I326720 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種氣密性腔體成型方法，特別係關於_ 種利用相變化原理進行散熱之氣密性腔體成型方法。 【先技術】 隨著電腦産業之飛速發展，筆記型電腦中之發熱電子 元件如CPU、VGA等産生之熱量越來越多，然而，筆記型 電腦之外形設計向著輕、薄、短、小之方向發展，其内部 空間不斷减少，這就對筆記型電腦中散熱模組之設計提出 了更ifj之要求。爲了提南該散熱模組之換熱效率，習知之 方法係在散熱模組中使用氣密性腔體(Vap0r Chambel:)。 氣密性腔體最主要之優點不僅在於其換熱表面遠大於 普通熱管(Heatpipe)’且由於氣密性腔體相對熱管有很大的 蒸發汽體流動面積，在回流毛細力能够滿足冷凝液回流要 求之前提下，可以有效提高氣密性腔體之最大輸熱量。另 外，氣密性腔體還可以解决多個熱源同時散熱的問題，尤 其在筆記型電腦中，當發熱電子元件如CPU、VGA同時需 要散熱時，利用氣密性腔體可以根據需要設計出多個熱交 換區，位置可以靈活掌控，以滿足多個發熱電子元件之散 熱要求。 習知之氣密性腔體多釆用溝槽(Groove)或燒結金屬顆 粒做爲其毛細結構。溝槽式毛細結構受限於制做工藝，無 法在外形結構複雜之氣密性腔體内形成足够小之毛細尺 6 寸，難 冰‘植n人心之毛細效果。而采賴械加工殼體 :證 雜金屬顆粒毛細結構之卫藝方法，使製作過程較繁 雜且使氣密性腔體之外形結構難以保 【發明内容】 有馨·於此， 性腔體成型方法 有必要提供一種製作 過程簡單可行之氣密 —種氣密性腔體成型方法，包括如下步驟：⑴芯模製 —步驟’即製作表面覆有至少—層編_而内部填充有芯 換材料之—芯模；（2)金屬沈積步驟，即在該芯模之表面進 =金屬搞直至形成—層金屬層，而得到金屬層與芯模之 複。結構，⑶雌步驟，即賴秘㈣從該金屬層分離 出去而得到由該金屬層及編織網構成之巾空腔體；以及(4) 後續處理步驟，即在該中空腔體内注人量之工作液體 並進行密閉以得到氣密性腔體結構。 _ 與習知技術相比，藉由該金屬沈積步驟，將該編織網 毛細結構緊貼於該氣密性腔體内壁，使得該氣密性腔體成 型方法具有製作過程簡單可行之優點。 【實施方式】 圖1爲本發明氣密性腔體成型方法之流程示意圖，其 包括如下四個主要步驟：芯模製作—金屬沈積〜脫模〜^ 續處理得到成品。 、 、力 爲簡潔及叙述方便，以下介紹中以圖6所示之氣汽座 腔體100爲代表進行成型方法介紹。在芯模製作步锦中 需要成型得到如圖3所示之芯模1〇，該芯模1〇 <兩侧分 別向外延伸設有兩侧柱狀之凸出部16,該芯模1〇於大 致中^位置形成—穿孔U。請參照圖2,爲製作該芯模1〇 ’ =先提供—芯模賴，該紐賴2〇包括-上模22及 模24該上模22與下模24相配合形成一腔體％，同 ^形成供成型凸出部16之模穴⑽未示)。該腔體％與該 =。1〇之外形結構相一致’該上模22上設有複數注料口 。將多層編織網12層叠貼設於芯模母模20之腔體26 該等編織網12可由易於彎折之金屬銅絲、不錄 相配織形成’以便預先彎折成與該腔體26之内壁 之後’沿該等注料口 222注入溶融或液態 編織辆W 14 ’直至該芯模材料14充滿該腔體26以及該 ^織，，周12内之孔隙。該芯模 合物辇鉍扭β 、石貧或聚 物專材科。待該芯、模材料14凝固後， 下模24，蔣兮wβ 1Λ ] μ上板22及 、。心板10從該芯模母模2〇中 :::r網12而内部填充該芯模材二= 之兩側同時形成兩個凸出部16。 月〜、圖3至圖5，在金屬沈積過輕中 10進行導電化處理， 士該心杈 tH-U 1« ^ P在該心杈⑽之外表面噴塗一戶導 寬材科1S作爲電鑄起始層 層導 端面⑽未噴㈣二：仁該‘10之凸出部16之末 一電禱槽5〇中，該 考將該心杈10置於 陰極52連接，^料18與電鑄槽50之 史丧對該芯模1〇進行雷鏟， 電鑄在該芯模1〇之外# 如圖4所示。藉由 如圖5所示。沈積—定厚度之金屬層60， 由於㈣部16之末麵_树塗導電材 七8 ’從純該金顧6G幼卿賴數排污口 62。 屬^參照圖5至圖δ，在脫模過程中，將該芯模10與金 ^ 合結構從電禱槽50中取出，並放入烘箱（圖未 進姨烤’使得該频1G模㈣㈣化並從 =屬層60之排污口62流出（如圖6所示），從而得到由 *屬層60及編織網12構成之中空鑄件，如圖7及圖8所 可以理解地，如果採用之芯模材料M爲石膏等易粉碎 之材料’該脫模過程也可以藉由粉碎與振動之方式將該— f材料14從該金屬層6〇内脫出。爲保持該中空鑄件: 潔，還可對該中空鑄件之空腔進行適當清洗。 月 、在後續處理過程中，_該等排污σ 62雜金屬層 6〇進行抽真空之後充人適量之工作液體，接著封閉該等排 巧口 62。從而最終得到本發明之氣密性腔體結構_。由 於該等排污口 62形成在魏密性腔體結構⑽之兩側，從 而有效地確保該氣密性腔體結構1〇〇上下表面之平整。 在使用時，該氣密性腔體100之上、下表面可與多個 熱源接觸，該氣密性腔體100上形成之穿孔u可容納—離 心風扇（圖未示）’利用該離心風扇對該氣密性腔體100進行 强制散熱。 丁 綜上所述，該氣密性腔體100在製作過程中，藉由對 由編織網12包覆之芯模10進行金屬沈積之方式將多層編 織網12與電鑄金屬層60 一體成型’使得該等編織網12與 氣密性腔體100之内壁緊密結合，具有換熱效率較高之優 點。另外，該金屬沈積步驟使得該氣密性腔體成型方法在 操作上簡單可行，錢最終制之腔體具❹層編織網12 組成之毛細結構，該毛細結構之孔隙較小，有效地提高了 該氣密性腔體100之回流毛細力，從而有效提高該氣密性 腔體100之最大輸熱量。同時，該成型方法還可用於成型 具有複雜結構之氣密性腔體。 綜上所述’本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 热悉本案技藝之人士 ’錢依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1爲本發明氣密性腔體成型方法之流程示意圖。 圖2爲本發明其巾—實施例之芯模製作示意圖。 圖3爲由圖2所制得之芯模立體圖。 圖4爲圖3所示芯模之金屬沈積示意圖。 圖5爲圖3所示芯模金屬沈積後之剖視圖。 圖6爲圖3所不芯模金屬沈積後之脫模示意圖。 圖7爲圖6所不脫模後得到之産品之立體示意圖。 圖8爲圖7所示産品沿Α·Α線之剖視圖。 【主要元件符號說明】 10 穿孔 11 12 芯模材料 14 16 末端面 160 18 芯模母模 20 22 注料口 222 24 腔體 26 怒模 編織網 凸出部 導電材料 上模 下模 1326720 電鑄槽 50 陰極 金屬層 60 排污口 氣密性腔體 100 52 62I326720 IX. Description of the Invention: [Technical Field] The present invention relates to a gas-tight cavity forming method, and more particularly to a gas-tight cavity forming method for heat dissipation using a phase change principle. [First Technology] With the rapid development of the computer industry, the heat generated by the electronic components such as CPU and VGA in the notebook computer is increasing. However, the shape of the notebook computer is light, thin, short and small. In the direction of development, the internal space is continuously reduced, which puts more requirements on the design of the heat dissipation module in the notebook computer. In order to improve the heat transfer efficiency of the heat dissipation module, the conventional method uses a gas-tight cavity (Vap0r Chambel:) in the heat dissipation module. The main advantage of the airtight cavity is that the heat transfer surface is much larger than the ordinary heat pipe (Heatpipe) and because the airtight cavity has a large evaporation vapor flow area relative to the heat pipe, the return capillary force can satisfy the condensate It can effectively increase the maximum heat transfer capacity of the airtight cavity before the reflow requirement. In addition, the airtight cavity can solve the problem of simultaneous heat dissipation of multiple heat sources. Especially in notebook computers, when heat-generating electronic components such as CPU and VGA need to dissipate heat at the same time, the airtight cavity can be designed as needed. The heat exchange area can be flexibly controlled to meet the heat dissipation requirements of multiple heat-generating electronic components. Conventional airtight cavities use Groove or sintered metal particles as their capillary structure. The grooved capillary structure is limited by the manufacturing process, and it is impossible to form a small enough capillary size 6 inches in a gas-tight cavity having a complicated outer shape structure, and it is difficult to freeze the capillary effect of the human heart. The processing method of the shell: the decorative method of the capillary structure of the metal particles makes the manufacturing process more complicated and makes the shape of the airtight cavity difficult to protect. [Inventive content] Xin Xin, here, cavity molding The method necessitates providing a gas-tight and airtight cavity forming method which is simple and feasible in the manufacturing process, and includes the following steps: (1) core molding - the step of preparing the surface is covered with at least - layering _ while the inner filling is filled with the core material The core mold; (2) the metal deposition step, that is, the metal layer is formed on the surface of the core mold until the metal layer is formed, and the metal layer and the core mold are obtained. Structure, (3) the female step, that is, the reliance (4) is separated from the metal layer to obtain a towel cavity composed of the metal layer and the woven mesh; and (4) a subsequent processing step of injecting a dose into the hollow cavity The working fluid is sealed and sealed to obtain a hermetic cavity structure. _ Compared with the prior art, the woven mesh capillary structure is closely attached to the inner wall of the airtight cavity by the metal deposition step, so that the airtight cavity forming method has the advantages that the manufacturing process is simple and feasible. [Embodiment] Fig. 1 is a schematic flow chart of a method for molding a hermetic cavity according to the present invention, which comprises the following four main steps: mandrel production - metal deposition - demoulding ~ ^ continuous processing to obtain a finished product. For the sake of brevity and convenience of description, in the following description, the gas-filling cavity 100 shown in Fig. 6 is used as a representative for the molding method. In the core mold making step, it is necessary to form a core mold 1〇 as shown in FIG. 3, and the core mold 1〇<the two sides respectively extend outwardly to have two columnar protrusions 16 on both sides, the core mold 1 The 形成 is formed at a substantially middle position—the perforation U. Referring to FIG. 2, in order to fabricate the core mold, the core mold is provided first, and the upper mold 22 includes an upper mold 22 and a mold 24. The upper mold 22 cooperates with the lower mold 24 to form a cavity %. The cavity (10) for forming the projection 16 is formed as the same. % of the cavity with the =. The outer shape of the outer shape is uniform. The upper mold 22 is provided with a plurality of injection ports. The multi-layer woven mesh 12 is laminated on the cavity 26 of the core mold 20, and the woven mesh 12 can be formed by a metal copper wire which is easy to be bent, and is not woven to be 'pre-bent into the inner wall of the cavity 26. The molten or liquid braided vehicle W 14 ' is then injected along the injection ports 222 until the core mold material 14 fills the cavity 26 and the voids in the circumference 12 . The core compound is a torsionally β, stone poor or polymer specialty material. After the core and mold material 14 are solidified, the lower mold 24, Jiang Wei wβ 1Λ ] μ is applied to the upper plate 22 and . The core plate 10 is internally filled with the ::: r mesh 12 and internally filled with the two sides of the core molding material 2 while forming two projections 16. Month ~, Figure 3 to Figure 5, in the metal deposition of light and 10 in the conductive treatment, Shi heart 杈 tH-U 1 « ^ P on the surface of the heart 杈 (10) sprayed a family of conductive materials 1S as electricity The starting layer of the casting layer (10) is not sprayed (4) 2: the end of the '10' of the protruding portion 16 is in the middle of the electric prayer slot 5, the test is placed on the cathode 52, the material 18 and electricity The casting mold 50 is smashed and the shovel is applied to the core mold 1 , and electroforming is performed outside the core mold 1 as shown in FIG. 4 . As shown in Figure 5. Deposition - the thickness of the metal layer 60, due to the end of the (four) part 16 _ tree coated conductive material seven 8 ' from the pure Jin Gu 6G young Qing Lai number sewage outlet 62. Referring to Fig. 5 to Fig. δ, during the demolding process, the mandrel 10 and the gold structure are taken out from the electric prayer slot 50, and placed in an oven (the figure is not baked) so that the frequency 1G mode (4) (4) And flowing out from the sewage outlet 62 of the genus layer 60 (as shown in FIG. 6), thereby obtaining a hollow casting composed of the genus layer 60 and the woven mesh 12, as can be understood from FIGS. 7 and 8, if The core mold material M is a pulverizable material such as gypsum. The demolding process can also remove the material f from the metal layer 6 by pulverization and vibration. To maintain the hollow casting: clean, The hollow cavity of the hollow casting can be properly cleaned. During the subsequent processing, the sewage σ 62 impurity metal layer 6 〇 is evacuated and filled with a proper amount of working liquid, and then the sealing valve 62 is closed. Thus, the airtight cavity structure of the present invention is finally obtained. Since the sewage outlets 62 are formed on both sides of the Weiwei cavity structure (10), the upper and lower surfaces of the airtight cavity structure are effectively ensured. Leveling. The upper and lower surfaces of the airtight cavity 100 can be combined with multiple In the heat source contact, the perforation u formed on the airtight cavity 100 can accommodate a centrifugal fan (not shown) to forcibly dissipate the airtight cavity 100 by using the centrifugal fan. In the manufacturing process, the multilayer woven mesh 12 and the electroformed metal layer 60 are integrally formed by metal deposition of the core mold 10 covered by the woven mesh 12 to make the woven mesh 12 and the gas The inner wall of the dense cavity 100 is tightly combined, and has the advantages of high heat exchange efficiency. In addition, the metal deposition step makes the airtight cavity forming method simple and feasible in operation, and the cavity of the final cavity is woven by a layer of woven layer. The capillary structure composed of the net 12 has a small pore size, which effectively increases the reflow capillary force of the airtight cavity 100, thereby effectively increasing the maximum heat transfer capacity of the airtight cavity 100. At the same time, the molding The method can also be used for forming a gas-tight cavity having a complicated structure. In summary, the invention meets the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention. The equivalent modifications or variations made by the person skilled in the art of the present invention should be covered by the following patent application. [Simplified Schematic] FIG. 1 is a method for forming a hermetic cavity according to the present invention. Figure 2 is a schematic view of the core mold of the present invention, Fig. 3 is a perspective view of the core mold prepared by Fig. 2. Fig. 4 is a schematic view showing the metal deposition of the core mold shown in Fig. 3. Fig. 3 is a cross-sectional view showing the metal mold after deposition of the metal mold. Fig. 6 is a schematic view showing the mold release after the deposition of the metal mold of Fig. 3. Fig. 7 is a perspective view of the product obtained after the mold release of Fig. 6. Fig. 8 is a view Section 7 shows the cross-sectional view of the product along the Α·Α line. [Main component symbol description] 10 Perforated 11 12 core material 14 16 End surface 160 18 core mold 20 22 Injection port 222 24 cavity 26 woven woven mesh Outer conductive material upper mold lower die 1326720 electroforming groove 50 cathode metal layer 60 drain airtight cavity 100 52 62
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