TW200810655A - Flexible printed wiring board and electrical connection apparatus - Google Patents

Abstract

Disclosed is a flexible circuit board wherein the mechanical strength of an internal conductive path is increased by suppressing increase in electrical resistance of the internal conductive path. The flexible circuit board comprises a flexible insulating synthetic resin film and a conductive path arranged on or inside the film. The conductive path has a multilayer structure composed of a first conductive material layer and a second conductive material layer which has higher toughness than the first conductive material layer.

Description

200810655 IX. Description of the Invention: Technical Field The present invention relates to an electric connection test and an electric connection device which are often suitable for use in a flat object to be inspected such as an integrated circuit or a substrate for a display device. A flexible wiring board that connects the devices. [Prior Art]

A flexible wiring board (fwb) such as a flexible (four) circuit board (FPCB) can be used as a flat plate for a substrate such as a dragon circuit or a display device, in addition to a flexible circuit that can be used to connect terminals. The probe piece body of the probe piece of the electrical connection device of the electrical test of the test object. A conventional electrical connection device of this type includes a rigid wiring board (rwb), a block that is elastically supported by the rabbit yellow member on the hard f wiring board, and a probe sheet whose back 1 is supported by the block. The probe piece has a probe sheet body and a plurality of contacts protruding from the surface of the probe sheet body. Therefore, in the probe body, a bent portion is formed along the edge portion of the block. However, the conductive circuit of the aforementioned probe sheet is formed of copper = having excellent conductivity. Here, the bent portion of the probe piece main body having the conductive circuit which is bent along the edge portion of the block body generates a strong bending force. Further, in the case where the probe # is formed or when the probe piece is fixed to the block, a strong pressing force acts on the conductive circuit to generate a shearing force of the conductive circuit. Therefore, it is desirable to increase the strength of the external force of the conductive circuit. [Patent Document 1] JP-A-2002-31 1049 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a circuit capable of suppressing an increase in resistance of an internal conductive circuit to increase the mechanical strength of the conductive circuit. A wiring board and an electrical connection device for using the wiring board for the probe sheet body. The flexible wiring board of the present invention includes a flexible insulating synthetic resin film and a conductive circuit disposed on or in the film, wherein the conductive circuit includes a second conductive material layer and The toughness is higher than the laminated structure of the second conductive material layer of the first conductive material layer. According to the flexible wiring board of the present invention, the first conductive material layer and the second conductive material layer having a toughness higher than that of the conductive material layer, that is, stronger than the ith conductive material layer, the first conductive material Since the material layer is reinforced by the second conductive material layer, the resistance of the conductive circuit is not excessively increased, and the mechanical strength can be appropriately increased. Such a flexible wiring board can be used as a wiring for connecting a connection between two hard wiring substrates or a probe sheet because the mechanical strength of the circuit can be improved without loss of flexibility. Probe body. An electrical connection device according to the present invention includes: a rigid wiring board; a block body elastically supported by the hard wiring board via a spring member; and a flexible wiring board having a plurality of electrically connected to the plurality of lines of the hard wiring board A guiding circuit, and one of the back portions thereof is supported by the block. A plurality of contacts electrically connected to the corresponding conductive circuits are protruded from a surface of the flexible wiring substrate supported on the block. The conductive circuit of the flexible wiring board has a laminated structure of an i-th conductive material layer and a second conductive material layer having a higher toughness than the first conductive material layer. In the electrical connection device of the present invention, since the conductive circuit of the flexible wiring substrate provided with the contact member is improved in mechanical strength by the reinforcing effect of the second conductive material layer, even during the process or use If a force other than the previous strong pressure or the repeated load acts on the conductive circuit, the conventional crack generated by the external force can also be prevented. Therefore, it is possible to improve the durability of the probe main body by providing the flexible wiring substrate provided with the contact member, thereby improving the performance of the electrical connecting device. The cymbal cymbal is provided with an opening at a central portion thereof through a thickness direction of the rigid wiring substrate to accommodate a part of the block. At this time, the spring structure for elastically supporting the block on the hard wiring substrate can use a leaf spring member disposed to traverse the opening. The block is supported by the plate-like structure in order to provide a space from the hard f wiring board to the thickness direction of the one hard wiring board on the supporting surface for supporting the flexible wiring board. X, the back surface of the central portion of the flexible wiring board can be fixed to the support surface of the block, and the outer edge portion of the flexible wiring board can be joined to the hard wiring substrate. 'The flexible wiring board! The conductive material layer may be composed of copper, and the 2 conductive material layer may be composed of nickel or an alloy thereof.该 The conductive circuit of the flexible wiring substrate can adopt a three-layer structure of a pair of second conductive material and a second conductive material layer between the two conductive material layers, since the reinforcing layer can be used as a reinforcing layer The ground layer is sandwiched by a layer of m conductive material, and the effect is also suppressed to increase the electrical resistance of the conductive circuit to increase its mechanical strength. The respective conductive layers can be formed by a plating method to form a plating method, and an electroplating method can be used. 8 200810655 [Embodiment] The present invention provides a rigid wiring board 12 and a block 16 which is elastically supported by the magazine member 4, as shown in Fig. 1 which is exploded and displayed. a hard wiring board; and a probe sheet 20 having a flexible wiring board 18 provided with a plurality of strip circuits i 8a (see FIG. 4) electrically connected to a plurality of lines of the hard wiring board 12 (not shown), and the present embodiment In the example, the flexible wiring board 18 of the present invention is used as a probe sheet body of the probe sheet 2〇. The hard wiring board 12 has, for example, a hard printed wiring board which is conventionally known, and has a plate-shaped electric material base material made of an epoxy resin containing glass fibers, and a wiring line on the base material. The hard wiring board 12 is connected to a circuit (not shown) on the circuit. In the example of the figure, the hard wiring board 12 is used for a circular hard wiring board having a circular opening (3) at the center. The spring member 14 is formed of a flat spring (four), and includes an annular support portion W having a smaller outer diameter than a circular opening 12a of the hard wiring substrate 12, and a cross shape disposed to traverse the annular support portion The main body portion: as shown in FIG. 2, a circular support plate 24 made of a metal such as stainless steel is fixed to the upper surface of the hard wiring substrate 12 through the bolt 22 of the screw-type material wiring substrate 12 without obstructing the portion of the wiring line. . The support plate 24 is a support for the hard wiring.] The access 24'" plate has the reinforcing effect of the hard wiring substrate. The annular mounting plate 26 and the plurality of pressing plates 相互 which are combined into a ring shape are held in the circular opening 12a. In order to hold the spring member Μ, the mounting plate % is coupled to the underside of the support plate 24 by bolts 30, and each The pressing plate 28 is joined to the mounting plate % by a bolt 32 that penetrates the supporting portion (4) of the pressing plate and the spring member 14 and is screwed to the mounting plate 26. Thereby, the spring member μ is held in the circular opening 12a. In addition, as shown in FIG. 2, the parallel adjustment screw member 34 for adjusting the holding posture of the elastic member and the member 14 in a state in which the bolt 30 is loosened is capable of abutting against the mounting plate at the front end thereof. The top surface is screwed to the support plate M. The block body 16 is fixed to the main body portion 14b of the magazine member 14 held in the circular opening 12a of the hard wiring substrate 12. =, , body 16 has a rectangular cross section a support portion i6b having a regular octagonal cross-sectional shape coupled to the lower end of the stem portion. The support stem: the stem 6b' has a pedestal portion 36 having a constant diameter along its axis, and is attached to the pedestal portion and a bottom portion 38 having a cross-section similar to its cross-sectional shape. The bottom portion 38 has a transverse dimension that is transverse to the axis of the support portion (10), that is, the diameter decreases toward the lower end. Thereby, the block is at its bottom & There is a conical surface 40, and in the example of the figure, eight 4 〇 (refer to Fig. 3) are formed. - The ? cone surface. Referring again to Fig. 2, the block body 16 has a bottom portion 38 of the pedestal portion 36, downward, The top surface of the rod portion 16a is coupled to the base member 14b of the spring member 。. This combination means that the body portion is held together with the # portion 16a by screwing the screw member of the rod portion i 6 & The fixed core 16a is attached to the birch 10 200810655. The flexible wiring board 18 of the Si household needle 2G, that is, the probe sheet body 18, as shown in FIG. 3, has a bottom portion with the block 16 at the central portion thereof. 38 pairs of banks form an octagonal portion 46, in the octagonal portion, a majority of 摞4+ "> 4. A contact region 50 configured for arranging the contacts M 8a is formed. This contact region 50 is formed in a rectangular shape in the example shown in FIG. Rainbow:: two = as shown in Fig. 2, as described later, the adhesive is fixed to the Μ protrusion by the adhesive, and the tip of the probe 48 from the contact area of the probe piece body 18 is turned toward the lower part. The back of the heart is supported by the bottom 38 of the probe 16. Further, the probe 2 is attached to the hard wiring substrate 12 from the octagonal portion 4 by the table + a square dog, and the portion: has a slight slack. In order to carry out the probe _; 52:::=::... the edge is configured with # 54. M h rubber ring 52 ring metal wood '' 0 outer edge and two members 52, 54, - pin 56 to determine the relative hard f ', the bad by the probe ... two structures: 2 = two relative position . By the locking of the through-hole 12, the 配线 构件 member 58 is bonded to the hard wiring board 12 by bonding the outer edge portion of the needle piece 2 to the hard wiring board, and the 30-edge portion is bonded to the hard wiring base & U. Similarly, the disk conventional technique "connects the above-mentioned conductive circuit (10) of the probe piece 2G to the corresponding wiring of the hard wiring substrate 12. In the example shown in Figs. 2 and 3, it is obliquely. 〇^ • The guide pin 60 is disposed so as to penetrate through the needle long hole 6〇a (see Fig. 3). At the lower end of the alignment pin 60,

There are alignment marks (10) available for the camera to be selected for the platform. X can be used to support the position information of the platform (not shown) relative to the probe assembly 10 for supporting the image of the inspected 11 200810655 body, so that the position can be obtained from the alignment image. The position of the information adjustment probe assembly 10 with respect to the support platform is such that the needle tip 48a of each probe 48 of the probe assembly 10 is in proper contact with each electrode corresponding to the object to be inspected on the platform. Thereafter, the probe body 48 is electrically connected to the corresponding electrode by the needle tip 48a of each probe 48 to perform energization inspection of the test subject body. The configuration of the aforementioned probe piece 2A will be described in detail based on Fig. 4 . The probe piece 2 〇 "the pair of electrically insulating synthetic tree moon 62 62, 64 ' with a flexible flexible resin layer embedded in the resin film i ^ is buried between the two resin films. In the body 1b, the conductive circuit i8a is a laminated structure, and is used as a conductive material layer 66 of a metal material (for example, copper) having high conductivity as an electric wire, and has a higher mobility than the metal material of the β-th material. (For example, the first structure formed by the combination of nickel or nickel and scales. The toughness of the two layers of the two layers of the conductive layer 08 of the Ang 2 conductive material, when the two metals of the same shape and the same size are made When the stone essence is obtained from the stress-strain line diagram of T th ^ ^ yv Q by, for example, the impact test, the area of the metal to the crack of the temple is compared. The area surrounded by the stress-strain curve of the point of the winding is The stress-strain curve of the recorded transmission is not easy to break, and it is also gp &&&&&&&&&&&&&&&&&&&&&&&&&&&> Thickness, and 箆9... The field is, for example, stacked on a 10/zm layer of electrically charged material 68, for example, a pile The thickness of 2"m is obtained, since 12 200810655 The circuit 18a has a thickness of, for example, approximately 22/m. These metal layers 66, 68 can be deposited by electroplating as will be described later. There is a base portion of the probe 48 that protrudes from one of the electrically insulating synthetic tree-forming membranes 62. Further, it corresponds to the contact region 50 (see Table 3) in which the probes 48 are disposed, and has a substantially corresponding to the probe region. A flat reinforcing plate 7'' of an equal size and shape, for example, a ceramic plate is embedded in the two electrically insulating moon-shaped films 62, 64 @ partially covering the conductive circuit 18a. The reinforcing plate 7〇, As shown in the figure, it can be affixed to the two electrically insulating synthetic resin films Μ, j by the bonding piece 72 of the sapphire slab. The reinforcing plate 70 has a (4) rigidity due to the electrical insulating synthetic resin film. 'Therefore, it is possible to suppress the deformation caused by the force outside the region of the probe sheet main body 18 corresponding to the reinforcing plate 70. Although other plate-like members can be used as the reinforcing plate, it is preferable to use f and the thermal deformation is small. Plate. The reinforcing plate 70 composed of the ceramic board, : The deformation caused by the aforementioned external force of the probe piece body 18 is generated, r: the sheet: the expansion and contraction due to heat, so that deformation due to thermal expansion and contraction of the needle piece body 18 can be effectively suppressed. 7〇, in the synthetic resin 62, 64, the conductive circuit (8) has sighed the opposite side of the contact portion of the conductive circuit and the probe #48 (contact). The configuration is not necessary to avoid each The probe 48, that is, the interference of the contact member 48, applies a special shape to the single-plate member 70 to arrange the reinforcing plate 7 so as to cover the contact portion 5: "by burying the reinforcing plate 70" The probe piece 2 is fixed to the block 1 of the block, as shown in FIG. 4, and is formed by another electrically insulating synthesis of the probe piece 13 200810655 == The resin film 64 is formed with the portion 74 of the reinforcing surface. On the other hand, in forming the probe sheet main body synthetic resin film 62, it is not necessary to form a convex shape with respect to the reinforcing plate π. The block that receives the back of the probe piece body 18 is: 5. Below the butt portion 38, as shown in FIG. 4, is formed substantially with the contact portion 38: the t-square rectangular support surface I is formed at the bottom portion 'and by the octagonal shape surrounding the central portion Flat = formed by l to protrude downward from the segment. Thereby, the segment portion 78 between the conical surface-surface biconical surface and the branch 76 is connected to the support surface % which is formed to protrude downward from the flat segment portion 78, and is opened for the second side to accommodate Rectangular recess (10). The central recess 80 has a smaller planar shape than the contact area 5 . The central recess 8 is formed, and a flat support surface portion 76a surrounding the central recess is left on the support surface 76. The support surface portion % is formed to be appropriately sized to receive the edge portion of the reinforcing plate 70, and the annular portion 82 surrounding the concave portion 8 is formed in the supporting surface portion "a". The manner in which the probe sheet 20 is mounted to the block 16 The adhesive agent is supplied before the central recess 8. Further, the same adhesive is supplied to the segment 78 surrounding the support surface 76. After the adhesive 82a is supplied to the block 16, it is as shown in Fig. 4. The position of the gripper 20 and the block 16 is determined such that the probe sheet is convex. The outer edge of the yoke 74 is opposite to the support surface portion 76a. As shown in Fig. 5, the probe piece body 18 is pressed against the bottom of the bottom portion 14 200810655 38 of the block body 16. By the (four) pressing action, the convex portion 74 of the probe piece body 18 disappears, and instead the 'needle pin body 1 $ The lunar surface of the north η is formed in a concave shape along the segment portion 78 and the support surface 76, and the probe sheet body 18 is fixed to the support surface 76 and the segment portion of the bottom portion 38 (excluding the conical surface 40). Further, when the lunar surface of the probe piece body 18 r 士 18 18 is deformed along the segment portion 78 and the support surface 76, the probe piece body 18 is combined with the 后 μ & In this case, in the region corresponding to the outer edge of the support surface 76, a strong shear stress is generated due to the support plate (four) conduction circuit w." However, the probe of the present invention The needle piece 2g, because its guiding circuit (10) is subjected to the second conductive material which has a sharp edge, is reinforced by the tenth 68. Therefore, the guiding circuit 18a is not broken due to the male stress. The reinforcing effect can also prevent the breaking of the guiding circuit 18a in the process of the motive piece 20 of the moxibustion of the second layer 2 conductive material layer 68. The excess portion of the adhesive 82a that supplies the probe piece body 18 to the block body 16 to the recess 80 is received by the annular groove 82 when the probe is subjected to the aforementioned tightening force. Excess. The knife does not pass over the support surface portion 76a beyond the section Μ. And 'the difference between the length of the segment 78 and the support segment and the thickness of the reinforcing plate 7〇 by the pressing of the probe piece body 18 against the block body, and the thickness of the reinforcing plate 7〇 The surface of ... money. As a result, the contact area 0 of the probe piece main body 18 protrudes downward from the peripheral portion by a step amount Δ Η. By this step ΔΗ, it is possible to increase the contact between the probe piece body 18 and the distance between the outer portion of the region 50 and the object to be inspected. The increase of the interval can more reliably prevent the interference between the outer portion of the contact portion of the probe piece body 18 and the object to be inspected, and more reliably prevent the contamination of the object to be inspected due to interference between the two objects. Or damage. In the case where the reinforcing plate 7 is not to be reinforced, the support surface 76 can be protruded from the peripheral portion thereof to transmit the medium to the step ΔΗ corresponding to the amount of protrusion of the supporting surface 76. However, in order to obtain a larger step ΔΗ and to make the probe sheet 20

It is easier to use, and in order to prevent the tip of the probe 48 from stinging on the xH surface and preventing the tip of the needle from being in a high position (in the z direction, it is better to use a reinforcing plate 7〇. For example, How to adjust the tip of the probe 48 when manufacturing the probe piece 20, when the contact area 50 is deformed by external force or deformed by heat when it is used, the female material 48 is also neatly arranged. The potential is turbulent, and the result is that the tip of the needle is turbulent. Moreover, f is deflected in the contact area when it is next to the block 16, and the probe piece body 18 is fixed to the support while maintaining the curvature. In the case of the surface %, the needle tip 48a is turbulent in the same manner. However, by embedding the contact portion 5〇 with the probe sheet main body 18 and the reinforcing plate 70 is embedded in the probe sheet main body 18, it can be reliably prevented. In this case, the contact area 5 of the ten-piece body is deformed as described above, thereby being able to prevent the respective probes, that is, the contact 48 of the contact member, from being deformed due to the deformation of the contact region 50, can surely prevent The tip 48a of the contact member 48 is in a state of confusion. The probe assembly 1 is easy to use and the position of the needle tip 48a is high. 16 200810655 Next, the probe sheet 2 of the present invention will be described with reference to Figs. 6 to 13. For simplification of explanation and illustration In the following description, the probe of the Μ Μ Μ 来 代表 代表 代表 代表 代表 代表 代表 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( No, use example. A metal plate of a stainless steel plate is used as the base cymbal (10), and a recess 1 〇 2 for the tip of the probe 48 is formed on the surface thereof by, for example, an indentation of a pressing member.

Although Fig. j shows only the single-concave 4 1G2, it is clear from the above that a plurality of recesses 102 are formed corresponding to the number of the contact pins formed at a large interval between the nipples. "In the case of the inside of the crucible, after forming the recess 1 2, the pattern mask of the probe tip 48a of the probe 2 is formed in the region including the recess 1G2 by selecting the exposure and development processing using the photoresist of the lithography technique. 1〇4 (Fig. 6(b)). + Use this pattern mask 104 to deposit the metal for the needle tip in the recess 102 and its vicinity by, for example, electric ore _ Figure 6(c)). The genus material may use, for example, tantalum or a hard f metal of a gold alloy. After stacking the gold 106, the pattern mask 1〇4 is removed (Fig. 6(d)). After the base 100 20 is completed, the pattern is removed. After the mask 1 〇 4, as shown in FIG. 6 (the lithography technique is used to form a pattern mask 1 〇 8 for the sacrificial layer removed by the probe sheet by the lithography technique. ▲ In order to form a sacrificial layer First, the recording layer (1) is first deposited on the region exposed from the pattern mask 108 on the base 100 by mineral depositing. Next, the copper layer 112 is also deposited on the nickel layer 110 by a bell method. Although the metal material 17 200810655 for forming the arm portion of the probe 48 body is stacked later, the copper layer U2' can function from the base (10) of the probe body (10) ( The effect of easy peeling is formed by the deposition of the metal material. Further, since it is difficult to directly deposit the copper layer 112 on the base 100, the copper layer 112 is deposited through the recording layer 110. The sacrificial layer is formed. After 110, 112, the pattern mask 1 〇 8 is removed (the following is a pattern reticle 114 for forming an arm portion connected to the tip of the probe material by the same photoresist as described above (Fig. 6 〇 1)) In the region exposed from the pattern mask ι 4, the arm portion of the cymbal needle 48 is deposited with a metal material on the tip metal and the sacrificial layer 110 by a method such as electroforming (4) 矿 (4). Thus, the arm portion is pseudo-integrated with the needle tip formed of the metal ι 6 (Fig. 6 (1)). For the metal material path of the arm portion, for example, a nickel-phosphorus alloy can be used. In the state where the pattern mask 114 is left In the arm portion, the copper layer n6 which functions as a protective layer in the step described later is deposited by, for example, mineral depositing (Fig. 6(J)). After the copper layer 116 is formed, the pattern mask is removed (4). After the arm portion 48b is formed, a second sacrificial layer is formed as a reference surface of the probe sheet body. Before the second sacrificial layer, a pattern mask 118 composed of a photoresist is formed by the same photoresist technique as described above, and the photoresist is selectively covered to form a well-formed arm of the base (10). (Fig. 2 (4)) ° The metal material (Fig. %) for the second sacrificial layer 120 is deposited in a region exposed from the pattern mask 118 on the base (10). The second sacrificial layer (10) can be made of nickel and is made of a clock. After the formation of the second sacrificial layer 120, the mask reticle m covering the arm portion is removed (Fig. 7 (4)). Thereafter, the photoresist is removed (to remove some of the copper layer on the arm portion 18 200810655) 116) The light-shielding mask 122 is constructed such that only the excess portion of the protective film composed of the copper layer ι6 is exposed to the rear surface of the base (1) (7). When the excess material of (4) 116 exposed by the photoresist mask 122 is removed by the money (10) 7 (e)), the photoresist mask 122 (10) 7 (f) p is removed by removing the excess portion of the front _ 116 to prevent the arm from being removed. The elasticity of the portion 4卟 with the deflection deformation is damaged by the copper layer 116. In this way, the probe can maintain the predetermined bomb

(Second Step) After the photoresist light 122 is removed, the second sacrificial layer 120 and the arm portion which are the reference planes of the probe sheet 18 are pseudo-exposed on the base ι, and then P A resin layer 126 for the dry insulating film of the third sacrificial layer, the electrically insulating synthetic resin film 62 of the probe sheet body, and a protective film 128 made of a photoresist are formed in this order (Fig. 7(g)). (Third Step) In the state in which the resin film 62 is electrically protected by the protective film 4 (four) 126, the opening 130 of the copper layer 116 on the arm portion 481 is formed using, for example, laser light (Fig. 7). (h)). The lower end of the opening 13 is opened on the copper layer 116 at the end of the arm 48b opposite to the tip 48a. By covering the upper portion of the arm with the copper layer 116, the arm can protect the arm from the laser light. (Step 4) After the opening 130 is formed, 116, the arm portion 48b is exposed to the inside of the copper layer opening 130 in which the straw is removed from the opening 130 (Fig. 7 (1)). In the opening ι3 〇 19 200810655, for example, a nickel layer U2 for forming the base portion 48c of the probe 48 is deposited on the arm portion 48b by plating. The size of the nickel layer η] in the opening 13〇 exceeds the thickness of the dry film, that is, the thickness of the third sacrificial layer 124 = but does not exceed the thickness of the sacrificial layer and the resin layer 126. Therefore, the upper surface of the nickel layer 132 is located in the thickness region of the resin layer 126 for the electrically insulating synthetic resin film 62. A copper layer 134 is integrally deposited on the nickel layer 2 by plating. Therefore, the dissimilar metal joint regions of the two metals U2, 134 are present in the thickness range of the resin layer 126, that is, the electrically insulating synthetic resin film 62. Thereby, the heterogeneous metal junction region can be protected by the electrically insulating synthetic resin film 62. The copper layer 134 has a thickness which is substantially the same as the upper surface of the resin layer 126. After the copper layer 134 is deposited, the protective film UK is removed (Fig. 7(k)). (Fifth Step) On the resin layer 126 and the steel layer 134 which are exposed by removing the protective film 128, as shown in FIG. 8(a), for example, 0.3/Z m is formed by sputtering to grow the conductive circuit. A copper layer 136 of thickness dimension. Thereafter, as shown in Fig. 8(b), a pattern mask 138 which is patterned to match the wiring region (including the copper layer 134) is formed by photoresist by lithography. In a region exposed from the pattern mask 138, a conductive circuit is sequentially deposited by, for example, a plating method (a copper layer 66 having a thickness of 10/m thickness, a nickel layer μ of a thickness of 2#m, and 10/zm). The copper layer 66 of a thickness (Fig. 8(c)). After the conductive circuit 18a is formed by the deposition of the copper layer 66, the nickel layer 68, and the copper layer 66, the pattern mask 138 is removed (Fig. 8(d)). Then, the portion beyond the conductive circuit 18a of the copper layer 136 is removed by etching 20 200810655 (Fig. 8(e)). Thereby, the conductive circuit excellent in breaking strength can be formed as described above. 6 step) The resin layer 126 which is exposed by removing the pattern mask 13 and removing part of the copper layer 136, that is, the electrically insulating synthetic resin film 62 and the conductive circuit 18a_L on the film, as shown in FIG. 8(f) Next, there is a _72' composed of a synthetic resin material, and a ceramic plate 70 covering the contact region is disposed on the sheet. Further, as shown in Fig. 8(g), the deposit covers the same and is used to form Further, the electrically insulating synthetic resin film 6 is made of the yttrium imide resin layer 140. When the polyimine resin layer 14G is formed, the pressing pressure f is applied to the polystyrene. . This amine resin layer is tightly pressed against the six force locust F - A section, although will by

The nickel layer 132 and the copper layer 134 are stacked, and the portion indicated by the base portion 48c of the probe 48 formed by the reporter and the + A is used as a shearing stress of the single V circuit 18a. Brother 2 conductive material layer 62 to strengthen the way + do Nanqiang's V circuit l8a, and will not be damaged by male stress. (Step 7) After forming the polyanilin resin layer 1 4 # ^ ® ^ , 4υ, the upper layer of the polyimine layer is used as the fourth film (4)--the dry film of the crucible 144 (Fig. 9(4)). Thereafter, as shown in (b) 9(b), the error is taken by the laser light, the sacrificial layer 144 of the younger brother 4 and the lower layer of the imide resin layer 140, and the 146. The claw forming is open on the guiding circuit 18a and is opened in the opening 146. As shown in Fig. 9(), the plating pad body is also used. Hey. For example, nickel may be deposited as a metal material of the tenon 148.勹 bump 148 (8th step), the portion protruding from the surface of the fourth sacrificial layer 144 of the bump 48 is further flattened (Fig. 9(d))' on the flat surface by, for example, == The gold layer 15b Ϊ Ϊ Ϊ 与 与 与 与 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬 硬144, etc. - is removed from the base 100.... Even if the contact of the probe piece body 18 via the probe 48 causes a bending force to be applied to the contact member 50, it can be buried in contact. The reinforcing plate 70 of the piece region 50 suppresses the deformation thereof. As described above, it is possible to prevent the posture of each probe 48 and the needle width 48a from being deviated due to the peeling. After the base 1 is removed by the peeling of the probe 48, and the treatment is performed, the first sacrificial surface 120 composed of the nickel layer 11 and the copper layer 3 7 ^ 曰 112 is removed. 1〇(b)). Further, the dry film m which is discharged by removing the second sacrificial layer U0 is 144 (Fig. 10(c)). The removal of the sacrificial layer of the 4th (the 9th step) is shown by the laser processing or the cutting process of the cutter, and then the contour of the road: and the position of the probe body 18 is not interfered with, respectively. To accommodate the positioning - and the valley alignment pin 6. The long hole 60a is formed to form the probe assembly body core 22 200810655. According to the aforementioned manufacturing method of the probe sheet 20 according to the invention, the probe 4 and the base pepper which are required to have extremely high precision are formed on the base 2 The arm portion △ 上上 η is sequentially formed by holding the probes 48 on the substrate / the probe sheet body 18 and the probe 48 are bonded to the probe 48. Therefore, since the operation of the probe, that is, the probe sheet body 18, is not required, and the position of the needle tip is not required, it can be ==/piece 48 4〇^.+ /h 4C 匕1 again The probe sheet 20 that is accurately placed in a predetermined position is manufactured in a more convenient manner. Further, it is possible to carry out a series of steps efficiently and consistently. The above-described series of steps is a step of starting the formation of the needle tip 48a and adjusting the needle piece 2〇. The shape of the needle body 18 is completed and the slanting soil dq η & in the formation of the contact member 48 is stacked on the base 1 in the first step of the arm portion 48b. 〇〇上=〇 will deposit the hard metal material of the metal material of the arm 48b on the base (5) ""1G2. After depositing the hard metal material, by stacking the metal material for the arm material of the metal material by stacking f, the needle tip 48a of each contact member 48 can be formed by the hard genus =, so that the contact of each contact member can be improved. The durability of each of the contact members 48 is improved by 48a. Needle/48 In the aforementioned step f1, lithography techniques can be used to form the top ten techniques as previously described. By using this lithography technique, the edge of the tip 48a formed by the metal (10) as shown in Fig. η and Fig. u can be formed to correspond to the shape of the end face of the pattern light I(10)", and the width dimension thereof increases with the end face. The skirt portion 48d is formed by the accumulation of the metal material to form the arm portion 48b covering the portion 23d of the step 23 200810655. Therefore, the needle tip is combined with the arm portion of the arm portion to form a so-called trapezoidal groove. As a result, two can be obtained. The strong combination of the 4th. ' : In the fourth step, it is higher than the height of the dry film 124 and does not exceed the height II of the U-shaped synthetic tree wax layer 126: placed in the opening 130 The same material as the arm portion Na is formed to form the soil 4 48c. The base portion 4 in the opening 13〇 is embossed with copper of the same material as the metal material for the conductive circuit W, and the thickness of the steel is at the μ: synthetic (four) 126 In the thickness dimension, as a result, the connection boundary of the conductive circuit formed by the base "different metal material" can be substantially in the first flexible synthesis (4) 126 (62), so that the first! Flexible synthetic resin 126 (62) protects the joint boundaries of the two metals. In the fifth step of forming the conductive circuit 18a, the second conductive material layer 66 for sequentially guiding the circuit (10) on the ι-shaped synthetic resin m(10), and the second layer having the bob property higher than the ith conductive material layer A layer of conductive material and a layer 66 of a first conductive material. Thereby, the conductive circuit 18a can be formed in a three-layer structure, and the strength against breakage of the conductive circuit 8a can be improved. Further, in the fifth step, after the conductive circuit 18& is formed, the reinforcing plate (the upper region of the cover contact member 48 is attached to the first flexible synthetic resin 126 (62) and the conductive circuit) 18a. By means of the configuration of the reinforcing plate 7', as described above, the contact 48 of the probe body 18 is peeled off from the base 1 in the forming step of the probe #2G, or When the needle 2 body 18 is assembled to the block body 16 of the probe piece 2 or the hard wiring board u or the like, deformation due to a force other than the contact portion of the contact member 24 200810655 provided with each contact 48 can be suppressed or The deformation of the tip due to thermal expansion and contraction can suppress the positional deviation of the needle tip due to the above-described deformation. The present invention is not limited to the above embodiment, and various t can be used instead of the material within the scope of the gist of the invention. The body of the circuit (having a laminated structure) is used in the form of a probe sheet body, for example, as a flexible electric circuit. [Simple description of the drawing]

wI Vision Wiring Substrate A perspective view of the package shown in Fig. 2 is a longitudinal sectional view of the probe assembly shown in Fig. 1. Fig. 3' is an enlarged view showing the probe piece of the grasping needle assembly of Fig. 3'. The 4 4' shows a longitudinal section of the state shown in Fig. 1. Before the combination of the needle piece and the support block, Figure 5' shows the Figure 4; ^#力丄, jp state of 1 eight # i Α wood, ten pieces of 舁 support block have been combined ~ old 4 points enlarged longitudinal section Figure. Figure 6 is a view showing the process of the probe sheet of the present invention. (Fig. 7) shows the probe sheet of the present invention. Fig. 8 is a schematic diagram of the process of the 曰gn month 1 private (the 2 ). Figure 9, Sun Hao - Shi Zhengyi private process description diagram (3) 〇 显 显 之 之 之 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针 探针The drill of the present invention 5). , ten-part process description chart (the figure

Figure 12 is a plan view of the probe sheet of the present invention as seen from the present invention. Stereo view from the front end of the needle tip 25 200810655 Figure 13, is a cross-sectional view taken along line XU - XBI of Figure 12. [Explanation of main component symbols] 10 Probe assembly 12 Hard wiring board 12a Opening of hard wiring board 14 Spring member 16 Block 18 Probe sheet body (flexible wiring board) 18 a Lead circuit 20 Probe piece 48 Contact piece ( Probe) 50 contact region 66 first conductive material layer 68 second conductive material layer 76 support surface 26

Claims (1)

200810655 X. Patent application scope: 1. A flexible wiring board, and having an insulating synthetic resin film having flexibility and a conductive circuit disposed on or in the film, wherein 'δ海导电路And having a laminated structure of a first Φ - LX 1 I CJ ^ ^ electrical material layer and a second conductive material layer having higher toughness than the first conductive material layer. 2. The flexible wiring board of claim 1, wherein the first conductive material layer is made of copper, and the second conductive material layer is made of nickel or an alloy thereof. 3. The flexible wiring board according to the above aspect, wherein the guide path includes the first conductive material layer, the second conductive material layer on the conductive material layer, and the second conductive layer A three-layer construction of another ι conductive material layer of the material layer. ▲ 4. The flexible wiring substrate of the invention of the invention, wherein the layers are combined with each other by mineral coating. 5 · an electrical connection device, ι · clothing with a hard wiring substrate; block, elastically supported by a spring member on the 乂忑 ^ 乂忑 hard shell wiring substrate; and flexible wiring substrate ' is not separate from the rigid The plurality of conductive circuits are electrically connected to the plurality of lines of the wiring board, and one of the basins is supported by the block, and the flexible wiring substrate is supported by the flexible wiring substrate. The surface of the region of the block is provided with a plurality of contacts electrically connected to the corresponding conductive circuits, wherein the conductive circuit of the flexible wiring substrate has an ith conductive material layer, and the mobility is higher than The layer of the second conductive material layer of the ith conductive material layer is 6. The electrical connection device of claim 5, wherein 27 200810655 hard wiring substrate, in the middle. Qiu+, thickness direction, #容(4) μ/贞 is provided on the rigid wiring substrate and is elastically supported by the hard spring 4 for the opening of the block spring member, and the block 1 is arranged in the second line to be a ribbed line... support The flexible matching soil/support surface is spaced from the hard f wiring substrate to the thickness direction of the hard wiring substrate, and the stalk is supported by a seesaw spring member, the flexible wiring substrate The central section, connected to the support of the block The outer edge 邛 is bonded to the hard wiring substrate. The electrical connection device of the present invention, wherein the second conductive material layer is made of nickel or a metal layer of the fifth conductive material layer of the patent application range. 8. The electrical connection device of claim 5, wherein the conductive circuit comprises the first conductive material layer, the second conductive material layer on the conductive material layer, and another layer covering the second conductive material layer A three-layer structure of a second layer of conductive material. 9. The electrical connection device of claim 5, wherein the layers are integrally formed by plating. XI. Schema: as the next page 28