200817686 九、發明說明： 【發明所屬之技術領域】 本發明尤指其提供-種利用疊接排列的方， 於台板上方裝設數個對應各測試板之可滑移n叫试板，並 送機構於近供、收料端處以較短的運動行程，，構’而使得輸 送待測及完測之電子元件，進而達到有效節劣处；各轉運機構輸 提升作業速度之疊接式電子元件測試分類裝置:θ、易於維修及 【先前技術】200817686 IX. Description of the invention: [Technical field to which the invention pertains] The present invention particularly provides a method for using a stacked arrangement, and a plurality of slip-on n-test panels corresponding to the test boards are mounted above the platen, and The sending mechanism uses a short movement stroke at the near supply and the receiving end to construct the electronic components to be tested and completed, thereby achieving an effective disadvantage; the transfer mechanism of the transfer mechanism to increase the speed of the operation Component test classification device: θ, easy to repair and [prior art]
請參閱第1、2圖，其係為台灣專利申語笛 測試處理機』專利案，該測試處理機係於 851號『1C 有供料心升降器i i、空Ε/升降器丄2二2=分別裝設 升降器丄1係裝填有待測IC，空3 ’供料匣/ 座’以利放置完測之1C ’輸出匣係可細分不同等:之;出3 b // 3 C，以儲放完測之不同等級1C，數個測Ϊ埠1 4 a、 2、，l 4d係設於於齡1 〇之後端’各測試埠1 4a、 J，、1 4c、1 4d内平行排列設置具有測試 15c、l5d之測試板168、16b 巧1，、15b、 試板1 6a、！ 6b、1 6c、1 6d前端^^ 6以及於測 衝A 1 7«、1 7U 1 7 1 bd 各^又有—對待測IC旋轉緩 1 ou 、 7c、1 7d及完測Ic旋轉緩衝台1 8a、 =b、1 8c、1 8d’另一 ic輸送機構丄9係週旋於供龍/升 1 3b^ 4b' 1 4〇' 1 1 3a^ 預献E ? n 負機構間之1C輪送工作，以及可增設有 測ΐ作2 1對待測之IC於測試前進行職的作#;進行1C 5: i t f則試板1 6a、1㈣、1 6c、1 6d之測試座丄 内ΙΓ对罢Htr 5c、15d的IC放置方向與供料匣/升降器1 1 =降^置Λ向相同時，則係直接先以1C輸送機構1 9將供舰/ 开㈣1 1上之待測IC取出，並分別輸送放置於各測試座丄5&、 200817686 八別將、丨1 5 H成測試後，再* W輸送機構；[9 j將測试座15a、15b、15c、15d内完測之 依據測試絲將完狀職駐各輸 ^亚 e、=mw6a、16b、16c、16d^4fi5ia3。 5c、1 5d的1C放置方向與供料£/升降器丄工内 I時’則係先以IC輸送機構1 9將供料心升降器1 1 1 寺1 f取出，並分別輸送放置於待測IC旋轉緩衝台1 7a、 c、1 7d上，轉動待測1C旋轉緩衝台1 7a、] 7h 、1 7d之方向’使IC角位相同於各測試座工^ (卜 y =、1 5 d後’再以IC輸送機構i 9將IC放入各測試座、 15b、15c、15d内’於完成測試後，再由IC輸送 =別將測試座1 5a、1 5b、1 5c、1 5d内完測之1(：取出 放置於完測ic旋轉緩衝台18a、18b、18c 、’ ic角位相同於輸岐13a、13b、13c，接著再η 構1 9依據測試結果將完測之IC輸送至各輸出gl % ^機 1 3c置放；該測試處理機之設計架構具有如下之缺弊·· 、 1 ·該測試處理機之各測試埠丄4a、i 4b、丄4e' · , 行排列設置測試板i 6a、i 6b、丄6c、工6d，以及平= 排列设置相對應之待測IC旋轉緩衝台iya、i7b 1 7d及完測ic旋轉緩衝台工8a、工8b、工8c、' c、 因此整體的機體會顯得相當龐大，尤其因絲而增設測試痒 時，將使得機體不斷向兩侧擴充，而機體過大時即產生廠戶 空間不敷使用的情形，因此體積大及佔空間是其問題之二了 該測試處理機之各測試埠1 4a、1 4b、1 4d#° 行排列設置，且各相鄰之測試埠1 4a、1 4b、丄 d係緊密相連，因此除了兩最外側之測試埠具有空間^維修人 員靠近維修外，其餘内側之測試埠將非常不易進入維修，/因 此不易維修是其問題之二。 、> 2 200817686 3 .該測試處理機不論其測試座丄5a、 職置方向與供料E/升降器1 1内Ic放置上5d的 其^係有賴單—組職職m ’ 之待測1C分別輪送放置於各測試 ^降-11上 而無法依_铸雜觸的進行IG 、^ ’ 有鑑於二:發其 ，前所面臨之問題深====;: ί;Γ·類裝置，效改==== 【發明内容】 置，目的係提供—種疊接式電子树測試分類裝 =S5HSSS= 二之5ί 括:位，:^測=類L 機構『該ϊϊ測跑以及對應各測試區之數個轉運 個具有測試座之職板，使得各_之__=$ 200817686 ί修:Ϊ2於側方具有空間供維修人員進入維修 ，進而達到易於 置，目的係提供—種疊接式電子元件測試分類裝 端之^送機^ 供料E、收料s、近供、收料 機構；該數_二二23以及對應各測試區之數個轉運 數個且有懒^#於°板下方以非直線疊接制的方式裝設 另於供、收料端及各測試端間，各自以不同距 53：^ ^ 件’使得輸賴構健於近供、 ϊϊίί ΐ運動行程，對應各轉運機構輸送待測及完測之 而移動至測試區，進而依據時序安排順暢的進行 ^讀的輸送健，達到提升健 【實施方式】 ϋϋ貴審查委員對本發明有進—步之深人瞭解，兹例舉-較佳貫鉍例，並配合圖式說明如后： 請參_3、4®，本發明包括有位於機台前端之供料g ff,:收料531a、31b、3lc、31(1、空&3 2、近供、 收料端之輸送機構3 3、數個疊接之測試區3 4a、34b、34c、 3 4d、3 4e、3 4f、3 4g、3 4h以及對應各測試區之數個韓 ^35a>35b>35c^5d^35e>35f^35g ? 5h ;該供料匣3 〇係承置有待測電子元件，空匣3 2則接收由供 料匣30使用完之空的供料匣，並可依需要取出至收料匣31， 以利放置完測之1C，收料匣係可細分不同等級之收料匣3 1&、3 lb、31c、31d’以儲放完測之不同等級電子元件，另可辦嗖 有預熱匣3 6，以於需要時對待測之電子元件於測試前進行預曰^ 的作業，數個測試區3 4a、3 4b、3 4c、3 4d、3 4e、3'4 f、3 4g、3 4h係於機台台板4 〇下方以非直線疊接排列的方 裝設數個具有測試座341a、341b、341c、3 4 Id、^ 41e、341f、341g、34 lh 之測試板 3 4 2a、3 4 2b、 200817686 342c、342d、342e、342f、342g、342h，機 台台板4 0相對應測試座341a、341b、341c、 341e、341f、341g、34 lh位置並開設有貫穿槽，以 使測試座 341a、341b、341c、341d、3 41 e、曰 34 1 f、3 4 lg、3 4 lh可裸露出機台台板4 0，再於機台台板4 0 上方對應測試座 341a、341b、341c、341d、34： le、341f、341g、341h位置裝設可升降之下壓測試頭 343a、343b、343c、343d、343e、343f、3 4 3g、3 4 3h，該下壓測試頭 3 4 3a、343b、343c、3 43d、343e、343卜343g、34 3h係可為具升降之取 放器或下壓頭，該各測試區3 4a、3 4b、3 4c、3 4d、3 4e、 3 4f、3 4g、3 4h可採部分重疊或不重疊的非直線疊接排列方 式，均可使各測試區之間非為緊緊相鄰之型態，而各自於側方具 有空間供維修人員進入維修，達到易於維修之目的，且當採部分 重疊的疊接排列方式時，更可有效減少機體的體積，進而節省放 置機台之空間；數個轉運機構3 5a、3 5b、3 5c、3 5d、3 5e、3 5f、3 5g、3 5h係設置於台板4 0上方，並分別對應 各測試區之測試座341a、341b、341c、341d、34 le、341f、341g、34 1 h位置，各轉運機構具有可滑移 之供料載台 3 51a、351b、351c、351d、351e、3 5 If、3 5 lg、3 5 lh及收料載台 3 5 2a、3 5 2b、3 5 2 c、352d、352e、352f、352g、352h，並可分別 滑移於機台前端之供、收料端及各測試座端間，而各自以不同距 離承載，送待測及完測之電子元件，或該各轉運機構亦可為雙吸 嘴的型態，以供、收移載電子元件，由於轉運機構3 5a、3 5b、 35c、35d、35e、35f、35g、3 5h係可轉運電子元件 於近供、收料端及各測試座341a、341b、341c、341 41e、34lf、341g、341h 間，因此輸送機構 3 3 只需設置於近供、收料端處，並移動於供料匣3 〇、收料匣3 1 a、 9 200817686Please refer to Figures 1 and 2, which are patents for the Taiwan Patent Application Flute Tester. The test handler is at No. 851 "1C with feed center lift ii, open/lifter 丄 2 2 2 = separately installed lifter 系 1 is loaded with IC to be tested, empty 3 'feed 匣 / seat' to facilitate the placement of the measured 1C 'output 匣 system can be subdivided differently; 3 b / 3 C, According to the different grades of 1C stored and stored, several test Ϊ埠1 4 a, 2, and l 4d are set at the end of the age of 1 〇, each test 埠1 4a, J,, 14c, 14d parallel Arrange the test boards 168, 16b, 1, 15b, test board 16 6 with test 15c, l5d, ! 6b, 1 6c, 1 6d front end ^^ 6 and in the test A 1 7«, 1 7U 1 7 1 bd each ^ there are - to test the IC rotation slow 1 ou, 7c, 1 7d and complete Ic rotary buffer 1 8a, =b, 1 8c, 1 8d' Another ic transport mechanism 丄9 system is rotated around the supply dragon / liter 1 3b ^ 4b' 1 4 〇 ' 1 1 3a ^ Pre-E? n 1C round between the negative mechanism Send work, and can add test ΐ 2 1 IC to be tested before the test work; 1C 5: itf test board 1 6a, 1 (four), 16 6, 16d test 丄When the IC placement direction of Htr 5c and 15d is the same as that of the supply/lifter 1 1 = drop, the IC to be tested is taken out directly by the 1C transport mechanism 1 1 . And transported separately in each test stand 丄 5 &, 200817686 八别将, 丨 1 5 H into the test, and then * W transport mechanism; [9 j will test the test stand 15a, 15b, 15c, 15d According to the test wire, it will be stationed in each of the sub-e, =mw6a, 16b, 16c, 16d^4fi5ia3. 5C, 1 5d 1C placement direction and feeding / / lifter completion I time ' is first taken by the IC transport mechanism 1 9 feed center lift 1 1 1 Temple 1 f, and respectively placed and placed On the test IC rotation buffer table 1 7a, c, 1 7d, turn the direction of the 1C rotary buffer table 1 7a, 7h, 1 7d to be tested to make the IC corner position the same as the test bench ^ (Bu y =, 1 5 After d', IC is placed in each test stand, 15b, 15c, 15d by IC transport mechanism i9. After the test is completed, the IC is transported. = Test stand 1 5a, 1 5b, 15c, 15d Internal measurement 1 (: taken out after the test ic rotary buffer table 18a, 18b, 18c, 'ic angle is the same as the input 13a, 13b, 13c, and then η structure 1 9 according to the test results will be completed IC It is delivered to each output gl % ^ machine 1 3c; the design of the test processor has the following drawbacks: · 1 · Each test of the test processor 埠丄 4a, i 4b, 丄 4e ' · , Arrange the test boards i 6a, i 6b, 丄 6c, work 6d, and flat = arrange the corresponding IC rotation buffer table iya, i7b 1 7d and the test ic rotation buffer bench 8a, 8b, 8c , 'c, therefore The body of the body will appear quite large, especially when the test itching is added due to the silk, the body will continue to expand to both sides, and when the body is too large, the situation that the factory space is not enough will be used, so the volume is large and the space is the problem. The test 埠1 4a, 14b, 1 4d#° row arrangement of the test processor is arranged, and the adjacent test 埠14a, 14b, 丄d are closely connected, so except for the two outermost sides Test 埠 has space ^ maintenance personnel close to maintenance, the remaining inner test 埠 will be very difficult to enter maintenance, / therefore difficult to repair is the second problem., > 2 200817686 3. The test processor regardless of its test 丄 5a, The position of the job and the supply E/lifter 1 1 Ic placed on the 5d of the ^ system depends on the single - group job m ' to be tested 1C respectively placed on each test ^ drop -11 and can not be cast IG, ^ ' of the miscellaneous touches. In view of the second: the issue, the problem faced before is deep ====;: ί; Γ · class device, effect change ==== [invention content] set, the purpose is to provide - A type of spliced electronic tree test classification = S5HSSS = 2 of 5 ί including: bit, : ^ test = class L mechanism The test run and several transfer pieces corresponding to each test area have a test seat, so that each __=$200817686 修 repair: Ϊ2 has space on the side for maintenance personnel to enter the repair, thereby achieving easy setting, The purpose is to provide a kind of splicing type electronic component test classification and delivery machine ^ feeding material E, receiving s, near supply, receiving mechanism; the number _ 22 2 and several transfer numbers corresponding to each test area And lazy ^# under the ° plate is installed in a non-linear stacking system, and between the supply and receiving ends and the test ends, each with a different distance of 53: ^ ^ pieces 'make the structure Supply, ϊϊίί ΐ movement stroke, corresponding to each transport mechanism to be tested and completed to move to the test area, and then smoothly according to the scheduling of the transfer of the health of the health, to achieve improved [implementation] There is a deeper understanding of the steps, as exemplified - better examples, and with the following description: Please refer to _3, 4®, the present invention includes a feed g ff located at the front end of the machine, Receiving 531a, 31b, 3lc, 31 (1, empty & 3 2, near supply, receiving end of the delivery 3 3, several stacked test areas 3 4a, 34b, 34c, 3 4d, 3 4e, 3 4f, 3 4g, 3 4h and several Han corresponding to each test area ^ 35a > 35b > 35c ^ 5d ^ 35e>35f^35g ? 5h; the supply 匣3 承 is equipped with electronic components to be tested, and the empty 匣3 receives the empty supply hopper used by the supply 匣30, and can be taken out as needed Material 匣 31, in order to place the measured 1C, the receiving 匣 can subdivide different levels of receiving 匣 3 1 &, 3 lb, 31c, 31d' to store the measured different levels of electronic components, another can be done There are preheating 匣 3 6 to perform the pre-processing of the electronic components to be tested before the test, and several test areas 3 4a, 3 4b, 3 4c, 3 4d, 3 4e, 3'4 f, 3 4g, 3 4h are placed under the machine table 4 〇 under the non-linear overlapping arrangement of several test sets 341a, 341b, 341c, 3 4 Id, ^ 41e, 341f, 341g, 34 lh The plates 3 4 2a, 3 4 2b, 200817686 342c, 342d, 342e, 342f, 342g, 342h, the machine table 4 0 corresponding to the test seats 341a, 341b, 341c, 341e, 341f, 341g, 34 lh position and open Through the slot to make the test seat 341a, 341b, 341c, 341d, 3 41 e, 曰 34 1 f, 3 4 lg, 3 4 lh can expose the machine table 40, and then the test seats 341a, 341b above the machine table 40 341c, 341d, 34: le, 341f, 341g, 341h position can be installed with the lower and lower pressure test heads 343a, 343b, 343c, 343d, 343e, 343f, 3 4 3g, 3 4 3h, the pressing test head 3 4 3a, 343b, 343c, 3 43d, 343e, 343, 343g, 34 3h may be a pick-and-place picker or a lower pressing head, and the test zones 34a, 3 4b, 3 4c, 3 4d, 3 4e, 3 4f, 3 4g, 3 4h can be partially overlapped or non-overlapping non-linear splicing arrangement, which can make the test areas not closely adjacent, and each has space on the side for maintenance Personnel enters the maintenance to achieve the purpose of easy maintenance, and when the overlapping overlapping arrangement is adopted, the volume of the body can be effectively reduced, thereby saving space for placing the machine; several transfer mechanisms 3 5a, 3 5b, 3 5c 3 5d, 3 5e, 3 5f, 3 5g, and 3 5h are disposed above the platen 40 and correspond to the test seats 341a, 341b, 341c, 341d, 34 le, 341 of the test areas, respectively. f, 341g, 34 1 h position, each transport mechanism has a slippery feeding stage 3 51a, 351b, 351c, 351d, 351e, 3 5 If, 3 5 lg, 3 5 lh and receiving stage 3 5 2a, 3 5 2b, 3 5 2 c, 352d, 352e, 352f, 352g, 352h, and can be respectively slipped between the supply and receiving ends of the front end of the machine and the test end, and each is carried at a different distance. The electronic components to be tested and completed, or the transporting mechanisms may also be in the form of double nozzles for feeding and receiving electronic components, due to the transport mechanisms 3 5a, 3 5b, 35c, 35d, 35e, 35f 35g, 35h are transportable electronic components between the near supply and receiving ends and the test seats 341a, 341b, 341c, 341 41e, 34lf, 341g, 341h, so the transport mechanism 3 3 only needs to be set to near supply and receive At the material end, and moved to the supply 匣3 〇, receiving 匣3 1 a, 9 200817686
Ub、、UCf、3Λά及各轉運機構3 5a、3 5b、3 5c、3 5d、 測，、隹而甘5g、3 5h間之小區域範圍内，而無需移動至 序ϋ順暢的:隹—^取放器3 3 1可以較短的運動行程，依據時 的輸送作業’達到提升作業速度之目的;請 =本發明其中—載台式之轉運 ϊ at；:: ^3 5 2a'3 ㈣客，曰：U E2僅可由弟一驅動源3 5 3 a帶動作直 電ΐ元件放VI弟二驅動源3 5 4a帶動旋轉’以於測試座的 與供料四電子元件放，〇料 元株ί 惟當測試座的電子树放置方向與供料£内電子 ϊΓίί 同時，則無需使供料載台3 5 la及收料載台3 5 乙a万疋轉。 3 4a^w,j^ 置轉運麟3 5a可將供料載台3 5 laJ^ ㈣“電子兀巧移运至測試座3 4 1 a上方之下壓測試頭3 4 3a 雷早供^壓測試頭3 4 3a下降取出待測電子元件，並將待測 成二％下堅β置入測試座3 4 1 a⑺執行測試作業，當電子元件完 3減後吓_試頭3 4 3a再取出電子元件並放置於轉運機構 a之收料載台3 5 2a内，再於轉運機構3以之 5 la=取出T—雜測電子元件，㈣成f子元叙4 二=參閲第6圖，當轉運機構3 5a滑移回至供、收料端位 構3 3上之一取放器3 3 1將會於供料E 3 0内取出 ί H 件4 2。請參閱第7 ®，#轉運機構3以滑移回至 置f，輪送機構3 3上之取放11 3 3 1將會移動至 UfiL處’將取放113 31上之待測電子元件42置入於 3 ^ 9 D — la上’而其上之另一取放器3 3 1則取出收料載台 a * 完測之電子元件4 1。請參閱第8圖，當轉運機構3 5 二成^測之電子元件4 2及完測之電子元件4工之交換後即移 仏、收料端，輸送機構3 3即依據測試結果將完測之電子元件 200817686 移送至收料匣3la、3ib、31c、 之轉運機構3 5 b、3 5c、3 5d、3 5e、3^fm組 亦相同由該輸送機構3 3進行待測之電子m P: _mm機構3 3只需移動於近供、 乾圍内，而無需移動至測試區，因此 ，構3 5a、3 5b、3 5c、3 5d、口 开）_免造成部份測試區待機的^ 形’達到斯健速度及生產效率之目的。 、匕传械_ 作掌=，’ ίΓ不僅可有效節省空間、易於維修，且有效提升 1C測試處理機』專 1C测試處理機』專 深具實用性及進步性之設計，縣見有相同之 /圖口式從而允符發明_請要件，爰依法提出申請。 第1圖：係為台灣專利申請第91105851號 ^ 利案之配置示意圖。 第3圖 第4圖 第5圖 第6圖 第7圖 第8圖 第2圖·係為台灣專利申請第911〇5851號 利案之部分外觀示意圖。 本發明之架構示意圖。 本發明單一測試區之示意圖。 本發明轉運機構之示意圖。 本發明輸送機構移動之示意圖（一） 本發明輸送機構移動之示意圖（二） 【主要4¾構移動之示意圖(三） 習式部份： 1 2 :空匣/升降器 } 2 ，台 1 ί :供料!£/升降器 14a、14b、i4c、14d =、15b、l5c、15d 1 6a、1 6b、1 6c、i 6d l3a、13b、l3c:輸出更 測試埠 測試座 測試板 200817686 1 7a、1 7b、1 7c、1 7d:待測1C旋轉緩衝台 1 8a、1 8b、1 8c、1 8d:完測 IC旋轉緩衝^ 19: IC輸送機構 ° 2 0 :預熱匣 本發明部份： 3 0 :供料匣 31a、31b、31c、31d:收料匣 3 2 :空匣 3 3 :輸送機構 3 31 :取放器 34a、34b、34c、34d、34e、34f、34g、34h :測試區 341a、341b、341c、341d、341e、341f、3 4 1 g、3 4 1 h :測試座 342a、342b、342c、34 2d、342e、342f、3 4 2g、3 4 2h :測試板 343a、343b、343c、343d、343e、343f、3 4 3g、3 4 3h :下壓測試頭 35a、35b、35c、35d、35e、35f、35g、35h :轉運機構 351a、351b、351c、351d、351e、351f、3 5 lg、3 5 lh :供料載台 35 2a、35 2b、352c、35 2d、35 2e、352f、3 5 2g、3 5 2h:收料載台 3 5 3a :第一驅動源 3 5 4a ··第二驅動源 3 6 :預熱匣 4 0 ··台板 41 :電子元件 4 2 :電子元件 12Ub, UCf, 3Λά and each transport mechanism 3 5a, 3 5b, 3 5c, 3 5d, measured, 隹 隹 甘 5g, 3 5h within a small area, without moving to the order of smooth: 隹 - ^The pick-and-placer 3 3 1 can take a short movement stroke, and the conveying operation according to the time can be used to achieve the purpose of lifting the working speed; please = the present invention - the carrier of the carrier ϊ at;:: ^3 5 2a'3 (four) , 曰: U E2 can only be driven by the brother of a driving source 3 5 3 a with a direct action ΐ component put VI brother two drive source 3 5 4a to drive the rotation 'for the test seat and the supply of four electronic components, the material element ί Only when the electronic tree in the test stand is placed in the direction of the electronic ϊΓίί, the feeding stage 3 5 la and the receiving stage 3 5 need not be turned. 3 4a^w,j^ Transferring Lin 3 5a can supply the carrier 3 5 laJ^ (4) "Electronically handed to the test seat 3 4 1 a above the pressure test head 3 4 3a Lei early supply pressure The test head 3 4 3a is lowered to take out the electronic component to be tested, and the test piece to be tested is placed into the test seat 3 4 1 a (7) to perform the test operation, and when the electronic component is finished 3 minus, the test piece 3 4 3a is taken out again. The electronic component is placed in the receiving stage 3 5 2a of the transporting mechanism a, and then the transporting mechanism 3 takes 5 la = takes out the T-missing electronic component, and (4) becomes the f-sub-dimension 4 2 = see Figure 6 When the transfer mechanism 35a slides back to the supply and receiving end position 3 3, the pick-and-placer 3 3 1 will take out the ίH piece 4 2 in the feed E 3 0. See section 7 ®, #交通机构3 slides back to set f, pick and place 11 3 3 1 on the transfer mechanism 3 3 will move to UfiL 'put the electronic component 42 to be tested on the access 113 113 into 3 ^ 9 D — la on ' and another pick-and-placer 3 3 1 on it takes out the receiving stage a * The finished electronic component 4 1 . Please refer to Figure 8 when the transfer mechanism 3 5 After the exchange of the component 4 2 and the completed electronic component 4 At the end, the transport mechanism 3 3 transfers the completed electronic component 200817686 to the receiving buffers 3la, 3ib, 31c according to the test result, and the transfer mechanisms 3 5 b, 3 5c, 3 5d, 3 5e, 3^fm are also the same. The electrons to be tested by the transport mechanism 33: the _mm mechanism 3 3 only needs to move in the near supply and the inner circumference without moving to the test area, and therefore, the structures 35a, 3 5b, 3 5c, 3 5d , mouth open) _ avoid the part of the test area standby ^ shape 'to achieve the speed and productivity of the purpose. 匕 匕 _ _ _ _ _ _ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ Γ The test processor "Special 1C Test Processor" is designed for practical and progressive design. The county has the same / map type to allow for the invention _ please, please apply according to law. Figure 1: Taiwan Patent Application No. 91105851 ^ Schematic diagram of the configuration. Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 2 Schematic diagram of the architecture of the present invention. Schematic diagram of a single test zone of the present invention. Schematic diagram of the transport mechanism (1) Schematic diagram of the movement of the transport mechanism of the present invention (2) Schematic diagram of the movement of the transport mechanism of the present invention (2) Schematic diagram of the main 43⁄4 structure movement (3) Formula: 1 2: Open/lifter} 2 , station 1 ί : feeding! £ / lifter 14a, 14b, i4c, 14d =, 15b, l5c, 15d 1 6a, 1 6b, 1 6c, i 6d l3a, 13b, l3c: output test 埠 test seat test Board 200817686 1 7a, 1 7b, 1 7c, 1 7d: 1C rotary buffer table to be tested 1 8a, 1 8b, 1 8c, 1 8d: Complete IC rotation buffer ^ 19: IC transport mechanism ° 2 0 : Preheat 匣Part of the invention: 3 0 : supply 匣 31a, 31b, 31c, 31d: receiving 匣 3 2 : empty 匣 3 3 : conveying mechanism 3 31 : pickers 34a, 34b, 34c, 34d, 34e, 34f, 34g, 34h: test zones 341a, 341b, 341c, 341d, 341e, 341f, 3 4 1 g, 3 4 1 h : test seats 342a, 342b, 342c, 34 2d, 342e, 342f, 3 4 2g, 3 4 2h : test plates 343a, 343b, 343c, 343d, 343e, 343f, 3 4 3g, 3 4 3h : pressing test heads 35a, 35b, 35c, 35d, 35e, 35f, 35g, 35h: transport mechanisms 351a, 351b, 351c , 351d, 351e, 351f, 3 5 Lg, 3 5 lh : feeding stage 35 2a, 35 2b, 352c, 35 2d, 35 2e, 352f, 3 5 2g, 3 5 2h: receiving stage 3 5 3a: first driving source 3 5 4a ·Second driving source 3 6 : Preheating 匣 4 0 · Platen 41 : Electronic component 4 2 : Electronic component 12