200819557 九、發明說明： . 【發明所屬之技術領域】 ， 本發明涉及一種氣密性腔體成型方法，特別係關於— 種利用相變化原理進行散熱之氣密性腔體成型方法。 【先前技術】 隨著電腦産業之飛速發展，筆記型電腦中之發熱電子 元件如CPU、VGA等産生之熱量越來越多，然而，筆記型 _ 電腦之外形設計向著輕、薄、短、小之方向發展，其内部 空間不斷减少，這就對筆記型電腦中散熱模組之設計提出 了更尚之要求。爲了提高該散熱模組之換熱效率，習知之 方法係在散熱模組中使用氣密性腔體(Vapor Chambeir)。 氣密性腔體最主要之優點不僅在於其換熱表面遠大於 普通熱管(Heatpipe)，且由於氣密性腔體相對熱管有很大的 蒸發'/ία體流動面積’在回流毛細力能够滿足冷凝液回流要 求之别提下，可以有效提尚氣密性腔體之最大輸熱量。另 • 外，氣密性腔體還可以解决多個熱源同時散熱的問題，尤 其在筆記型電腦中，當發熱電子元件如cpu、VGA同時需 要散熱時，利用氣密性腔體可以根據需要設計出多個熱交 換區，位置可以靈活掌控，以滿足多個發熱電子元件之散 熱要求。 習知之氣密性腔體多采用溝槽仲㈤㈣或燒結金屬顆 粒做爲其毛細結構。溝槽式毛細結構受限於制做工藝，無 法在外形結構複雜之氣密性腔體内形成足够小之毛細尺 6 200819557 ^難以達到令人滿意之毛細效果。而采用機械加 外加燒結金屬顆粒毛細結構之工藝方法，使製作過程較繁 雜且使氣紐賴之外騎_雜證。 ” 【發明内容】 有鑒於此，有必要提供一種製作過程 性腔體成型方法。 丁之孔在200819557 IX. INSTRUCTIONS: [Technical Field] The present invention relates to a gas-tight cavity forming method, and more particularly to a gas-tight cavity forming method for heat dissipation using a phase change principle. [Prior Art] With the rapid development of the computer industry, the heat generated by the electronic components such as CPU and VGA in the notebook computer is increasing. However, the notebook _ computer is designed to be light, thin, short and small. In the direction of development, the internal space is continuously reduced, which puts more requirements on the design of the heat dissipation module in the notebook computer. In order to improve the heat exchange efficiency of the heat dissipation module, the conventional method uses a gas-tight cavity (Vapor Chambeir) in the heat dissipation module. The main advantage of the airtight cavity is that the heat exchange surface is much larger than the ordinary heat pipe (Heatpipe), and because the airtight cavity has a large evaporation relative to the heat pipe, the reflow capillary force can be satisfied. The condensate reflux requirement can be raised to effectively increase the maximum heat transfer capacity of the airtight chamber. In addition, the airtight cavity can also solve the problem of simultaneous heat dissipation of multiple heat sources. Especially in notebook computers, when heat-generating electronic components such as cpu and VGA need to dissipate heat at the same time, the airtight cavity can be designed according to needs. Multiple heat exchange zones are available, and the position can be flexibly controlled to meet the heat dissipation requirements of multiple heat-generating electronic components. Conventional airtight cavities use grooved secondary (5) (four) or sintered metal particles as their capillary structure. The grooved capillary structure is limited by the manufacturing process, and it is not possible to form a sufficiently small capillary in a gas-tight cavity having a complicated outer shape. 6 200819557 ^ It is difficult to achieve a satisfactory capillary effect. The mechanical and mechanical process of adding the sintered metal particle capillary structure makes the production process more complicated and makes the gas ride outside the ride. [Invention] In view of this, it is necessary to provide a method for manufacturing a process cavity.
-種氣密性腔體成型方法，包括如下步驟：⑴芯模製 4/驟gp製作表面覆有至少一層編織網而内部填充有芯 权材料之—芯模；（2)金屬沈積步驟，即在該芯模之表面進 t金屬沈積直至形成-層金屬層，而得到金屬層與芯模之 複口結構，⑶脫模步驟’即將該芯模材料從該金屬層分離 出^而得到由該金屬層及編織網構成之中空腔體；以及⑷ 後績處理麵’即在該巾空雜岐人-定量之工作液體 並進行密閉以得到氣密性腔體結構。 知技術相比，藉由該金屬沈積步驟，將該編織網 毛細結構緊貼於魏雜㈣，使得該氣密性腔體成 型方法具有製作過程簡單可行之優點。 【實施方式】 圖1爲本發明氣密性腔體成型方法之流程示意圖，其 包括如下四個主要步驟：芯模製作—金屬沈積—脫模—後 續處理得到成品。 、 爲簡潔及叙述方便，以下介紹中以圖6所示之氣密性 腔體1GG爲代表進行姻方法介紹。在芯難作步驟中， 而要成型得到如圖3所示之芯模1〇，該芯模1〇之兩側分 200819557- a gas-tight cavity forming method comprising the following steps: (1) a core molding 4 / a step of gp forming a core mold having a surface covered with at least one woven mesh and internally filled with a core material; (2) a metal deposition step, ie Depositing a metal on the surface of the core mold until a metal layer is formed to obtain a double-layer structure of the metal layer and the core mold, and (3) a demolding step of separating the core mold material from the metal layer to obtain The metal layer and the woven mesh constitute a hollow body; and (4) the post-processing surface is a working fluid in the empty space of the towel and sealed to obtain a hermetic cavity structure. Compared with the known technology, the woven mesh capillary structure is closely attached to Wei (4) by the metal deposition step, so that the airtight cavity forming method has the advantages of simple and feasible manufacturing process. [Embodiment] Fig. 1 is a schematic flow chart of a method for molding a hermetic cavity according to the present invention, which comprises the following four main steps: mandrel production - metal deposition - demolding - subsequent processing to obtain a finished product. For the sake of brevity and convenience of description, the following description introduces the airtight cavity 1GG shown in Fig. 6 as a representative method. In the difficult step of the core, the core mold 1 shown in Fig. 3 is formed, and the two sides of the core mold are divided into 200819557.
別向外延伸設有兩個圓柱狀之凸出部16，該芯模1〇於大 致中央位置形成一穿孔U。請參照圖2，爲製作該芯模ι〇， 首先提供一芯模母模20，該芯模母模20包括一上模22及 一下模24，該上模22與下模24相配合形成一腔體％，同 ¥亦开>成供成型凸出部16之模穴(圖未示）。該腔體％與兮 芯模10之外形結構相一致，該上模22上設有複數注料口Λ 222。將多層編織網12層叠貼設於芯模母模2〇之腔體％ 之内表面，該等編織網12可由易於彎折之金屬銅絲、不銹 鋼絲或纖維編卿成，以朗先彎、折成無雜26之内壁 相配^之形狀。之後，沿該等注料σ 222注入溶融或液= 之芯模材料14 ’直至該频材料14充滿該腔體％以及該 編織網12内之孔隙。該芯模材料14可爲石壤、石膏或= 合物等材料。待該芯模材料14翻後，分開該上模22 ^ 下模24 ’將該芯模10從該芯模母模2〇中取出，即得到表 面^覆有編_ 12而内部填充該芯模材料14之芯模ι 該芯模ίο之兩侧同時形成兩個凸出部16。 、 3至圖5，在金屬沈積過程中，先對該芯損 10進仃導電化處理，即在該芯模1G之外表面喷塗— 電材料18作爲電鑄起始層，㈣芯模1G之凸出部^ 端=0未健該導電材料18。接著，將該芯模炉 =麵槽50中，該额1G之導紐料18與 之 連接，_芯模料行輯，如圖4所示。夢由 :在該雜1G之外表面上沈積—定厚度之 如圖5所示。由於該凸出部16之末端面16〇未喷塗導電相 200819557 料18 ’從而在該金屬層6〇上相應形成複數排污口泣。 請參照圖5至圖8，在脫模過程中，將該芯模1〇與金 屬層6〇之複合結構從電鑄槽％中取出，並放入烘箱(圖未 示)内進行賴，使得賊模1G内之雜材料14溶化並從 該金屬層60之排污口 62流出（如圖6所示），從而得到由 金屬層60及編織網12構成之中空鑄件，如圖7及圖8所 示。可以理解地，如果採用之芯模材料14爲石膏等易粉碎 1材料，該脫模過程也可以藉由粉碎與振動之方式將該芯 模材料14從該金屬層60内脫出。爲保持該中空鑄件之清 潔’還可對該中空鑄件之空腔進行適當清洗。 在後續處理過程中，利用該等排污口 62對該金屬層 6〇進行抽真空之後充入適量之工作液體，接著封閉該等排 污口 62。從而最終得到本發明之氣密性腔體結構1〇〇。由 於該等排污口 62形成在該氣密性腔體結構1〇〇之兩側，從 而有效地確保該氣密性腔體結構1〇〇上下表面之平整。 在使用時’該氣密性腔體100之上、下表面可與多個 熱源接觸’該氣密性腔體100上形成之穿孔U可容納一離 心風扇（圖未示）’利用該離心風扇對該氣密性腔體進行 强制散熱。 綜上所述，該氣密性腔體100在製作過程中，藉由對 由編織網12包覆之芯模10進行金屬沈積之方式將多層編 織網12與電鑄金屬層60 —體成型，使得該等編織網12與 氣密性腔體100之内壁緊密結合，具有換熱效率較高之優 點。另外，該金屬沈積步驟使得該氣密性腔體成型方法在 9 200819557 操作上簡單可行，並使最終得到之腔體具有多層編織網12 組成之毛細結構，該毛細結構之孔隙較小，有效地提高了 該氣密性腔體100之回流毛細力，從而有效提高該氣密性 腔體10G之最大輸熱量。同時，該成型方法還可用於成型 具有複雜結構之氣密性腔體。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡Further, two cylindrical projections 16 are formed extending outwardly, and the core mold 1 is formed with a through hole U at a substantially central position. Referring to FIG. 2, in order to fabricate the core mold, first, a core mold 20 is provided. The core mold 20 includes an upper mold 22 and a lower mold 24. The upper mold 22 and the lower mold 24 cooperate to form a mold. The cavity %, the same as ¥ is also opened into a cavity for forming the projection 16 (not shown). The cavity % coincides with the outer structure of the core mold 10, and the upper mold 22 is provided with a plurality of injection ports 222. The multilayer woven mesh 12 is laminated on the inner surface of the cavity of the core mold 2, and the woven mesh 12 can be made of metal copper wire, stainless steel wire or fiber which is easy to bend, and is bent first, Fold into the shape of the inner wall of the no-blind 26. Thereafter, a molten or liquid = core molding material 14' is injected along the injection σ 222 until the frequency material 14 fills the cavity % and the voids in the woven mesh 12. The mandrel material 14 can be a stone, gypsum or a compound. After the core material 14 is turned over, the upper mold 22 is separated from the lower mold 24', and the core mold 10 is taken out from the core mold 2, so that the surface is covered with the braid 12 and the core mold is filled inside. The core mold of the material 14 has two projections 16 formed on both sides of the core mold ίο. 3 to 5, in the metal deposition process, the core loss 10 is first conductive, that is, the surface of the core mold 1G is sprayed - the electrical material 18 is used as the electroforming starting layer, and (4) the core mold 1G The projections are terminated by the conductive material 18. Next, in the core mold = face groove 50, the 1G guide material 18 is connected thereto, and the core mold is arranged as shown in Fig. 4. Dream by: depositing on the surface outside the impurity 1G - the thickness is shown in Figure 5. Since the end face 16 of the projection 16 is not sprayed with the conductive phase 200819557 material 18', a plurality of sewage spouts are formed on the metal layer 6〇. Referring to FIG. 5 to FIG. 8 , in the demolding process, the composite structure of the core mold 1〇 and the metal layer 6〇 is taken out from the electroforming tank %, and placed in an oven (not shown) for making The impurity material 14 in the thief mold 1G is melted and flows out from the drain port 62 of the metal layer 60 (as shown in FIG. 6), thereby obtaining a hollow casting composed of the metal layer 60 and the woven mesh 12, as shown in FIGS. 7 and 8. Show. It can be understood that if the core mold material 14 is a material such as gypsum which is easily pulverized, the demolding process can also remove the core material 14 from the metal layer 60 by pulverization and vibration. In order to keep the hollow casting clean, the cavity of the hollow casting can also be properly cleaned. In the subsequent processing, the metal layer 6 is evacuated by the drain ports 62 and then filled with an appropriate amount of working liquid, and then the drains 62 are closed. Thereby, the hermetic cavity structure of the present invention is finally obtained. Since the drain ports 62 are formed on both sides of the airtight cavity structure 1 , the flatness of the upper and lower surfaces of the airtight cavity structure 1 is effectively ensured. When in use, the upper and lower surfaces of the airtight cavity 100 can be in contact with a plurality of heat sources. The through hole U formed on the airtight cavity 100 can accommodate a centrifugal fan (not shown). Forced heat dissipation of the airtight cavity. In summary, the airtight cavity 100 is formed by integrally depositing the multilayer woven mesh 12 and the electroformed metal layer 60 by metal deposition of the core mold 10 covered by the woven mesh 12 during the manufacturing process. The woven mesh 12 is tightly coupled to the inner wall of the airtight cavity 100, and has the advantage of high heat exchange efficiency. In addition, the metal deposition step makes the airtight cavity forming method simple and feasible in the operation of 9 200819557, and the resulting cavity has a capillary structure composed of a plurality of woven meshes 12, the pores of the capillary structure are small, effectively The reflow capillary force of the airtight cavity 100 is increased, thereby effectively increasing the maximum heat transfer amount of the airtight cavity 10G. At the same time, the molding method can also be used to form an airtight cavity having a complicated structure. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only a preferred embodiment of the present invention,
“、、本案技藝之人士，在爰依本發明精神所作之等致修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1爲本發明氣密性腔體成型方法之流程示意圖。 圖2爲本發明其中一實施例之芯模製作示意圖。 圖3爲由圖2所制得之芯模立體圖。 圖4爲圖3所示芯模之金屬沈積示意圖。 圖5爲圖3所示芯模金屬沈積後之剖視圖。 圖6爲圖3所示芯模金屬沈積後之脫模示意圖。 圖7爲圖6所示脫模後得到之産品之立體示意圖。 圖8爲圖7所示産品沿A_A線之剖視圖。 【主要元件符號說明】 編織網 凸出部 導電材料 上模 下模 10 穿孔 u 12 芯模材料 14 16 末端面 16〇 18 芯模母模 2〇 22 注料口 222 24 腔體 2(5 200819557 電鑄槽 50 陰極 52 金孱層 60 排污口 62 氣密性腔體 100 11", the person skilled in the art, the modifications or changes made in accordance with the spirit of the present invention shall be covered by the following patent application. [Simplified illustration of the drawings] Figure 1 shows the airtight cavity forming of the present invention. 2 is a schematic view showing the manufacture of a core mold according to an embodiment of the present invention. Fig. 3 is a perspective view of the core mold prepared by Fig. 2. Fig. 4 is a schematic view showing the metal deposition of the core mold shown in Fig. 3. Fig. 6 is a cross-sectional view showing the metal mold after deposition of the metal mold of Fig. 3. Fig. 7 is a schematic view showing the release of the metal mold after the mold release shown in Fig. 6. Fig. 7 is a perspective view of the product obtained after demolding shown in Fig. 6. Figure 7 is a cross-sectional view of the product along line A_A. [Description of main component symbols] woven mesh bulging conductive material upper mold lower 10 perforation u 12 core material 14 16 end surface 16〇18 core mold 2〇22 Note Feed port 222 24 cavity 2 (5 200819557 electroforming tank 50 cathode 52 gold layer 60 drain port 62 airtight chamber 100 11