TW200813659A - Stage apparatus, exposure apparatus, and method for manufacturing device - Google Patents
Stage apparatus, exposure apparatus, and method for manufacturing device Download PDFInfo
- Publication number
- TW200813659A TW200813659A TW096118814A TW96118814A TW200813659A TW 200813659 A TW200813659 A TW 200813659A TW 096118814 A TW096118814 A TW 096118814A TW 96118814 A TW96118814 A TW 96118814A TW 200813659 A TW200813659 A TW 200813659A
- Authority
- TW
- Taiwan
- Prior art keywords
- machine
- axis
- adjustment
- adjustment member
- movable range
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000000034 method Methods 0.000 title description 8
- 230000003287 optical effect Effects 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 8
- 238000005286 illumination Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 210000002784 stomach Anatomy 0.000 claims 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 52
- 230000001133 acceleration Effects 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 14
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- KJONHKAYOJNZEC-UHFFFAOYSA-N nitrazepam Chemical compound C12=CC([N+](=O)[O-])=CC=C2NC(=O)CN=C1C1=CC=CC=C1 KJONHKAYOJNZEC-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000005453 pelletization Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006161644A JP2007329435A (ja) | 2006-06-09 | 2006-06-09 | ステージ装置、露光装置及びデバイス製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200813659A true TW200813659A (en) | 2008-03-16 |
Family
ID=38821169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096118814A TW200813659A (en) | 2006-06-09 | 2007-05-25 | Stage apparatus, exposure apparatus, and method for manufacturing device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7907256B2 (enExample) |
| JP (1) | JP2007329435A (enExample) |
| KR (1) | KR100895640B1 (enExample) |
| TW (1) | TW200813659A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI384340B (zh) * | 2008-04-15 | 2013-02-01 | Ind Tech Res Inst | 加工機台 |
| CN107656101A (zh) * | 2017-09-27 | 2018-02-02 | 上海旻艾信息科技有限公司 | 一种用于半导体测试旋转机架的旋转机构 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1036898A1 (nl) * | 2008-05-21 | 2009-11-24 | Asml Netherlands Bv | Substrate table, sensor and method. |
| KR100971323B1 (ko) | 2008-08-21 | 2010-07-20 | 주식회사 동부하이텍 | 노광공정에서 레티클의 회전량 및 시프트량의 다중보정을 위한 레티클 스테이지 및 이를 이용한 다중보정방법 |
| JP5606039B2 (ja) * | 2009-10-26 | 2014-10-15 | キヤノン株式会社 | ステージ装置及び波面収差測定装置 |
| KR20130040805A (ko) * | 2010-04-07 | 2013-04-24 | 가부시키가이샤 야스카와덴키 | θＺ 구동 장치 및 스테이지 장치 |
| JP6181956B2 (ja) * | 2013-03-26 | 2017-08-16 | キヤノン株式会社 | ステージ装置、リソグラフィ装置及びデバイス製造方法 |
| US10192773B2 (en) * | 2016-06-20 | 2019-01-29 | Nexperia B.V. | Semiconductor device positioning system and method for semiconductor device positioning |
| JP7022527B2 (ja) * | 2017-07-07 | 2022-02-18 | キヤノン株式会社 | ステージ装置、リソグラフィ装置、および物品製造方法 |
| JP7557329B2 (ja) * | 2020-10-07 | 2024-09-27 | キヤノン株式会社 | 位置決め装置、リソグラフィ装置及び物品の製造方法 |
| CN114562709B (zh) * | 2022-03-14 | 2023-04-25 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 底部照明模块调节装置 |
| JP7759295B2 (ja) * | 2022-04-28 | 2025-10-23 | キヤノン株式会社 | ステージ装置、転写装置および物品製造方法 |
| CN115789590A (zh) * | 2022-12-16 | 2023-03-14 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | 一种底部照明模块调节装置 |
| CN116661256A (zh) * | 2023-05-22 | 2023-08-29 | 上海赐兴微电子技术有限公司 | 一种精密工作台的装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60032568T2 (de) * | 1999-12-01 | 2007-10-04 | Asml Netherlands B.V. | Positionierungsapparat und damit versehener lithographischer Apparat |
| JP2003022960A (ja) * | 2001-07-09 | 2003-01-24 | Canon Inc | ステージ装置及びその駆動方法 |
| JP4307288B2 (ja) | 2004-02-25 | 2009-08-05 | キヤノン株式会社 | 位置決め装置 |
| JP3950861B2 (ja) * | 2004-02-25 | 2007-08-01 | キヤノン株式会社 | 位置決め装置及び露光装置 |
| FR2872878B1 (fr) | 2004-07-07 | 2008-07-04 | Hutchinson Sa | Support antivibratoire hydraulique pilotable |
-
2006
- 2006-06-09 JP JP2006161644A patent/JP2007329435A/ja not_active Withdrawn
-
2007
- 2007-05-25 TW TW096118814A patent/TW200813659A/zh unknown
- 2007-06-04 US US11/757,771 patent/US7907256B2/en not_active Expired - Fee Related
- 2007-06-08 KR KR1020070055792A patent/KR100895640B1/ko not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI384340B (zh) * | 2008-04-15 | 2013-02-01 | Ind Tech Res Inst | 加工機台 |
| CN107656101A (zh) * | 2017-09-27 | 2018-02-02 | 上海旻艾信息科技有限公司 | 一种用于半导体测试旋转机架的旋转机构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007329435A (ja) | 2007-12-20 |
| KR100895640B1 (ko) | 2009-05-07 |
| KR20070118026A (ko) | 2007-12-13 |
| US20070284950A1 (en) | 2007-12-13 |
| US7907256B2 (en) | 2011-03-15 |
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