TW200812924A - Cutting apparatus - Google Patents

Cutting apparatus Download PDF

Info

Publication number
TW200812924A
TW200812924A TW096126441A TW96126441A TW200812924A TW 200812924 A TW200812924 A TW 200812924A TW 096126441 A TW096126441 A TW 096126441A TW 96126441 A TW96126441 A TW 96126441A TW 200812924 A TW200812924 A TW 200812924A
Authority
TW
Taiwan
Prior art keywords
cutting
cut
cutting tool
temperature
glass
Prior art date
Application number
TW096126441A
Other languages
English (en)
Chinese (zh)
Inventor
Masaaki Takita
Original Assignee
Takita Res & Dev Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2007/063969 external-priority patent/WO2008010457A1/ja
Application filed by Takita Res & Dev Co Ltd filed Critical Takita Res & Dev Co Ltd
Publication of TW200812924A publication Critical patent/TW200812924A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
TW096126441A 2006-07-20 2007-07-19 Cutting apparatus TW200812924A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006198666 2006-07-20
PCT/JP2006/316192 WO2008010303A1 (fr) 2006-07-20 2006-08-17 Dispositif de coupe
PCT/JP2007/063969 WO2008010457A1 (fr) 2006-07-20 2007-07-13 appareil de découpe

Publications (1)

Publication Number Publication Date
TW200812924A true TW200812924A (en) 2008-03-16

Family

ID=38956639

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096126441A TW200812924A (en) 2006-07-20 2007-07-19 Cutting apparatus

Country Status (5)

Country Link
JP (1) JP4414473B2 (ja)
KR (1) KR101069621B1 (ja)
CN (1) CN101489746B (ja)
TW (1) TW200812924A (ja)
WO (1) WO2008010303A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414365B (zh) * 2009-06-09 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Cooling the nozzle and the cooling method using the nozzle and the cutting method of the brittle material substrate
TWI456647B (zh) * 2011-05-09 2014-10-11 Mitsuboshi Diamond Ind Co Ltd 刻劃裝置
TWI547346B (zh) * 2014-01-27 2016-09-01 rong-feng Lin Method of processing glass

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102749746B (zh) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 液晶基板切割装置及液晶基板切割方法
KR101405442B1 (ko) * 2012-08-01 2014-06-13 주식회사 라미넥스 고주파 유도 가열기를 이용한 유리 모서리 가공 방법 및 장치
KR101420627B1 (ko) * 2013-04-10 2014-07-17 박명아 유리 기판 열 커팅 장치
TWI471279B (zh) * 2013-04-22 2015-02-01 Taiwan Mitsuboshi Diamond Ind Co Ltd 用於一化學強化玻璃基板之加工方法及加工設備
CN104045230A (zh) * 2014-07-05 2014-09-17 蚌埠玻璃工业设计研究院 一种超薄与超厚平板玻璃切割方法
KR102219324B1 (ko) * 2014-10-16 2021-02-22 동우 화인켐 주식회사 유리 면취가공용 발열장치
KR20160001892U (ko) * 2014-11-25 2016-06-02 동우 화인켐 주식회사 유리 기판 모서리 가공 장치
CN104678897B (zh) * 2015-01-27 2017-10-27 合肥京东方光电科技有限公司 监控装置及方法、显示基板切割及磨边装置
CN105058605B (zh) * 2015-08-02 2017-08-29 河南鸿昌电子有限公司 一种线切割机和半导体晶棒的线切割方法
KR101969164B1 (ko) * 2018-10-22 2019-08-13 오진옥 높이 조절이 가능한 원형 톱날 절단 장치
CN110480321A (zh) * 2019-10-12 2019-11-22 崔少华 一种圆柱形锂离子电池拆解新工艺
KR102391577B1 (ko) * 2020-01-22 2022-04-28 삼성전기주식회사 세라믹 부품의 제조 방법 및 이의 제조 장치
CN112306121A (zh) * 2020-10-15 2021-02-02 凯盛君恒有限公司 一种玻璃管切割温度控制系统与方法
KR102589337B1 (ko) * 2021-10-01 2023-10-16 (주)하나기술 초박막 유리 절단 장치 및 이를 이용한 절단 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0388690U (ja) * 1989-12-25 1991-09-10
JPH08276398A (ja) * 1995-04-10 1996-10-22 Ricoh Co Ltd 基板分割方法及び基板分割装置
JP2001079794A (ja) * 1999-09-07 2001-03-27 Ricoh Co Ltd 液晶基板シート切断機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414365B (zh) * 2009-06-09 2013-11-11 Mitsuboshi Diamond Ind Co Ltd Cooling the nozzle and the cooling method using the nozzle and the cutting method of the brittle material substrate
TWI456647B (zh) * 2011-05-09 2014-10-11 Mitsuboshi Diamond Ind Co Ltd 刻劃裝置
TWI547346B (zh) * 2014-01-27 2016-09-01 rong-feng Lin Method of processing glass

Also Published As

Publication number Publication date
JP4414473B2 (ja) 2010-02-10
WO2008010303A1 (fr) 2008-01-24
JPWO2008010457A1 (ja) 2009-12-17
CN101489746A (zh) 2009-07-22
KR101069621B1 (ko) 2011-10-05
KR20090023678A (ko) 2009-03-05
CN101489746B (zh) 2012-02-08

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