CN203422006U - Aluminum groove soaking plate - Google Patents

Aluminum groove soaking plate Download PDF

Info

Publication number
CN203422006U
CN203422006U CN201320546989.7U CN201320546989U CN203422006U CN 203422006 U CN203422006 U CN 203422006U CN 201320546989 U CN201320546989 U CN 201320546989U CN 203422006 U CN203422006 U CN 203422006U
Authority
CN
China
Prior art keywords
soaking plate
switching path
capillary
hot switching
condensation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320546989.7U
Other languages
Chinese (zh)
Inventor
张化喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XUZHOU NUANGE ENERGY TECHNOLOGY Co Ltd
Original Assignee
XUZHOU NUANGE ENERGY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XUZHOU NUANGE ENERGY TECHNOLOGY Co Ltd filed Critical XUZHOU NUANGE ENERGY TECHNOLOGY Co Ltd
Priority to CN201320546989.7U priority Critical patent/CN203422006U/en
Application granted granted Critical
Publication of CN203422006U publication Critical patent/CN203422006U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Abstract

The utility model discloses an aluminum groove soaking plate which comprises a soaking plate body. The soaking plate body adopts an aluminum extrusion process to form a condensation radiating planar plate and an evaporation heat absorption planar plate through extrusion at one time, and a plurality of mutually independent heat exchange passages with a fracture surface of a rectangular or square structure are formed through extrusion and are arranged horizontally between the condensation radiating planar plate and the evaporation heat absorption planar plate in the soaking plate body at intervals. Tiny groove channels are uniformly distributed on an upper inner wall and a lower inner wall of the heat exchange passages, tiny raised bars are formed between two neighboring tiny groove channels, the tiny groove channels on the upper inner wall and the tiny raised bars and the tiny groove channels on the lower inner wall are arranged in a concave-convex complementary manner, two ends of each heat exchange passage are both sealed to constitute a vacuum negative pressure cavity, and moderate condensation working medium is stuffed in each heat exchange passage. the aluminum groove soaking plate is simple in structure, low in manufacturing difficulty, fine in heat conduction effect and easy to be combined with a conventional radiator, and a requirement of efficient radiation of cpu (central processing unit), gpu (graphic processing unit) and display cards can be met.

Description

A kind of aluminium matter groove soaking plate
Technical field
The utility model relates to board-like heat dissipation technology field, is particularly applied to a kind of plane soaking plate that the high-power cooling heat sources such as cpu, gpu, RAM strip heating radiator, led TV are used, specifically a kind of aluminium matter groove soaking plate.
Background technology
Along with improving constantly of computer fittings integrated level, the quickening of cpu chip processing speed, more and more higher frequency makes its caloric value all increasing, in deal with data, can produce a large amount of heat.In the extensive use of high-power LED, the large heat of small size easily forms junction temperature chip, thereby the quality of heat radiation will directly have influence on the service life of job stability and the product of device.Therefore heat radiation also just becomes subject matter.In prior art, the heat abstractor of electric elements has various structures, and wherein soaking plate is little with heat transfer resistance, and heat exchange contact area is large, and heat exchange efficiency is high to be widely used.Soaking plate is the vacuum cavity element that an inwall has micro-structural, and it is mainly to rely on inner Working fluid phase changing to reach the object of flash heat transfer heat radiation.But traditional soaking plate difficulty of processing is large, and product yield is low, and production cost is high, make difficulty, profile is irregular, thereby is not easy to promote and use.
Summary of the invention
Technical problem to be solved in the utility model is for above-mentioned prior art present situation, and provide manufacture difficulty little, heat conduction fruit is good, size flexible and it is compound to be easy to traditional heat-dissipating device, meets a kind of aluminium matter groove soaking plate of the high efficiency and heat radiation demand of cpu, gpu video card.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of aluminium matter groove soaking plate, comprise soaking plate body, soaking plate body adopts an extrusion modling of aluminium extrusion technique to have the condensation cooling fins panel of upper plate and the evaporation endothermic surface plate of lower plate, and in soaking plate body, be positioned at equidistant transversely arranged extrusion modling between condensation cooling fins panel and evaporation endothermic surface plate have multiple tracks separate and section is rectangle or the hot switching path of square structure, the upper inwall of hot switching path and lower inner wall even distribution are provided with the micro-ditch conduit of recessed capillary, between two adjacent micro-ditch conduits of capillary, be formed with capillary raised line, the micro-ditch conduit of capillary of above-mentioned upper inwall and the capillary raised line of capillary raised line and lower inwall and the micro-ditch conduit of capillary are concavo-convex complementary setting, the equal two ends of each hot switching path welded seal forms an airtight negative pressure of vacuum chamber, and in each hot switching path, be all filled with appropriate condensation working medium.
For optimizing technique scheme, the measure of taking also comprises:
The upper inwall of above-mentioned hot switching path and lower inwall consist of the inner plate surface of condensation cooling fins panel and the inner plate surface of evaporation endothermic surface plate respectively, and the two side of hot switching path is comprised of the reinforcement gripper shoe being molded between condensation cooling fins panel and evaporation endothermic surface plate.
The two side ends of above-mentioned soaking plate body forms dalta wing limit, forms the cavity of triangular structure in this dalta wing limit.
The rear and front end of above-mentioned soaking plate body has the gradual change of condensation cooling fins panel and the upper and lower pressing formation of evaporation endothermic surface plate and shrinks sealing limit, and hot switching path shrinks the sealing airtight negative pressure of vacuum chamber that contains condensation working medium that forms, limit by gradual change.
Above-mentioned gradual change contraction is sealed limit and is formed with gradual change inclined-plane, and the tail end on this gradual change inclined-plane has the arc tail end that adopts cold welding and pressure diffusion sealing mouth formation after Passivation Treatment and curing processing.
Above-mentioned condensation working medium is any one in degasification pure water, methyl alcohol, ethanol, acetone or r141b.
Negative pressure value in above-mentioned hot switching path is 10Kpa to 3Kpa.
Compared with prior art, soaking plate body of the present utility model adopts an extrusion modling of automobile aluminum advection pipe aluminium extrusion technology to have condensation cooling fins panel and evaporation endothermic surface plate, and in soaking plate body, be positioned at condensation cooling fins panel and evaporation endothermic surface plate forms multiple tracks hot switching path, the upper inwall of hot switching path and lower inwall are laid with the micro-ditch conduit of capillary, between two adjacent micro-ditch conduits of capillary, be formed with capillary raised line, and the micro-ditch conduit of the capillary of upper inwall and lower interior wall cloth and capillary raised line are complementary and arrange, the micro-ditch conduit of capillary and capillary raised line can not only improve the heat exchange efficiency of product, and when being complementarity and being arranged on the port sealing of hot switching path by the effect that mutually stinging and can reach enhanced leaktightness effect of the micro-ditch conduit of upper and lower capillary and capillary raised line, condensation working medium can realize the evaporative condenser circulation of long-time idle in the hot switching path under airtight negative pressure state, thereby make product start-up temperature low.The utlity model has heat absorption fast, area of dissipation is large, idle, and size is easy to the feature compound with traditional heat-dissipating device flexibly, and its delicate structure, dependable performance be easy to processing, is suitable for mass production and application.
Accompanying drawing explanation
Fig. 1 is the section sectional structure schematic diagram of the utility model embodiment;
Fig. 2 is perspective view of the present utility model;
Fig. 3 is the side-looking structural representation that in Fig. 2, sealing limit is shunk in gradual change;
Fig. 4 is planar structure schematic diagram of the present utility model;
Fig. 5 is operation principle schematic diagram of the present utility model;
Fig. 6 is the perspective view of the utility model soaking plate body.
The specific embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
Fig. 1 is to Figure 6 shows that structure of the present utility model and operation principle schematic diagram.
Reference numeral is wherein: sealing limit 15, gradual change inclined-plane 15a, arc tail end 15b, condensation working medium 2 are shunk in the micro-ditch conduit of capillary K1, capillary raised line K2, soaking plate body 1, hot switching path 1a, cavity 1b, condensation cooling fins panel 11, evaporation endothermic surface plate 12, reinforcement gripper shoe 13, dalta wing limit 14, gradual change.
As shown in Figures 1 to 6, a kind of aluminium matter groove soaking plate of the present utility model, comprise soaking plate body 1, soaking plate body 1 adopts an extrusion modling of aluminium extrusion technique to have the condensation cooling fins panel 11 of upper plate and the evaporation endothermic surface plate 12 of lower plate, and 12 of condensation cooling fins panel 11 and evaporation endothermic surface plates equidistant transversely arranged form multiple tracks separate and section is rectangle or the hot switching path 1a of square structure, the upper inwall of hot switching path 1a and lower inner wall even distribution are provided with the micro-ditch conduit of recessed capillary K1, between the two adjacent micro-ditch conduit of capillary K1, be formed with capillary raised line K2, capillary micro-ditch conduit K1 of upper inwall and the capillary raised line K2 of capillary raised line K2 and lower inwall and the micro-ditch conduit of capillary K1 are concavo-convex complementary setting, each the equal two ends of hot switching path 1a welded seal forms an airtight negative pressure of vacuum chamber, and in each hot switching path 1a, be all filled with appropriate condensation working medium 2.The heat dissipation problem of the pyrotoxins such as prior art Computer video card, cpu, gpu is one of key factor affecting complete machine job stability and product service life always.Traditional soaking plate or heat-transfer pipe complex manufacturing technology, and after cold extrusion, the working medium of heat-exchange tube inside is easily leaked, and periphery profile is also regular not, so be difficult to traditional heat-dissipating device compoundly, cause and install and use difficulty, the problem such as accommodation is little, and cost of manufacture is high, be difficult for promoting.Soaking plate body 1 of the present utility model adopts an extrusion modling of automobile aluminum advection pipe aluminium extrusion technology, the hot switching path 1a that soaking plate body 1 after moulding has the condensation cooling fins panel 11 of upper plate and the evaporation endothermic surface plate 12 of lower plate and is positioned at 12 of the evaporation endothermic surface plates of condensation cooling fins panel 11 and lower plate, the upper inwall of hot switching path 1a and the extruding of lower inwall are formed with the micro-ditch conduit of capillary K1, the micro-ditch conduit of capillary K1 makes condensation working medium 2 flow resistance little, therefore can increase the Axial Thermal conducting power of hot switching path 1a, and radially thermal resistance is less.Between the two adjacent micro-ditch conduit of capillary K1, be formed with capillary raised line K2, capillary micro-ditch conduit K1 of upper inwall and lower interior wall cloth and capillary raised line K2 are concavo-convex complementary setting, interlock mutually when the upper and lower pressing of two-port that concavo-convex complementary setting makes hot switching path 1a seals, thereby improved the sealing fastness of port, the vacuum in assurance hot switching path 1a and inner condensation working medium 2 can not leak.The utility model heat absorption is fast, and area of dissipation is large, and condensation working medium 2 is lossless in hot switching path 1a, have product structure simple, manufacture difficulty is little, and heat conduction fruit is good, and be easy to the feature with the combination of traditional heat-dissipating device, can meet the high efficiency and heat radiation demand of cpu, gpu, video card.
In embodiment as shown in Figure 1, the upper inwall of hot switching path 1a and lower inwall consist of the inner plate surface of condensation cooling fins panel 11 and the inner plate surface of evaporation endothermic surface plate 12 respectively, and the two side of hot switching path 1a is comprised of the reinforcement gripper shoe 13 that is molded over 12 of condensation cooling fins panel 11 and evaporation endothermic surface plates.
In embodiment, the two side ends of soaking plate body 1 forms dalta wing limit 14, forms the cavity 1b of triangular structure in this dalta wing limit 14.
In embodiment, the rear and front end of soaking plate body 1 has condensation cooling fins panel 11 and sealing limit 15 is shunk in the gradual change that Shang Xia 12, pressing forms of evaporation endothermic surface plate, and hot switching path 1a shrinks the sealing airtight negative pressure of vacuum chamber that contains condensation working medium 2 that forms, limit 15 by gradual change.
In embodiment, as shown in Figure 3, gradual change contraction is sealed limit 15 and is formed with gradual change inclined-plane 15a, and the tail end of this gradual change inclined-plane 15a has the arc tail end 15b that adopts cold welding and pressure diffusion sealing mouth formation after Passivation Treatment and curing processing.
In embodiment, condensation working medium 2 is any one in degasification pure water, methyl alcohol, ethanol, acetone or r141b.
In embodiment, the negative pressure value in hot switching path 1a is 10Kpa to 3Kpa.
Soaking plate body 1 of the present utility model adopts cold welding and the processing of pressure diffusion sealing mouth first to make condensation cooling fins panel 11 and the pressing sealing Shang Xia 12 of evaporation endothermic surface plate of hot switching path 1a mono-port after adopting an extrusion modling of aluminium extrusion, in hot switching path 1a after the sealing of one end, through processing, add appropriate condensation working medium 2 to use boiling method deaeration, and then the other end of hot switching path 1a is carried out to pressing welding.And then the method for carrying out secondary air-discharging obtains the negative pressure state of inner 10Kpa to 3Kpa, obtain thus this product of efficient heat transfer.The two ends of hot switching path 1a adopt cold welding and pressure diffusion sealing mouth and Passivation Treatment can guarantee that good sealing effectiveness avoids traditional cold to push the leakage that causes working medium.
Fig. 5 is operation principle schematic diagram of the present utility model, in figure, show, after evaporation endothermic surface plate 12 heat absorption, make the vaporization natural evaporation of being heated of the condensation working medium 2 of vacuum filling in hot switching path 1a, condensation working medium 2 after vaporization liquefies and falls after rise to bottom after 11 heat exchanges of condensation cooling fins panel, condensation working medium 2 repeatedly vaporize liquefaction lossless work, condensation working medium 2 efficient circulation is carried out the heat-sinking capability that heat conduction has improved this product greatly, therefore this product can meet cpu, gpu, the high efficiency and heat radiation demand of video card, and have simple in structure, handling ease, the feature of low cost of manufacture.

Claims (7)

1. an aluminium matter groove soaking plate, comprise soaking plate body (1), it is characterized in that: described soaking plate body (1) adopts an extrusion modling of aluminium extrusion technique to have the condensation cooling fins panel (11) of upper plate and the evaporation endothermic surface plate (12) of lower plate, and in described soaking plate body (1), be positioned at equidistant transversely arranged extrusion modling between condensation cooling fins panel (11) and evaporation endothermic surface plate (12) have multiple tracks separate and section is rectangle or the hot switching path of square structure (1a), the upper inwall of described hot switching path (1a) and lower inner wall even distribution are provided with the micro-ditch conduit of recessed capillary (K1), between described two adjacent micro-ditch conduits of capillary (K1), be formed with capillary raised line (K2), the micro-ditch conduit of capillary (K1) of described upper inwall and capillary raised line (K2) are concavo-convex complementary setting with capillary raised line (K2) and the micro-ditch conduit of capillary (K1) of lower inwall, described each hot switching path (1a) all two ends welded seal forms an airtight negative pressure of vacuum chamber, and in described each hot switching path (1a), be all filled with appropriate condensation working medium (2).
2. a kind of aluminium matter groove soaking plate according to claim 1, it is characterized in that: the upper inwall of described hot switching path (1a) and lower inwall consist of the inner plate surface of condensation cooling fins panel (11) and the inner plate surface of evaporation endothermic surface plate (12) respectively, and the two side of described hot switching path (1a) is comprised of the reinforcement gripper shoe (13) being molded between condensation cooling fins panel (11) and evaporation endothermic surface plate (12).
3. a kind of aluminium matter groove soaking plate according to claim 2, it is characterized in that: the two side ends of described soaking plate body (1) forms dalta wing limit (14), in this dalta wing limit (14), form the cavity (1b) of triangular structure.
4. a kind of aluminium matter groove soaking plate according to claim 3, it is characterized in that: the rear and front end of described soaking plate body (1) has the gradual change of condensation cooling fins panel (11) and the upper and lower pressing formation of evaporation endothermic surface plate (12) and shrinks sealing limit (15), and described hot switching path (1a) shrinks the sealing airtight negative pressure of vacuum chamber that contains condensation working medium (2) that forms, limit (15) by gradual change.
5. a kind of aluminium matter groove soaking plate according to claim 4, it is characterized in that: described gradual change contraction is sealed limit (15) and is formed with gradual change inclined-plane (15a), the tail end on this gradual change inclined-plane (15a) has the arc tail end (15b) that adopts cold welding and pressure diffusion sealing mouth formation after Passivation Treatment and curing processing.
6. a kind of aluminium matter groove soaking plate according to claim 5, is characterized in that: described condensation working medium (2) is any one in degasification pure water, methyl alcohol, ethanol, acetone or r141b.
7. a kind of aluminium matter groove soaking plate according to claim 6, is characterized in that: the negative pressure value in described hot switching path (1a) is 10Kpa to 3Kpa.
CN201320546989.7U 2013-09-04 2013-09-04 Aluminum groove soaking plate Expired - Fee Related CN203422006U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320546989.7U CN203422006U (en) 2013-09-04 2013-09-04 Aluminum groove soaking plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320546989.7U CN203422006U (en) 2013-09-04 2013-09-04 Aluminum groove soaking plate

Publications (1)

Publication Number Publication Date
CN203422006U true CN203422006U (en) 2014-02-05

Family

ID=50021101

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320546989.7U Expired - Fee Related CN203422006U (en) 2013-09-04 2013-09-04 Aluminum groove soaking plate

Country Status (1)

Country Link
CN (1) CN203422006U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103824928A (en) * 2014-03-18 2014-05-28 熊文勇 LED (Light Emitting Diode) horizontal fluid dissipating COB (Chip-On-Board) light source and packaging process thereof
CN104482788A (en) * 2014-10-29 2015-04-01 北京德能恒信科技有限公司 Micro heat pipe
CN105865242A (en) * 2016-04-14 2016-08-17 青岛海尔特种电冰箱有限公司 Heat conducting plate and production method for plate body of heat conducting plate
CN105910478A (en) * 2016-04-14 2016-08-31 青岛海尔特种电冰箱有限公司 Temperature balancing container and refrigerator provided with same
CN106767069A (en) * 2016-12-06 2017-05-31 中山市华控光电热能科技有限公司 A kind of double the dimension flat heat pipe of array trench aluminium and its manufacture methods
CN107517575A (en) * 2017-09-28 2017-12-26 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment
CN108206168A (en) * 2018-02-08 2018-06-26 华南理工大学 A kind of phase transformation substrate for promoting heat directional transmissions and preparation method thereof
CN112566466A (en) * 2020-12-11 2021-03-26 佛山市飞成金属制品有限公司 Machining method of heat dissipation structure

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103824928B (en) * 2014-03-18 2017-06-20 熊文勇 LED lateral fluids radiating COB light source and its packaging technology
CN103824928A (en) * 2014-03-18 2014-05-28 熊文勇 LED (Light Emitting Diode) horizontal fluid dissipating COB (Chip-On-Board) light source and packaging process thereof
CN104482788A (en) * 2014-10-29 2015-04-01 北京德能恒信科技有限公司 Micro heat pipe
EP3444552A4 (en) * 2016-04-14 2019-11-20 Qingdao Haier Special Refrigerator Co., Ltd Temperature homogenizing container and refrigerator having same
CN105865242A (en) * 2016-04-14 2016-08-17 青岛海尔特种电冰箱有限公司 Heat conducting plate and production method for plate body of heat conducting plate
CN105910478A (en) * 2016-04-14 2016-08-31 青岛海尔特种电冰箱有限公司 Temperature balancing container and refrigerator provided with same
CN105910478B (en) * 2016-04-14 2018-05-29 青岛海尔特种电冰箱有限公司 Samming container and the refrigerator with the samming container
CN106767069A (en) * 2016-12-06 2017-05-31 中山市华控光电热能科技有限公司 A kind of double the dimension flat heat pipe of array trench aluminium and its manufacture methods
CN107517575A (en) * 2017-09-28 2017-12-26 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment
CN107517575B (en) * 2017-09-28 2019-10-29 北京无线电测量研究所 A kind of lightweight samming efficient radiating apparatus and electronic equipment
CN108206168A (en) * 2018-02-08 2018-06-26 华南理工大学 A kind of phase transformation substrate for promoting heat directional transmissions and preparation method thereof
CN112566466A (en) * 2020-12-11 2021-03-26 佛山市飞成金属制品有限公司 Machining method of heat dissipation structure
CN112566466B (en) * 2020-12-11 2021-07-09 佛山市飞成金属制品有限公司 Heat dissipation structure and processing method thereof

Similar Documents

Publication Publication Date Title
CN203422006U (en) Aluminum groove soaking plate
CN103528035B (en) Great power LED integrated thermal heat dissipating method and device
CN103307579B (en) Improve method and the integral heat radiator of LED illumination light source radiating efficiency
CN203964739U (en) Thermal siphon loop heat abstractor
CN104154787A (en) Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device
CN103307917A (en) Micro-channel radiator
CN103822516A (en) Stick tube type fluid heat exchanger and manufacturing method thereof
CN203479113U (en) Vacuum heat conduction and heat dissipation device
CN201156860Y (en) Water cooling head construction for heat radiating
CN204513305U (en) Heat sink, heat abstractor and LED bay light cooling system
CN102208375B (en) Circulation radiator, and manufacturing method and components thereof
CN203501872U (en) Microgroove group phase change heat transfer aluminum temperature uniforming plate
CN202749364U (en) Annular heat pipe section material superconducting radiator
CN209489061U (en) A kind of radiator of wind-power electricity generation frequency conversion device power module
CN201238048Y (en) CPU radiator
CN203964737U (en) Hollow heat-pipe radiator
CN103615921A (en) Novel radiator
TWM628154U (en) Air-liquid dual cooling radiator for memory modules
CN204420621U (en) LED light emission device
CN203131969U (en) Heat sink with built-in heat pipes
CN203687710U (en) Novel heat radiator
CN204301466U (en) The radiator of grain drying tower
CN201206955Y (en) Heat pipe
CN201681825U (en) Heat pipe principle profile-type superconducting radiator
CN202103040U (en) Circulation heat radiation device and assembly thereof

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140205

Termination date: 20140904

EXPY Termination of patent right or utility model