CN1832156A - Structure of heat sink and manufacturing method - Google Patents
Structure of heat sink and manufacturing method Download PDFInfo
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- CN1832156A CN1832156A CN 200510054134 CN200510054134A CN1832156A CN 1832156 A CN1832156 A CN 1832156A CN 200510054134 CN200510054134 CN 200510054134 CN 200510054134 A CN200510054134 A CN 200510054134A CN 1832156 A CN1832156 A CN 1832156A
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Abstract
This invention discloses a radiating device, which can be a uniform heat cavity combined with any heating components. The device includes a closed cavity and a capillary structure formed on the inside wall of said cavity, in which, said capillary structure includes multiple grooves formed on the inside wall of the cavity and porous powder sintered under high temperature on the inside wall , thus the radiating device has good capillary force of sintered capillary structure and penetrability of groove structure to speed up the radiation backflow of the working liquid and increase the radiation efficiency of the device.
Description
Technical field
The present invention relates to a kind of structure and manufacture method thereof of heat abstractor, particularly a kind of heat abstractor and manufacture method thereof that has high capillary force and high osmosis simultaneously.
Background technology
Along with development of technology, the number of electronic components on the unit are of electronic equipment is more and more, causes electronic equipment caloric value when work to increase thereupon.Therefore, be in effective working temperature in order to keep electronic equipment, existing way is to utilize to add fan and radiating fin realization heat radiation mostly.
Because heat pipe (heat pipe) can transmit one section considerable distance with a large amount of heat under very little sectional area and temperature difference, and do not need the additional power source supply to operate, power is provided and utilizes economically under the consideration in space need not, heat pipe has been one of heat-transferring assembly of widely using in the electronic radiation product.
Typical heat pipe is made of cavity (chamber), capillary structure (wick structure) and working fluid, its action principle is to utilize working fluid to evaporate from the heat that thermal source produced in the evaporation section absorption of cavity again, working fluid forms steam because of the latent heat effect and flows to the condensation segment of cavity, condense into liquid state once more after discharging heat, and make working fluid flow back to evaporation section by means of the capillary force that capillary structure provided, so constantly repeat phase change circulation, continue and effectively heat energy is sent to the choosing of loosing at a distance from thermal source.
Heat uniform temp cavity (vapor chamber, steam cavity) belongs to a kind of of heat pipe, is mostly to utilize up and down two dull and stereotypedly and form airtight cavity, and forms capillary structure on the inwall of two flat boards.Generally speaking, the capillary structure of heat uniform temp cavity mainly forms in three kinds of modes: sintering capillary structure (sinteredwick), netted capillary structure (mesh wick) and channel form capillary structure (groove wick).
See also Fig. 1, with regard to sintering capillary structure 13, prior art forms with porousness powder such as copper powder (sintered powder) high temperature sintering on two flat boards, 11,12 inwalls of heat uniform temp cavity 10.Though sintering capillary structure 13 has preferable capillary force, its permeability is poor than channel form and netted capillary structure, so to be applied to separately on the heat uniform temp cavity 10 be not fine to this sintering capillary structure 13.Moreover, because temperature is quite high during sintering, very easily cause dull and stereotyped 11,12 softeningly, must increase by dull and stereotyped 11,12 thickness usually, can strengthen the mechanical strength of heat uniform temp cavity 10 integral body.Yet this measure has not only improved the material cost of heat uniform temp cavity 10, the weight of heat uniform temp cavity 10 is increased, really non-good solution.
See also Fig. 2, with regard to netted capillary structure 14, it utilizes the metal screen cloth to form multiple runner through extrusion molding, afterwards, insert again and be attached on the inwall of two flat boards 11,12 of heat uniform temp cavity 10, so, can provide heat uniform temp cavity 10 more runner, thereby reach preferable radiating effect.Yet netted capillary structure 14 needs to attach fully with the inwall of two flat boards 11,12, otherwise will influence the heat conduction efficiency of heat uniform temp cavity 10, so its difficulty of making is higher, also makes and makes improve relative with material cost.
Please refer to Fig. 3 A, 3B and 3C, with regard to channel form capillary structure 15, utilize mould 20 on the inwall of dull and stereotyped 11 (or dull and stereotyped 12), to stamp out the groove (being channel form capillary structure 15) that institute's desire forms by means of the machining mode.Though this type of channel form capillary structure 15 has preferable permeability, capillary force is not as sintering capillary structure 13, for a long time, and this defective perplexs the manufacturing development always person and user.Moreover, make the width minimization of channel form capillary structure 15 also be subjected to certain limitation, generally speaking, the minimum widith that 20 on mould can be made the channel form capillary structure is about 300 microns (micrometer, μ m), channel form capillary structure 15 quantity that form when desire on dull and stereotyped 11 increase or the degree of depth of channel form capillary structure 15 needs when darker, the required impulsive force of manufacturing process also needs bigger, at any time replacing designs so mould 20 need are desired the difference of the difference of groove number of moulding or the degree of depth with institute on dull and stereotyped 11, and driving mould 20 also need provide bigger actuating force just to be enough to make the inwall formation requirement of heat uniform temp cavity 10 and the groove of the degree of depth with the toolroom machine of punching press flat board 11, has so also increased manufacturing cost significantly.In addition, when making channel form capillary structure 15 with impact style, the situation of channel form capillary structure 15 lazy weights takes place to prevent dull and stereotyped 11 in dull and stereotyped 11 the crack, limit 16 that need be reserved with preset width all around because of distortion in punching course.After to be punched the finishing, unnecessary 16 need in crack, limit are wiped out it by means of the instrument of cutting out again around the flat board 11, thus, the material cost of making heat uniform temp cavity 10 are increased substantially.
The continuous densification of assembled components in various electronic equipments and volume is got under the trend that becomes to dwindling, because assembly aggregation degree improves constantly, cause its caloric value progressively to increase, therefore, making the heat abstractor with higher heat conduction speed and efficient will become one of following research direction.
Summary of the invention
In view of the above, the technical problem to be solved in the present invention provides a kind of heat abstractor that has high capillary force and high osmosis simultaneously, and then can improve its radiating efficiency significantly.Another technical problem that will solve of the present invention provides the method for making this heat abstractor.
The technical scheme that the present invention solves described problem is, what provided is applied on arbitrary heat generating component, can be the capillary structure that the heat abstractor of heat uniform temp cavity mainly has closed cavity and is formed at this cavity inner wall, wherein, described capillary structure comprises that the groove that is formed at cavity inner wall and high temperature sintering are in the porousness powder of cavity inner wall.Thus, this heat abstractor possesses the preferable capillary force that the sintering capillary structure is arranged and the preferable permeability of channel form capillary structure simultaneously, cause the back-flow velocity of the working fluid of filling in cavity after heat radiation faster, and then can effectively improve the radiating efficiency of heat abstractor.
According to the present invention, the method for the described heat abstractor of manufacturing that is provided comprises: prepared substrate; Sintered porous property powder on described substrate; On described substrate, form the multiple tracks groove; Make described substrate form a cavity, and form evaporation section and condensation segment, and make described groove and sintered powder all be positioned at the inwall of cavity; In described cavity, inject hydraulic fluid, and make described cavity form the enclosed vacuum cavity.
Description of drawings
For above and other objects of the present invention, feature and advantage can be become apparent, a preferred implementation cited below particularly also is elaborated in conjunction with the accompanying drawings.In the accompanying drawing:
Fig. 1 is existing phantom with heat uniform temp cavity of sintering capillary structure;
Fig. 2 is existing phantom with heat uniform temp cavity of netted capillary structure;
Fig. 3 A is the schematic diagram of the channel form capillary structure of existing manufacturing heat uniform temp cavity inwall;
Fig. 3 B is the schematic diagram after the channel form capillary structure moulding of heat uniform temp cavity among Fig. 3 A;
The phantom of Fig. 3 C when being made for airtight cavity among Fig. 3 B;
Fig. 4 is the phantom of the heat abstractor of preferred implementation of the present invention;
Fig. 5 is the flow chart of heat abstractor manufacture method of the present invention.
Description of reference numerals
10 heat uniform temp cavities, 11 flat boards
12 dull and stereotyped 13 sintering capillary structures
14 netted capillary structure 15 channel form capillary structures
Crack, 16 limit 20 moulds
30 cavitys, 40 capillary structures
41 porousness powder, 42 grooves
Embodiment
Please refer to Fig. 4, heat abstractor of the present invention can be realized by heat uniform temp cavity (vapor chamber).This heat abstractor includes cavity 30 and is formed at the capillary structure 40 of cavity 30 inside.Capillary structure 40 comprises that also high temperature sintering is in the porousness powder 41 (sintered powder) of cavity 30 inwalls and the multiple tracks groove 42 that is formed at cavity 30 inwalls.By means of described structure; this heat abstractor possesses the preferable capillary force that the sintering capillary structure is arranged and the preferable permeability of channel form capillary structure simultaneously; both complement each other; thereby can improve the radiating efficiency of heat abstractor, like this then can protect heat generating component that it connected (for example: CPU) more perfectly.
At this, what must remark additionally is, be filled with working fluid (inorganic compound for example in the heat abstractor in addition, water, alcohols, liquid metal, ketone, refrigerant, or organic compound), working fluid can absorb the heat row evaporation again from thermal source produced in the evaporation section (not shown) of cavity 30, working fluid forms steam because of the latent heat effect and flows to the condensation segment (not shown) of cavity 30, condense into liquid state once more after emitting heat, and make working fluid flow back to evaporation section by means of the capillary force that capillary structure 40 is provided, so constantly repeat the phase change circulation, and can effectively heat energy be sent to dissipation at a distance from thermal source.
Consult Fig. 5, it is for making the method flow diagram of this heat abstractor.This manufacture method comprises:
The A that gets the raw materials ready, prepared substrate, the material of this substrate are selected from by copper, titanium, molybdenum or have a kind of material in the group that the metal material of high heat-conduction coefficient forms;
Powder sintered B, with porousness powder 41 such as copper powder (sintered powder) high temperature sintering on substrate;
Groove shaping C utilizes such as behind the fabrication techniques moulds such as laser cutting mode, Precision Machining, utilizes the molded above-mentioned sintering of this mould that the substrate of porousness powder is arranged again.With little mould model method is example, and it comprises mould fabrication schedule and molded program.At first, carry out the mould fabrication schedule, comprise base material is provided; On base material, form pre-die layer, and use the microelectronics processing method, pre-die layer processing is formed pre-die; The die material is formed on the pre-die, and making the die forming materials is die; The die making is become mould, and picture on surface on the mould (being a plurality of parallel projections herein) and the inverted configuration of desiring on substrate, to form, then, carry out molded program, utilize the mould mold substrate, the parallel groove of described multiple tracks 42 is formed on the substrate;
Warpage shaping D, the substrate that described sintering is had porousness powder 41 and be formed with groove 42 forms cavity 30 by modes such as warpage and welding;
Inject working fluid and vacuumize E, end with cavity 30 seals earlier, then inject working fluid (for example being: inorganic compound, water, alcohols, liquid metal, ketone, refrigerant or organic compound) and it is vacuumized, the other end with cavity 30 seals at last, and finishes the making of this heat abstractor.
At this, what be worth paying special attention to is in described manufacture method, also the step of powder sintered B and groove shaping C can be exchanged.In brief, exactly earlier after producing groove 42 on the substrate, sintered porous property powder 41 on the plane between groove 42 and the groove 42 again.The change of described step does not influence the effect after heat abstractor is made, and this change need not those skilled in the art to be carried out creative work and can draw, so do not describe with flow chart in addition at this.
At last, the applicant more is stressed that, in described two kinds of different manufacture methods, also can make or prepare two substrates simultaneously, after forming porousness powder 41 and groove 42 on two substrates, be that available welding or alternate manner mutually combine them and connect into cavity 30, and then make described heat abstractor.This makes change on the step and also need not those skilled in the art and carry out creative work and can draw, so do not give unnecessary details at this.
The above is an exemplary illustration only, is not to be limitation of the present invention.Anyly under the prerequisite that does not exceed design of the present invention and protection range, all should fall into appended claim to its equivalent modifications of carrying out or conversion.
Claims (15)
1. heat abstractor that is incorporated on the heat generating component, it comprises:
One cavity, it has an inwall, and this cavity comprises an evaporation section and a condensation segment;
One capillary structure, it comprises that multiple tracks is positioned at the groove and the porousness powder that is sintered on the described cavity inner wall of described cavity inner wall; And
Be arranged in the working fluid of described cavity;
Wherein, described working fluid absorbs the heat of heat generating component and is evaporated in described evaporation section, and is condensed into liquid state after described condensation segment is emitted heat, and makes described working fluid flow back to described evaporation section by means of the capillary force that described capillary structure provided.
2. heat abstractor as claimed in claim 1, wherein, described heat abstractor forms a closed cavity by a substrate warpage.
3. heat abstractor as claimed in claim 2, wherein, by utilizing molded the making of this mould to have described multiple tracks groove on the described cavity inner wall behind laser cutting mode or the precision processing technology making mould.
4. heat abstractor as claimed in claim 2, wherein, described substrate is made by a kind of material that is selected from copper, titanium, molybdenum or have in the group that the metal material of high heat-conduction coefficient forms.
5. the manufacture method of a heat abstractor comprises the following steps:
Prepared substrate;
Sintered porous property powder on described substrate;
Shaping multiple tracks groove on described substrate;
Make described substrate form a cavity, and form evaporation section and condensation segment; And
In described cavity, inject hydraulic fluid, and make this cavity form the enclosed vacuum cavity.
6. heat abstractor manufacture method as claimed in claim 5 wherein, behind laser cutting mode or precision processing technology making mould, utilizes this mould molded so that described multiple tracks groove is formed on the described substrate.
7. heat abstractor manufacture method as claimed in claim 6, wherein, described multiple tracks groove is formed on the described substrate by little model type method, and this little model type method comprises:
The mould fabrication schedule, it comprises provides base material; On described base material, form pre-die layer, and by the microelectronics processing method described pre-die layer is processed and to be formed pre-die; The die material is formed on the described pre-die, and making described die forming materials is die; With described die making becoming mould; And
Molded program, it comprises and utilizes the molded described substrate of described mould, and described multiple tracks groove is formed on the described substrate.
8. heat abstractor manufacture method as claimed in claim 5, wherein, described substrate is made by the metal material with high heat-conduction coefficient, and it is formed a cavity by the warpage mode, earlier after the end sealing with this cavity, the working fluid that reinjects, and this cavity vacuumized, at last again with its other end sealing.
9. heat abstractor manufacture method as claimed in claim 5 wherein, is prepared the substrate that sintering has the porousness powder again, by welding or alternate manner described two substrates is combined into a cavity.
10. the manufacture method of a heat abstractor comprises the following steps:
Prepared substrate;
On described substrate, form the multiple tracks groove;
Sintered porous property powder on described substrate;
Make described substrate form a cavity, and form evaporation section and condensation segment; And
In described cavity, inject hydraulic fluid, and make this cavity form the enclosed vacuum cavity.
11. heat abstractor manufacture method as claimed in claim 10, wherein, on the powder sintered plane between described groove and groove of described porousness.
12. heat abstractor manufacture method as claimed in claim 10, wherein, make mould by laser cutting mode or precision processing technology after, utilize the molded so that described multiple tracks groove of this mould to form on the described substrate.
13. heat abstractor manufacture method as claimed in claim 12, wherein, described multiple tracks groove is formed on the described substrate by little model type method, and this little model type method comprises:
The mould fabrication schedule, it comprises provides base material; On described base material, form pre-die layer, and by the microelectronics processing method described pre-die layer is processed and to be formed pre-die; The die material is formed on the described pre-die, and making described die forming materials is die; With described die making becoming mould; And
Molded program, it comprises and utilizes the molded described substrate of described mould, and described multiple tracks groove is formed on the described substrate.
14. heat abstractor manufacture method as claimed in claim 10, wherein, described substrate is to be made by the metal material with high heat-conduction coefficient, and it is formed a cavity by the warpage mode, earlier with after the described cavity one end sealing, the working fluid that reinjects, and this cavity vacuumized, at last again with its other end sealing.
15. heat abstractor manufacture method as claimed in claim 10 wherein, can prepare to form fluted substrate again, makes described two substrates be combined into a cavity by welding or other mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510054134 CN1832156A (en) | 2005-03-09 | 2005-03-09 | Structure of heat sink and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510054134 CN1832156A (en) | 2005-03-09 | 2005-03-09 | Structure of heat sink and manufacturing method |
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| CN1832156A true CN1832156A (en) | 2006-09-13 |
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| CN 200510054134 Pending CN1832156A (en) | 2005-03-09 | 2005-03-09 | Structure of heat sink and manufacturing method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101839660A (en) * | 2010-03-31 | 2010-09-22 | 华南理工大学 | Flat heat tube with hole-groove combined mandrel and manufacturing method thereof |
| CN101684988B (en) * | 2008-09-26 | 2011-04-20 | 和硕联合科技股份有限公司 | Temperature-uniforming plate with skiving fin structure and manufacture method thereof |
| CN102208375A (en) * | 2011-04-11 | 2011-10-05 | 锘威科技(深圳)有限公司 | Circulation radiator, and manufacturing method and components thereof |
| CN102318457A (en) * | 2011-07-26 | 2012-01-11 | 华为技术有限公司 | Radiating bin for communication device |
| WO2012152018A1 (en) * | 2011-07-01 | 2012-11-15 | 中兴通讯股份有限公司 | Planar heat-pipe heat exchanger |
| CN102902326A (en) * | 2011-07-26 | 2013-01-30 | 江苏宏力光电科技有限公司 | Radiating tube used for laptops |
| CN103217042A (en) * | 2012-01-19 | 2013-07-24 | 极致科技股份有限公司 | Method for manufacturing temperature equalizing device without liquid injection tube and temperature equalizing device manufactured by using method |
| WO2013107026A1 (en) * | 2012-01-19 | 2013-07-25 | 极致科技股份有限公司 | Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method |
| CN103712496A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin composite-type guide plate pipe |
| CN106767058A (en) * | 2016-11-25 | 2017-05-31 | 重庆大学 | Big plane small space free convection heat pipe |
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- 2005-03-09 CN CN 200510054134 patent/CN1832156A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101684988B (en) * | 2008-09-26 | 2011-04-20 | 和硕联合科技股份有限公司 | Temperature-uniforming plate with skiving fin structure and manufacture method thereof |
| CN101839660A (en) * | 2010-03-31 | 2010-09-22 | 华南理工大学 | Flat heat tube with hole-groove combined mandrel and manufacturing method thereof |
| CN101839660B (en) * | 2010-03-31 | 2012-10-31 | 华南理工大学 | Flat heat tube with hole-groove combined mandrel and manufacturing method thereof |
| CN102208375A (en) * | 2011-04-11 | 2011-10-05 | 锘威科技(深圳)有限公司 | Circulation radiator, and manufacturing method and components thereof |
| WO2012152018A1 (en) * | 2011-07-01 | 2012-11-15 | 中兴通讯股份有限公司 | Planar heat-pipe heat exchanger |
| CN102902326A (en) * | 2011-07-26 | 2013-01-30 | 江苏宏力光电科技有限公司 | Radiating tube used for laptops |
| CN102318457A (en) * | 2011-07-26 | 2012-01-11 | 华为技术有限公司 | Radiating bin for communication device |
| CN103217042A (en) * | 2012-01-19 | 2013-07-24 | 极致科技股份有限公司 | Method for manufacturing temperature equalizing device without liquid injection tube and temperature equalizing device manufactured by using method |
| WO2013107026A1 (en) * | 2012-01-19 | 2013-07-25 | 极致科技股份有限公司 | Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method |
| JP2015512020A (en) * | 2012-01-19 | 2015-04-23 | アクメクールズ テック． リミテッドＡｃｍｅｃｏｏｌｓ Ｔｅｃｈ． Ｌｔｄ． | Method for manufacturing a soaking device without an injection pipe and a soaking device manufactured by this manufacturing method |
| EP2806242A4 (en) * | 2012-01-19 | 2015-10-21 | Acmecools Tech Ltd | Manufacturing method of temperature equalization device without liquid injection tube and temperature equalization device manufactured by the method |
| CN103712496A (en) * | 2012-10-09 | 2014-04-09 | 元镫金属股份有限公司 | Thin composite-type guide plate pipe |
| CN106767058A (en) * | 2016-11-25 | 2017-05-31 | 重庆大学 | Big plane small space free convection heat pipe |
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