TW200817116A - A structure for combining a heat pipe and a radiation fin, and a manufacturing method thereof - Google Patents
A structure for combining a heat pipe and a radiation fin, and a manufacturing method thereof Download PDFInfo
- Publication number
- TW200817116A TW200817116A TW95137151A TW95137151A TW200817116A TW 200817116 A TW200817116 A TW 200817116A TW 95137151 A TW95137151 A TW 95137151A TW 95137151 A TW95137151 A TW 95137151A TW 200817116 A TW200817116 A TW 200817116A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat pipe
- dissipating
- pipe
- fin
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 230000005855 radiation Effects 0.000 title abstract 10
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 13
- 230000005494 condensation Effects 0.000 claims description 5
- 238000009833 condensation Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 13
- 230000007613 environmental effect Effects 0.000 description 2
- 241000125205 Anethum Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 241000239226 Scorpiones Species 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 208000037805 labour Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010865 sewage Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95137151A TW200817116A (en) | 2006-10-05 | 2006-10-05 | A structure for combining a heat pipe and a radiation fin, and a manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95137151A TW200817116A (en) | 2006-10-05 | 2006-10-05 | A structure for combining a heat pipe and a radiation fin, and a manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200817116A true TW200817116A (en) | 2008-04-16 |
| TWI313203B TWI313203B (enrdf_load_stackoverflow) | 2009-08-11 |
Family
ID=44769272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95137151A TW200817116A (en) | 2006-10-05 | 2006-10-05 | A structure for combining a heat pipe and a radiation fin, and a manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200817116A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114060139A (zh) * | 2021-07-30 | 2022-02-18 | 艾酷沃(山东)新材料有限公司 | 一种能够调节风量的汽车散热器及其制造方法 |
-
2006
- 2006-10-05 TW TW95137151A patent/TW200817116A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114060139A (zh) * | 2021-07-30 | 2022-02-18 | 艾酷沃(山东)新材料有限公司 | 一种能够调节风量的汽车散热器及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI313203B (enrdf_load_stackoverflow) | 2009-08-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |