CN1696595A - Heat pipe and manufacturing method - Google Patents
Heat pipe and manufacturing method Download PDFInfo
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- CN1696595A CN1696595A CN 200410043505 CN200410043505A CN1696595A CN 1696595 A CN1696595 A CN 1696595A CN 200410043505 CN200410043505 CN 200410043505 CN 200410043505 A CN200410043505 A CN 200410043505A CN 1696595 A CN1696595 A CN 1696595A
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- conduit
- heat pipe
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Abstract
The present invention relates to a heat-conducting pipe and its making method. Said method includes the following steps: providing a pipe, processing said pipe to make said pipe be formed, inserting plastic rod material into said pipe, forming capillary structure separating the plastic rod form said pipe and injecting working fluid and forming closed space. Said invention can raise capacity of heat transmission of said integral heat-conducting pipe.
Description
Technical field
The relevant a kind of heat pipe of the present invention and manufacture method, particularly the heat pipe manufacture method of the relevant high heat conduction efficiency of a kind of tool.
Background technology
Along with development of technology, the number of transistors on the electronic building brick unit are is more and more, the increase of caloric value when causing its work.On the other hand, the operating frequency of electronic building brick is also more and more higher, and the heat (switch loss) that the on/off conversion is caused during transistor work also is the reason that the electronic building brick caloric value increases.In recent years, because the fast development of semiconductor technology and IC structure packing technique, the computational speed of chip obtains significantly to promote, relative makes chip when running, hear rate rises along with the increase of clock pulse frequency, if fail these heats of suitable processing, will cause the reduction of chip arithmetic speed, severe patient even have influence on life-span of chip.
Therefore will how effectively to handle these heat dissipations, the existing fado of doing is to utilize to add fan and radiating fin and keep chip and be in effective operating temperature.In order to derive heat rapidly, the fan running quickening can make power consumption and noise increase, and increases the setting of radiating fin, though can promote heat conduction efficiency, makes the economy variation of space utilization.And because heat pipe (heat pipe) can be with a large amount of one section considerable distances of heat transmission under very little sectional area and temperature difference, and do not need the additional power source supply to operate, need not power provide with the considering of space utilization economy under, heat pipe is applied in the electronic product gradually widely.
Please refer to Fig. 1, it is the flow chart of existing heat pipe manufacture method.The preparation method of general traditional heat pipe comprises the steps.At first, in step 102, provide a hollow copper tubing as conduit, an end of this hollow copper tubing seals earlier.Then, in step 104, insert a bar in conduit.Because an end of hollow copper tubing seals earlier, generally speaking seals the taper into the center evagination, so the top that one of bar end can place outer convex cone shaped to seal, location by this.Thus, make and form a space with fixed interval (FI) between the tube wall of conduit and the bar.The rigidity bar that its used bar for example is a stainless steel bar, graphite rod or other material.
Then, in step 106, fill in the clearance space of copper powder between duct wall and bar, according to the needs of technology, the compression of can going again in addition makes copper powder tight.Then, in step 108, sintering makes the copper powder of being filled form a capillary structure on duct wall.Afterwards, in step 110, bar is extracted out in conduit.In step 112, inject working fluid.At this, according to the difference of formed capillary structure, can exchange inject working fluid and the execution sequence that vacuumizes after, seal again.At last, in step 114, do completed cylindric heat pipe crooked or flatten into flat, required with the shape of the radiating subassembly that meets the follow-up electronic building brick that is applied to generate heat.
Yet, because after the heat pipe manufacturing finished, required during for practical application, heat pipe reprocessing that must be originally round and straight make the heat pipe that becomes bending or flat.Thus, conduit is in the regional area that is bent, or flattened in the regional area of flat, the capillary structure of heat pipe inside wrecks, lose the function of its heat conduction, make the heat conduction of the heat pipe integral body decline of measuring one's own ability, the highest loss even can reach more than seventy percent, the influence that it caused can not be ignored.
Summary of the invention
Therefore, for addressing the above problem, the objective of the invention is to propose a kind of manufacture method of heat pipe, carry out the processing of heat pipe shape earlier, form the capillary structure of heat pipe inside again, the capillary structure of avoiding existing catheter interior is impaired during because of following process, can possess complete capillary structure, improves the heat conduction of heat pipe integral body and measures one's own ability.
A kind of heat pipe manufacture method according to an aspect of the present invention, heat pipe are to be applied in the electronic building brick radiating subassembly, and need mouldingly according to the shape of the radiating subassembly of electronic building brick, and this manufacture method may further comprise the steps: a conduit (a) is provided; (b) processing makes the conduit moulding; (c) insert a plastotype bar in conduit; (d) form a capillary structure; (e) separate plastotype bar and conduit; And (f) inject a working fluid and form a confined space.
A kind of heat pipe manufacture method according to a further aspect of the invention may further comprise the steps: a conduit (a) is provided; (b) processing makes the conduit moulding; (c) insert a plastotype bar in conduit; (d) separate plastotype bar and conduit; (e) form a capillary structure; And (f) inject a working fluid and form a confined space.
Making in the step of conduit moulding in processing, is that utilization bending or the mode of flattening conduit are with moulding.The surface of plastotype bar has a plurality of ridge portions, uses so that duct wall is consistent with the gap between the plastotype bar.The material of ridge portion can be identical with capillary structure, when forming capillary structure as one of raw material of capillary structure.Perhaps, before separating plastotype bar and conduit, ridge portion can be heated back direct boiling or liquefaction.The material of plastotype bar is the flexual material of a tool, can directly extract out in conduit.Moreover the plastotype bar is that a material with respect to the formation capillary structure is the material than low ignition point, vaporizes or liquefies in the heating back, makes with conduit and separates.Perhaps, the material of plastotype bar is a material that can be dissolved by an organic solvent, and as macromolecule organic, and the plastotype bar is with by the mode of organic solvent dissolution, makes with conduit and separates.Organic solvent for example is an acetone.
A kind of heat pipe according to a further aspect of the present invention comprises at least: a conduit forms a confined space and has an inwall; One capillary structure is formed on this inwall of this conduit; And a working fluid, be placed in this conduit; Wherein, this capillary structure is after conduit is processed plastotype, just is formed on this inwall of this conduit.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 is the flow chart of existing heat pipe manufacture method.
Fig. 2 is the flow chart according to the heat pipe manufacture method of first embodiment of the invention.
Fig. 3 is the flow chart according to the heat pipe manufacture method of second embodiment of the invention.
The specific embodiment
First embodiment
Please refer to Fig. 2, it is the flow chart according to the heat pipe manufacture method of first embodiment of the invention.The heat pipe preparation method of present embodiment comprises the steps.At first, in step 202, provide a conduit.The material of conduit for example is plastics, metal, alloy or nonmetallic materials.In the present embodiment, preferably adopting copper pipe is example.Then, in step 204, for the shape of the radiating subassembly of follow-up applied heating electronic building brick required, earlier with conduit with crooked, flatten or alternate manner, make conduit become bending, flat or other shape.
Then, in step 206, insert a plastotype bar in conduit, make to form a space with fixed interval (FI) between the tube wall of conduit and the plastotype bar.Because conduit has been processed to bending or flat, therefore, the material of the plastotype bar that is adopted must be the flexual material of a tool.And, for the tube wall of keeping conduit consistent with the clearance space between the plastotype bar, surface in the plastotype bar disposes a plurality of ridge portions in addition, consistency of thickness by ridge portion, just, use so that duct wall is consistent with the gap between the plastotype bar as the clearance space between duct wall and the plastotype bar.
Then, in step 208, fill the clearance space of copper powder between duct wall and plastotype bar.Then, in step 210, form a capillary structure.Capillary structure can be netted capillary structure (meshwick), fibrous capillary structure (fiber wick), sintering capillary structure (sinter wick), or ditch shape capillary structure (groove wick).And the method that forms capillary structure has many kinds, for example sintering, stick together, filling, deposition etc.Because present embodiment adopts copper pipe as conduit, so in this step, adopt copper powder or other metal alloy powders, be filled in the clearance space between duct wall and the plastotype bar after, heat-agglomerating again makes the copper powder of being filled form capillary structure on duct wall.In addition,, can before heat-agglomerating, compress copper powder separately according to the needs of different process, make copper powder closely after, heat-agglomerating again is to form the capillary structure of different aperture degree or different structure.At this, what need pay special attention to is, if adopt different materials as filler, then may add and use corresponding solvent or bond, to increase the effect that copper powder is closely filled, simultaneously, before heat-agglomerating, the step that can increase the step of a drying accordingly or remove bond is to remove solvent or bond.
Afterwards, in step 212, separate plastotype bar and conduit.At last, in step 214, inject working fluid, and vacuumize, after the other end of conduit is sealed, just finish the manufacturing process of heat pipe.Working fluid for example is inorganic compound, water, alcohols, the liquid metal such as mercury, ketone, such as refrigerant or other organic compound of HFC-134a etc.Generally speaking, more often make water as working fluid.At this, according to the difference of formed capillary structure, institute is corresponding to the surface tension difference between the working fluid, can change in good time exchange the execution sequence that injects working fluid and vacuumize after, seal again.Generally speaking,, then take to inject earlier the mode that working fluid vacuumizes again, can reach preferable effect if form the sintering capillary structure.And if the capillary structure that forms is netted capillary structure, or ditch shape capillary structure then takes to vacuumize earlier the mode of the working fluid that reinjects, and in the time of can avoiding vacuumizing earlier, working fluid is by the shortcoming of excessive extraction.
Second embodiment
Please refer to Fig. 3, it is the flow chart according to the heat pipe manufacture method of second embodiment of the invention.Present embodiment is similar to the manufacture method described in first embodiment, at first, in step 302, provides a conduit, is preferably a copper pipe.Then, in step 304, for the shape of the radiating subassembly of follow-up applied heating electronic building brick required, earlier with conduit with crooked, flatten or alternate manner, make conduit become bending, flat or other shape.
Then, in step 306, insert a plastotype bar in conduit, make to form a space with fixed interval (FI) between the tube wall of conduit and the plastotype bar.In step 308, fill the clearance space of copper powder between duct wall and plastotype bar.Because present embodiment adopts copper pipe as conduit,, be filled in the clearance space between duct wall and the plastotype bar so in this step, adopt copper powder or other metal alloy powders.In addition, the porosity size of the capillary structure that the employed copper powder particle size of foundation and institute's desire form, but the different processing step of otherwise designed.For example, can after filling copper powder, compress copper powder more separately, make copper powder become to combine closely.At this, what need pay special attention to is, if adopt different materials as filler, then may add and use corresponding solvent or bond, to increase the effect that copper powder is closely filled, simultaneously, before forming capillary structure, the step that can increase the step of a drying accordingly or remove bond is to remove solvent or bond.
Then, in step 310, separate plastotype bar and conduit.Afterwards, in step 312, form a capillary structure.The method that forms capillary structure has many kinds, for example sintering, stick together, filling, deposition etc.At last, in step 314, inject working fluid, and vacuumize, after the other end of conduit is sealed, just finish the manufacturing process of heat pipe.At this, according to the difference of formed capillary structure, institute is corresponding to the surface tension difference between the working fluid, can change in good time exchange the execution sequence that injects working fluid and vacuumize after, seal again.Generally speaking,, then take to inject earlier the mode that working fluid vacuumizes again, can reach preferable effect if form the sintering capillary structure.And if the capillary structure that forms is netted capillary structure, or ditch shape capillary structure then takes to vacuumize earlier the mode of the working fluid that reinjects, and in the time of can avoiding vacuumizing earlier, working fluid is by the shortcoming of excessive extraction.
Different is with first embodiment, present embodiment be earlier with the plastotype bar with after conduit separates, just heat-agglomerating is to form capillary structure.The enforcement order of this two step can adjust according to the needs of different processing procedures.Material as for the plastotype bar that is adopted, except being the flexual material of a tool, and preferably dispose outside a plurality of ridge portions in the surface of plastotype bar, the material of the plastotype bar that is adopted, can be one for the material that forms capillary structure, tool is than the material of low ignition point, or the material of the plastotype bar that is adopted is can be by the material that organic solvent dissolved.
When the material of plastotype bar was the flexual material of a tool, the plastotype bar can directly be extracted out in this conduit, made with this conduit and separated.Moreover, when the material of plastotype bar is the flexual material of a tool, and when the surface of plastotype bar preferably disposed a plurality of ridge portion, the material of ridge portion was identical with capillary structure, when sintering formed capillary structure, ridge portion can directly be sintered and as one of raw material of capillary structure.Or the material of ridge portion is that a material with respect to the formation capillary structure is the material than low ignition point, can be heated back vaporization or liquefaction when sintering.
When the plastotype bar, when be material than low ignition point with respect to the material that forms capillary structure, the plastotype bar can be heated direct boiling afterwards or liquefaction, makes with conduit and separates.Perhaps, the material of plastotype bar is a material that can be dissolved by an organic solvent, and therefore, the plastotype bar separates with this conduit after can being dissolved by organic solvent.For example, when the material of plastotype bar adopted a macromolecule organic, the organic solvent that is adopted was an acetone.
In sum, because disclosed heat pipe manufacture method is after carrying out the shape processing of heat pipe earlier, form the capillary structure of heat pipe inside again.This method avoids the capillary structure of existing catheter interior to wreck because of following process, can possess complete capillary structure, improves the heat conduction of heat pipe integral body and measures one's own ability.And utilizing the heat pipe of the method manufacturing, is to be applied in the radiating subassembly of electronic building brick, and can need according to the shape of the radiating subassembly of electronic building brick, carries out mouldingly in advance, makes heat pipe can fully contact the electronic building brick surface, promotes radiating effect.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation or the replacement of various equivalences, therefore, as long as in connotation scope of the present invention in the scope to the variation of the foregoing description, claims that modification all will drop on the application.
Claims (13)
1. heat pipe manufacture method comprises:
One conduit is provided;
Process this conduit and make this conduit moulding;
Insert a plastotype bar in this conduit;
Separate this plastotype bar and this conduit;
Form a capillary structure; And
Inject a working fluid and form a confined space.
2. heat pipe manufacture method as claimed in claim 1, it is characterized in that this heat pipe is to be applied in the radiating subassembly of an electronic building brick, and the shape according to the radiating subassembly of this electronic building brick needs moulding, wherein making the step of this conduit moulding in processing is to utilize mode crooked or that flatten, makes this conduit moulding.
3. heat pipe manufacture method as claimed in claim 1 is characterized in that the surface of this plastotype bar has a plurality of ridge portions, uses so that this duct wall is consistent with the gap between this plastotype bar.
4. heat pipe manufacture method as claimed in claim 3, the material that it is characterized in that this ridge portion are identical with this capillary structure, when forming this capillary structure as one of raw material of this capillary structure.
5. heat pipe manufacture method as claimed in claim 3 is characterized in that, before separating this plastotype bar and this conduit, this ridge portion is heated back vaporization or liquefaction.
6. heat pipe manufacture method as claimed in claim 1, the material that it is characterized in that this plastotype bar are the flexual materials of a tool, and this plastotype bar can directly extract out in this conduit, make with this conduit and separate.
7. heat pipe manufacture method as claimed in claim 1 it is characterized in that this plastotype bar is that a material with respect to this capillary structure of formation is the material than low ignition point, and this plastotype bar makes with this conduit and separates in heating the back vaporization or liquefying.
8. heat pipe manufacture method as claimed in claim 1, the material that it is characterized in that this plastotype bar are materials that can be dissolved by an organic solvent, and this plastotype bar is with by the mode of this organic solvent dissolution, makes with this conduit and separates.
9. heat pipe manufacture method as claimed in claim 8, the material that it is characterized in that this plastotype bar are macromolecule organics, and this organic solvent is an acetone.
10. heat pipe comprises at least:
One conduit forms a confined space and has an inwall;
One capillary structure is formed on this inwall of this conduit; And
One working fluid is placed in this conduit;
Wherein, this capillary structure is after conduit is processed plastotype, just is formed on this inwall of this conduit.
11. heat pipe as claimed in claim 10, it is characterized in that heat pipe is to be applied in the radiating subassembly of an electronic building brick, and the shape according to the radiating subassembly of this electronic building brick needs moulding, wherein making the step of this conduit moulding in processing is to utilize mode crooked or that flatten, makes this conduit moulding.
12. heat pipe as claimed in claim 10, it is characterized in that this capillary structure be selected from netted capillary structure, fibrous capillary structure, sintering capillary structure, ditch shape capillary structure one of them, and this capillary structure is the method for utilizing sintering, sticking together, fill, deposit one of them, is formed on this inwall of this conduit.
13. heat pipe as claimed in claim 10, it is characterized in that this working fluid be selected from inorganic compound, water, alcohols, liquid metal, ketone, refrigerant, organic compound one of them, and the material of this conduit be selected from plastics, metal, alloy, nonmetallic materials one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410043505 CN1696595A (en) | 2004-05-11 | 2004-05-11 | Heat pipe and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410043505 CN1696595A (en) | 2004-05-11 | 2004-05-11 | Heat pipe and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1696595A true CN1696595A (en) | 2005-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200410043505 Pending CN1696595A (en) | 2004-05-11 | 2004-05-11 | Heat pipe and manufacturing method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334250B (en) * | 2007-06-26 | 2010-06-16 | 张复佳 | Superconductor component and its implantation process |
| CN101839663A (en) * | 2010-05-12 | 2010-09-22 | 锘威科技(深圳)有限公司 | Sintered flat plate heat pipe and manufacturing method thereof |
| CN102252544A (en) * | 2011-06-10 | 2011-11-23 | 深圳市凯强热传科技有限公司 | Platelike heat pipe and manufacturing method thereof |
| CN102305564A (en) * | 2011-08-26 | 2012-01-04 | 华南理工大学 | Fiber sintering type micro heat pipe and manufacturing method thereof |
| CN102345994A (en) * | 2011-08-29 | 2012-02-08 | 华南理工大学 | Composite liquid absorption core of heat dissipation heat pipe and manufacture method thereof |
| CN102501039A (en) * | 2011-10-28 | 2012-06-20 | 昆山德泰新材料科技有限公司 | Manufacturing method of flat heat-conducting pipe |
| CN101749973B (en) * | 2008-11-28 | 2012-07-18 | 台达电子工业股份有限公司 | Thermal uniform-temperature cavity, capillary structure and manufacturing method thereof |
| CN103953798A (en) * | 2014-05-08 | 2014-07-30 | 昆山德泰新材料科技有限公司 | Flat type metal tube and manufacturing technique thereof |
| TWI823040B (en) * | 2020-12-15 | 2023-11-21 | 鴻準精密工業股份有限公司 | Method for processing heat pipe, heat pipe made, and mechanical device |
-
2004
- 2004-05-11 CN CN 200410043505 patent/CN1696595A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101334250B (en) * | 2007-06-26 | 2010-06-16 | 张复佳 | Superconductor component and its implantation process |
| CN101749973B (en) * | 2008-11-28 | 2012-07-18 | 台达电子工业股份有限公司 | Thermal uniform-temperature cavity, capillary structure and manufacturing method thereof |
| CN101839663A (en) * | 2010-05-12 | 2010-09-22 | 锘威科技(深圳)有限公司 | Sintered flat plate heat pipe and manufacturing method thereof |
| CN102252544A (en) * | 2011-06-10 | 2011-11-23 | 深圳市凯强热传科技有限公司 | Platelike heat pipe and manufacturing method thereof |
| CN102305564A (en) * | 2011-08-26 | 2012-01-04 | 华南理工大学 | Fiber sintering type micro heat pipe and manufacturing method thereof |
| CN102345994A (en) * | 2011-08-29 | 2012-02-08 | 华南理工大学 | Composite liquid absorption core of heat dissipation heat pipe and manufacture method thereof |
| CN102501039A (en) * | 2011-10-28 | 2012-06-20 | 昆山德泰新材料科技有限公司 | Manufacturing method of flat heat-conducting pipe |
| CN103953798A (en) * | 2014-05-08 | 2014-07-30 | 昆山德泰新材料科技有限公司 | Flat type metal tube and manufacturing technique thereof |
| TWI823040B (en) * | 2020-12-15 | 2023-11-21 | 鴻準精密工業股份有限公司 | Method for processing heat pipe, heat pipe made, and mechanical device |
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