CN100377345C - Method for molding air tightness cavity - Google Patents

Method for molding air tightness cavity Download PDF

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Publication number
CN100377345C
CN100377345C CNB2004100919008A CN200410091900A CN100377345C CN 100377345 C CN100377345 C CN 100377345C CN B2004100919008 A CNB2004100919008 A CN B2004100919008A CN 200410091900 A CN200410091900 A CN 200410091900A CN 100377345 C CN100377345 C CN 100377345C
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China
Prior art keywords
forming method
model
gas
tight cavity
cavity forming
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Expired - Fee Related
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CNB2004100919008A
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Chinese (zh)
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CN1797754A (en
Inventor
黄清白
朱习剑
杨志豪
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2004100919008A priority Critical patent/CN100377345C/en
Publication of CN1797754A publication Critical patent/CN1797754A/en
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Abstract

The present invention discloses a molding method of an airtight cavity, which comprises the following steps: a model making step, a mold having a surface shape corresponding to an airtight cavity body is made; a metal depositing step, metal is deposited on the surface of the mold to form a metallic layer, and a composite structure of the mold and the metallic layer is obtained; a demoulding step, the mold and the metallic layer are separated in the composite structure to obtain a hollow cavity formed from the metallic layer; a post-treatment step, a certain amount of working fluids are injected in the hollow cavity and sealed to obtain an airtight cavity structure. The present invention can integrally form an airtight cavity with the method of metal deposit, the quality of products can be improved, and products having proper complicated shapes can be made.

Description

Gas-tight cavity forming method
[technical field]
The heat radiation of the present invention and electronic applications is relevant, particularly about a kind of forming method that utilizes the air-tight cavity that the phase change principle dispels the heat.
[background technology]
Along with the develop rapidly of electronics and information industry, the speed of updates such as various electronic product such as computer is obviously accelerated, function also from strength to strength, but the heat of generation such as electronic component in it such as central processing unit simultaneously also increases synchronously.For guaranteeing the normal operation of electronic component, industry is usually by installing heat abstractor so that it is carried out auxiliary heat dissipation.
For solving the heat dissipation problem of high heat density, industry has been invented the various heat radiation solutions of utilizing the capillary principle, as the heat pipe that uses in the existing heat radiation field and air-tight cavity (Vapor Chamber) etc.Air-tight cavity is after the cavity with a given shape is evacuated, inject an amount of hydraulic fluid such as ammoniacal liquor, methyl alcohol, water or acetone etc., be sealed to form after making the porous capillary structure of being close to cavity inner wall soak into hydraulic fluid, when it contacts with thermal source, hydraulic fluid near evaporating area in the chamber promptly absorbs heat and carburation by evaporation, steam is full of whole vacuum chamber, when steam touches any one colder inwall (condensing zone), be that release heat condenses into liquid, liquid flows back to evaporating area along porous capillary structure by capillarity or action of gravity again, so circulation is endlessly reached heat the cold end surface of air-tight cavity by the thermal source contact position.Certainly, with regard to heat pipe itself, the cavity in it also constitutes a miniature air-tight cavity, and promptly air-tight cavity and heat pipe there is no tangible differentiation boundary line.
At present, air-tight cavity has been applied to the electronic radiation field, as United States Patent (USP) the 5th, 216, No. 580, the 6th, 269, the announcement that is wherein for 866B1 number, but because present immature on processing procedure, make that air-tight cavity other outside space industry is also not extensive as the electronic radiation Application for Field.The manufacture method of air-tight cavity mainly contains two kinds at present, promptly adopts many welding to form or pass through to form after the circular heat pipe flattening.Wherein weld in the middle of the processing procedure, because the processing of weldment requires the weldment wall thickness that certain requirement of strength is arranged with welding sequence, cause the finished product after the processing heavier, and because there is contact in welding, the airtight reliability of product is reduced, product quality can not get assurance.Damage and flatten the inner original capillary structure of the easy opposite heat tube of processing procedure, it is basic destroyed fully and lose its due function especially to flatten the capillary structure of both sides, back, also reduces quality of finished.In addition, above-mentioned two kinds of manufacture methods can not be made the airtight cavity structure of complicated shape substantially.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of gas-tight cavity forming method that promotes product quality and can make suitable complicated shape product.
For solving the problems of the technologies described above, gas-tight cavity forming method of the present invention comprises the steps: (1) modelling step, promptly makes a model that has corresponding surface configuration with this air-tight cavity; (2) metal deposition step promptly is deposited at the enterprising row metal in the above-mentioned surface of this model and forms a metal level, and obtains the composite construction of metal level and model; (3) demoulding step is promptly separated model from above-mentioned composite construction and the hollow cavity that obtains being made of metal level with metal level; (4) subsequent processing steps is promptly injected a certain amount of hydraulic fluid and is carried out airtight to obtain airtight cavity structure in this hollow cavity.
Compared with prior art, gas-tight cavity forming method of the present invention is made into integration by the mode of metal deposition, save welding processing procedure in the existing manufacturing process and the flattening processing procedure that circular heat pipe is carried out, thereby reduce reliability hidden danger that causes by welding and the capillary structure destruction of causing by the flattening processing procedure, time by the control metal deposition then can obtain the shaped article of different wall, and this method also can be produced the changeable and more complicated product of suitable shape as required.
[description of drawings]
Below with reference to accompanying drawing, in conjunction with the embodiments the present invention is further described.
Fig. 1 is the schematic flow sheet of gas-tight cavity forming method of the present invention.
Fig. 2 is the modelling schematic diagram of first embodiment of the invention.
Fig. 3 is by the prepared model schematic diagram of Fig. 2.
Fig. 4 is the metal deposition schematic diagram of first embodiment of the invention.
Fig. 5 is the demoulding schematic diagram of first embodiment of the invention.
Fig. 6 is the prepared model schematic diagram of second embodiment of the invention.
Fig. 7 is the metal deposition schematic diagram of second embodiment of the invention.
Fig. 8 is the structural representation after Fig. 7 metal deposition is finished.
Fig. 9 is the prepared model schematic diagram of third embodiment of the invention.
Figure 10 is the metal deposition schematic diagram of third embodiment of the invention.
Figure 11 is the product schematic diagram that obtains according to the moulding of third embodiment of the invention institute.
[embodiment]
Fig. 1 is the schematic flow sheet of first embodiment of gas-tight cavity forming method of the present invention, and it comprises following four key steps: the modelling → metal deposition → demoulding → subsequent treatment obtains finished product.
Reach narration conveniently for succinct, be that the forming method introduction is carried out in representative with the square air-tight cavity of the better simply solid of structure among the present invention, as shown in Figure 2, when modelling, to inject prefabricated hollow mould 20 by the base material 10 that ceramic slurry or polymeric material etc. constitutes, obtain model shown in Figure 3 30 through moulding, this model 30 has corresponding appearance structure with the air-tight cavity that the moulding of wanting obtains; Carry out metal deposition then, this model 30 is put into the electrotyping bath 40 energising certain hours that are filled with electroforming solution 42 as shown in Figure 4 carry out metal deposition (the present invention does not illustrate other structures such as electrode), the certain thickness metal level 50 of deposition on the outer surface of model 30, as shown in Figure 5; Carry out the demoulding afterwards, the composite construction of this model 30 and metal level 50 taken out from electrotyping bath 40 and by mechanical oscillation as beaing etc. or 10 disengagings of the base material in the metal level being fallen by heat treated mode, thereby obtain the hollow casting that constitutes by metal level 50, for keeping the cleaning of foundry goods, also can carry out suitable cleaning to the cavity in the foundry goods; At last, by the subsequent treatment operation, as capillary structure is set in the cavity of foundry goods, charges into and vacuumize and seal after an amount of hydraulic fluid etc., thereby finally obtain airtight cavity structure of the present invention by modes such as sintering metal powders.
Fig. 6 to Fig. 8 is disclosed as another embodiment of the present invention, it substantially also comprises above-mentioned four key steps, at first make a hollow model 30a who is combined to form by two parts up and down, as shown in Figure 6, the inner surface of this model 30a is corresponding with the air-tight cavity shape and structure that want moulding obtains; In conjunction with Fig. 7 and shown in Figure 8, electrotyping bath 40a when this model 30a is used as electroforming in the lump, in this electrotyping bath 40a, inject electroforming solution 42 and carry out the electro-deposition of certain hour along its opening 44, thereby the certain thickness metal level 50a of deposition on the internal face of model 30a, be concentration and lifting electroforming velocity and the quality that keeps electroforming solution 42, can increase electrolysis tank 40a and import and export pipeline (figure does not show), allow electroforming solution 42 circulate by rights.Electroforming solution 42 can be emitted after electroforming is finished and model 30a unloaded and obtain early stage hollow casting, this foundry goods promptly obtains airtight cavity structure of the present invention via cleaning among above-mentioned first embodiment and subsequent treatment operation at last.
Fig. 9 to Figure 11 is disclosed as another embodiment of the present invention, but this embodiment one in forming process forms capillary structure in the chamber, it substantially also comprises four key steps among above-mentioned first embodiment, promptly at first make the model 30b that the air-tight cavity that obtains with the moulding of wanting has corresponding appearance structure, as shown in Figure 9, this model 30b is stereoscopic quadrate, is formed with the some parallel projection 32 that is used for the moulding capillary structure on its outer surface in the lump; Then, this model 30b is put into the electrotyping bath 40b energising certain hour that is filled with electroforming solution 42 as shown in figure 10 carry out electro-deposition, the certain thickness metal level 50b of deposition on the outer surface of model 30b, as shown in figure 11, after electroforming is finished this model 30b is separated from metal level 50b, thereby obtain the hollow cavity that is made of metal level 50b, the inwall of this hollow cavity forms the capillary structure 52 with parallel groove in the lump; This hollow cavity promptly obtains airtight cavity structure of the present invention after via cleaning, topping up and operation such as airtight at last.Be appreciated that ground, if on the outer surface of above-mentioned model 30b, form interlaced and non-parallel projection, then correspondingly can on the shaped article inwall, form interlaced channel form capillary structure, further, this interlaced groove also can form deep mixed structure, to strengthen the capillarity effect; In addition, if above-mentioned model 30b is made into toroidal, then can correspondingly be used for the moulding inwall and has the circular heat pipe of capillary structure.
In the air-tight cavity manufacturing process of the present invention, the mode of carrying out metal deposition by electroforming is made into integration, save welding sequence in the existing manufacturing process and the processing procedure that circular heat pipe is flattened, thereby reduce reliability hidden danger that causes by welding and the capillary structure destruction of causing by the flattening processing procedure, promote product quality, then can obtain the shaped article of different wall by the time of controlling electroforming; Though the present invention only does the introduction of moulding method at the comparatively simple air-tight cavity of shape, yet when the three-dimensional model that adopts the different cross section shape such as square, circular, triangle or polygonized structure, can correspondingly produce the changeable and more complicated air-tight cavity product of shape.
In use, a wherein surface or a plurality of surfaces of air-tight cavity contact with thermal source, and some radiating fins can be set on other surface to increase area of dissipation, the heat of thermal source evaporates the hydraulic fluid in the air-tight cavity, and steam returns be condensed into liquid after the release heat when meeting with huyashi-chuuka (cold chinese-style noodles) after, circulates and so forth so that heat is taken away from thermal source.

Claims (10)

1. a gas-tight cavity forming method comprises the steps:
(1) modelling step is promptly made a model that has corresponding surface configuration with this air-tight cavity;
(2) metal deposition step promptly is deposited at the enterprising row metal in the above-mentioned surface of this model and forms a metal level, and obtains the composite construction of metal level and model;
(3) demoulding step is promptly separated model from above-mentioned composite construction and the hollow cavity that obtains being made of metal level with metal level; And
(4) subsequent processing steps is promptly injected a certain amount of hydraulic fluid and is carried out airtight to obtain airtight cavity structure in this hollow cavity.
2. gas-tight cavity forming method as claimed in claim 1 is characterized in that: its cross section of described model is square, circular, triangle or polygonized structure.
3. gas-tight cavity forming method as claimed in claim 1 is characterized in that: the modelling step is made for insert substrate forming in prefabricated hollow mould.
4. gas-tight cavity forming method as claimed in claim 3 is characterized in that: described this base material is ceramic slurry or polymeric material.
5. gas-tight cavity forming method as claimed in claim 4 is characterized in that: described demoulding step is by carrying out mechanical oscillation or heat treated mode above-mentioned ceramic slurry or polymeric material to be separated from described composite construction.
6. gas-tight cavity forming method as claimed in claim 3 is characterized in that: described metal deposition step for electroforming mode plated metal on the outer surface of this model.
7. gas-tight cavity forming method as claimed in claim 1 is characterized in that: the hollow structure of the model of described making for being combined to form by two parts.
8. gas-tight cavity forming method as claimed in claim 7 is characterized in that: this metal deposition step in this hollow structure, insert electroforming solution with electroforming mode plated metal on the inner surface of this hollow structure.
9. gas-tight cavity forming method as claimed in claim 1 is characterized in that: the model of making is formed with some corresponding projectioies that form capillary structure on the inwall of hollow cavity that are used on the outer surface.
10. gas-tight cavity forming method as claimed in claim 9 is characterized in that: described projection is arranged parallel to each other or forms the shape that is staggered.
CNB2004100919008A 2004-12-25 2004-12-25 Method for molding air tightness cavity Expired - Fee Related CN100377345C (en)

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CNB2004100919008A CN100377345C (en) 2004-12-25 2004-12-25 Method for molding air tightness cavity

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Application Number Priority Date Filing Date Title
CNB2004100919008A CN100377345C (en) 2004-12-25 2004-12-25 Method for molding air tightness cavity

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CN100377345C true CN100377345C (en) 2008-03-26

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101161870B (en) * 2006-10-11 2010-11-10 富准精密工业(深圳)有限公司 Gas-tight cavity forming method
CN101230472B (en) * 2007-01-26 2010-05-26 富准精密工业(深圳)有限公司 Method for manufacturing airtight cavity structure
CN110763060B (en) * 2019-10-29 2021-04-20 深圳大学 Preparation method of ultrathin heat pipe

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130691A (en) * 1984-07-23 1986-02-12 Honda Motor Co Ltd Production of electroforming mold
JPH1158475A (en) * 1997-08-26 1999-03-02 Mazda Motor Corp Manufacture of mold for injection molding
CN1518098A (en) * 2003-01-17 2004-08-04 蔡政龙 Slot-type heat pipe and its manufacturing method
CN1536654A (en) * 2003-04-04 2004-10-13 刘俊富 Method for making thermal superconducting block, sheet and cover body

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130691A (en) * 1984-07-23 1986-02-12 Honda Motor Co Ltd Production of electroforming mold
JPH1158475A (en) * 1997-08-26 1999-03-02 Mazda Motor Corp Manufacture of mold for injection molding
CN1518098A (en) * 2003-01-17 2004-08-04 蔡政龙 Slot-type heat pipe and its manufacturing method
CN1536654A (en) * 2003-04-04 2004-10-13 刘俊富 Method for making thermal superconducting block, sheet and cover body

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