CN202259430U - High-power LED (light-emitting diode) micro-circulation heat dissipation device - Google Patents

High-power LED (light-emitting diode) micro-circulation heat dissipation device Download PDF

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Publication number
CN202259430U
CN202259430U CN2011204157757U CN201120415775U CN202259430U CN 202259430 U CN202259430 U CN 202259430U CN 2011204157757 U CN2011204157757 U CN 2011204157757U CN 201120415775 U CN201120415775 U CN 201120415775U CN 202259430 U CN202259430 U CN 202259430U
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CN
China
Prior art keywords
heat
heat dissipation
radiator
led
power led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011204157757U
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Chinese (zh)
Inventor
蓝卫
杨浩亮
连新宇
丁永峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shijiazhuang Liming Electronic Technology Co., Ltd.
Original Assignee
SHIJIAZHUANG GAOXINQU LIMING ELECTRONIC SCIENTIFIC CORP Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHIJIAZHUANG GAOXINQU LIMING ELECTRONIC SCIENTIFIC CORP Ltd filed Critical SHIJIAZHUANG GAOXINQU LIMING ELECTRONIC SCIENTIFIC CORP Ltd
Priority to CN2011204157757U priority Critical patent/CN202259430U/en
Application granted granted Critical
Publication of CN202259430U publication Critical patent/CN202259430U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a high-power LED (light-emitting diode) micro-circulation heat dissipation device, belonging to the technical field of LED heat dissipation. The high-power LED micro-circulation heat dissipation device comprises a heat dissipater and a heat dissipation pipe, wherein the interior of the heat dissipation pipe is in the vacuum state and is filled with heat conduction medium. The high-power LED micro-circulation heat dissipation device is characterized in that the inner wall of the heat dissipation pipe is provided with a heat dissipation body. When an LED generates heat, the heat is transferred to the heat conduction medium through the copper heat dissipation pipe, the heat conduction medium is heated to become gas, and hereby the heat conduction medium moves to the tail end of the copper heat dissipation pipe along the copper heat dissipation pipe with the heat dissipation body. In the process, the heat conduction medium transfers the heat to a heat dissipation framework and the heat dissipater through the copper heat dissipation pipe, then the heat conduction medium is cooled to become liquid, and the liquid is returned to the front end of the copper heat dissipation pipe through a heat diversion trench. Due to the adoption of the heat dissipation body in the heat dissipation pipe, the heat dissipation area and the heat dissipation contact degree can be increased so that the heat can be conducted. Due to the adoption of the heat diversion trench, the return speed of the liquid obtained by cooling the heat conduction medium can be improved. Therefore, the heat dissipation speed and the heat dissipation capacity of the high-power LED micro-circulation heat dissipation device can be improved, and the service life of the LED can be prolonged.

Description

A kind of great power LED microcirculation heat abstractor
Technical field
The utility model belongs to LED heat dissipation technology field, relates in particular to a kind of high-power LED heat radiating device.
Background technology
Existing illuminating industry is increasing to be light source in application of LEDs; Single encapsulated LED application performance is good; But unit price is than higher; In order to improve the cost performance that LED uses, domestic encapsulation company is with many integrated being encapsulated on the substrate of great power LED, and this encapsulation can effectively reduce the manufacturing cost of LED.But; In actual application, because the LED high concentration, the heat of its generation is high concentration also; Adopt the direct connected mode heat radiation of existing LED substrate and radiator effectively the quick conduction of the heat of LED to be come out, will influence the useful life of LED like this.
The utility model content
Thereby providing a kind of good heat dissipation effect, the technical problem that the utility model will solve to prolong the LED heat abstractor in useful life.
For solving the problems of the technologies described above; The technical scheme that the utility model is taked is: a kind of great power LED microcirculation heat abstractor; Comprise radiator and radiating tube, the inside of said radiating tube is vacuum state and is filled with heat conductive medium, it is characterized in that the inwall of said radiating tube is provided with radiator.
Said radiator is thermal column, fin or radiator-grid.
The inwall below of said radiating tube is provided with guiding gutter.
The manufacturing materials of said radiating tube and said radiator is a copper.
Said heat abstractor also comprises the heat radiation skeleton; Said heat radiation skeleton is connected platform by LED binding platform, bracing frame and radiator and forms; Said LED binding platform is connected platform and is fixedly connected through support frame as described above with said radiator; Said radiator is connected platform and is fixedly connected with said radiator, said radiating tube is embedded in said LED binding platform and is connected in the platform with said radiator.
Said radiating tube is to be arranged side by side more than two.
The beneficial effect of the utility model is following: the heat radiation copper pipe is in manufacturing process; Different according to heat abstractor shape and service orientation are made said radiator at heat radiation copper pipe inwall, below the inwall of heat radiation copper pipe, make guiding gutter; And the copper pipe that will the dispel the heat state that is evacuated, insert heat conductive medium.When the LED adstante febre; Heat passes to heat conductive medium through the heat radiation copper pipe; Heat conductive medium is heated into gas, and then heat conductive medium moves to its end along the heat radiation copper pipe inwall with radiator, heat conductive medium passes to heat radiation skeleton and radiator through the heat radiation copper pipe with heat fast in this process; Heat conductive medium is cooled to liquid, and is back to the front end of heat radiation copper pipe through guiding gutter.Radiator design increase area of dissipation in the said heat-conducting copper pipe and heat radiation exposure level; Help the conduction of heat; The guiding gutter design can improve the cooled back-flow velocity of medium of dispelling the heat, and has increased the radiating rate and the ability of said heat abstractor, effectively reduces the heat radiation thermal resistance of LED; Can the temperature difference between LED substrate and the radiator be reduced in 4 ℃, thus the useful life of having improved LED.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is done further detailed explanation.
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the cross-sectional view of radiating tube in the utility model;
Wherein: 1, radiator 2, radiating tube 3, LED binding platform 4, bracing frame 5, radiator connect platform 6, radiator 7, guiding gutter 8, LED.
Embodiment
As depicted in figs. 1 and 2, a kind of great power LED microcirculation heat abstractor comprises radiator 1 and radiating tube 2, and the inside of said radiating tube 2 is vacuum state and is filled with heat conductive medium that the inwall of said radiating tube 2 is provided with radiator 6.Said radiator 6 can or be organized fin more or organizes radiator-grid more and form by many groups thermal column.The inwall below of said radiating tube 2 is provided with guiding gutter 7, because the radiating effect of copper and economic effect are better, so said radiating tube 2 uses copper to make with said radiator 6.
Said heat abstractor also comprises the heat radiation skeleton, and the material of use is more because the heat radiation skeleton is produced extensively, so use the better aluminum material of economic effect to be made, said heat radiation skeleton is connected platform 5 by LED binding platform 3, bracing frame 4 and forms with radiator.Said LED binding platform 3 is connected platform 5 and is fixedly connected through support frame as described above 4 with said radiator, said radiator 1 is connected platform 5 and is fixedly connected with said radiator, and said radiating tube 2 is embedded in said LED binding platform 3 and is connected in the platform 5 with said radiator.Said radiating tube 2 is to be arranged side by side more than two.
Through the substrate on the LED8 said LED8 is fixed on the said LED binding platform 3, the heat radiation copper pipe in manufacturing process, different according to heat abstractor shape and service orientation, the copper pipe inwall is made said radiator 6 dispelling the heat.When the LED8 adstante febre; Heat passes to heat conductive medium through the heat radiation copper pipe; Heat conductive medium is heated into gas, and then heat conductive medium moves to its end along the heat radiation copper pipe inwall with radiator 6, heat conductive medium passes to heat radiation skeleton and radiator 1 through the heat radiation copper pipe with heat fast in this process; Heat conductive medium is cooled to liquid, and is back to the front end of heat radiation copper pipe through guiding gutter 7.Radiator 6 designs increase area of dissipation and heat radiation exposure level in the said heat-conducting copper pipe; Help the conduction of heat; Guiding gutter 7 designs can improve the cooled back-flow velocity of medium of dispelling the heat, and have increased the radiating rate and the ability of said heat abstractor, effectively reduce the heat radiation thermal resistance of LED8; Can the temperature difference between LED substrate and the radiator 1 be reduced in 4 ℃, thus the useful life of having improved LED8.

Claims (6)

1. a great power LED microcirculation heat abstractor comprises radiator (1) and radiating tube (2), and the inside of said radiating tube (2) is vacuum state and is filled with heat conductive medium, it is characterized in that the inwall of said radiating tube (2) is provided with radiator (6).
2. a kind of great power LED microcirculation heat abstractor according to claim 1 is characterized in that said radiator (6) is thermal column, fin or radiator-grid.
3. a kind of great power LED microcirculation heat abstractor according to claim 1 is characterized in that the inwall below of said radiating tube (2) is provided with guiding gutter (7).
4. a kind of great power LED microcirculation heat abstractor according to claim 1 is characterized in that the manufacturing materials of said radiating tube (2) and said radiator (6) is a copper.
5. according to claim 1,2,3 or 4 described a kind of great power LED microcirculation heat abstractors; It is characterized in that said heat abstractor also comprises the heat radiation skeleton; Said heat radiation skeleton is connected platform (5) and is formed by LED binding platform (3), bracing frame (4) with radiator; Said LED binding platform (3) is connected platform (5) and is fixedly connected through support frame as described above (4) with said radiator; Said radiator (1) is connected platform (5) and is fixedly connected with said radiator, said radiating tube (2) is embedded in said LED binding platform (3) and is connected in the platform (5) with said radiator.
6. a kind of great power LED microcirculation heat abstractor according to claim 5 is characterized in that said radiating tube (2) is to be arranged side by side more than two.
CN2011204157757U 2011-10-27 2011-10-27 High-power LED (light-emitting diode) micro-circulation heat dissipation device Expired - Fee Related CN202259430U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204157757U CN202259430U (en) 2011-10-27 2011-10-27 High-power LED (light-emitting diode) micro-circulation heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204157757U CN202259430U (en) 2011-10-27 2011-10-27 High-power LED (light-emitting diode) micro-circulation heat dissipation device

Publications (1)

Publication Number Publication Date
CN202259430U true CN202259430U (en) 2012-05-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102354727A (en) * 2011-10-27 2012-02-15 石家庄高新区立明电子科技有限公司 High-power LED (light-emitting diode) microcirculation cooling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102354727A (en) * 2011-10-27 2012-02-15 石家庄高新区立明电子科技有限公司 High-power LED (light-emitting diode) microcirculation cooling device

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP03 Change of name, title or address

Address after: 050000 Hebei, Shijiazhuang, Luquan District No. 99 yuan Garden Road, Optics Valley Science Park, building A, No. 5

Patentee after: Shijiazhuang Liming Electronic Technology Co., Ltd.

Address before: 050000 Hebei province Shijiazhuang City Xinshi North Road, No. 368

Patentee before: Shijiazhuang Gaoxinqu Liming Electronic Scientific Corp., Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120530

Termination date: 20171027