1311192 . 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種氣密性腔體結構之製造方法，尤係涉 及一種利用相變化原理進行散熱之氣密性腔體結構之製造 方法。 【先前技術】 隨著電腦產業之飛速發展，筆記型電腦中之發熱電子 • 元件如CpU、VGA等產生之熱量越來越多，然而，筆記蜇 電腦之外形設計向著輕、薄、短、小之方向發展，其内部 之空間不_少’龍對筆記魏财散熱模組之設計提 出更高要求。為在較小之空間内提高散熱模組之換熱效 率，現採用方法之一係在散熱模組中使用氣密性腔體結構 (Vapor Chamber) ° 氣密性腔體結構最主要之優點不僅在於其換熱表面遠 大於普通熱管(HeatPiPe)，且由於氣密性腔體結構相對熱管 有卓乂大之蒸發八體流動面積，在回流毛細力能夠滿足冷凝 液回流要求之前提下可以有效提高氣密性腔體結構之最大 輪熱量。另外，氣密性腔體結構還可以解決多個熱源同時 散熱之問題，尤其在筆記型電腦中，當發熱電子元件如 CPU、VGA肖時f要散鱗，湘絲健體結構可以根 據需要設計多個熱交換區，並能靈活掌控其位置，以滿足 對多個發熱電子元件之散熱要求。 S知之氣#性腔體結構多採用機械加工之方式形成殼 1311192 體内利用數控技術(CNC )加工形成溝槽(Groove) ^燒結金屬雛做為其毛細結構。溝槽式毛細結構受限於 立乍藝，無法形成足夠小之毛細尺寸，難以達到令人滿 、、田效果。而採用機械加工殼體外加燒結金屬顆粒毛 細結構之工黏, *万法’使製作過程較繁雜且使氣密性腔體結 構之外形結構難以保證。 【發明内容】 # 妹有鑒於此，有必要提供一種可方便成型之氣密性腔體 結構之製造方法，且使用本方法製造出之氣密性腔體結構 具較好之毛細效果。 —種氣密性腔體結構之製造方法，包括如下步驟：製 彳H纽結構之芯模，”作—開孔泡沫娜骨架；對 該芯模之表面及表面下預定深度内泡孔之孔壁進行導電處 =;對該芯模進行首次電鑄，於該芯模之表面及所述預定 深紅泡孔㈣鑄形成第—金麟層；對首次電鑄後之芯 • 模進行表面光亮處理以使其表面平整光滑；對芯、模進行二 :欠電鑄，於芯模之外表面上電鑄形成第二金麟層丨除去 芯模，得到以第-金屬鑄層為毛細結構、以第二金屬禱層 為殼體之腔體；及向腔體内注入工作液體並將腔體密封， 得到所述氣密性腔體結構。 與習知技術相比，本發明氣密性腔體結構之製造方法 ^ ’採㈣孔齡轉科料雜，藉㈣次輯在芯 模之表面及-定深度之泡孔内電鑄形成氣密性腔體結構之 毛細結構，再經過二次電縳在毛細結構之外圍包覆一層金 8 1311192 屬鑄層以械氣錄腔體結構之殼體，本製妨法制程簡 單可方便地成型具較好毛細效果之氣密性腔體結構。 【實施方式】 圖1所示為本發明氣密性腔體結構之製造方法之流程 不意圖’其包括如下主要步驟1作具有多孔結構之芯模 〜首次電缚前處理~>首次輯形成毛細結構—二次電禱前 處理-^一次電鑄形成外層殼體—電鑄後處理—成品。IX. INSTRUCTIONS: TECHNICAL FIELD The present invention relates to a method of manufacturing a hermetic cavity structure, and more particularly to a method of manufacturing a hermetic cavity structure that uses a phase change principle to dissipate heat. [Prior Art] With the rapid development of the computer industry, the heat generated by the electronic components and components such as CpU and VGA in the notebook computer is increasing. However, the notebook is designed to be light, thin, short and small. In the direction of development, the internal space is not _ less 'long's notes on the design of the Wei Cai thermal module. In order to improve the heat transfer efficiency of the heat dissipation module in a small space, one of the methods used is to use a gas-tight cavity structure in the heat dissipation module (Vapor Chamber). The most important advantage of the airtight cavity structure is not only The heat exchange surface is much larger than the ordinary heat pipe (HeatPiPe), and because the airtight cavity structure has a large evaporation flow area relative to the heat pipe, it can be effectively improved before the return capillary force can meet the condensate return requirement. The maximum wheel heat of the airtight cavity structure. In addition, the airtight cavity structure can also solve the problem of heat dissipation of multiple heat sources at the same time, especially in the notebook computer, when the heating electronic components such as CPU and VGA are scattered, the Xiangsi fitness structure can be designed according to needs. Multiple heat exchange zones and flexible control of their position to meet the heat dissipation requirements of multiple heat-generating electronic components. S know the gas #Sexual cavity structure is formed by mechanical processing to form the shell 1311192 The body uses CNC technology (CNC) to form the groove (Groove) ^ sintered metal chick as its capillary structure. The grooved capillary structure is limited by the vertical art, and it is impossible to form a small enough capillary size to achieve a full and field effect. However, the mechanical viscosity of the casing and the fine structure of the sintered metal particles is used, and the manufacturing process is complicated and the structure of the airtight cavity structure is difficult to ensure. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a method for manufacturing a gas-tight cavity structure which can be easily formed, and the airtight cavity structure manufactured by the method has a good capillary effect. - a method for manufacturing a hermetic cavity structure, comprising the steps of: making a core mold of a H-shaped structure, "making an open-cell foam skeleton"; and a hole of a predetermined depth in the surface of the core mold and under the surface Conducting a wall at the wall = first electroforming the core mold, forming a first-gold layer on the surface of the core mold and the predetermined deep red cell (4); surface-shining the core mold after the first electroforming To make the surface smooth and smooth; the core and the mold are subjected to two: under-electroforming, electroforming on the outer surface of the core mold to form a second gold layer to remove the core mold, and the first metal casting layer is obtained as a capillary structure, The second metal prayer layer is a cavity of the casing; and the working fluid is injected into the cavity and the cavity is sealed to obtain the airtight cavity structure. Compared with the prior art, the airtight cavity of the invention The manufacturing method of the structure ^ ' mining (four) hole age transfer material miscellaneous, by (four) times in the surface of the core mold and - the depth of the cavity electroformed to form the capillary structure of the airtight cavity structure, and then through the second electrical binding A layer of gold 8 1311192 is cast on the periphery of the capillary structure to record the cavity The structure of the casing, the system is simple and convenient to form a gas-tight cavity structure with a good capillary effect. [Embodiment] FIG. 1 shows the flow of the manufacturing method of the hermetic cavity structure of the present invention. It is not intended to include the following main steps 1 as a core mold with a porous structure ~ first electrical pre-treatment ~> first to form a capillary structure - secondary electric pre-treatment - ^ one time electroforming to form an outer shell - after electroforming Processing - finished products.
為簡潔及敍述方便，下面以圖4與圖5中所示之氣密 性腔體結構30為代表對上述製造方法進行實例說明。圖4 與圖5為氣密性腔體結構30未填充工作液體且未進行密封 處理前之示意圖。該氣密性腔體結構30包括一殼體31， 該殼體31内形成空腔32，該殼體31整個内壁上設置有多 孔性毛細結構33，該殼體31相對之兩端分別設有—長開 口 34,以供在製作氣密性腔體結構30之過程中排污之用。 另外，在殼體31之一端還設有一細長之中空管體35，該 中二ί體35设有充灌口 36，以便於在抽完真空後往殼體 31内充入工作液體，其中該充灌口 36之截面積比長開口 34之截面積要小很多。 在製作該氣密性腔體結構30之過程中，首先製作—具 有多孔結構之芯模1〇，該芯模10 —般採用—具高開孔率 之開孔泡沫塑膠骨架，該開孔泡沫塑膠骨架内形成有相互 連通之眾多泡孔11 ,如圖2所示。該芯模10之兩端八別 向外延伸設有—個凸出部12，該凸出部12用於成型3 性腔體結構30之長開口 34。該芯模10之其中—端還凸μ 9 1311192 有一細長之圓柱體13，以用於成型氣密性腔體結構30之 中空官體35。該開孔泡沫瓣骨架㈣孔硬質聚胺基甲酸 酯泡沫师（Polyuiethane Fbam)肋#]加：]1所形成，其 中硬質聚胺基甲酸醋泡沫塑膠通常簡稱為聚氨醋硬泡。對 於開孔硬質聚胺基甲酸g旨泡珠塑膠之各種製作方法，已見 於各種公開出版物及專利文獻，如由中國國家環保總局對 外經濟合作領導小組辦公室、聯合國工業發展組織及北京 華塑資易公司聯合編寫之《聚氨醋硬泡cm替代技術手 冊》、中華民國專利第撕675號、第293827號等，故對 於製作開孔硬質聚胺基甲酸g旨泡沫瓣之方法在此不再資 敘。在製作開孔硬質聚胺基甲酸醋泡珠塑膠時，可根據氣 密性腔體結構30中毛細結構33所需毛細力要求對硬質聚 胺基甲酸醋泡沫塑膠中泡孔之孔徑大小進行控制以得到適 合之泡孔結構。為便於後續步驟之進行，在將開孔硬質聚 胺基甲酸醋泡珠塑膠切割加工為所需形狀之開孔泡沫塑膠 骨架之前’還可以對開孔硬質聚胺基甲酸醋泡沐塑膠之泡 孔結構進行適當之硬化和粗化處理，經硬化處理後可以使 對開孔硬質聚胺基甲酸g旨泡沐塑膠切割加工及後續對開孔 泡床塑膠骨架中之泡孔U進行處理更容易，經粗化處理後 則在電鑄時·在芯模1G之泡孔u _成金屬鋒層。 接著對芯模10進行首次電鑄以形成毛細結構33。在 2模1〇進行首找鑄前，需對雜1G進行首次電轉前 =導電處理。導電處理之方法為對芯模1()之表面喷塗導電 、’在喷塗導電漆之過程中’藉由調整噴塗之壓力，使導 1311192 電漆嘴到_ 1G預定深劾之航11之減上，深度之 :制^所為开>成之毛細結構33之厚度為標準，以在該預定 冰度之/包孔11之孔壁表面及芯模1〇之外表面上形成一導 電層（圖未不）以做為電鑄之起始層。另外，對於芯模10 之凸出部12及圓柱體13之端部121、131則採取遮蓋手段 而未喷上導轉，岐後續對芯模10電鑄時在凸出部12 及圓柱體13之端部121、131形成開口。For the sake of brevity and convenience of description, the above manufacturing method will be exemplified by the airtight cavity structure 30 shown in Figs. 4 and 5. 4 and 5 are schematic views of the airtight cavity structure 30 before it is filled with the working liquid and not sealed. The airtight cavity structure 30 includes a casing 31. A cavity 32 is formed in the casing 31. The entire inner wall of the casing 31 is provided with a porous capillary structure 33, and the opposite ends of the casing 31 are respectively provided. - a long opening 34 for draining during the process of making the airtight cavity structure 30. In addition, an elongated hollow tube body 35 is disposed at one end of the housing 31, and the middle body 35 is provided with a filling port 36 for filling the working chamber with the working liquid after the vacuum is exhausted. The cross-sectional area of the fill port 36 is much smaller than the cross-sectional area of the long opening 34. In the process of fabricating the hermetic cavity structure 30, a core mold 1 having a porous structure is first produced, and the core mold 10 is generally used as an open-cell foam plastic skeleton having a high opening ratio, the open-cell foam. A plurality of cells 11 communicating with each other are formed in the plastic skeleton, as shown in FIG. The two ends of the mandrel 10 are extended outwardly with a projection 12 for forming the long opening 34 of the three-dimensional cavity structure 30. The mandrel 10 has a convex end 9 1311192 which has an elongated cylindrical body 13 for forming the hollow body 35 of the hermetic cavity structure 30. The open-cell foamed skeleton (4) hole polyurethane Fbam rib #] is formed by adding:]1, wherein the rigid polyurethane foam is usually referred to as a polyurethane hard foam. Various methods for making open-celled rigid polycarbamate g-bubble plastics have been found in various public publications and patent documents, such as the Office of the Leading Group for Foreign Economic Cooperation of the State Environmental Protection Administration of China, the United Nations Industrial Development Organization and Beijing Huasu The "polyurethane hard foam cm replacement technology manual" jointly prepared by Yi company, the Republic of China patent tearing 675, the 293827, etc., so the method for making the open-hole rigid polyurethane g-foam valve is no longer here. Capital. When making the open-hole rigid polyurethane foam beads plastic, the pore size of the cells in the rigid polyurethane foam can be controlled according to the required capillary force requirement of the capillary structure 33 in the airtight cavity structure 30. In order to obtain a suitable cell structure. In order to facilitate the subsequent steps, before the open-hole rigid polyurethane foam beads are cut into the desired shape of the open-cell foam plastic skeleton, the pores of the hard polyurethane foam can be opened. The structure is subjected to appropriate hardening and roughening treatment, and after hardening treatment, it is easier to process the open-hole hard poly-carbamic acid g-bubble plastic processing and subsequently process the cells in the plastic skeleton of the open-cell bubble bed. After the chemical treatment, the cells in the core mold 1G are formed into a metal front layer during electroforming. The mandrel 10 is then electroformed for the first time to form the capillary structure 33. Before the first casting is carried out in 2 die 1 ,, the first 1G of the hybrid 1G needs to be electrically conductive. The conductive treatment method is to spray the surface of the core mold 1 (), and to adjust the pressure of the spray during the process of spraying the conductive paint, so that the conductive paint nozzle of the 1311192 is slid into the _ 1G predetermined voyage 11 Subtracting, depth: the thickness of the capillary structure 33 is standard, and a conductive layer is formed on the surface of the hole wall of the predetermined ice/envelope 11 and the outer surface of the core mold 1 (Figure is not) as the starting layer of electroforming. In addition, the projections 12 of the core mold 10 and the end portions 121 and 131 of the cylindrical body 13 are covered by the means of shielding without being sprayed, and the subsequent projections 12 and the cylindrical body 13 are electroformed to the core mold 10. The ends 121, 131 form an opening.
者，將導電處理後之芯模1〇置於如圖3所示之電鑄 槽2〇中進行電鑄。該電鑄槽20中盛有電解液21，並插入 有，極22與陽極23。將該電鑄槽20之陰極22與芯模10 之導電層連接’通電後對芯模1G進行電鑄。控制電缚之時 1模1〇之表面及所述預定深度内之泡孔U之孔壁 上電鑄出所需厚度之鑄層後將芯模1〇從電鑄槽如内取 攸而在芯模1G之表面及該預定深度之泡孔u内電鱗 件到連在—起之交連、立體網狀之第-金屬鑄層，即圖5 中所示之毛細結構33。在對泡孔11進行電鑄時，可控制 將該預定深度内之泡孔11完全充滿或麵為 热俊，對取出之電鑄有第 ，•必，两π /百〜 俠ιυ進杆一 =電鑄之前處理。由於芯模1G之表面佈滿泡孔以，經; 二電鑄後之芯模1G之表面並不平整。為使二次電轉後 10 而對心_ U)進诚面光亮處理。如在雜1G之 平整處填級細金屬聽、縣之錢或聚合物以使固化 11 1311192 後芯模之表面達到平整光滑 二次電鑄前無_模10之表面再時’ 石钱聚合魏魏_，二㈣翁= 面進行導電處理，如嘴塗導電漆。、 ’。、之表Then, the conductively processed core mold 1 is placed in an electroforming tank 2 as shown in Fig. 3 for electroforming. The electroforming tank 20 contains an electrolyte 21 and is inserted with a pole 22 and an anode 23. The cathode 22 of the electroforming cell 20 is connected to the conductive layer of the core mold 10. After energization, the core mold 1G is electroformed. Controlling the surface of the die and the wall of the cell of the cell U in the predetermined depth to electrically cast a cast layer of a desired thickness, and then taking the core die 1 from the electroformed groove. The surface of the core mold 1G and the inner scale of the predetermined depth of the cell u are connected to the interconnected, three-dimensional network of the first metal casting layer, that is, the capillary structure 33 shown in FIG. When electroforming the cell 11 , it is possible to control the cell 11 in the predetermined depth to be completely filled or the surface to be hot, and the electroforming of the extraction is performed, and the two π / hundred ~ 曼 υ υ = Processing before electroforming. Since the surface of the core mold 1G is filled with cells, the surface of the core mold 1G after electroforming is not flat. In order to make the secondary electricity turn 10, the heart is _ U) into the face of the bright treatment. For example, fill in the fine metal hearing, county money or polymer in the level of the miscellaneous 1G to make the surface of the core mold after curing 11 1311192 to be smooth and smooth before the surface of the secondary electroforming. Wei _, two (four) Weng = surface conductive treatment, such as the mouth painted conductive paint. , '. Table
於電完成二次料之前處理後，將芯模10置 20描：蝴。電鑄—糊後，在芯模 10=表面經電鑄得到-層厚度均勻之第二金屬轉層，即 圖5中所示之氣密性腔體結構3〇之殼體31。由於芯模比 2出部12及圓柱體13之端部121、131未倾導電漆， 故電辦在芯模10之凸出部12及圓柱體13之端部⑵、 131未形成金屬鑄層’這樣在去除雜1〇後可在相對應位 置形成長開口 34及充灌π 36。之後將輯後之產品取出 並進行必要之電鑄後清洗和處理。再將電鑄後之產品放入 烤箱（圖未示）中進行烘烤，然後經過高溫焙燒該模芯1〇， 以使該心模1〇熔化並從殼體31兩端未封閉之長開口 ％排 出’從而得到以第一金屬鑄層為毛細結構33、以第二金屬 鑄層為殼體31之腔體。再對該腔體進行必要之清洗以保證 所得產品之清潔及乾淨，密封兩端之長開口 34，由充灌口 36對腔體内抽真空並充填工作液體’再密封充灌口 36即 得到所需之氣密性腔體結構30之成品。 該氣密性腔體結構30可用於筆記型電腦等電子裝置 中對電子元件進行散熱。在使用時’該氣密性腔體結構3〇 之上、下表面可與多個熱源接觸’從而實現同時對多個電 子元件散熱。 12 1311192 該氣密性腔體結構30在製作過程中，由於採用且 孔率m末塑㈣架作為成型毛細結構33 毛細結構33所需毛細力之要求，在製作泡珠= 由對泡孔11之纽大小進行控制，同時根 33所需厚度之要求，在對芯模1Q魅導電漆時㈣j 噴塗壓力以對預定深度内之泡孔11進行導電處理:從而： 電鑄時能夠有效控制電缚後所成毛細結構％之毛細 徑。使用本方法制得之氣密性腔體結構3〇可= 隙、立體網狀之毛細結構33，從而提供报好之毛細效^。 此外’芯模10之開孔輯塑膠骨架藉由切割成型，可 枝將芯模10做成複雜之形狀，從而能方便地加卫出吨 模1〇之外形相對應之具複雜形狀之毛細結構及具複雜= 形之’以應對筆記型電腦等電子裝置内複雜之空間佈 局並滿足對多個發熱電子元件進行散熱之需求。 =上所述’本發日將合翻翻要件，綠法提出專 =二惟，以上所述者僅為本發明之較佳實施例，舉凡 藝之人士’在爰依本發明精神所作之等效修飾 或皮化’ &應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明氣密性腔體結構之製造方法之流程示意 圖。 圖2係依圖1所示步驟提供之芯模之立體示意圖。 圖3係圖2所示芯模經電鑄前處理後置入電鱗槽内之 剖面示意圖。 1311192 圖4係經過二次電鑄並除去芯模後所得氣密性腔體結 構之立體示意圖。 圖5係圖4所示氣密性腔體結構沿V-V方向之剖面示 意圖。 【主要元件符號說明】 芯模 10 泡孔 11 凸出部 12 端部 121 、 131 圓柱體 13 電鑄槽 20 電解液 21 陰極 22 陽極 23 氣密性腔體結構 30 殼體 31 空腔 32 毛細結構 33 長開口 34 中空管體 35 充灌口 36 14After the electricity is processed before the completion of the secondary material, the mandrel 10 is placed 20: butterfly. After electroforming - paste, a second metal transfer layer having a uniform thickness is obtained by electroforming at the core mold 10 = surface, that is, the airtight cavity structure 3 shown in Fig. 5 is a casing 31. Since the core mold is not inclined to the conductive paint at the end portions 121 and 131 of the second portion 12 and the cylindrical body 13, the metal portion is not formed at the end portions (2) and 131 of the protruding portion 12 of the core mold 10 and the cylindrical body 13. 'This way, after removing the impurity, a long opening 34 and a filling π 36 can be formed at the corresponding positions. The assembled product is then removed and the necessary electroforming is followed by cleaning and processing. Then, the electroformed product is baked in an oven (not shown), and then the core 1 is baked at a high temperature to melt the core mold 1 and the unopened long opening from both ends of the casing 31. % is discharged to obtain a cavity in which the first metal cast layer is the capillary structure 33 and the second metal cast layer is the shell 31. The cavity is further cleaned to ensure that the resulting product is clean and clean. The long openings 34 at both ends of the seal are sealed, and the cavity is evacuated by the filling port 36 and filled with the working liquid 'resealing the filling port 36. The finished product of the required airtight cavity structure 30. The airtight cavity structure 30 can be used to dissipate heat from electronic components in electronic devices such as notebook computers. In use, the upper surface of the hermetic cavity structure 3 、 can be in contact with a plurality of heat sources to achieve simultaneous heat dissipation of the plurality of electronic components. 12 1311192 In the manufacturing process, the airtight cavity structure 30 is used in the manufacturing process, and the capillary force is required as the capillary structure of the capillary structure 33. The size of the button is controlled, and at the same time, the required thickness of the root 33 is required. In the case of the core mold 1Q, the spraying pressure is applied to conduct the conductive treatment on the cells 11 in the predetermined depth: thus: the electric binding can be effectively controlled during electroforming The capillary diameter of the capillary structure after the formation. The airtight cavity structure obtained by the method can be used to provide a report of the capillary structure of the three-dimensional network. In addition, the open-hole plastic skeleton of the core mold 10 can be formed into a complicated shape by cutting, so that the capillary structure having a complicated shape corresponding to the shape of the ton mold can be easily added. And complex = shape to deal with the complex spatial layout of electronic devices such as notebook computers and meet the need to dissipate heat from multiple heat-generating electronic components. = The above-mentioned 'this day will be turned over, and the green method is specific to the two. The above is only the preferred embodiment of the present invention, and the person of the art is doing the same in the spirit of the present invention. Effect modification or leatheration ' & should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic flow chart showing a method of manufacturing a hermetic cavity structure of the present invention. Figure 2 is a perspective view of a mandrel provided in accordance with the steps shown in Figure 1. Fig. 3 is a schematic cross-sectional view showing the mandrel of Fig. 2 placed in an electric scale tank after electroforming. 1311192 Figure 4 is a schematic perspective view of the hermetic cavity structure obtained after secondary electroforming and removal of the mandrel. Figure 5 is a cross-sectional view of the hermetic cavity structure shown in Figure 4 taken along the line V-V. [Main component symbol description] Mandrel 10 Cell 11 Projection 12 End 121, 131 Cylinder 13 Electroformation tank 20 Electrolyte 21 Cathode 22 Anode 23 Airtight cavity structure 30 Housing 31 Cavity 32 Capillary structure 33 long opening 34 hollow tube body 35 filling port 36 14