the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached further comprises: 18 200820854 No.: TW2332PA moves the attaching mechanism and the short indenter to a second position, the second position being located outside the other side of the platform. 26. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the short pressure Heading to the top of the platform; and moving the cutting anisotropic conductive material by moving the short indenter toward the platform. f 27. The method of claim 23, before the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the sticker Attaching the mechanism and the short indenter to the first position. 28. The method of claim 23, after the step of placing the wafer or the circuit board carrying the wafer on the substrate to which the anisotropic conductive material is attached, further comprising: moving the attachment And the short head to the top of the platform; and, the short pressing head moves toward the platform to press the cut anisotropic conductive material. 29. The method of claim 15, wherein the long head and the short head have a cushioning material between the long head or the short head and the substrate when an external force is applied. 30. The method of claim 15, wherein the long head and the short head control temperature and pressure.