CN204420621U - LED light emission device - Google Patents
LED light emission device Download PDFInfo
- Publication number
- CN204420621U CN204420621U CN201420796576.9U CN201420796576U CN204420621U CN 204420621 U CN204420621 U CN 204420621U CN 201420796576 U CN201420796576 U CN 201420796576U CN 204420621 U CN204420621 U CN 204420621U
- Authority
- CN
- China
- Prior art keywords
- led lamp
- heat
- lamp panel
- pipe radiator
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007789 sealing Methods 0.000 claims abstract description 8
- 239000011324 bead Substances 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- -1 pottery Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of LED light emission device, comprises heat-pipe radiator and LED lamp panel, and the front of described LED lamp panel is provided with LED lamp bead, and described heat-pipe radiator is positioned at the back side of LED lamp panel, and is connected with LED lamp panel sealing backside.The utility model can save the thermal contact resistance between LED lamp panel and heat-pipe radiator, improves radiating efficiency and reduces manufacturing cost.
Description
Technical field
The utility model belongs to technical field of heat dissipation, particularly a kind of LED (Light Emitting Diode, light emitting diode) LED light emission device.
Background technology
In existing LED light emission device, the connection of LED lamp panel and radiator is screwed after adopting the bottom surface of heat-conducting glue and radiator bonding the LED lamp panel welding LED lamp bead again, and its typical structure as shown in Figure 1.Heat-conducting glue 3 is there is between LED lamp panel 1 and radiator 2.
Existing syndeton is all by generation thermal contact resistance.This thermal resistance size depends on the performance of heat-conducting glue and the thickness of adhesive linkage, and therefore this structure requires very high to the surface treatment of bonding plane and technique for sticking thus causes production cost to raise.Further, adopt which kind of heat-conducting glue all can there is certain aging phenomenon in existing syndeton, after aging, its heat conductivility will decline thus this thermal contact resistance is increased.
Utility model content
Main purpose of the present utility model is to provide a kind of LED light emission device, is intended to the technical problem that solution prior art needs technique for sticking to cause cost higher.
In order to realize utility model object, the utility model provides a kind of LED light emission device, comprises heat-pipe radiator and LED lamp panel, and the front of described LED lamp panel is provided with LED lamp bead, described heat-pipe radiator is positioned at the back side of LED lamp panel, and is connected with LED lamp panel sealing backside.
Preferably, described heat-pipe radiator comprises fin end and non-finned end, and described non-finned end is connected with LED lamp panel sealing backside.
Preferably, described fin end comprises some spaced hollow fins.
Preferably, the described LED lamp panel back side is that rib shape is arranged.
Preferably, be filled with heat eliminating medium between described heat-pipe radiator and LED lamp panel, this heat eliminating medium is liquid.
The utility model, by using the heat abstractor of heat-pipe radiator as LED, improves radiating efficiency; And, one end of heat-pipe radiator is directly connected with the sealing backside of LED lamp panel, surrounding formation one together can the cavity of accommodating heat eliminating medium, the back side of LED lamp panel can be used as the evaporating surface of heat-pipe radiator, thus the thermal contact resistance eliminated between LED lamp panel and heat-pipe radiator, improve radiating efficiency, save heat-conducting glue and simplify manufacture craft.
Accompanying drawing explanation
Fig. 1 is the structural representation of LED light emission device in prior art;
Fig. 2 is the structural representation of LED light emission device in the utility model one embodiment;
Fig. 3 is the structural representation of heat-pipe radiator in the utility model one embodiment;
Fig. 4 is the structural representation of heat-pipe radiator in another embodiment of the utility model.
The realization of the utility model object, functional characteristics and advantage will in conjunction with the embodiments, are described further with reference to accompanying drawing.
Detailed description of the invention
Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
With reference to Fig. 2, in the utility model embodiment, LED light emission device comprises heat-pipe radiator 10 and LED lamp panel 20, and is connected with the sealing backside of LED lamp panel 20, and the back side of LED lamp panel 20 and heat-pipe radiator 10 are encircled into one can the cavity of accommodating heat eliminating medium 30.
In the utility model embodiment, can the cavity of accommodating heat eliminating medium owing to the back side of LED lamp panel 20 to be encircled into together with one end of heat-pipe radiator 10 one, the back side of LED lamp panel 20 can be used as the evaporating surface of heat-pipe radiator, thus the thermal contact resistance eliminated between LED lamp panel 20 and heat-pipe radiator 10, improve radiating efficiency, save heat-conducting glue and simplify manufacture craft.
With reference to Fig. 3 and Fig. 4, in the utility model embodiment, heat-pipe radiator 10 comprises fin end 11 and non-finned end 12, and non-finned end 12 is connected with the sealing backside of LED lamp panel 20.Fin end 11 comprises multiple spaced hollow fin 111.Fin 111, as the condensation segment of heat eliminating medium, is equivalent to the condensation segment of existing heat-pipe radiator.In the utility model embodiment, heat-pipe radiator 10 is one-body molded by mould, its material has multiple choices, such as, can be plastics, rubber, pottery, metal, plastics and metallic composite, rubber and metallic composite or pottery and metallic composite etc., during for metal (such as aluminium or copper), by the technological forming such as die casting, extruding; During for plastic cement, by injection moulding or blow molding process shaping; During for pottery, shaping by pottery.Concrete, by mould, one part is set to hollow, this is the known general knowledge of those skilled in the art, does not just repeat at this.
In the utility model embodiment, the shape and size of fin end 11 also can need according to application scenario and technique and arrange flexibly, and such as, if in electronic equipment internal, fin end 11 may slightly thicker in hinge structure, other and indistinction.In fin end 11, fin 111 can linearly be spaced, and also can be fan-shaped or other shaped formation.
Further, heat-pipe radiator 10, also can the heat eliminating medium 30 of filling wherein for dispelling the heat before forming confined space with LED lamp panel 20.This heat eliminating medium 30 comprises liquid, also can comprise gas.This heat eliminating medium 30 can be selected according to the application scenario of heat-pipe radiator, and such as, it can be freon, water, alcohol, acetone, ammoniacal liquor or cold-producing medium etc.When vacuumizing, not forming perfect vacuum, only need make, in cavity, there is certain vacuum, should ensure after heat eliminating medium 30 is evaporated, backflow or siphon can be formed.Due to fin 111 inner hollow, each fin 111 is equivalent to a part for heat-pipe radiator condensation segment, and the gas formed after evaporative heat loss medium 30 is condensed into liquid and flows back to evaporator section by siphon or gravity in the cavity of multiple fin.This just makes, and no matter fin adopts which kind of physical dimension of which kind of material, the temperature of fin 111 any place is all close to identical, this heat conductivility being equivalent to fin 111 will exceed at least one magnitude than aluminium used in the prior art, copper, the radiating efficiency of fin 111 significantly improves, thus greatly improves the radiating effect of this heat-pipe radiator.Meanwhile, owing to adopting hollow design, the consumption of materials of heat-pipe radiator 20 greatly reduces, and alleviates the weight of heat-pipe radiator, reduces material cost.In addition, owing to not needing welding procedure that fin is welded to heat pipe, the utility model embodiment also reduces manufacture craft, reduces the cost of manufacture of heat-pipe radiator.
In the utility model embodiment, in order to better heat radiation, also the back side of LED lamp panel 20 can be set to wavy or for micro-groove structure.
These are only preferred embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (2)
1. a LED light emission device, it is characterized in that, comprise heat-pipe radiator and LED lamp panel, the front of described LED lamp panel is provided with LED lamp bead, described heat-pipe radiator is positioned at the back side of LED lamp panel, and be connected with LED lamp panel sealing backside, the back side of LED lamp panel is set to wavy or is micro-groove structure; Described heat-pipe radiator comprises fin end and non-finned end, and described non-finned end is connected with LED lamp panel sealing backside; Described fin end comprises some spaced hollow fins.
2. LED light emission device as claimed in claim 1, it is characterized in that, be filled with heat eliminating medium between described heat-pipe radiator and LED lamp panel, this heat eliminating medium is liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420796576.9U CN204420621U (en) | 2014-12-15 | 2014-12-15 | LED light emission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420796576.9U CN204420621U (en) | 2014-12-15 | 2014-12-15 | LED light emission device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204420621U true CN204420621U (en) | 2015-06-24 |
Family
ID=53470991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420796576.9U Expired - Fee Related CN204420621U (en) | 2014-12-15 | 2014-12-15 | LED light emission device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204420621U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784254A (en) * | 2017-01-20 | 2017-05-31 | 深圳市润芯科技有限公司 | LED wafer packaging frame, component, technique and LED light source |
| CN115524885A (en) * | 2022-08-24 | 2022-12-27 | 惠科股份有限公司 | Display device and backlight module thereof |
-
2014
- 2014-12-15 CN CN201420796576.9U patent/CN204420621U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784254A (en) * | 2017-01-20 | 2017-05-31 | 深圳市润芯科技有限公司 | LED wafer packaging frame, component, technique and LED light source |
| CN115524885A (en) * | 2022-08-24 | 2022-12-27 | 惠科股份有限公司 | Display device and backlight module thereof |
| CN115524885B (en) * | 2022-08-24 | 2024-04-12 | 惠科股份有限公司 | Display device and backlight module thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 |