TW200819002A - Method and apparatus for connecting printed wiring boards - Google Patents

Abstract

Provided is a method for connecting printed wiring boards at least one of which is a flexible printed wiring board. A connecting terminal (4) of one printed wiring board (3) is placed over a connecting terminal (2) of the other printed wiring board (1) at a plurality of areas separated in a longitudinal direction by having an adhesive resin (6) in between. Pressure is applied to the both printed wiring boards while applying ultrasonic oscillation in a status where the adhesive resin is unhardened, and connecting terminals are bonded by solid phase intermetallic bonding at a plurality of areas. Since a time required for the solid phase intermetallic bonding (room temperature bonding) is extremely short, pressurization can be stopped without waiting for the resin to harden. Operating rate of the connecting apparatus is improved, and thus productivity is improved.

Description

200819002, lin nin, invention description: [Technical Field of the Invention] A connection method for a printed wiring board in which at least one is a flexible printed wiring board, and a connection device directly used in the implementation of the method. [Prior Art] "The part where the machine is required to be used for the machine is made of a hard printed wiring board. The part where the flexibility is used is a replaceable printed wiring board. Of course, the "defective printed wiring board and the flexible printed wiring" The board needs to be connected, and a 'method of soldering the soldered material to the direct connection by means of a connector connection method or a resistance welding method. 'Tai'i The progress of the high-density and high-speed of the machine is not used. The connection method by the connector is not used. In the aspect of welding, the method of soldering: the method of increasing density is used, and the solder is exposed. Q: As the fine pitch progresses, short-circuit problems with adjacent terminals often occur. To solve this problem, micro-connections with a pitch of about 300 # m or less between terminals have been used until now. A method of uniformly dispersing conductive particles in a thermosetting resin film, and holding them between the connection terminals of the two printed wiring boards and applying thermocompression bonding A method in which electrical conduction is caused by solidification caused by elastic contact of conductive particles, and a thermosetting resin is hardened to maintain a semi-permanent connection. 5 200819002 :,,; and since this method uses a pellet shuttle 3 to 1 〇 # m The elastic contact between the left and right conductive particles (the mechanical contact between the compressive stress of the resin and the recovery force of the conductive particles) ensures conduction, and therefore has a problem that the conductive path is narrow, so that a large current cannot flow. Dispersion of particle uniformity: Resin film is expensive, and therefore has a problem that it is only applicable to a limited field of high added value such as a liquid crystal panel. On the other hand, it is also used to mount a semiconductor wafer on a printed wiring board in a reversed wafer manner. A method of ultrasonic bonding for picking up an anisotropic conductive film. The square & first forming a gold bump on one of the bonded connection terminals, the gold bump borrowing ultrasonic wave A method of joining metal joints between the connection terminals of the two printed wiring boards for bonding. However, since this ultrasonic bonding method is necessary The gold bumps thus have problems such as an increase in cost or a complicated process of the printed wiring board, etc. In order to solve the above problems, a plastic flow (Bingham flow) using a thermosetting resin has been proposed to make the conductors in the resin. In this method, the mold is brought into contact with the connection terminal of the flexible printed wiring board, and periodic irregularities are formed at the connection terminals, and the thermosetting resin which has been thermally cured is coated thereon. The processed flexible printed wiring board is aligned on the 帛2 printed wiring board, and the heat-side force is connected to each other (see Non-Patent Document 1). (Non-Patent Document 1) Kawakami Hiroshiro, "Using Non-Conductive Membrane Connection Technology", Proceedings of the 13th Microelectronics Symposium, 2〇〇3 years ι〇月, 332 pages ~ 335 pages. In this method, when the portions of the overlapping connection terminals are pressurized, and the stress exceeding the yield value is applied to the resin of the heat-hardened 6 200819002, the hardened resin is softened, and the flowability of Bingham plastic is obtained. The plastically fluidized resin 'is discharged to the concave portion of the surface of the connection terminal subjected to the concavo-convex processing, and the connection terminals are in contact with each other at the surface of the convex portion. Heating is carried out in this state to raise the junction terminal junction portion to a recrystallization temperature or a eutectic temperature for solid diffusion bonding ' while hardening the resin. [Summary of the Invention]

In the method of utilizing the plastic flow of the resin (Bingham flow), since the contact of the conductive particles in the anisotropic conductive film is ensured, a wider conductive path can be secured, and electrical performance can be improved. However, in this method, since it is necessary to form a processing cost of minute irregularities at the connection terminal portion of the printed wiring board, there is a problem that it is difficult to be widely applied to various fields. Further, in this method, since the terminal joint portion is heated to be subjected to diffusion bonding and the resin is cured while maintaining the connection terminals of the pressurization overlap, the joining time is prolonged, and the processing efficiency is unexpectedly lowered to lower the operation efficiency of the apparatus. Further, there is a problem that the resin to be used must have a proper relationship between the load and the viscosity of the Fortress, and it is necessary to use a temperature (10) which is much higher than the recrystallization temperature or the eutectic temperature of the terminal connection portion. Bu 235.特殊 Hardened special resin, the choice of resin has less freedom. The present invention is constituted by the above-mentioned problem, and its object is to provide a method for providing a drain current when the anisotropic conductive film is used, and it is not necessary to use: a two-valent film or The formation of gold bumps by the ultrasonic bonding method or the like can reduce the cost and increase the connection method of the printed wiring board in the field of use. The purpose of the present invention is to provide a method of connecting printed wiring boards which can increase the degree of freedom in selection of resins, shorten the bonding time, and improve the processing efficiency to improve the operation efficiency of the apparatus, as compared with the method of the above-mentioned Non-Patent Document No. 7 200819002. Further, it is an object of the present invention to provide a connecting device for a printed wiring board which can be directly used in the method. In the method of connecting the printed wiring board of the present invention, the connection terminals of the two printed wiring boards in which at least one wiring board is a flexible printed wiring board are overlapped and connected to each other in the longitudinal direction, and the following steps a) are provided. 〜e); a) preparing the first printed wiring board and the connection terminal formed as a second printed wiring board in which a plurality of portions separated from the connection terminal of the second printed wiring board are separated in the longitudinal direction; b) While holding the resin between the sub-substrate and overlapping at a plurality of portions; and c) pressing the two printed wiring boards while applying ultrasonic vibration in a state in which the resin is not hardened, so that the connection terminal is in plural The solid metal joints are joined together. In the connection device of the printed wiring board of the present invention, the connection terminals of the two printed wiring boards in which at least one wiring board is a flexible printed wiring board are overlapped and connected to each other in the longitudinal direction, and are characterized in that: a pressing mechanism for holding the joint portion of the two connection terminals that are then overlapped by the resin between the second connection terminals of the second connection wiring board of the first connection terminal block of the first printed wiring board The second connection terminal is formed to overlap a plurality of portions separated from the second connection terminal in the longitudinal direction; the vibration absorbing mechanism applies ultrasonic vibration at the joint portion of the two connection terminals; and the control mechanism is pressurized with 8 200819002 The mechanism and the vibration mechanism # mnr 皇 』 』 』 』 ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” Intermetallic joining. According to the connection method and device of the present invention, since one of the connection terminals is divided into a plurality of lengths in the longitudinal direction, the wiring board is overlapped by a hard part of the blade.

In this case, the area of the joint (contact) of the plurality of (four) joints becomes smaller, and the total area of the contact area is still increased. This increases the flow current. x ' does not need to use a special =: film such as an anisotropic conductive film or a gold bump to be processed by ultrasonic bonding. Therefore, the connecting material used in the present invention can correspond to the manner in which the circuit pattern forming step of the time plate changes the circuit pattern. Therefore, it is possible to reduce costs and expand the field of application. In the present invention, a so-called normal temperature solid-state bonder is used, and the resin for bonding which is held between the connection terminals may be kept in an uncured state in a time period in which the pressure-bonded connection terminals are subjected to the fixed metal bonding (normal temperature bonding). The use of a special and expensive resin can increase the freedom of choice of the resin. Here, the time required for the solid metal joint (normal temperature bonding) is extremely short, and the pressurization can be released without waiting for the solidification of the resin. Therefore, the bonded @ 2: wiring board: the connecting device can be removed to harden the resin. Therefore, the efficiency of the connecting device can be improved to increase the yield. [Embodiment] At least one of the printed wiring boards is a flexible printed wiring board, and the under-receiving is required. However, the other printed wiring board is not limited thereto. It is preferable that the wiring pattern of the printed wiring board which is not used can be discharged under pressure and then has a thick portion which can concentrate local stress at the connection terminal portion (large 9 200819002 about > ). Of course, the substrate material of the wiring board may be an organic printed wiring board, but other wiring boards, such as a printed wiring board such as Tauman or glass, may be used. ^ μ $ The connection terminal of the wiring board used here can be a step type terminal having a plurality of sub-terminals which are spaced apart from each other in the longitudinal direction of the connection terminal. At this time, a plurality of sub-terminals are respectively overlapped with the connection terminals of the other boards to be aligned.

Here, the sub-terminal may be a comb shape which protrudes at a right angle from the longitudinal direction < the long side portion in the longitudinal direction toward the side direction. At this time, the connection terminal of the other can be regarded as a linear shape having a narrow width, and each sub-terminal is superposed on the longitudinal direction. Further, the other terminal connection terminal may be formed in a symmetrical shape in a straight line direction, and the sub-terminals of the two connection terminals may be overlapped with each other to be aligned. Further, the shape of the sub-terminals may be a shape (stepped shape) in which +2 longitudinal long sides extending in parallel with each other in the longitudinal direction are connected at a predetermined interval. At this time, the shape of the recess portion between the small terminals of L may be a square shape, an ellipse (expanded circle), or a man-shaped shape _ only | the other connection terminal may be longitudinally cut in the concave portion in the longitudinal direction. Alternatively, one of the connection terminals may be formed into a wave shape (zigzag shape), and the other connection terminal may be regarded as a straight line or a waveform of the same period (the zigzag shape will connect the two connection terminals every predetermined period in the longitudinal direction). The connection terminal may be a discontinuous land type in which a platform such as a via hole connected to a circuit pattern of a wiring board is arranged on a surface of the wiring board at a predetermined interval. For example, The via hole connected to the inner layer circuit pattern of the wiring board is regarded as a connection terminal, and the connection terminal 200819002 of the other wiring board is overlapped on the platform of the same via hole. The connection terminals of the two may be a plurality of recesses across the width direction thereof. A step type formed in alignment with the longitudinal direction, which can be formed by an etching process used in the step of forming the wood.

In the method of connecting a printed wiring board according to the present invention, ultrasonic wave vibration is applied to the side of the resin, and the printed wiring t is printed on the plurality of portions of the solid metal. The hardening of #m can be carried out simultaneously with the solid metal by heating and adding in step e). However, the hardening of the tree wax can then be carried out in other steps than (4) c). At this time, it is possible to move the bonding device from the metal (four) for performing the two printed wiring boards to another device in order to be cured by the resin. Thereby, the use time of the connecting device for solid-state metal joining can be shortened, and the operating efficiency of the device can be improved. Further, the step b) of laminating the resin and overlapping the plurality of portions between the two connection terminals may be performed, and the two connection terminals of the two printed wiring boards may be pressed to perform temporary pressure bonding. At this time, in step c), ultrasonic vibration is applied to the two printed wiring boards which have been temporarily crimped, and the final crimping of the two connection terminals between the solid portions of the plurality of portions is performed. The binder used in the step b) may be a thermoplastic resin or a thermosetting resin. In the case of a thermoplastic resin, when the connection terminal joint portion is oscillated and pressurized, it is heated in order to soften the resin to a fluid state (unhardened state). This heating also has the effect of promoting solid metal intermetallic bonding (step C)). After the solid metal interfacial bonding step (step c)), the pressurization of the thermoplastic resin can be released by 11 200819002, and then the temperature is lowered to harden the thermoplastic tree. A preferred point of time for depressurizing the thermoplastic resin is when the thermoplastic resin exhibits a strength of about 5% by weight of its maximum bonding strength. When a thermosetting resin is used as the resin to be used, an adhesive which is not cured is used. However, since the solid-metal intermetallic bonding (step e)) promotes bonding due to an increase in temperature, in this step C), the temperature at which the thermosetting resin is hardened without being cured to maintain its adhesion is compared. good. The temperature can be heated to a temperature lower than the melting temperature of the connection terminal without hardening the resin. At this time, it is preferred to release the pressurization of the thermosetting resin after the solid metal bonding (step C)), and then increase the temperature to cure the thermosetting resin. When either a thermoplastic resin or a thermosetting resin is used next to the resin, the step b) of narrowly holding the resin between the two connection terminals and then replenishing the plurality of portions with the resin can pressurize the two connections of the two printed wiring boards. The terminals are temporarily crimped, followed by solid metal interfacing (step 0). When the heat-plastic resin is used, in step b), the thermoplastic resin is heated to soften to perform temporary pressure bonding of the two printed wiring boards. When the thermosetting resin is used, the step b) is heated until the adhesiveness is maintained to temporarily bond the two printed wiring boards, and in the step c), the thermosetting resin is not cured. The ultrasonic vibration is applied to the two printed wiring boards, and the connection terminals are subjected to formal pressure bonding in which a plurality of portions are joined between solid metals. Thereafter, the temperature is raised to harden the thermosetting resin. At this time, it is also possible to release the pressurization of the thermosetting resin after the final bonding of the solid metal (step c)), and then raise the temperature to cure the 12 200819002 thermosetting resin. In this case, when the thermosetting resin exhibits a hardness of about 50% of the maximum degree of hardening, the pressurization of the thermosetting resin is released, and the mechanical strength of the joint portion can be ensured in a short time, and the wiring board can be moved by the connecting device. . Further, when the adhesive agent exhibits a hardness of 5% by weight when the wiring board moves, reliability can be prevented from being lowered. The wiring board moved by the connecting means can be placed in the heating furnace to completely harden the thermosetting resin. Further, the resin may be a photocurable type (ultraviolet curing type), and in this case, the resin is cured by light irradiation after bonding between the solid metals (step c). The ultrasonic vibration applied by the pressurized crucible destroys the oxide film at the joint interface by plastic deformation, so that the clean metal faces (new faces) of the two connection terminals can be directly adhered to each other at an atomic level to promote solid metal intermetallic bonding. (solid state at room temperature bonding). That is, the joining method can be joined in a state where the joint portion is not melted and maintained in a solid state. In the solid state bonding method, as described above, the room temperature bonding at room temperature under normal temperature bonding and the diffusion bonding under high temperature (recrystallization degree, eutectic temperature or higher) are known. The diffusion bonding system maintains a high temperature for a long period of time and is joined by diffusion of atoms. That is, the joint interface is formed by the screwing phenomenon caused by the addition of ink, and the void is reduced by the sintering phenomenon, and the crystal grain boundary formed at the joint interface is moved to complete the joining. The method disclosed in the above non-patent document is equivalent to such diffusion bonding. In the present invention, the room temperature combiner 'breaks the oxide film by the unevenness of the atomic level of the joint surface by pressurization, but the application of ultrasonic vibration can promote the destruction of the oxide film and promote the density between the metals at the atomic level. 13 200819002 Combined to promote solid state bonding. The application of ultrasonic vibration can be performed constantly during pressurization, but the pressurization can be subjected to a two-stage change of temporary crimping and formal crimping, and ultrasonic waves are applied only during the formal crimping. Ultrasonic vibration is mainly applied to the direction perpendicular to the joint surface. However, 'ultrasonic vibration can also be applied to the horizontal direction parallel to the joint surface. Even if it is applied to the ultrasonic vibration in the horizontal direction, since the vibration of the two components in the vertical direction and the horizontal direction is relatively bonded to the bread, vertical vibration is applied to the bonded surface. In the case of the ultrasonic vibration applied to the horizontal direction, a film having a low friction coefficient such as Teflon (registered trademark) can be placed between the oscillating portion and the joint portion (wiring board) to weaken the vibration of the horizontal component. The vertical component is the main component. Further, the junction surface of the two connection terminals may be irradiated with an At ion beam to be washed and activated, and the pressure may be immediately contacted. The connection device for a printed wiring board according to the present invention includes a pressurizing mechanism, a vibration absorbing mechanism, and a control mechanism, and pressurizes the first connection terminal and the second printed wiring board of the first printed wiring board from above by a pressurizing mechanism. The second connection end _ is held between the sub-joints and the joint portions of the two connection terminals which are then overlapped by the resin. The same day's 'assist mechanism' applies ultrasonic vibration to the joint of the two connection terminals. The control mechanism causes the pressurizing mechanism to operate simultaneously with the oscillating mechanism, and ultrasonic vibration is applied while the two connecting terminals are pressed while the resin is not cured, thereby performing solid metal inter-joining. After the end of the solid metal joint, the uncured bond is hardened with a resin. Therefore, it is also possible to provide a heating mechanism in which the two connection terminals are joined to each other after the solid metal is joined, and the resin is hardened in an unhardened state. Alternatively, the pressurizing mechanism can be controlled by the control mechanism to release the pressurization in the state in which the resin is not hardened by using 200819002. At this time, the completed wiring board removed from the connecting device is heated by other means to harden the resin. Preferably, a positioning mechanism is provided in the printed wiring board connecting device, and the first printed wiring board and the second printed wiring board are held so as to hold the resin between the two connection terminals, and the second connection terminal and the second connection terminal are The plurality of parts separated by the long side direction overlap. The positioning mechanism includes a positioning table that can support the second printed wiring board and is positioned on the horizontal plane, and a first printed wiring board that is supplied to the upper side of the second printed wiring board to connect the terminals of the two printed wiring boards. Overlap the supply mechanism that remains in the long direction. Here, the positioning table can be used at a horizontal level.

The X-axis of the upper orthogonal XY direction and the direction of rotation about the vertical axis (theta direction) can be D. The holding plate can also be provided at the supply mechanism, and the second printed wiring board on the upper side can be set by, for example, suction negative pressure. Attracted and adsorbed under the retaining plate for transfer and supply. Alternatively, it may be a supply mechanism that only transfers and supplies the wiring board. The pressurizing mechanism includes, for example, a pressurizing portion that presses the upper wiring board downward, and a vibration portion that mainly applies ultrasonic vibration in the vertical direction to the wiring board. At this time, the oscillating portion can be formed by an ultrasonic amplifier and a supersonic vibrator fixed thereto, and the pressurizing portion can pressurize the wiring board through the ultrasonic amplifier. The oscillating mechanism may be formed by an ultrasonic amplifier and an ultrasonic vibrator mounted on the ultrasonic amplifier, and the pressurizing mechanism may pressurize the two printed wiring boards through the ultrasonic amplifier. It is also possible to provide a heating machine 15 in the ultrasonic amplifier. The control mechanism can control the heating mechanism, and then the resin is not hard-heated until the two connection terminal joints can be solid metal bonded and positioned by the positioning mechanism, and the two printed wiring boards are The structure of the joint portion of the two connecting materials can be engaged; the two connecting terminals are engaged by the vibration mechanism and the pressurizing mechanism and the pressurizing mechanism. The two connection terminals can be crimped and joined after the positioning: one person's pressing step.

5 The crimping after positioning can also be divided into two stages: temporary crimping and formal crimping. At this time, 'the heating mechanism is provided for the heating mechanism, and the heating mechanism for the heating mechanism is used, and the control unit controls the positioning mechanism to position the 帛2 connection terminal so as to overlap with the plurality of portions of the 帛1 connection terminal separated in the longitudinal direction. The pressurizing mechanism and the heating mechanism pressurize the two printed wiring boards to such an extent that they are not easily detached while being heated by the resin to such an extent that the adhesiveness can be exhibited or maintained. After that, the control mechanism controls the addition, the stacking structure, the pressing mechanism, and the vibration absorbing mechanism, and the two printings that have been temporarily crimped.

Structure. At this time, the temperature in the state of the state. The wiring board applies pressure and ultrasonic vibration sufficient to form a solid metal joint for formal crimping of the two connection terminals. In this way, temporary crimping and formal crimping can also be performed with different devices. Providing the positioning mechanism and the connection terminal for the two printed wiring boards positioned by the positioning mechanism to be heated and pressurized by the resin to maintain the adhesion degree. A heating and pressurizing mechanism that performs temporary crimping. On the other hand, the main pressure bonding device is provided with a vibration oscillating mechanism and a pressurizing mechanism, and ultrasonic vibration and pressure are applied to the two printed wiring boards that have been transported by the temporary pressure bonding device and are positioned and temporarily crimped so that the ultrasonic vibration and pressure are applied. Two 200819002 connection terminals are engaged. According to this configuration, the operation time of the final pressure bonding device to which ultrasonic vibration is applied can be shortened, and as a result, the operation rate can be improved. The reason why the ultrasonic wave is applied in the present invention is to promote the plastic deformation of the unevenness of the surface plating of the electrode (bonding terminal) by the compressive stress. Therefore, it is preferable to apply the longitudinal vibration. In the past, even if lateral vibration was applied, it was considered to be plastically denatured. However, the reason is that, in the actual joint surface, even if it is a lateral vibration, the stress has a vector component in the vertical direction, which promotes the resolute deformation of the unevenness and the joint. This is an indirect proof of the experimental fact that a slippery material such as a Teflon (trademark) sheet is inserted between the ultrasonic head and the printed wiring board as a release material or an unfixed wiring board. Further, it is possible to obtain a good bondability by moving the pressurizing head against the ultrasonic wave and moving it in the horizontal direction. (Principle) Next, the joining principle and joining conditions of the present invention will be described. As described above, it is necessary to use minute conductive particles in the conventional anisotropic conductive film. Further, in the above-mentioned sinister document 1, in order to form minute irregularities, the material cost or the cost is increased. In order to solve the problem, the connecting terminals of the printed wiring board are directly ultrasonically joined to each other in the solid state. However, in the connection of the printed wiring board, since the connection terminals are patterned in such a manner as to extend in the same direction, the contact area where the connection terminals overlap is excessively large only when the g-wave bonding is performed. When the contact area between the connection terminals is too large, the following problems occur. In the first point, when the contact area is too large, the non-contact portion of the terminal to be discharged from the resin is reduced, and the resin held between the terminals is hard to be discharged. Therefore, the contact terminals are not sufficiently in contact with each other. The second point is the problem of rebounding "仏" 17 200819002. In order to produce solidification caused by solid metal joints, the necessary load must be applied to plastically deform the joint, but the load will inevitably become larger with the contact area. Therefore, it will become larger. The load will be elastically deformed at the same time in the printed wiring board itself, and when the load is removed after the joining step, a rebound will occur. Therefore, the joint interface during the joining process will be temporarily engaged. It is peeled off. Thus, the method of ultrasonic bonding alone cannot make the connection terminals bond well.

However, since there is an advantage that the material cost or the processing cost can be reduced, the connection terminals of the printed wiring board are directly supersonicly coupled to each other in the solid state, which has practical value. Therefore, the solution to the above problem is as follows. In order to superimpose the connection terminals of the printed wiring board directly in the solid state y, it is necessary to perform the operation without applying an excessive load, that is, since the load will be The contact area between the connection terminals is proportionally increased. Therefore, the inventors of the present invention have considered a solution from the structural surface of the connection terminal. It is desirable to reduce the contact area and ensure the necessary load (pressure) while sufficiently reducing the contact of the joint. In this case, first investigate the degree of the minimum load necessary. First, observe that the semiconductor wafer that forms the adhesive layer at the joint interface is flip-chip bonded to the printability by ultrasonic bonding. The reverse case is due to the fact that the gold bumps formed on the semiconductor wafer are macroscopically two: therefore, the resin is discharged from the joint surface, and the direct contact between the gold bump and the printed component mounting pattern is performed by ultrasonic bonding. Inter-joining. At this time, since the molten structure is not recognized at the joint portion, it can be regarded as mutual diffusion or a solid-state joint similar thereto. Therefore, it is known that there is a pressure of about 15 GMPa at least at the joint interface (the average load per unit deformation area of the giant under bump). This is the case where gold bumps are formed on a semiconductor wafer. On the other hand, in the case of the printed wiring board to which the present invention is applied, the general wiring material is copper ore. Since the yield value of the electric copper prospecting pattern is several times that of gold, it is predicted that the copper-plated wiring pattern is subjected to a giant plastic deformation, and a pressure of several times 150 MPa at the time of the gold bump is required. In this connection, the relationship between the pressure of the contact surface and the contact resistance which are necessary when the copper-plated wiring patterns are joined by the ultrasonic bonding method is confirmed by a test. Figure 5 is the experimental results. This wiring pattern is applied to the gold and gold and is gilded. According to the results of the experiment, when the contact surface pressure is about 175 ohms or so, the contact resistance is hardly changed at about 175 ohms, so that it is known that application of a pressure of about 150 MPa can ensure sufficient conductivity. That is, the same pressure as when the gold bumps are applied can be applied. Here, as seen from the above-mentioned inverse deduction, applying a pressure equal to about 15 MPa, that is, equal to that of the gold bump, can ensure a very small contact resistance, and the result of this phenomenon can be known. The following things. After the joint interface was analyzed by a cross-sectional analysis method or the like, fine plating having a surface roughness of μιη was present in the gold plating portion on the surface of the copper-plated wiring pattern (with nickel plating and gold plating on the surface). The pressure of 15 MPa does not cause a giant plastic deformation of the copper wiring pattern. However, even with such a pressure, the front end of the minute concavities and the gold plating applied to the surface of the μπι unit can be plastically deformed with a pressure sufficient for the fine portion 19 200819002 to be discharged. Furthermore, when there is no nickel plating or gold plating, there are minute irregularities on the surface of the plated steel, and plastic deformation occurs. That is, in the ultrasonic bonding of the electroplated copper wiring patterns, the tip end portion of the micro-convex portion formed on the surface of the gold plating is plastically deformed by the load and the ultrasonic vibration, and at the same time, the resin is discharged, and the metal surface is contacted. The solidification phenomenon forms an intermetallic bond. In this manner, a bonding method of applying ultrasonic vibration by applying a pressure of about 150 MPa is applied, and the surface roughness of the connection terminal electrode of the printed wiring board is an important parameter. For this, the printed wiring board produced by the following method can be used as a graph of the average roughness of the printed wiring board, which is about the left and right of the table 19 (four) € as long as it has the degree of unevenness, in the copper plating pattern of each other Ultrasonic bonding is sufficient. That is, it is understood that there is no need to have a special step in order to cause irregularities on the surface of the wiring pattern. Next, the influence of the pressure of 150 MPa on the substrate of the printed wiring board was examined. The case where the connection terminals extending in parallel to each other in the same direction are side by side for crimping are calculated as follows. For the cow and σ, consider the connection portion made up of 3 terminals, and the visibility of the connection terminal is (umm, the length is 15mm. When the connection is repeated, since the contact area is at each connection terminal, there are 30 connection terminals. The total is 4.5mm2. Due to the pressure of i5〇MPa, a load of 150N is applied per lmm2, so 3〇 are connected to the mountain. It is known to add a load of 675N. Since the load is applied to the end J2L, riding Ai Zhengzheng 'Therefore, it is also applied to the substrate of the underlying printed wiring board, and the substrate of the printed wiring board of 20 200819002 causes significant X 73 significant elastic deformation. Therefore, when removing the load, the corresponding elastic complex; f > I m, the action of the original knife will break the joint. Of course, when the substrate of the printed wiring board is made of a material having a modulus of elasticity, it is possible to avoid damage to the joint: ,; and this will result in the application of a high load. The problem of large-scale construction equipment.

Further, in the solid state diffusion bonding shown in Non-Patent Document i, it is necessary to heat the joint interface to a eutectic temperature or a recrystallization temperature or higher, and to maintain the pressure for a certain period of time at this temperature. Therefore, the processing time is prolonged. Therefore, the present invention uses room temperature bonding (micro bonding at normal temperature). That is, the joint surface is sufficiently cleaned and brought into contact by only a small amount of pressure, and then the resin is hardened to reinforce the joint portion. As a result of the investigation and the detection of the second or more, the contact area of each of the joint portions after the division of the connection terminals is reduced, thereby achieving a connection terminal structure that is not easily broken and bonding, and printing using the connection terminal having such a configuration. A method and apparatus for connecting printed wiring boards of the present invention to a wiring board. (Embodiment 1) Fig. 1A is a plan view showing a printed wiring board according to an embodiment of the present invention, in which a plurality of sub-terminals are protruded at right angles to one side of the connection. Figure i B is a cross-sectional view taken along line 1B-1B of Figure i. Figs. 2 and 3 are schematic diagrams showing the steps of connecting the lower rigid printed wiring board and the upper flexible printed wiring board having the connection terminal of Fig. i. Fig. 4 is a plan view showing a portion (hatched portion) joined in the joining step of Figs. 2 and 3. In the drawings, B, a 3 series printed wiring board, and 4 connection terminals formed on the printed wiring board 3, a plurality of sub-terminals 4a are protruded from one side of the longitudinal portion of the longitudinal direction toward the end of the 21 200819002 side. . In the present invention, the sub-terminal 4a is used for connection between printed wiring boards. 4an is a nickel plating layer formed by electroplating or electroless plating on the surface of the connection terminal 4 and the sub-terminal 4a, and is a gold plating layer formed by the same treatment method on the surface of the nickel-plated layer 4an. In Fig. 2, a flexible printed wiring board (first wiring board) of the upper wiring board is formed with a connection terminal 2 and a rigid printed wiring board (second wiring board) of the lower wiring board of the third system. A connection terminal 4 is formed thereon, and the sub-terminal 4a of FIG. 1A is provided at the connection terminal 4. The 5 series flexible printed wiring board 1 14 hard) is a thermoplastic resin film of the hard printed wiring board 3 when the green printed wiring board 3 is connected. In Fig. 3, 7 is a supersonic head of the oscillating mechanism and the pressurizing mechanism of the present invention, and also has a heating mechanism. The ultrasonic head 7 superimposes and heats the connection terminals 2, 4 of the flexible printed wiring board 1 and the rigid printed wiring board 3, and applies ultrasonic vibration to connect the two connection terminals 2, 4. 8 The mold φ material is a ruthenium fluoride sheet which is used to make the ultrasonic head 7 easily detached when the thermoplastic resin 露出 is exposed between the connection terminals and contacts the ultrasonic head 7 during pressurization. The iron-air dragon sheet 8 also has a function of reducing the vibration component of the ultrasonic vibration in the horizontal direction of the wiring board, and mainly applying the vibration component in the vertical direction of the wiring board to the joint portion 9 of the two connection terminals 2, 4. In the case of the oblique line shown in Fig. 4, when the flexible printed wiring board 1 and the rigid printed wiring board 3 are connected, the joint portions 9 of the two connection terminals 2, 4 are connected. (Formation of Sub-terminals) First, a method of forming the sub-terminals 4a shown in FIG. Further, in the method of forming a method, the well-known method is directly used, and thus the illustration thereof is omitted. First, a printed wiring board having a laminated copper box is prepared. Next, for example, a photosensitive photoresist is applied to the surface of the mi. The photomask is used for ultraviolet exposure, and the development is performed 'after the formation of the residual light p having a predetermined wiring pattern on the surface of the m|" by using, for example, an aqueous solution of ferric chloride. It is described that the copper which is not covered by the excess portion of the photoresist is dissolved, and the connection terminal 4 and the sub-terminal 4a having a predetermined wiring pattern are formed.

After that, the % solution was removed with an experimental solution. Thereafter, the portion other than the sub-terminal 4 and the sub-terminal 4a is subjected to photoresist plating, and plating is sequentially applied in the order of clock recording and clock gold, and then the optical coating is removed. In this way, the connection end + 4 and the sub-terminal core having the nickel-plated layer 4an and the gold-plated layer 4ak can be formed, and the mineral layer 4an and the gold-plated layer 4ak can be formed, and only the ultrasonic splicer is considered. Therefore, it is not limited thereto. It may also be other metal ores that can be joined to each other, such as tin or tin alloy. Further, since the ultrasonic joint surface can be cleaned and can be joined to the ultrasonic wave, the connection terminal can be subjected to plasma treatment to clean the surface instead of the plating treatment. In the following, an example is given of the size and number of sub-terminals. According to the relationship between the area of the sub-terminal 乜 and the load at the time of connection, it is explained that the joint between the seed end and the 不会 is not broken by the elastic restoring force. As described above, it is known that a pressure of 1 kPa is applied and connected, and a connection resistance of money is obtained. Further, t is applied to the load of the connection terminal 4 and the printed wiring board 3 to the left and right sides, and the joint is not broken by the elastic restoring force. For example, the width of the longitudinal portion (main terminal) of the connection terminal 4 is 0.1 mm, and the connection terminal 4 is 〇 3 mm. Further, the length of the sub-terminal * ugly 23 200819002 direction is 0.05 mm, the length (length in the direction perpendicular to the direction) is 〇.15 mm, and the length of the long side of 4 is formed by 1 degree of 5 sub-terminals (long-side connection of the connection terminal 4) The longitudinal direction of the terminal 4 is at intervals of 0.15 mm at the connection terminal 4a (Fig. 1A).

The calculation of this load is as follows. When the sub-interface 4a of the rigid printed wiring board 3 is overlapped with the connection terminal 2 of the flexible printed circuit 1, the area of the % interface 4 is 〇 匪 5 匪 2 . Since there are five sub-terminals per 1 connection terminal, the contact area per "connection terminal" is 〇.〇25面2. Therefore, when 30 connection terminals are used in the conventional example, the contact area is 4 G.75 W in total, and when a pressure of 15 嶋pa is applied, a load of 112 N is applied to the connection terminal 4 and the printed wiring board 3. Substrate. Therefore, the sub-terminal 4a * # u α士^ is used. (4) ^ + ... material 'does not break with the restoring force (connection between printed wiring boards) Next, the flexible printed wiring board 具体A method of connecting the rigid printed wiring board 3. First, 'prepare the flexible printed wiring board in which the connection terminal 2 has been formed', and the rigid printed wiring board which has been formed into the connection terminal 4 of the sub-terminal 4a (Fig. 2 (a), (b)). The surface (the component mounting surface) on which the connection terminal 4 is formed in the rigid printed wiring board 3 faces upward, and is loaded on the load #5 (_ 2 (4)). Next, the connection terminal 2 of the flexible printed wiring board 1 is directed downward, and the thermoplastic resin film 6 is held between the switchable printed wiring board 1 and the rigid printed wiring board, and the connection terminal 2 of the flexible printed wiring board 1 is rigid. The sub-terminals 24 200819002 4a of the printed wiring board 3 are aligned and overlapped (Fig. 2(d), Fig. 4). The 5H alignment is performed by a known method such as the following. When the flexible printed wiring board 1 and the thermoplastic resin film 6 have sufficient transparency, the flexible printed wiring board 1 and the thermoplastic resin film 6 can be passed over the alignment mark attached to the rigid printed wiring board 3 as a reference. quasi. On the other hand, when either of the flexible printed wiring board i or the thermoplastic resin film 6 is opaque, the connection terminal 4 of the flexible printed wiring board 与 and the connection terminal 4 of the rigid printed wiring board 3 can be photographed in advance. The sub-terminals are aligned by using an automatic recognition mechanism for image recognition. Next, from the inside of the flexible printed wiring board 1 (upper side of FIG. 3(e)), the ultrasonic head 7 is placed at a position corresponding to the position of each of the connection terminals 2, 4a, and a pressure of 150 MPa is applied (FIG. 3). (e)). Further, at this time, the ultrasonic head 7 is preset to a temperature corresponding to the softening temperature of the thermoplastic resin film 6. By the ultrasonic head 7, a predetermined temperature and a predetermined pressure are applied to the flexible printed wiring board 1 and the rigid printed wiring board 3. Thereby, the thermoplastic resin film 6 can be softened, and the connection terminal 2 of the flexible printed wiring board can be brought into contact with the connection terminal 4a of the rigid printed wiring board. In this state, the ultrasonic vibration is applied by the ultrasonic head (Fig. 3(f), the direction is the surface, the inner surface direction, the ultrasonic vibration direction is horizontal with respect to the substrate, but due to the presence of the release sheet of the iron fluoride丨8, this can weaken the vibration component in the horizontal direction with respect to the substrate, and apply the vibration component in the vertical direction to the substrate joint portion to form a solid metal joint. Also, of course, the ultrasonic vibration direction can be perpendicular to the substrate at first. Direction (upper and lower directions in the figure) The application time of ultrasonic vibration is based on approximately 〇·5 seconds. With the time of 25 200819002, it is possible to complete the intermetallic bonding that is necessary to maintain the force. When the ultrasonic head 7 is separated from the switchable printed wiring board i, the connection portion which generates heat due to the ultrasonic head 7 is gradually cooled by heat dissipation, and the thermoplastic resin film 6 is solidified together to complete stable bonding. (Fig. 3 (g)). This % ' may also carry out the two wiring boards 1, 3 from the loading table $ without waiting for the hardening of the resin film 6. Since the connection terminals 2, 4 have been fixed by solid metal bonding. (Example 2) The thermoplastic resin film 6 of the first embodiment may be used instead of the thermoplastic resin film of the first embodiment, and the thermosetting resin may be used for the adhesive layer. The difference is only that the film is cured by heating or cooled by heating, and the effect is as an adhesive layer. The method of connecting the printed wiring boards when the thermosetting resin is used is basically the same as the method of connecting the flexible printed wiring board 1 and the rigid printed wiring board 3 in the above-described embodiment. The use of the heat-curable resin is to use a printing or coating method when the thermosetting resin is a liquid resin, and the semi-hardened resin film is used. In this case, the rigid printed wiring board 3 or the like may be temporarily bonded to the rigid printed wiring board 3 or the like as described above. In this manner, the thermosetting resin is sandwiched, and the flexible printed wiring board 1 and the rigid printed wiring board 3 are placed. The joint portion is aligned and overlapped. Further, the ultrasonic head 7 is set to a hardening temperature of the thermosetting resin, as described above, by applying the predetermined temperature and the predetermined pressure to the flexible end by the ultrasonic head 7. The printed wiring board 1 and the rigid printed wiring board 3 are used, whereby the connection terminal 2 of the flexible printed wiring board is brought into contact with the connection terminal 4a of the rigid printed wiring board 3 before the thermosetting 26 200819002 curing of the chemical resin. In this state, ultrasonic vibration is applied by the ultrasonic head (Fig. 3(f), the surface of the direction map, and the inner surface direction). The application time of the ultrasonic vibration is based on approximately 〇·5 seconds. The solid metal interfacial bonding having the necessary holding force can be completed. After this time, the temperature and pressure at which the thermosetting resin can be hardened for a predetermined time is applied by the ultrasonic head 7. Thereafter, the ultrasonic head is made 7 is separated from the flexible printed wiring board. In this manner, the thermosetting resin is cured to complete stable bonding (Fig. 3(g)). In the curing of the thermosetting resin, the resin can be removed in an uncured state and placed in a heating furnace instead of the heating of the ultrasonic head 7. This day's sufficiency is hardened by the heating and pressurization of the ultrasonic head 7 to a degree of hardening of 5 〇% of the degree of complete hardening of the thermosetting resin. Thereafter, the ultrasonic head 7 is separated by the flexible printed wiring board j. Moreover, the flexible printed wiring board 1 and the rigid printed wiring board 3 which are connected by the adhesive layer of the thermosetting resin in the semi-hardened state are placed in a separate heating furnace, and the temperature of the heating furnace is set to be The temperature at which the thermosetting resin is completely cured is maintained until it is completely hardened, and then taken out. In this manner, the thermosetting resin is cured to complete stable bonding (Fig. 3(g)). The curing temperature and curing time of the above thermosetting resin can be set in consideration of the hardening characteristics of the thermosetting resin to be used. This hardening property can be grasped first by the hardening rate prediction method of the thermosetting resin which has been previously patented by the applicant of the present application (Japanese Patent No. 2〇〇6_1471〇4). 27 200819002 (Embodiment 3) Fig. 6 is a conceptual view showing an embodiment of a terminal connecting device of a printed wiring board of the present invention. In this figure, the 2-inch positioning table can be positioned in the normal parent direction (X-Y direction) on the horizontal plane and the rotation angle (θ direction) in the vertical direction. A load stage 22 is fixed to the upper surface of the positioning table 20, and a rigid printed wiring board (second wiring board) 3 of one of the wiring boards is fixed thereon. The second connection terminal 4 of the second wiring board 3 is a step type of the above-described first embodiment, and a resin film 6 is attached thereto. The position of the positioning stage 20 is controlled by the position control unit 24. 26-series supply means for connecting the flexible wiring board of the other wiring board (the first wiring board is supplied to the upper side of the rigid printed wiring board (second wiring board) 3" to connect the two wiring boards 丨.3 The terminals 2, 4 are overlapped and held in the longitudinal direction. The supply mechanism 26 is positioned by the advancement and retreat movement of the position control portion 24. There is a retaining plate 28 under the supply mechanism 26. The retaining plate 28 is for example by inhaling The flexible printed wiring board 1 is attracted to the lower side for holding under pressure, and the positioning mechanism of the present invention is formed by the supply mechanism 26 and the positioning table 2, and the positioning mechanism is used to control the attraction of the holding plate 28. The force suction control unit. The four-stage pressurizing mechanism includes a pressurizing unit that presses the overlapping portion of the connection terminals 2 and 4 of the two wiring boards 1 and 3 downward from the upper side of the flexible printed wiring board Ο And an oscillating mechanism μ oscillating mechanism 38 that applies ultrasonic vibration mainly in the vertical direction (with a reverse vertical direction) to the overlapping portion from the upper side of the flexible printed wiring board i, and is composed of a vertically long metal member. The ultrasonic amplification is 40, and is fixed to the ultrasonic wave Ultrasonic vibration at the upper end of the 4 2008 28 200819002 〇σ The super-chopper amplification 40 resonates with the vibration frequency of the ultrasonic vibrator 42 and generates vibration in the up and down direction at the lower end. The position of the skin node is supported by the frame member 44. The frame member 44 is formed to surround the side and the upper side of the ultrasonic amplifier 40, and a residual force of the pressurizing portion is applied to the upper surface of the frame member 44. The force F (load) of the pressurizing portion 36 is detected by using a dynamometer or the like = the pressure sensor 46. The applied pressure F measured by the pressure sensor 46 is input to the pressurization control. In the portion 48, the pressurization control unit performs feedback control of the pressing force F of the pressurizing unit 36. Further, the ultrasonic amplifier is provided with a heating mechanism 43 composed of a heater or the like. The temperature of the heating mechanism 43 is controlled by a temperature sensor (not The detected value is input to the temperature control unit 32. The degree control unit 32 feedback-controls the temperature τ of the heating unit 43. Further, the ultrasonic vibration unit 42 is driven by the vibration control unit 5 at a predetermined frequency. System 52 control device 'which will control the signal transmission The position control unit μ, the suction control unit 30, the temperature control unit 32, the pressurization control unit 48, and the pressurization control unit 50 #each part' are controlled as a whole. Further, in general, heat transfer from the heating mechanism 43 is avoided. The heat insulating portion (not shown) to the ultrasonic vibrator 42 is provided between the ultrasonic amplifier 4A and the ultrasonic vibrator 42. Further, the operation of the connecting device is first performed by the vibration device 38. In the state of Fig. 6, the lower rigid printed wiring board (second wiring board) 3 is placed on the loading table 22 and the lower side of the holding plate 28 of the upper supply mechanism 26, and the flexible printed wiring board is adsorbed ( The second wiring board}1. In this state, the position control unit 24 controls the positions of the positioning table 2A and the supply mechanism 26 so that the connection terminals 2, 4 of the two printed wiring boards 33 are flat in the longitudinal direction 29 200819002 Lines and top and bottom positions overlap. Next, the pressurizing unit 36 lowers the frame member 44 of the oscillating mechanism 38 to abut on the upper surface of the flexible printed wiring board i so that the ultrasonic amplifier: the lower end surface of the cymbal is positioned on the two wiring boards, 3 The overlapping portions of the terminals 2, 4 are connected. The applied pressure F is controlled to the set pressure, and the temperature T is controlled to the set temperature, and the super-a wave vibrator 42 is activated. In this way, the interface voltages 2 and 4 are solidified in a state where the resin film 6 is not hardened by applying a set pressure to the interface of the two wiring boards, 3, and the ultrasonic vibration mainly in the vertical direction. Metal joints. The bonding time is extremely short (about 0.5 second), and thereafter, in a state where the resin film 6 is not cured, the pressurizing unit 36 raises the oscillating mechanism 38, and the ultrasonic amplifier 40 is separated from the upper surface of the flexible printed wiring board 1. . Here, the supply structure 26 and the suction holding plate 28 are separated from the flexible printed wiring board i, and then the next flexible printed wiring board is prepared. The flexible printed wiring board 1 is transferred and carried out from the positioning table 2 to the next step by the other transfer φ mechanism while being joined to the rigid printed wiring board 3. Further, the resin film 6 is cured by a predetermined step corresponding to the resin film 6. In this example, the flexible printed wiring board 1 is attached to the holding plate 28 of the transport mechanism 26, but the holding mechanism may be provided on the holding plate to hold the flexible printed wiring board 1. In this embodiment, after the positioning of the two printed wiring boards is performed on the loading platform 22, the ultrasonic vibration and pressure are applied to the loading platform 22 by the vibration mechanism 38 and the pressing mechanism 34 to engage the two connection terminals. Therefore, after the positioning, the pressurizing and oscillating steps can be used to crimp the two connection terminals, and 30 200819002 is engaged. Depending on the resin to be used, it is possible that the resin is sufficiently hardened before the resin is sufficiently discharged to the space between the terminals 2 and the space between the terminals 4 and 4 when the connection terminals are connected by one pressurization and vibration. . At this time, the positioning crimping may be divided into two stages of temporary crimping and formal crimping to perform the day-to-day maintenance. In the two printed wiring boards that have been positioned, the supersonic ultrasonic amplification boundary is 4 〇, and heating is performed simultaneously. The resin can then be used to maintain or maintain the degree of adhesion to temporarily crimp the two printed wiring boards to such an extent that they are not easily detached. Thereafter, the pressurizing mechanism and the oscillating mechanism are controlled, and the two printed wiring boards which have been temporarily crimped are subjected to pressure and ultrasonic vibration sufficient to form a solid metal joint to perform formal crimping of the terminals. By the temporary t & unconnected with the application of the ultrasonic vibration, the resin can be discharged to the space between the terminals 2, 2 and the terminals 4, 4 in an uncured state. Thereby, the terminal 2, 牦 is sufficiently contacted during the final crimping, and the solid metal joint between the terminals can be ensured. (Embodiment 4) The temporary bonding after positioning of the printed wiring board and the formal crimping for solid metal bonding are performed in different clothes. Fig. 7(A) is a conceptual view of the temporary pressure bonding device 100, and Fig. 7(B) is a schematic view of the final pressure bonding device u. The same members as those of the connecting device of Fig. 6 are assigned the same reference numerals to omit the detailed description. Although the temporary pressure bonding apparatus 100 includes a positioning mechanism including the positioning table 20 and the supply mechanism 26, the pressing mechanism 34A does not have a vibration absorbing mechanism, and the pressure head 5 加压 pressurizes the printed wiring board 丨3. The final crimping arrangement 1 has the same configuration as that of the connecting device of Fig. 6. The pressurizing mechanism 34B is provided with a vibration absorbing mechanism 38, and the ultrasonic amplifier 4〇B_31 200819002% pressurizes the printed wiring board 1, 3 Ultrasonic vibration is applied to the joint portion. Further, a heating mechanism 43A is provided in the pressurizing head 50, and a heating mechanism 43B is provided in the ultrasonic amplifier 4A. First, in the same manner as in the third embodiment, the flexible printed wiring board 1 is positioned and superposed on the rigid printed wiring board (second wiring board) on the loading table 22 of the temporary pressure bonding apparatus i by the supply mechanism 26. Next, the pressurizing head 5A is lowered to apply a predetermined load and temperature to the overlapping connection terminal portions of the two wiring boards. The load and temperature are such that the adhesive is then adhered to the extent that the two wiring boards are not easily detached. The two wiring boards 丨, 3, which are formed in the temporary crimping portion, are sent to the final pressure bonding apparatus 110 by a transfer mechanism (not shown). In the final crimping apparatus, the two wiring boards 1, 3 are loaded and positioned on the loading table 22B of the positioning table 20B so that the terminal joint portion which has been temporarily crimped can be positioned at a predetermined position. Thereafter, the ultrasonic amplifier 40B is lowered, and the temporary crimping portion is heated and pressurized, and ultrasonic vibration is applied to perform final pressure bonding. Thereby, the contact portions of the connection terminals of the two wiring boards are formed into a solid metal joint. (Embodiment 5) In each of Embodiments 1 to 4 described above, a linear connecting terminal 2 (Fig. 2) is joined to a stepped (cantilever structured "Μα type) connecting terminal 4 shown in Figs. The sub-terminal 4a. However, the connection terminal suitable for the present invention is not limited thereto. Fig. 8 to 12 are diagrams showing other embodiments of the stepped terminal. Also, two of the two wiring boards are separately provided. Since the connection terminal can be arranged in reverse, the connection terminal of one is used as the first terminal, and the connection terminal of the other 32 200819002 is used as the second terminal. The first terminal 60 is stepped. The second terminal is of the Qin type, but has an arc shape between the sub-terminals 6 of the first terminal 60.

In the continuous etching, it is not the shape of the rectangle of Fig. 1A but the shape of Fig. 8 which is changed by the thickness of the conductor (copper thickness). In the embodiment shown in FIG. 9, the sub-terminal 60 of the first terminal 60A is

Mine tooth shape? Considering the shape change caused by the engraving, a large dihedral shape is formed in advance. The second terminal 62 is linear. The embodiment shown in Fig. 1A has a stepped shape in which the sub-terminals of the first terminal 60 are connected to each other by two long side faces which are laid in the longitudinal direction at a predetermined interval. That is, the vacant pattern 6 〇 Bc removed by the last name is arranged in the longitudinal direction, and the linear (9) sub (four) is cut in the vacant pattern _c. In Fig. 10 (4), the etched pattern paper has a rectangular shape, and in Fig. 10(B), a circle is formed into an elliptical shape, and in Fig. 1 (c), a diamond shape is formed. In Fig. 11, the first terminal 60C and the second terminal 62C are unilaterally stepped (comb type), and the sub-terminals 6QCa and 62Ca are overlapped and joined to each other. In Figure 12, at the first! The terminal 6〇D and the second terminal 62d are provided with sub-terminals 6〇Da and 62Da which are respectively protruded from the one side in the longitudinal direction by a predetermined interval to the side and are substantially semi-arc-shaped. 〇Da, 62Da are joined in opposite directions. (Embodiment 6) In the embodiment of Fig. 13, the first terminals 60E and 60F have a substantially waveform (saw-tooth shape). In Fig. 13(A), the second terminal 62E is made linear. In Fig. i3 (B), the second terminal 62F has a waveform of the same period as the i-th terminal 6〇F, and 33 200819002 joins the plurality of terminals 60F and 62F at a plurality of positions separated in the longitudinal direction. (Embodiment 7) Each of Figs. 14 to 16 is a discontinuous platform type in which a platform having a via hole or the like is arranged in a plan view and a cross-sectional view. The first terminal 60G shown in Fig. i4 is linearly arranged along the upper surface of the platform of the non-all-conducting via 68 connected to the linear inner layer circuit pattern 66 of the rigid printed wiring board 64. The second terminal 62G provided in the flexible printed wiring board 70 is linearly formed on the platform, that is, the i-th terminal 60G. The second and second terminals 60G and 62G are held together by the resin 72 to form a solid metal bond. The resin 70 is solidified and fixed. The ith terminal 60H shown in Fig. 15 uses a platform penetrating the entire via hole 68A of the rigid printed wiring board 64A instead of the non-all-via hole 68 shown in Fig. According to this embodiment, since the resin 72 is subsequently penetrated into the via hole MA, the bonding strength between the first terminal 6〇H of the wiring board 64A and the linear second terminal 62H of the flexible printed wiring board 70 can be increased. In the embodiment shown in Fig. 16, the first terminal 601 of the rigid printed wiring board 64B is formed in a linear shape, and the second terminal 621 which is linearly arranged on the platform of the flexible printed wiring board 70A is formed. In other words, a linear wiring pattern 74 is formed on the upper surface of the flexible printed wiring board 70A, and the stage 621 connected to the wiring pattern 74 is placed on the lower surface, so that the stages are arranged discontinuously on a straight line. (Embodiment 8) The embodiment shown in Fig. 17 is an etch step type in which a plurality of concave portions 76 and convex portions 78 in the cross-sectional direction are alternately arranged by etching to be provided on the hard 34 200819002 printed wiring board 64C. The longitudinal direction of the linear first terminal 60J. The second terminal 62J of the flexible printed wiring board 70B is linear. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a plan view showing an outline of a connection terminal used in a method and apparatus for connecting printed wiring boards according to Embodiments 1 and 2 of the present invention. Figure 1B is a cross-sectional view taken along line IB-1B of Figure 1A. Fig. 2 is a schematic flow chart showing the first half (a) to (d) of the connecting step of the printed wiring board of the present invention. Fig. 3 is a schematic view showing the steps of the second half of the connecting step of the printed wiring board of the present invention. Fig. 4 is a view showing a portion (hatched portion) of the connection terminal to which the joining step is joined. Fig. 5 is a graph showing experimental results of the relationship between the contact surface pressure and the contact resistance of the electroplated copper wiring patterns. Fig. 6 is a conceptual view showing an embodiment of a connecting device for a printed wiring board of the present invention. A conceptual diagram of another embodiment of the present invention. Fig. 7 (A) and Fig. 7(B) show the connecting device of the printed wiring board of the present invention. The temporary crimping device and the final crimping device are shown. Fig. 8 is a view showing an embodiment in which the arc-shaped stepped connecting terminal is not shown.

A diagram of an embodiment. A diagram of an embodiment of an I-shaped connection terminal. a stepped connection terminal of the surname empty pattern Fig. 11(A), (Β) shows that the two connection terminals are single-sided stepped terminals 35 200819002. Fig. 12 (A) and Fig. 12 (B) are views showing an embodiment of a connection terminal having a sub-terminal having substantially semi-arc shape. Fig. 13 (A) and (B) are views showing an embodiment of a waveform (zigzag) connection terminal. Fig. 14 is a view showing an embodiment of a discontinuous platform type connecting terminal, the top view being a top view and the lower side being a cross-sectional view.

Fig. 15 is a view showing another embodiment of the discontinuous platform type connecting terminal, the top view being a top view and the lower side being a cross-sectional view. Fig. 16 is a view showing another embodiment of the discontinuous platform type connecting terminal, the top view being a top view and the lower side being a cross-sectional view. Fig. 17 is a plan view showing the etched step difference type connection, and the squat side is a sectional view. The diagram of the embodiment of the sub, the upper [main symbol description]

2 3 4 4a Flexible printed wiring board (first printed wiring board) 1st connection terminal rigid printed wiring board (second printed wiring board) 2nd connection terminal sub-terminal with sub-terminal 4 an 4ak 4b 5 6 Long-side loading stage thermoplastic resin film of layer gold-plated layer terminal (subsequent resin) 36 200819002 7 Ultrasonic head 8 Teflon sheet 9 Joint part 20, 20B Positioning stage 22, 22B Loading stage 24 Position control part 26 Supply mechanism 28 Holding plate 34, 34A, 34B Pressing mechanism 36 Pressing portion 38 Damping mechanism 40, 40B Ultrasonic amplifier 42 Ultrasonic vibrator 43, 43A, 43B Heating mechanism 44 Frame 50 Pressing head 52 Control unit 60, 60A, -60J First terminal 62, 62Ar - 62J Second terminal 64, 64A' - 64C Hard printed wiring board 70, 70A to 70B Flexible printed wiring board 37

Claims (1)

200819002 X. Patent application scope: 1. A method for connecting printed wiring boards, wherein connection terminals of two printed wiring boards in which at least one wiring board is a flexible printed wiring board are overlapped and connected to each other in a long side. It is characterized in that the first printed wiring board and the connection terminal are formed as a second printed wiring board in which a plurality of portions separated from the connection terminal of the first printed wiring board are separated in the longitudinal direction; b) Holding the resin between the two connection terminals and overlapping the plurality of portions; and c) pressing the two printed wiring boards while applying ultrasonic vibration in a state where the adhesive resin is not hardened, so that the connection terminal Bonding between a plurality of solid metal parts. 2. The method of joining printed wiring boards according to claim 1, wherein after the step c), the bonding resin is cured. 3. The method of joining printed wiring boards according to claim 1 or 2, which is after step c), has the following steps d); d) releasing the pressure of the subsequent resin, and then using the resin hardening. 4. In the method of connecting the printed wiring board of claim 1 or 2, in the step b), pressurizing the two connection terminals of the two printed wiring boards to perform temporary crimping; in step c), the pair is temporarily pressed. The two printed wiring boards are pressurized while applying ultrasonic vibration to perform a final pressure bonding in which the two connection terminals are joined between the solid portions of the plurality of portions. 5. The method of connecting printed wiring boards according to item 3 of the patent application, 38 200819002 In the step b), in the crimping process, the two printed wiring boards that have been temporarily crimped are subjected to super-side pressurization, so that the two connecting terminals are fixed in the plurality of parts in the step C), and the sound waves vibrate the side of the metal. Formal crimping of the joint. 6. The method of joining printed wiring boards according to claim 1, wherein the resin-based thermoplastic resin is used. Xin 7s is a method of joining printed wiring boards according to item 6 of the patent application, /, V, C), heating the thermoplastic resin to soften. 8. The method of joining printed wiring boards according to item 7 of the patent application, after the step c), further comprising the following steps; d1) releasing the pressurization of the thermoplastic resin, followed by lowering the temperature to harden the thermoplastic resin. 9. The method of connecting a printed wiring board according to item 8 of the patent application scope. In the step d-D, when the thermoplastic resin exhibits a strength of about 5% by weight of its maximum bonding strength, the pressurization of the thermoplastic resin is released. In the step b), the thermoplastic resin is heated to soften to perform temporary pressure bonding of the two printed wiring boards. The method of connecting a printed wiring board according to the first aspect of the invention, wherein the resin-based thermosetting resin is used. 12. The method of joining printed wiring boards according to the scope of claim 5, wherein in step C), the thermosetting resin is heated to a state in which adhesion can be maintained, and further has the following steps d-2); 39 200819002 D-2) The pressurization of the thermosetting resin is released, and then the temperature is raised to cure the thermosetting resin. 13) In the connection method of the printed wiring board of the eleventh application patent, in the step b), heating is performed to maintain the adhesiveness state for temporary crimping of the two printed wiring boards; in step c), in the thermal hardening In a state in which the resin is not cured, the two printed wiring boards are pressed while ultrasonic vibration is applied to perform final pressure bonding in which the connection terminals are joined between a plurality of solid metal portions. Thereafter, the temperature is raised to cure the thermosetting resin. 14. In the method of connecting the printed wiring board of the eleventh application patent, in the step b), heating is maintained to maintain the adhesive state for temporary crimping of the two printed wiring boards; in step c), in the thermal hardening In a state in which the resin is not cured, the two printed wiring boards are pressed while ultrasonic vibration is applied to perform final pressure bonding in which the connection terminals are joined between a plurality of portions of the solid metal, and further has the following step d-2) D-2) The pressurization of the thermosetting resin is released, and then the temperature is raised to cure the thermosetting resin. 1 5 - In the connection method of the printed wiring board of the invention of claim 14 in the step d-2), when the thermosetting resin exhibits a hardness of about 50% of its maximum degree of hardening, the thermosetting resin is released. Pressurize. 16. The method of joining printed wiring boards of claim 14 of the patent application's step d_2), wherein the thermosetting resin is heated by a heating furnace to be hardened. 200819002 17. In the connection method of the printed wiring board of the eleventh application of the patent application, in the step C), the connection terminal of at least one of the two printed wiring boards is heated to a temperature lower than the melting temperature of the connection terminal, and is thermally hardened. The resin does not reach the hardening temperature. 18. The method of connecting printed wiring boards according to claim 1, wherein in the step c), the ultrasonic vibration system applies the joint surface of the two connection terminals substantially in a vertical direction. For example, in the method of connecting the printed wiring board of claim 1, in the step c), the ultrasonic vibration system applies the joint surface of the two connection terminals substantially horizontally. (2) The method of connecting a printed wiring board according to the first aspect of the invention, wherein the connection terminal of the second printed wiring board has a stepped shape of a plurality of sub-terminals that are separated from each other in a longitudinal direction of the connection terminal; In b), the two connection terminals are aligned such that a plurality of sub-terminals are superposed on the connection terminals of the second printed wiring board. [21] The method of connecting a printed wiring board according to the first aspect of the patent application, wherein the connection terminal of the second printed wiring board is a waveform; and in the step b), the connection terminal of the second printed wiring board is set at a predetermined time The period is overlapped with the waveform connection terminal, and the two connection terminals are aligned. 22. The connection method of the printed wiring board according to the first application of the patent scope, the connection terminal of the 亥中°海弟2 printed wiring board is a discontinuous platform type in which the platform connected to the circuit pattern is arranged on the surface of the wiring board; In the step b), the connection terminals of the first printed wiring board are superimposed on each of the platforms of the 2008 200819002, and the two connection terminals are aligned. 23. The method of connecting printed wiring boards according to item i of the patent application, wherein the connection terminals of the second printed wiring board are arranged such that a plurality of concave portions and convex portions having a width=direction are arranged on the long side. In the step b) formed by the direction, the connection terminals of the f丨ep brush wiring board are overlapped with the respective convex portions, and the two connection terminals are aligned. In the connection device of the two types of printed wiring boards, at least the connection terminals of the two printed wiring boards in which the wiring board is a flexible printed wiring board are overlapped and connected to each other in the longitudinal direction, and are characterized in that: And a mechanism for pressing between the second connection terminal of the i-th printed wiring board and the second connection terminal of the second printed wiring board, and then bonding the two connection terminals by the tree The second connection terminal is formed as a plurality of stacks separated from the i-th connection terminal in the longitudinal direction; the ringing &amplifier mechanism applies ultrasonic vibration to the joint portion of the two connection terminals and is configured to pressurize The mechanism and the oscillating mechanism operate at the same time, and the ultrasonic vibration is applied while the two connecting terminals are pressurized by the station where the resin is not hardened, and the solid metal intermetallic joining is performed. 25. For example, the connection of the printed wiring board of the patent application 帛24 item is “At the same time, the mechanism is controlled by the mechanism of the 亥 亥 & amp , , , 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态 固态The connection device for a printed wiring board according to claim 24, further comprising a positioning mechanism that holds the second printed wiring board and the second printed wiring board in a two-connection The connection between the terminals is followed by a resin, and the second connection terminal and the fi connection terminal are overlapped at a plurality of locations in the longitudinal direction. The connection device of the printed wiring board of claim 26, wherein the positioning mechanism a positioning table that can support the second printed wiring board and is positioned on a horizontal surface, and a top of the second printed wiring board that supplies the second printed wiring board to the upper side of the second printed wiring board A connection device for a printed wiring board according to claim 24, wherein the vibration absorbing mechanism is provided with an ultrasonic wave And a supersonic vibrator mounted on the ultrasonic amplifier, the pressurizing mechanism pressurizing the two printed wiring boards through the ultrasonic amplifier. 29_Connecting device of the printed wiring board according to claim 28 of the patent scope The ultrasonic amplifier includes a heating mechanism that heats the connection portions of the two connection terminals to a temperature at which solid metal bonding can be performed under the condition that the resin is not cured. 3〇 Printing as in claim 29 The connecting device of the wiring board, wherein the control mechanism controls the heating mechanism. The connecting device of the printed wiring board of claim 25, wherein the side oscillating mechanism and the pressing mechanism are paired with the positioning mechanism Ultrasonic vibration and pressure are applied to the two printed wiring boards that are held on top to join the two connection terminals. 43 200819002 32. The connection device of the printed wiring board of claim 25, wherein the vibration absorbing mechanism is provided Heating the resin heating mechanism; the control unit controls the positioning mechanism to position the second connection terminal to be longer than the first connection terminal After the plurality of portions separated by the direction are overlapped, the pressurizing mechanism and the heating mechanism are controlled, and the two printed wiring boards are temporarily pressure-bonded to a degree that they are not easily detached while being heated by heating with the resin being able to exhibit or maintain the adhesiveness; Then, the control heating mechanism, the pressurizing mechanism, and the oscillating mechanism apply pressure and ultrasonic vibration sufficient to form a solid metal joint to the two printed wiring boards that have been temporarily crimped to perform formal crimping of the two connection terminals. The connecting device of the printed wiring board of claim 25, wherein the connecting device is composed of a temporary crimping device and a final crimping device; the temporary crimping device is provided with the positioning mechanism; and the heating and pressurizing mechanism The connection terminal of the two printed wiring boards positioned by the positioning mechanism is subjected to heating and pressurization to the extent that the resin can exhibit or maintain adhesiveness for temporary crimping; The vibrating mechanism and the pressing mechanism transmit the two stamps that have been transported from the temporary % crimping device and have been positioned and temporarily crimped Ultrasonic vibration is applied to the wiring board and pressure to bond the two connection terminals. The connecting device for a printed wiring board according to claim 24, wherein the oscillating mechanism applies ultrasonic vibration mainly in a direction perpendicular to the wiring board to the joint portions of the two connection terminals. In the connection device of the printed wiring board of claim 24, the vibration absorbing mechanism applies ultrasonic vibration mainly in the horizontal direction of the wiring board to the joint portions of the two connection terminals. 36. The connecting device of the printed wiring board according to claim 24, wherein the connecting member has a low friction material parallel to the joint portion between the vibration absorbing mechanism and the joint portion of the connecting terminals. XI. Schema: _ as the next page. 45