TW200809919A - Exposure apparatus - Google Patents

Exposure apparatus Download PDF

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Publication number
TW200809919A
TW200809919A TW096115379A TW96115379A TW200809919A TW 200809919 A TW200809919 A TW 200809919A TW 096115379 A TW096115379 A TW 096115379A TW 96115379 A TW96115379 A TW 96115379A TW 200809919 A TW200809919 A TW 200809919A
Authority
TW
Taiwan
Prior art keywords
original
beams
pattern
exposure apparatus
optical system
Prior art date
Application number
TW096115379A
Other languages
English (en)
Chinese (zh)
Inventor
Akinori Ohkubo
Akiyoshi Suzuki
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200809919A publication Critical patent/TW200809919A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/7045—Hybrid exposures, i.e. multiple exposures of the same area using different types of exposure apparatus, e.g. combining projection, proximity, direct write, interferometric, UV, x-ray or particle beam

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096115379A 2006-05-01 2007-04-30 Exposure apparatus TW200809919A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006127773A JP2007299993A (ja) 2006-05-01 2006-05-01 露光装置

Publications (1)

Publication Number Publication Date
TW200809919A true TW200809919A (en) 2008-02-16

Family

ID=38647955

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096115379A TW200809919A (en) 2006-05-01 2007-04-30 Exposure apparatus

Country Status (4)

Country Link
US (1) US8085384B2 (enExample)
JP (1) JP2007299993A (enExample)
KR (1) KR100878938B1 (enExample)
TW (1) TW200809919A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5182588B2 (ja) * 2008-04-29 2013-04-17 株式会社ニコン オプティカルインテグレータ、照明光学系、露光装置、およびデバイス製造方法
JP5294490B2 (ja) * 2009-12-22 2013-09-18 株式会社ブイ・テクノロジー フォトマスク
KR101131321B1 (ko) 2010-08-03 2012-04-04 경희대학교 산학협력단 비대칭적 투과 특성을 가지는 광차단 필터
JP2013072845A (ja) * 2011-09-29 2013-04-22 Nuflare Technology Inc パターン検査装置及びパターン検査方法
WO2013073873A1 (ko) * 2011-11-16 2013-05-23 Seong Nak Hoon 선광원 발생장치와, 선광원 발생장치를 구비한 노광기와, 선광원 발생장치에 사용되는 렌티큐라시스템
KR102008983B1 (ko) * 2012-09-14 2019-08-12 김정식 극미세 금속 부품의 제조방법과 그에 의한 극미세 금속 부품
US9261793B2 (en) 2012-09-14 2016-02-16 Globalfoundries Inc. Image optimization using pupil filters in projecting printing systems with fixed or restricted illumination angular distribution
US9575412B2 (en) * 2014-03-31 2017-02-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for reducing pole imbalance by adjusting exposure intensity
US11892776B2 (en) * 2018-12-31 2024-02-06 Asml Netherlands B.V. Imaging via zeroth order suppression
US20260036525A1 (en) * 2024-08-05 2026-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Inspection apparatus and methods of using the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242770A (en) * 1992-01-16 1993-09-07 Microunity Systems Engineering, Inc. Mask for photolithography
US6304317B1 (en) * 1993-07-15 2001-10-16 Nikon Corporation Projection apparatus and method
JP3060357B2 (ja) * 1994-06-22 2000-07-10 キヤノン株式会社 走査型露光装置及び該走査型露光装置を用いてデバイスを製造する方法
US6259513B1 (en) * 1996-11-25 2001-07-10 Svg Lithography Systems, Inc. Illumination system with spatially controllable partial coherence
US6628370B1 (en) * 1996-11-25 2003-09-30 Mccullough Andrew W. Illumination system with spatially controllable partial coherence compensating for line width variances in a photolithographic system
JP4310816B2 (ja) * 1997-03-14 2009-08-12 株式会社ニコン 照明装置、投影露光装置、デバイスの製造方法、及び投影露光装置の調整方法
GB2325129B (en) * 1997-05-02 2002-06-19 Lsi Logic Corp Demodulating digital video broadcast signals
WO1999024852A1 (en) * 1997-10-16 1999-05-20 Matsushita Electric Industrial Co., Ltd. Hologram element polarization separating device, polarization illuminating device, and image display
DE69931690T2 (de) * 1998-04-08 2007-06-14 Asml Netherlands B.V. Lithographischer Apparat
US6563567B1 (en) * 1998-12-17 2003-05-13 Nikon Corporation Method and apparatus for illuminating a surface using a projection imaging apparatus
US6107011A (en) 1999-01-06 2000-08-22 Creo Srl Method of high resolution optical scanning utilizing primary and secondary masks
US6096461A (en) * 1999-01-06 2000-08-01 Creo Srl Laser exposure utilizing secondary mask capable of concentrating exposure light onto primary mask
TW587199B (en) * 1999-09-29 2004-05-11 Asml Netherlands Bv Lithographic method and apparatus
JP2001195901A (ja) * 2000-01-14 2001-07-19 Nippon Sheet Glass Co Ltd 照明装置
US6567155B1 (en) * 2000-03-16 2003-05-20 Intel Corporation Method for improved resolution of patterning using binary masks with pupil filters
KR100827874B1 (ko) * 2000-05-22 2008-05-07 가부시키가이샤 니콘 노광 장치, 노광 장치의 제조 방법, 노광 방법, 마이크로 장치의 제조 방법, 및 디바이스의 제조 방법
EP1480080A1 (en) * 2003-05-22 2004-11-24 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
US8085384B2 (en) 2011-12-27
US20070252968A1 (en) 2007-11-01
KR20070106936A (ko) 2007-11-06
JP2007299993A (ja) 2007-11-15
KR100878938B1 (ko) 2009-01-19

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