JP2006090926A - Probe unit, and producing method and inspecting method of probe unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe unit adjusting the position of conducting wires to electrodes using contact marks, even if the inspecting pads are not prepared in the specimen for each electrode, and also to provide an inspecting method and and a producing method of the probe unit. <P>SOLUTION: The probe unit, which inspects the specimen equipped with electrodes and a padding for orientation positioned to the electrodes, is equipped with a substrate, conducting wires having a contact section formed on the substrate to contact with the electrode, and a mark generating section which is formed on the substrate and, by contacting with the padding for orientation in an area narrower than the contact section at the state where the contact section contacts with the electrodes, generates contact marks on the padding for orientation. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a probe unit, a probe unit manufacturing method, and an inspection method, and more particularly, to alignment between a probe unit and a specimen.

  Conventionally, a probe unit for inspecting an electronic device is known. Patent Document 1 discloses a probe unit in which a conductive wire that contacts an electrode of an electronic device is formed by lithography and does not protrude from an end portion of a substrate. When inspecting an electronic device as a specimen using this probe unit, it is difficult to align the specimen electrode and the lead wire of the probe unit while observing with a microscope or the like. This is because, if the conductor provided on the surface of the substrate on the electronic device side is observed from the specimen side of the substrate, the table on which the specimen is placed becomes an obstacle, and the conductor is observed from the opposite side of the specimen. This is because the substrate gets in the way. In such a case, the probe unit and the specimen can be aligned by contacting the lead of the probe unit with the electrode of the specimen with a large contact pressure and examining the position of the contact trace formed by the lead of the probe unit. Conceivable.

  However, the contact trace formed on the electrode causes a wiring failure in the electrode of the specimen. Therefore, a test pad that contacts the conducting wire of the probe unit is required for the specimen separately from the electrodes so that wiring failure due to contact traces does not occur. Since such a test pad is required for each electrode, the manufacturing cost of the specimen increases as the substrate size increases.

Korean Published Patent Publication No. 2003-0023662

  The present invention has been created in view of the above-described problem, and even if a test pad is not provided for each electrode, the position of the conductor with respect to the electrode can be adjusted using the contact trace. It is an object of the present invention to provide a probe unit, an inspection method and a probe unit manufacturing method.

(1) A probe unit according to the present invention for achieving the above object is a probe unit for inspecting a specimen including an electrode and a position confirmation pad positioned with respect to the electrode, the substrate, A conductive wire having a contact portion formed on a substrate and in contact with the electrode; and the position confirmation pad formed on the substrate and having a smaller area than the contact portion in a state where the contact portion is in contact with the electrode. And a trace forming part that forms a contact trace on the position confirmation pad by contact.

  The contact portion of the conductive wire is in contact with the electrode in a relatively large area, and the trace formation portion is in contact with the position confirmation pad in a relatively small area, so that the trace formation portion is in contact with the position confirmation pad. The pressure per unit area where the contact portion of the conductive wire contacts the electrode can be made lower than the pressure. Therefore, according to the present invention, even if the trace forming portion is brought into contact with the position confirmation pad in a state where the contact portion of the conducting wire is in contact with the electrode, the contact is made on the position confirmation pad without forming a contact trace on the electrode. Traces can be formed. Therefore, according to the present invention, the presence / absence and position of the contact trace on the test pad was inspected even if the test pad that is in contact with the lead wire of the probe unit and not wired at the time of mounting is not provided for each specimen. The position of the lead wire of the probe unit relative to the electrode of the specimen can be adjusted according to the result. As a result, according to the present invention, since the specimen can be examined by bringing the lead wire of the probe unit into contact with the wiring electrode, the manufacturing cost of the specimen can be reduced by downsizing.

(2) The trace formation part may be harder than the contact part.
The harder the trace formation portion, the easier it is for contact traces to be formed on the position confirmation pad.
(3) A probe unit according to the present invention for achieving the above object is a probe unit for inspecting a specimen including an electrode and a position confirmation pad positioned with respect to the electrode, the substrate; A conductor formed on the substrate and having a contact portion that contacts the electrode, and formed on the substrate, harder than the contact portion, and forms a contact trace on the position confirmation pad by contacting the position confirmation pad. And a trace forming part.

  According to the present invention, since the trace formation part is harder than the contact part of the conductive wire, even if the trace formation part is in contact with the position confirmation pad while the contact part of the conductive wire is in contact with the electrode, a contact trace is formed on the electrode. Without this, contact marks can be formed on the position confirmation pad. Therefore, according to the present invention, the presence / absence and position of the contact trace on the test pad was inspected even if the test pad that is in contact with the lead wire of the probe unit and not wired at the time of mounting is not provided for each specimen. The position of the lead wire of the probe unit relative to the electrode of the specimen can be adjusted according to the result. As a result, according to the present invention, since the specimen can be examined by bringing the lead wire of the probe unit into contact with the wiring electrode, the manufacturing cost of the specimen can be reduced by downsizing.

(4) The trace formation part may contact the position confirmation pad with an area smaller than the contact part.
As the area where the trace forming portion contacts the position confirmation pad is smaller, the contact trace is more likely to be formed on the position confirmation pad.

(5) The trace formation part may be sharper than the contact part.
The trace forming part sharper than the contact part comes into contact with the position confirmation pad in a smaller area than the contact part.
(6) The trace forming part may be a surface rougher than the contact part.
The trace forming portion, which is a rougher surface than the contact portion, contacts the position confirmation pad with a smaller area than the contact portion.

(7) The said contact part may be formed in the site | part protruded outside the said board | substrate of the said conducting wire.
By contacting the contact portion formed on the portion of the lead wire that protrudes outside the substrate with the electrode of the specimen, the portion of the lead wire that protrudes outside the substrate bends, so the contact portion per unit area that contacts the electrode A contact part and an electrode can be made to contact reliably, suppressing a pressure.

(8) The substrate may be flexible. The contact portion may be located immediately above the substrate.
Even if the contact portion is located directly above the substrate, by using a flexible substrate, the contact portion reliably contacts the electrode while suppressing the pressure per unit area where the contact portion contacts the electrode. be able to.
(9) A probe unit manufacturing method according to the present invention for achieving the above object is a method for manufacturing a probe unit for inspecting a specimen including an electrode and a position confirmation pad positioned with respect to the electrode. Forming a conductive wire having a contact portion in contact with the electrode by lithography, and forming a contact trace on the position confirmation pad by contacting the position confirmation pad with a smaller area than the contact portion. Forming a trace forming portion on the substrate by lithography.

  By forming the conducting wire by lithography, the position of the contact portion of the conducting wire can be finely controlled. By forming the trace forming part by lithography, the position of the trace forming part with respect to the contact part can be finely controlled.

(10) In the step of forming the trace forming part, the trace forming part may be sharper than the contact part.
By sharpening the trace forming portion, the area where the trace forming portion contacts the position confirmation pad can be reduced.

(11) In the step of forming the trace forming portion, the trace forming portion may be formed on a rougher surface than the contact portion.
By roughening the trace forming portion, the area where the trace forming portion contacts the position confirmation pad can be reduced.

(12) A probe unit manufacturing method according to the present invention for achieving the above object is a probe unit manufacturing method for inspecting a specimen including an electrode and a position confirmation pad positioned with respect to the electrode. Forming a lead having a contact portion in contact with the electrode by lithography on a substrate, and forming a contact trace on the position check pad by contacting the position check pad, which is harder than the contact portion and contacting the position check pad. Forming a trace forming portion to be formed on the substrate by lithography.

  By forming the conducting wire by lithography, the position of the contact portion of the conducting wire can be finely controlled. By forming the trace forming part by lithography, the position of the trace forming part with respect to the contact part can be finely controlled.

(13) A test method for achieving the above object is a test method for a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode, wherein the contact portion of the lead wire of the probe unit is used as the electrode. Inspecting the contact trace formed on the position confirmation pad by contacting the trace formation portion of the probe unit with the position confirmation pad in a smaller area than the contact portion, and the inspection result of the contact trace And adjusting the position of the probe unit relative to the specimen, and testing the continuity of the specimen in a state where the contact portion is in contact with the electrode and the trace forming portion is in contact with the position confirmation pad. And including.

  According to the present invention, the contact portion of the conductive wire is brought into contact with the electrode over a relatively large area, and the trace formation portion is brought into contact with the position confirmation pad over a relatively small area. The pressure per unit area where the contact portion of the conducting wire contacts the electrode can be made lower than the pressure per unit area. Therefore, according to the present invention, even if the trace forming portion is brought into contact with the position confirmation pad in a state where the contact portion of the conducting wire is in contact with the electrode, the contact is made on the position confirmation pad without forming a contact trace on the electrode. Traces can be formed. Therefore, according to the present invention, the presence / absence and position of the contact trace on the test pad was inspected even if the test pad that is in contact with the lead wire of the probe unit and not wired at the time of mounting is not provided for each sample. The position of the lead wire of the probe unit relative to the electrode of the specimen can be adjusted according to the result. As a result, according to the present invention, since the specimen can be examined by bringing the lead wire of the probe unit into contact with the wiring electrode, the manufacturing cost of the specimen can be reduced by downsizing.

(14) A test method for achieving the above object is a test method for a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode, wherein the contact portion of the lead wire of the probe unit is used as the electrode. Inspecting the contact trace formed on the position confirmation pad by contacting the position confirmation pad with a trace formation portion harder than the contact portion of the probe unit, and according to the inspection result of the contact trace Adjusting the position of the probe unit relative to the sample, and testing the continuity of the sample in a state where the contact portion is in contact with the electrode and the trace forming portion is in contact with the position confirmation pad, including.

According to the present invention, since the trace formation portion harder than the contact portion of the conductive wire is brought into contact with the specimen position confirmation pad, the trace formation portion is brought into contact with the position confirmation pad while the contact portion of the conductive wire is in contact with the electrode. However, the contact trace can be formed on the position confirmation pad without forming the contact trace on the electrode. Therefore, according to the present invention, the presence / absence and position of the contact trace on the test pad was inspected even if the test pad that is in contact with the lead wire of the probe unit and not wired at the time of mounting is not provided for each specimen. The position of the lead wire of the probe unit relative to the electrode of the specimen can be adjusted according to the result. As a result, according to the present invention, since the specimen can be examined by bringing the lead wire of the probe unit into contact with the wiring electrode, the manufacturing cost of the specimen can be reduced by downsizing.
In the present specification, “... formed on” means “... formed directly on” and “... on the intermediate” unless there is a technical obstruction factor. It is meant to include both “formed through”.
In addition, the order of each operation of the method described in the claims is not limited to the order of description unless there is a technical impediment, and may be executed in any order, and may be executed simultaneously. Also good.

Embodiments of the present invention will be described below with reference to the drawings. In each of the embodiments, the component having the same reference sign corresponds to the component of the other embodiment having the reference sign.
(First Example)
FIG. 1 is a diagram showing a probe unit according to a first embodiment of the present invention.
As shown in FIG. 1, the probe unit 1 according to the first embodiment includes a flexible substrate 10 made of a resin film or the like, and a conductor group consisting of a plurality of conductors 14 arranged on the substrate 10 at a predetermined interval. 12 and alignment conductors 16 arranged on the substrate 10 together with the conductors 14 so as to be positioned on both sides of the conductor group 12. The conducting wire 14 and the alignment conducting wire 16 may be made of the same material, or the positioning conducting wire 16 may be made of a material harder than the conducting wire 14. By making the alignment conducting wire 16 harder than the conducting wire 14, a contact trace is easily formed on the specimen position confirmation pad.

The front end portion 18 of each conductive wire 14 corresponds to the contact portion described in the claims.
The leading end portion 20 of the alignment conducting wire 16 corresponds to the trace forming portion described in the claims, and is sharper than the leading end portion 18 of the conducting wire 14. The tip portion 20 is formed of two side surfaces and a top surface that intersect at 60 °, for example. Since the distal end portion 20 of the alignment conducting wire 16 is sharper than the distal end portion 18 of the conducting wire 14, the distal end portion 20 of the alignment conducting wire 16 serves as the specimen position confirmation pad and the distal end portion 18 of the conducting wire 14 during examination of the specimen. Contact in a smaller area. The leading end portions 18 and 20 of the conducting wire 14 and the positioning conducting wire 16 are both located immediately above the substrate 10.

2 and 3A and 3B are views showing an inspection method using the probe unit according to the first embodiment of the present invention. In FIG. 3, the elastic body, the probe base, and the flexible printed wiring board are not shown, and in FIG. 3B, the substrate 10 is further omitted. In FIGS. 5 to 8 described later, these members are not shown in the same manner as FIG.
As shown in FIG. 2, when the probe unit 1 is used for the continuity test of the specimen 8, the probe unit 1 is fixed to the probe base 92 with the elastic body 90 sandwiched between the substrate 10 and the probe base 92. The Hereinafter, the module of the inspection apparatus including the probe unit 1, the elastic body 90, and the probe base 92 is referred to as a probe head 9. A flexible printed wiring board 7 connected to a continuity testing device main body (not shown) is connected to each conducting wire 14 of the probe unit 1. The probe head 9 is attached to a continuity test apparatus main body (not shown) in such a posture that the probe unit 1 contacts the specimen 8 at a predetermined angle during the continuity test. The specimen 8 is placed on the table 120. The continuity testing apparatus main body adjusts the position of the electrode 80 of the specimen 8 and the position of the distal end portion 18 of the probe unit 1 by moving the table 120 or the probe head 9 in a direction parallel to the board surface 122 of the table 120. The continuity testing apparatus main body brings the tip 18 of the probe unit 1 into contact with the electrode 80 of the specimen 8 by moving the table 120 or the probe head 9 in a direction perpendicular to the surface 122 of the table 120.

  As shown in FIG. 2 and FIGS. 3A and 3B, the specimen 8 to be examined in this embodiment is a liquid crystal panel or LSI in which linear electrodes 80 are arranged on a substrate 84 at predetermined intervals. An electronic device such as a chip. The specimen 8 includes position confirmation pads 82 on both sides of the plurality of electrodes 80 on the substrate 84. The position confirmation pad 82 is positioned with respect to the electrode 80 by a method of forming the electrode 80 by lithography at the same time. Note that the position confirmation pad 82 may be made of a softer material than the electrode 80 in order to easily form a contact trace on the position confirmation pad 82.

The examination of the specimen 8 includes a primary contact stage, an alignment stage, a secondary contact stage, and a signal input stage.
In the primary contact stage, the probe unit 1 is brought into contact with the specimen 8 by moving the table 120 or the probe head 9. When the distal end portion 20 of the alignment lead wire 16 contacts the position confirmation pad 82 of the specimen 8, a contact trace 86 is formed on the position confirmation pad 82, as shown in FIG.

  In the alignment step, the surface of the position confirmation pad 82 is observed, and the position of the contact trace 86 is measured. Next, according to the position of the contact trace 86, the table 120 or the probe head 9 is moved so that the position of the electrode 80 of the specimen 8 and the position of the tip 18 of the conducting wire 14 are matched.

In the secondary contact stage, the electrode 120 and the tip 18 of the conducting wire 14 are brought into contact with each other by moving the table 120 or the probe head 9.
In the signal input stage, a test signal is input to the probe unit 1 via the flexible printed wiring board 7 and the continuity test of the specimen 8 is performed. Specifically, for example, the pixel pattern of the liquid crystal panel that emits light in accordance with the inspection signal is inspected.

  By the way, when the probe unit and the specimen are aligned by inspecting the contact trace formed by the conducting wire, in order to prevent the wiring defect from occurring in the electrode due to the contact trace formed by the contact portion of the conducting wire, FIG. As shown to (A), the test | inspection pad 104 for every electrode is required for the test substance 100. FIG. The test pad 104 is a test pad that comes into contact with a contact portion of a conductive wire and inputs a test signal for the purpose of testing the continuity of the electrode 102 of the specimen 100. Since the test pad 104 is provided on the sample 100 separately from the electrode 102, the contact trace 106 can be formed on the test pad 104 for the purpose of positioning the probe unit and the sample 100. Further, since the test pad 104 is necessary only at the time of the test, the part 100a in the vicinity of the test pad 104 of the specimen 100 is unnecessary after the test is finished, and is separated and removed. As described above, since it is necessary to form the test pad 104 on the sample 100 in order to input the test signal by the probe unit, the sample 100 is increased in size and the manufacturing cost of the sample 100 increases. Furthermore, after the examination of the specimen 100 is completed, it is necessary to remove the unnecessary portion 100a in the vicinity of the examination pad 100, thereby increasing the manufacturing cost of the specimen 100.

  On the other hand, according to the present embodiment, the distal end portion 20 of the alignment conducting wire 16 is formed sharper than the distal end portion 18 of the conducting wire 14, so that the position of the distal end portion 20 of the alignment conducting wire 16 and the specimen 8 is increased. The confirmation pad 82 is brought into contact with an area narrower than the area where the tip 18 of the lead wire 14 contacts the electrode 80. As a result, the contact pressure between the tip 18 of the lead wire 14 and the electrode is smaller than the contact pressure between the tip 20 of the positioning lead 16 and the position confirmation pad. For this reason, even if the distal end portion 20 of the alignment conducting wire 16 is brought into contact with the position confirmation pad 82 of the specimen 8 while the distal end portion 18 of the conducting wire 14 is in contact with the electrode 80, a contact trace is formed on the electrode 80. The contact trace 86 can be formed on the position confirmation pad 82. Therefore, according to the present embodiment, as shown in FIG. 4B, it is not necessary to provide a test pad for continuity testing for each electrode in the sample 8, and if a small number of positioning pads 82 are provided in the sample 8. Since it is only good, the specimen 8 can be miniaturized. Further, according to this embodiment, it is not necessary to remove a part of the specimen 8 after completion of the examination. Therefore, according to the present embodiment, the manufacturing cost of the specimen 8 can be reduced.

Further, according to the present embodiment, when the contact trace 86 is formed on the position confirmation pad 82, the contact defect is not formed on the electrode 80 of the specimen 8, thereby preventing the wiring defect due to the contact trace of the electrode 80, The quality of the specimen 8 can be improved.
As shown in FIG. 5A, the tip end portion 18 of the conducting wire 14 and the tip end portion 20 of the positioning conducting wire 16 may be protruded from the substrate 10. When the leading end portion 18 of the conducting wire 14 and the leading end portion 20 of the alignment conducting wire 16 protrude from the substrate 10, the conducting wire 14 and the alignment conducting wire 16 can be bent independently of each other. Therefore, in this case, the difference between the contact pressure between the distal end portion 18 of the conducting wire 14 and the electrode 80 and the contact pressure between the distal end portion 20 of the alignment conducting wire 16 and the position confirmation pad 82 can be increased.

Further, the specimen 8 is not limited to the liquid crystal panel described above, and any sample may be used. For example, as shown in FIGS. 6A and 6B, the electrode 80 may have a block shape.
Further, as shown in FIGS. 7A and 7B, only one alignment lead 16 and one position confirmation pad 82 for the specimen 8 may be provided.
Further, as shown in FIGS. 8A and 8B, the alignment conductor 16 may be provided on the substrate 10 in the vicinity of the center in the arrangement direction of the conductor group 12.

9 and 10 are views showing a method of manufacturing the probe unit 1 according to the first embodiment of the present invention.
First, as shown in FIGS. 9A1 and 9B1, a conductor film underlayer 30 is grown on the substrate 10 by sputtering, vapor deposition, or the like. As the substrate 10, for example, a substrate made of partially stabilized zirconia and having a thickness of 1.2 mm is used. The conductor film underlayer 30 is composed of, for example, a multilayer composed of a Ti layer having a thickness of 200 mm and a Ni layer having a thickness of 1500 mm. Instead of the Ni layer, a NiW layer, a NiFe layer, a NiMo layer, or the like may be used.

  Next, as shown in FIGS. 9A2 and 9B2, a resist having a first opening 34 at a portion where the conductor group 12 is formed and a second opening 36 at a portion where the alignment conductor 16 is formed. A film 32 is formed. Specifically, a resist is applied on the conductor film underlayer 30, exposed using a mask corresponding to the pattern of the conductor group 12 and the alignment conductor 16, and then developed, and the first opening 34 and the second opening A resist film 32 having 36 is formed.

Next, as shown in FIGS. 9A3 and 9B3, a conductor film 38 is grown in the first opening 34 and the second opening 36 by plating. The conductor film 38 is made of, for example, a Ni film having a thickness of 20 μm.
Next, as shown in FIGS. 10A1 and 10B1, the resist film 32 is removed.
Next, as shown in FIGS. 10A2 and 10B2, the exposed conductor film underlayer 30 is removed by milling.

Next, as shown in FIGS. 10A3 and 10B3, when the substrate 10 is cut by dicing and unnecessary portions are removed, the probe unit 1 is obtained. The conducting wire group 12 and the positioning conducting wire 16 of the probe unit 1 include a conductor film underlayer 30 and a conductor film 38.
According to the present embodiment, by forming the conductor film 38 constituting the conductor group 12 and the alignment conductor 16 by lithography, the position of the tip 18 as a contact portion of the conductor 14 can be finely controlled. The position of the distal end portion 20 as the trace forming portion of the alignment conducting wire 16 can be finely controlled with respect to the distal end portion 18 of the conducting wire 14.

  Note that a step of thinning the substrate 10 by polishing may be added. For example, the substrate 10 may be about 0.2 mm. When the substrate 10 is thinned, the flexibility of the substrate 10 can be increased, so that the tip 18 of the conducting wire 14 and the electrode of the specimen can be reliably brought into contact with each other with a low contact pressure. In particular, even when the electrode surface of the specimen is uneven, the tip 18 of the conducting wire 14 and the electrode can be reliably brought into contact with each other.

  Moreover, you may form the conducting wire group 12 and the conducting wire 16 for position alignment at another process. In that case, by adjusting the growth time of the film forming the conductive wire group 12 and the growth time of the film forming the alignment conductive wire 16 individually, or by polishing the film after film formation, the tip end portion of the conductive wire 14 The height of 18 and the height of the tip 20 of the alignment conductor 16 are adjusted.

(Second embodiment)
FIG. 11 shows a probe unit according to the second embodiment of the present invention.
As shown in FIG. 11, in the probe unit 2 according to the second embodiment, a part 11 on one side of the substrate 10 is formed thinner than other parts. The conductor group 12 and the alignment conductor 16 are both formed directly on the substrate 10 on the base side, the distal end portions 18 and 20 are separated from the surface of the thin portion 11 of the substrate 10, and the distal end portions 18 and 20 are thin portions of the substrate 10. 11 is located directly above. For this reason, the conducting wire 14 and the alignment conducting wire 16 can bend independently of each other until they contact the substrate 10. Therefore, according to the second embodiment, the difference between the contact pressure between the distal end portion 18 of the conducting wire 14 and the electrode and the contact pressure between the distal end portion 20 of the alignment conducting wire 16 and the position confirmation pad 82 is calculated as follows. Can be larger than

12 to 14 are views showing a method of manufacturing the probe unit 2 according to the second embodiment of the present invention.
First, as shown in FIGS. 12A1 and 12B1, after forming a bowl-shaped recess 40 in the substrate 10, a sacrificial film base layer 42 is grown on the substrate 10. Specifically, for example, after forming a recess 40 having a depth of 150 μm on the substrate 10 made of glass ceramic, a sacrificial film underlayer 42 such as a Cu layer is grown to a thickness of 3000 mm by sputtering. An adhesion layer may be formed before the Cu layer is grown. For the adhesion layer, for example, a Cr layer or a Ti layer having a thickness of 300 mm is used.

Next, as shown in FIGS. 12A2 and 12B2, a sacrificial film 44 is formed on the sacrificial film base layer 42 so that the recesses 40 are filled with the sacrificial film 44. For example, Cu is used for the sacrificial film 44. The sacrificial film 44 may be formed by plating, or the sacrificial film 44 may be formed by applying a paste.
Next, as shown in FIGS. 12A3 and 12B3, the sacrificial film 44 is polished until the substrate 10 is exposed, and a flat polished surface 46 constituted by the substrate 10, the sacrificial film underlayer 42, and the sacrificial film 44 is obtained. Form.

Next, as shown in FIGS. 13A1 and 13B1, a conductor film underlayer 30 is grown on the polished surface 46. Next, as shown in FIG. Specifically, it conforms to the steps shown in FIGS. 9A1 and 9B1.
Next, after the conductor film 38 is formed according to the steps shown in FIGS. 9A2 and 9B2 to 10A2 and 10B2, the exposed conductor film underlayer 30 is removed.
Next, as shown in FIGS. 13A2 and 13B2, the sacrificial film 44 is removed.

Next, as shown in FIGS. 13A3 and 13B3, the sacrificial film base layer 42 is removed. When the sacrificial film underlayer 42 is made of Cr, it is removed with ceric ammonium nitrate.
Next, as shown in FIGS. 14A and 14B, when the substrate 10 is cut by dicing and unnecessary portions are removed, the probe unit 2 is obtained.

(Third embodiment)
FIG. 15 is a view showing a third embodiment of the probe unit according to the present invention.
As shown in FIG. 15, in the probe unit 3 according to the third embodiment, the distal end portion 20 of the alignment conducting wire 16 protrudes from the substrate 10 more than the distal end position of the conducting wire group 12. Therefore, according to the third embodiment, the difference between the contact pressure between the tip 18 of the lead wire 14 and the electrode and the contact pressure between the tip 20 of the positioning lead 16 and the position confirmation pad 82 is determined according to the second embodiment. It can be larger than the example.

(Fourth embodiment)
FIG. 16 shows a probe unit according to the fourth embodiment of the present invention.
As shown in FIG. 16, in the probe unit 4 according to the fourth embodiment, the substrate 10 has an outer edge portion 13 formed so as to be thinner toward the outer side. The leading end of the conducting wire group 12 and the leading end of the positioning conducting wire 16 protrude outside the substrate 10.

The protruding portion of the conducting wire 14 and the protruding portion of the alignment conducting wire 16 have substantially the same shape. A first bump 22 is formed in the vicinity of the tip of each conductive wire 14. The first bump 22 corresponds to the contact portion described in the claims. The first bump 22 is trapezoidal in cross section and has a quadrangular pyramid shape protruding in a direction perpendicular to the longitudinal axis of the conducting wire 14.
A second bump 24 is formed in the vicinity of the tip of the alignment conductor 16. The second bump 24 corresponds to a trace forming portion described in the claims. The second bump 24 has a triangular cross section and protrudes in a direction perpendicular to the longitudinal axis of the alignment conductor 16. Since the second bump 24 is sharper than the first bump 22, the second bump 24 comes into contact with the specimen position confirmation pad in a smaller area than the first bump 22. Even if the height of the first bump 22 from the conductive wire 14 and the height of the second bump 24 from the alignment conductive wire 16 are varied, the first conductive wire 14 and the alignment conductive wire 16 bend, so that the first The bump 22 can be brought into contact with the electrode of the specimen, and the second bump 24 can be brought into contact with the position confirmation pad of the specimen.

Further, the conductor group 12 and the alignment conductor 16 are formed directly on the substrate 10 so as not to protrude outside the substrate 10, and the first bump 22 of the conductor 14 and the second bump 24 of the alignment conductor 16 are formed. You may arrange | position right above the board | substrate 10. FIG. Alternatively, the second bump 24 may be formed directly on the substrate 10 without forming the alignment conductor 16 on the substrate 10.
17A and 17B are views showing an inspection method using the probe unit according to the fourth embodiment of the present invention. As shown in FIGS. 17A and 17B, by using a probe unit 4 in which a first bump 22 is formed on a conducting wire 14 and a second bump 24 is formed on an alignment conducting wire 16, a probe is used. The unit 4 and the sample 8 can be brought into contact with the substrate 10 of the probe unit 4 and the substrate 84 of the sample 8 in parallel. Since the second bump 24 is sharper than the first bump 22, the contact trace 86 (see FIG. 17C) can be formed on the position confirmation pad 82 without forming the contact trace on the electrode 80.

18 and 19 are views showing a method of manufacturing the probe unit 4 according to the fourth embodiment of the present invention.
First, in accordance with the steps shown in FIGS. 12A1 and 12B1 to FIGS. 13A1 and 13B1, a conductive film is formed on the polishing surface 46 constituted by the sacrificial film base layer 42, the sacrificial film 44, and the substrate 10. An underlayer 30 is formed. Thereafter, the first conductor film 38 is formed on the conductor film underlayer 30 in accordance with the steps shown in FIGS. 9A2 and 9B2 to FIGS. 10A1 and 10B1.

Next, as shown in FIGS. 18A1 and 18B1, a portion where the first bump 50 of the conducting wire 14 is formed and the first bump 50 is formed in the portion of the conducting wire 14 where the second bump 24 of the alignment conducting wire 16 is formed. After forming the resist film 48 having the second opening 52 on the conductor film underlayer 30 and the first conductor film 38, the second conductor film 54 is plated in the first opening 50 and the second opening 52 by plating. Grow.
Specifically, a resist is applied on the conductor film underlayer 30 and the first conductor film 38, exposed using a mask corresponding to the pattern of the first bumps 22 and the second bumps 24, developed, and then the first openings. A resist film 48 having 50 and a second opening 52 is formed. Ni, NiFe, or the like is used for the second conductor film 54.

This step may be performed after removing the resist film 32 formed by lithography for forming the first conductor film 38, or may be performed without removing it.
Next, as shown in FIGS. 18A2 and 18B2, the resist film 48 is removed until the vicinity of the surface of the second conductor film 54 is exposed. Specifically, for example, the resist film 48 is removed by reactive ion etching using O ₂ gas.

Next, as shown in FIGS. 18A3 and 18B3, the second conductor film 54 is sharpened by removing a part of the exposed portion of the second conductor film 54. Specifically, the second conductor film 54 is sharpened by ion milling using Ar ions.
Next, as shown in FIGS. 19A1 and 19B1, the resist film 48 is removed using acetone or NMP (N-methyl-2-pyrrolidone), and then the exposed conductor film underlayer 30 is removed. Further, the substrate 10 is divided into a necessary portion 10a and an unnecessary portion 10b by cutting with a dicer from the opposite side of the concave portion 40 of the substrate 10 into the sacrificial film 44 and making a cut 56.

Next, as shown in FIGS. 19A2 and 19B2, by removing the sacrificial film 44 with an etching solution or the like, the unnecessary portion 10b of the substrate 10 is separated and removed.
Next, as shown in FIGS. 19A3 and 19B3, when the sacrificial film base layer 42 is removed, the probe unit 4 is obtained. When the sacrificial film underlayer 42 is made of Cr, it is removed with ceric ammonium nitrate. In the present embodiment, the first bump 22 of the conductive wire 14 and the second bump 24 of the alignment conductive wire 16 are both constituted by the second conductor film 54.

  According to the present embodiment, the first conductor film 38 constituting the conductor group 12 is formed by lithography, and the second conductor film 54 constituting the first bump 22 as the contact portion is formed by lithography. In addition, the position of the first bump 22 can be finely controlled. Further, the first conductor film 38 constituting the alignment conducting wire 16 is formed by lithography, and the second conductor film 54 constituting the second bump 24 as the trace forming portion is formed by lithography, whereby the position with respect to the conductor group 12 is determined. The position of the matching conductor 16 can be finely controlled, and the position of the second bump 24 relative to the first bump 22 can be finely controlled.

FIG. 20 is a view for explaining a method of connecting the probe unit 4 and the flexible printed wiring board according to the fourth embodiment of the present invention.
As shown in FIG. 20, the flexible printed wiring board 7 can be bent due to its high flexibility, Cu wiring 72 is formed on an insulating substrate 70 made of polyimide, and a specific portion is an insulating film 74 such as a photo solder resist. Further, a reinforcing substrate 76 is provided. The surface of the electrode 78 of the Cu wiring 72 is covered with an Au plating layer 71. In order to connect the flexible printed wiring board 7 to the probe unit 4, the electrode 58 provided on one end opposite to the first bump 22 of the conducting wire 12 of the probe unit 4 and the Cu wiring 72 of the flexible printed wiring board 7 are connected. The electrode 78 is connected by an anisotropic conductive film 73. The alignment conducting wire 16 is formed for the purpose of alignment between the specimen and the probe unit 4 and is not used for the continuity test of the specimen, and therefore does not have to be connected to the Cu wiring 72 of the flexible printed wiring board 7.

(Fifth and sixth examples)
FIG. 21 shows a probe unit according to the fifth embodiment of the present invention. FIG. 22 shows a probe unit according to the sixth embodiment of the present invention.
In the probe unit 5 according to the fifth embodiment, the second bump 24 of the alignment conductor 16 is harder than the first bump 22 of the conductor 14. In FIG. 21A, the portion corresponding to the second bump 24 is hatched. The first bump 22 and the second bump 24 may have the same shape as shown in FIG. 21, or the second bump 24 may be sharper than the first bump 22. That is, the second bump 24 may be in contact with the specimen position confirmation pad in the same area as the first bump 22, or the second bump 24 may be in a smaller area than the first bump 22 in the position confirmation pad. You may make it contact.

  In the probe unit 6 according to the sixth embodiment, since the tip surface 28 of the hard second bump 24 of the alignment conductor 16 is rougher than the tip surface 26 of the first bump 22 of the conductor 14, the second bump 24 is It contacts the specimen position confirmation pad in an area smaller than the first bump 22. For this reason, according to the present embodiment, it is possible to form the contact trace on the specimen position confirmation pad without forming the contact trace on the specimen electrode.

  FIGS. 23A and 23B are diagrams showing an inspection method using the probe unit according to the fifth embodiment of the present invention. As shown in FIGS. 23A and 23B, according to the present embodiment, the second bump 24 and the specimen harder than the first bump 22 in a state where the first bump 22 is in contact with the electrode 80 of the specimen 8. The contact trace 86 (see FIG. 23C) can be formed on the position confirmation pad 82 without forming a contact trace on the electrode 80 of the specimen 8 by contacting the position confirmation pad 82. . Further, if the second bump 24 is brought into contact with the position confirmation pad 82 of the specimen 8 in a smaller area than the first bump 22, the contact pressure between the second bump 24 and the position confirmation pad 82 can be further increased. Therefore, it is easy to form a contact trace on the position confirmation pad 82.

FIG. 24 is a diagram showing a method of manufacturing the probe units 5 and 6 according to the fifth and sixth embodiments of the present invention.
In the method of manufacturing the probe unit 5 according to the fifth embodiment, first, the sacrificial film base layer 42, the sacrificial film 44, and the sacrificial film 44 are formed according to the steps shown in FIGS. 12A1 and 12B1 to 13A1 and B1. A conductor film underlayer 30 is formed on the polishing surface 46 constituted by the substrate 10. Thereafter, the first conductor film 38 is formed on the conductor film underlayer 30 in accordance with the steps shown in FIGS. 9A2 and 9B2 to FIGS. 10A1 and 10B1.

  Next, as shown in FIGS. 24A1 and 24B1, a resist film 60 having an opening 50 at a portion where the first bump 22 of the conductive wire 14 is formed is formed on the conductor film underlayer 30 and the first conductor film 38. After the formation, the second conductor film 54 is grown in the opening 50 by plating. Specifically, a resist is applied onto the conductor film underlayer 30 and the first conductor film 38, exposed using a mask corresponding to the pattern of the first bump 22, developed, and then a resist film 60 having an opening 50. Form. Ni, NiFe, or the like is used for the second conductor film 54.

This step may be performed after removing the resist film 32 formed by lithography for forming the first conductor film 38, or may be performed without removing it.
Next, as shown in FIGS. 24 (A2) and (B2), after removing the resist film 60, a resist film 62 having an opening 52 at a portion where the second bump 24 of the alignment conductor 16 is formed is formed as a conductor film. A high hardness film 64 is formed on the underlayer 30, the first conductor film 38, and the second conductor film 54, and is grown in the opening 52 by plating. Specifically, a resist is applied on the conductor film underlayer 30, the first conductor film 38, and the second conductor film 54, exposed using a mask corresponding to the pattern of the second bump 24, developed, and then opened. A resist film 62 having 52 is formed. The high hardness film 64 is a film harder than the second conductor film 54, and is made of, for example, Rh. Instead of Rh, NiW, NiFe, NiB, NiMn, NiP, etc. may be used.

  Next, the second conductor film 54 and the high-hardness film 64 are sharpened according to the steps shown in FIGS. 18A2 and B2 to FIGS. 19A3 and B3, and the substrate 10 is not necessary and unnecessary. When the sacrificial film 44 and the sacrificial film base layer 42 are removed after dividing into two parts, the probe unit 5 is obtained. According to the present embodiment, the first bump 22 is composed of the second conductor film 54, and the second bump 24 is composed of the high hardness film 64.

In the method of manufacturing the probe unit 6 according to the sixth embodiment, after performing the steps shown in FIGS. 24A2 and 24B2, the high-hardness film 64 is chlorinated as shown in FIGS. 24A3 and 24B3. Etch with ferrous iron to roughen the surface. The subsequent steps are the same as in the method for manufacturing the probe unit 5 according to the fifth embodiment.
According to the fifth and sixth embodiments, the first conductor film 38 constituting the conductor group 12 is formed by lithography, and the second conductor film 54 constituting the first bump 22 is formed by lithography. In addition, the position of the first bump 22 can be finely controlled. Further, the first conductor film 38 constituting the alignment conductor 16 is formed by lithography, and the high hardness film 64 constituting the second bump 22 is formed by lithography, so that the position of the alignment conductor 16 with respect to the conductor group 12 is increased. Can be finely controlled, and the position of the second bump 24 relative to the first bump 22 can be finely controlled.

Further, according to the fifth and sixth embodiments, the high hardness film 64 constituting the second bump 24 of the alignment conductor 16 is sharpened, whereby the contact area between the second bump 24 and the specimen position confirmation pad. Can be reduced.
Further, according to the sixth embodiment, the surface area of the high hardness film 64 constituting the second bump 24 of the alignment conductor 16 is roughened so that the contact area between the second bump 24 and the specimen position confirmation pad is increased. Can be reduced.

(A) is a top view which shows the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A). It is sectional drawing which shows the inspection method using the probe unit by 1st Example of this invention. (A) is a top view which shows the inspection method using the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 1st implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A) is a top view which shows the sample test | inspected with the test | inspection method by a comparative example, (B) is a top view which shows the sample test | inspected with the test | inspection method using the probe unit by 1st Example of this invention. is there. (A) is a top view which shows the inspection method using the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 1st implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A) is a top view which shows the inspection method using the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 1st implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A) is a top view which shows the inspection method using the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 1st implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A) is a top view which shows the inspection method using the probe unit by 1st Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 1st implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A1) to (A3) are plan views showing a method of manufacturing the probe unit according to the first embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A1) to (A3) are plan views showing a method of manufacturing the probe unit according to the first embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A) is a top view which shows the probe unit by the 2nd Example of this invention, (B) is the sectional view on the aa line of (A). (A1) to (A3) are plan views showing a method of manufacturing a probe unit according to the second embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A1) to (A3) are plan views showing a method of manufacturing a probe unit according to the second embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A) is a top view which shows the manufacturing method of the probe unit by the 2nd Example of this invention, (B) is the sectional drawing. (A) is a top view which shows the probe unit by the 3rd Example of this invention, (B) is the sectional view on the aa line of (A). (A) is a top view which shows the probe unit by 4th Example of this invention, (B) is the sectional view on the aa line of (A). (A) is a top view which shows the inspection method using the probe unit by 4th Example of this invention, (B) is the sectional view on the aa line of (A), (C) is 4th Example. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A1) to (A3) are plan views showing a method of manufacturing a probe unit according to the fourth embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A1) to (A3) are plan views showing a method of manufacturing a probe unit according to the fourth embodiment of the present invention, and (B1) to (B3) are sectional views thereof. (A) is a top view for demonstrating the connection method of the probe unit and flexible printed wiring board by 4th Example of this invention, (B) is the sectional drawing. (A) is a top view which shows the probe unit by 5th Example of this invention, (B) is the sectional view on the aa line of (A). (A) is a top view which shows the probe unit by the 6th Example of this invention, (B) is the sectional view on the aa line of (A). (A) is a top view which shows the inspection method using the probe unit by 5th Example of this invention, (B) is a sectional view on the aa line of (A), (C) is 5th implementation. It is a schematic diagram which shows the contact trace formed with the test | inspection method using the probe unit by an example. (A1) and (A2) are plan views showing a method of manufacturing a probe unit according to a fifth embodiment of the present invention, and (B1) and (B2) are sectional views thereof. (A3) is a top view which shows the manufacturing method of the probe unit by the 6th Example of this invention, (B3) is the sectional drawing.

Explanation of symbols

  1-6 Probe unit, 8 specimens, 10 substrate, 14 conductor, 18 tip (contact part), 20 tip (trace forming part), 22 first bump (contact part), 24 second bump (trace forming part) , 80 electrode, 82 position confirmation pad, 86 contact trace

Claims (14)

A probe unit for inspecting a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode,
A substrate,
A conductor having a contact portion formed on the substrate and in contact with the electrode;
Forming traces formed on the substrate and forming contact traces on the position confirmation pads by contacting the position confirmation pads with a smaller area than the contact parts in a state where the contact parts are in contact with the electrodes. And
A probe unit comprising:   The probe unit according to claim 1, wherein the trace forming part is harder than the contact part. A probe unit for inspecting a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode,
A substrate,
A conductor having a contact portion formed on the substrate and in contact with the electrode;
A trace forming portion formed on the substrate, harder than the contact portion, and forming a contact trace on the position check pad by contacting the position check pad in a state where the contact portion is in contact with the electrode. When,
A probe unit comprising:   The probe unit according to claim 3, wherein the trace forming portion contacts the position confirmation pad with a smaller area than the contact portion.   The probe unit according to claim 1, wherein the trace forming portion is sharper than the contact portion.   The probe unit according to claim 1, wherein the trace forming portion is a surface rougher than the contact portion.   The probe unit according to any one of claims 1 to 6, wherein the contact portion is formed at a portion of the conducting wire that protrudes outside the substrate. The substrate is flexible;
The probe unit according to claim 1, wherein the contact portion is located immediately above the substrate. A method of manufacturing a probe unit for inspecting a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode,
A lead forming step of forming a lead having a contact portion in contact with the electrode by lithography on a substrate;
A trace formation part forming step of forming a trace formation part on the substrate by lithography on the position confirmation pad by contacting the position confirmation pad with a smaller area than the contact part; and
A method for manufacturing a probe unit comprising:   10. The method of manufacturing a probe unit according to claim 9, wherein, in the step of forming the trace formation portion, the trace formation portion is sharpened from the contact portion.   10. The method of manufacturing a probe unit according to claim 9, wherein the trace forming part is formed on a surface rougher than the contact part in the trace forming part forming step. A method of manufacturing a probe unit for inspecting a specimen comprising an electrode and a position confirmation pad positioned with respect to the electrode,
A lead forming step of forming a lead having a contact portion in contact with the electrode by lithography on a substrate;
A trace formation part forming step of forming a trace formation part on the substrate by lithography, which is harder than the contact part and forms a contact trace on the position confirmation pad by contacting the position confirmation pad;
A method for manufacturing a probe unit comprising: A specimen inspection method comprising an electrode and a position confirmation pad positioned with respect to the electrode,
Contact traces formed on the position confirmation pad by contacting a contact portion of the lead wire of the probe unit with the electrode and bringing a trace formation portion of the probe unit into contact with the position confirmation pad in a smaller area than the contact portion. The stage of inspection;
Adjusting the position of the probe unit relative to the specimen according to the test result of the contact trace;
Testing the continuity of the specimen in a state where the contact portion is in contact with the electrode and the trace forming portion is in contact with the position confirmation pad;
The inspection method characterized by including. A specimen inspection method comprising an electrode and a position confirmation pad positioned with respect to the electrode,
The contact trace formed on the position confirmation pad is inspected by bringing the contact portion of the lead wire of the probe unit into contact with the electrode and bringing the trace formation portion harder than the contact portion of the probe unit into contact with the position confirmation pad. Stages,
Adjusting the position of the probe unit relative to the specimen according to the test result of the contact trace;
Testing the continuity of the specimen in a state where the contact portion is in contact with the electrode and the trace forming portion is in contact with the position confirmation pad;
The inspection method characterized by including.

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