TW200809286A - Dry film for optical waveguide formation, optical waveguide, and process for producing the same - Google Patents

Abstract

A dry film from which an optical waveguide having high dimensional accuracy, satisfactory transmission characteristics, and excellent flex resistance can be easily produced in a short time. The dry film (1) comprises a base film (2), an uncured photosensitive resin composition layer (3), and a cover film (4) which have been superposed in this order. The photosensitive resin composition layer (3) comprises (A) a polymer comprising repeating units represented by the following formulae (1) and (2): (1) (2) (wherein R1 and R2 each independently is hydrogen or alkyl; R3 is (meth)acryloyl; X is a single bond or a divalent organic group; and Y is an unpolymerizable organic group), (B) a compound which contains a linear structure formed by the reaction of a polyol compound with a polyisocyanate compound and having urethane bonds repeatedly and has two to six (meth)acryloyl groups, (C) a compound having one or more ethylenically unsaturated groups per molecule, and (D) a photo-radical polymerization initiator.

Description

200809286 (1) Description of the Invention [Technical Field] The present invention relates to a dry film for forming an optical waveguide, an optical waveguide, and a method of manufacturing the same. More specifically, it relates to a dry film which can form various optical waveguide portions (cladding layers, etc.) having high shape accuracy, good transmission characteristics, and excellent bending resistance, and an optical waveguide manufactured using the dry film, and the like A method of manufacturing an optical waveguide. [Prior Art] In order to meet the advent of the era of the composite media and to increase the capacity and speed of information processing for optical communication systems and computers, optical waveguides for optical transmission media have attracted attention. Representatives of such optical waveguides, such as quartz-based waveguides, are generally manufactured in the following steps. (1) A bottom cladding layer is formed of a glass film on a ruthenium substrate by a method such as flame deposition (FHD) or CVD. (2) After forming a thin film having a different refractive index on the under cladding layer, the film was patterned by reactive ion etching (RIE) to form a core portion. (3) The upper cladding layer is formed by a flame deposition method. However, in the manufacturing method of such a quartz-based waveguide, a special manufacturing apparatus is required, and there is a problem that the manufacturing time is long. In order to solve such problems, it has been proposed to use a dry film (also referred to as a dry film photoresist-6 - (2) (2) 200809286 agent) which is obtained by laminating a base film or an uncured photosensitive resin composition layer. The method of optical waveguides. For example, it has been proposed to use a dry film photoresist formed of a base film and at least two photosensitive resin layers having different refractive indices after curing, and in the method of forming an optical waveguide, after laminating a dry film photoresist on a substrate, The dry film photoresist is irradiated with a certain amount of light by using an illumination tool that depicts a desired optical waveguide pattern, and after the radiation is hardened at a certain position, the unexposed portion is removed using a developer, and a coating layer is formed on the upper portion of the core layer. Method of optical waveguide (Japanese Patent Publication No. 6-25 8 5 3 7). The method for manufacturing a conventional quartz-based waveguide is described. This method is capable of forming an optical waveguide in a short time and at low cost because only a dry film resist is laminated on a substrate and irradiated with a certain amount of light to develop an image. However, since the side wall of the optical waveguide formed by the method exposes the core layer by air, it is necessary to cover the optical waveguide with a coating layer such as a liquid photoresist. Therefore, in addition to the dry film photoresist, other photoresists such as a liquid photoresist are required, and an additional step for forming the coating layer is required. Further, it has been proposed to contain (a) a polymer having a carboxyl group, a polymerizable group, and another organic group, (b) a compound having two or more polymerizable reactive groups in the molecule, and (c) a photosensitive polymerization initiator. SUMMARY OF THE INVENTION The present inventors have learned from the above proposal that the use includes the above (a). The conventional dry film of (c (3) (3) 200809286) has an optical waveguide having high shape accuracy and excellent transmission characteristics. However, the optical waveguide formed using the dry film exhibits a curved shape in the form of a film-like cured product, so that there is a problem of cracking or breaking. SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art, and it is therefore an object of the invention to provide a dry film which can form an optical waveguide having high shape accuracy, good transmission characteristics (waveguide loss) and excellent bending resistance in a simple manufacturing process. In order to solve the above problems, the inventors of the present invention have found that a dry film having a layer formed of a photosensitive resin composition containing a plurality of components having a specific chemical structure can be used in a simple manufacturing process to form a shape with high precision and transfer characteristics. The present invention is completed by an optical waveguide which is excellent and excellent in bending resistance. That is, the present invention provides the following items [1] to [1 1 ]. [1] A dry film for forming an optical waveguide, characterized in that the photosensitive resin composition layer is formed by forming a dry film for an optical waveguide obtained by laminating a base film and an uncured photosensitive resin composition layer. Contains the following components (A) to (D): (A) Polymers containing repeating units of the following general formulas (1) and (2), R1

I *-CH〇一C — · | (1)

X

I R3 200809286 (4) R2 ——CH2—C—— (2)

I

Y (wherein R1 and R2 are each independently a hydrogen atom or a carbon number of 1 to 12; R3 is a (meth) acrylonitrile group; X is a single bond or a divalent organic group; and Y is an organic having no polymerizability (B) a polyol compound formed by reacting a polyisocyanate compound with a linear structure having a urethane bond and having 2 to 6 (meth) acryloyl groups, (C) A compound having one or more ethylenically unsaturated groups in a molecule and a photosensitive resin composition of (D) a photoradical polymerization initiator. [2] The dry film for forming an optical waveguide of the above item [1] wherein the above general formula (1) is a structure represented by the following general formula (3)' R1

I , CH2—C- (3) 〇

I c=o

I N-Η Z—R3 (wherein R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; r3 is a (methyl) (5) (5) 200809286 acrylonitrile group; and W and Z are each independently a single bond. Or a divalent organic group). [3] The dry film for forming an optical waveguide according to the above [1] or [2], wherein the polystyrene-converted polystyrene-equivalent (B) component has an average molecular weight of 1,000 to 100,000. [4] The dry film for forming an optical waveguide according to any one of [1], wherein the component (B) is a reaction of a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate. Things. [5] The dry film for forming an optical waveguide according to any one of [1] or [4] wherein the photosensitive resin composition layer has a thickness of from 1 to 200 // m. [6] The dry film for forming an optical waveguide according to any one of [1] or [5] wherein the coated film is laminated on the opposite side surface of the base film of the photosensitive resin composition layer. [7] An optical waveguide characterized in that, in the optical waveguide including the bottom cladding layer, the core portion and the upper cladding layer, at least the bottom cladding layer and the upper cladding layer are from the foregoing item [1] or [6] Any of the hardened materials forming the photosensitive resin composition layer of the dry film for optical waveguides. [8] An optical waveguide characterized in that, in an optical waveguide including a bottom cladding layer, a core portion and an upper cladding layer, at least one of a bottom cladding layer, a core portion and an upper cladding layer is used in the preceding paragraph [ a cured product of a photosensitive resin composition layer for forming a dry film for an optical waveguide according to any one of [1] or [6], wherein a portion other than the portion formed by the cured product is composed of the above-mentioned photosensitive resin A cured product of the liquid photosensitive resin composition of the component (A) to the component (D) is formed. [9] An optical waveguide characterized in that the bottom cladding layer, the core portion -10 (6) (6) 200809286 and the upper cladding layer are any one of the above items [1] or [6]. The cured portion of the photosensitive resin composition layer of the dry film for optical waveguide is formed, and the refractive index of the core portion is larger than the refractive index of the under cladding layer and the upper cladding layer by 0.1% or more. [1] A method for producing an optical waveguide, characterized in that, in the method for manufacturing an optical waveguide including a bottom cladding layer, a core portion, and an upper cladding layer, a step of forming a bottom cladding layer is formed to form a core portion And the step of forming the upper cladding layer, and the step of forming at least the bottom cladding layer and the step of forming the upper cladding layer, comprising the step of forming the optical waveguide for any of the above [1] or [6] The photosensitive resin composition layer of the film is subjected to light irradiation to be hardened.

[11] A method of manufacturing an optical waveguide, characterized in that the method for manufacturing an optical waveguide including a bottom cladding layer, a core portion, and an upper cladding layer includes a step of forming a bottom cladding layer, a step of forming a core portion, and The step of forming an upper cladding layer, and the step of forming a bottom cladding layer, the step of forming a core portion, and the step of forming an upper cladding layer are at least one step comprising any one of [1] or [6] The step of forming a photosensitive resin composition layer for forming a dry film for an optical waveguide and curing it by light irradiation, and forming a portion other than the portion to be cured after light irradiation of the photosensitive resin composition layer includes The liquid photosensitive resin composition of the (A) component to the component (D) of the resin composition layer is cured by light irradiation, and the dry film having the specific photosensitive resin composition layer of the present invention can be used efficiently. The optical waveguide with good shape accuracy in a short period of time with a simple manufacturing step - 11 (7) (7) 200809286, excellent transmission characteristics (waveguide loss) and excellent bending resistance. BEST MODE FOR CARRYING OUT THE INVENTION The dry film of the present invention is obtained by laminating a base film such as a polyethylene terephthalate film or a layer containing an unhardened photosensitive resin composition of a specific component. In the present specification, the "dry film" is defined as a base film for a support having at least a photosensitive resin composition layer, and an unhardened photosensitive resin composition layer laminated on one surface of the base film. film. The components (A) to (D) and other optional components for the photosensitive resin composition constituting the dry film of the present invention will be described in detail below. [(A) component] The component (A) used in the present invention is a polymer (for example, a random polymer) containing a repeating unit represented by the following general formulas (1) and (2). R1

I —ch2—C- | (1)

X

I R3 R2 -CH2 -C- (2)

I

Y (wherein R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; -12-(8) 200809286 R3 is a (meth) propyl storage group; X is a single bond or a divalent organic group; It is an organic group which does not have a polymerizability). R1 and R2 in the general formulae (1) and (2) are each independently a hydrogen atom or a fluorenyl group having 1 to 12 carbon atoms, preferably a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms, more preferably a hydrogen atom or methyl. A preferred example of the repeating unit represented by the general formula (1) is as shown in the following general formula (3). -CH2 R1 II •C—I—IW | I 〇II c= I =〇IN— I -H To R: (3) (wherein R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3 It is a (meth) acrylonitrile group; w and hydrazine are each independently a single bond or a divalent organic group). W (a divalent organic group) in the general formula (3) is a structure represented by the following general formula (4) or a phenyl group or the like.

I c=〇〇(4) 200809286 Ο) (wherein R4 is a methyl group or a C 2 to 8 alkyl group). The Z (divalent organic group) in the general formula (3) is as defined above, η is an integer from 1 to 8) and the like. In the general formula (2), for example, the following general formula (phenyl group, cyclic decylamino group, pyridyl group, etc. (wherein R5 is a linear or branched group having a carbon number of 1 to 20). The (Α) component has an average weight of 2,000 to 100,000 in terms of polystyrene, preferably 5,000 to 100,000 to 70,000, and particularly preferably 10,000 to 50,000. This is not a low viscosity of the composition, making it difficult to form a dry film. The photosensitive resin composition layer has a viscosity of more than 100,0 (10) and a disadvantage of a photosensitive resin composition when a dry film is formed. (A) A method for producing a component, such as a radical polymerizable compound in a solvent After radical polymerization of the component (b) (corresponding to a radical polymerizable compound), (C) a method of adding (meth) propylene oxime to the hydroxyl group of the chain. The compound used in the method (a) will be described below. _(CH2) n-〇-(5) The molecular weight of the structure, chain or cyclic carbon is preferably, more preferably 8,0 0 to 5, and it will fall when 〇〇〇: a certain thickness Increasing the coating property of the composition f is deteriorated (a) having a hydroxyl group of the general formula (2): obtaining a copolymer a branched isocyanate to (c). -14- (10) (10) 200809286 Compound (a) (a radical polymerizable compound having a hydroxyl group) is a hydroxyl group in the compound and an isocyanate group in the compound (c) ( -N = C = 0) After the reaction, the obtained branched moiety contains a urethane bond (-NH-COO -) and a constituent unit derived from the (meth) propylene methoxy group of the compound (c) is introduced into the component. (A) For example, compound (a) is, for example, 2-hydroxyethyl (meth) acrylonitrile, 2-hydroxypropyl (meth) acrylonitrile, 4-hydroxybutyl (meth) propylene hydride A hydroxymethyl (meth) acrylonitrile group, a 4-hydroxycyclohexyl (meth) acryl fluorenyl group, etc. The compound (a) may be used alone or in combination of two or more. (A) A compound in the component (a) The content of the content is preferably from 3 to 80% by mass, more preferably from 7 to 60% by mass, particularly preferably from 10 to 40% by mass. When the content is less than 3% by mass, the curing is insufficient. The content exceeds 80% by mass. It is difficult to adjust the refractive index at %. The main purpose of the compound (b) (the compound corresponding to the structure of the general formula (2)) is moderate. The mechanical properties and refractive index of the component (A). Compound (b) such as methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, η-butyl (meth)acrylic acid ester, sec-butyl (meth) acrylate, alkyl (meth) acrylate such as t-butyl (meth) acrylate; dicyclopentanyl (meth) acrylate, An ester of (meth)acrylic acid such as cyclohexyl (meth) acrylate and a cyclic hydrocarbon compound; phenyl (meth) acrylate, benzyl (meth) acrylate, fluorenyl-phenylphenol glycidyl ether ( Methyl)acrylic acid-15-(11) (11)200809286 ester, p-cumylphenoxyethylene glycol acrylate, etc. (aryl) (meth) acrylate; tribromophenol ethoxy (meth) acrylate Ester, 2,2,3-trifluoromethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (A Halogenated (meth) acrylates such as acrylates, perfluorooctylethyl (meth) acrylates; styrene, α-methylstyrene, m-methylphenyl Aromatic vinyl such as ene, p-methylstyrene, vinyltoluene or p-methoxystyrene; 1,3-butadiene, isoprene, 1,4-dimethylbutadiene, etc. a conjugated diene; a nitrile group-containing polymerizable compound such as acrylonitrile or methacrylonitrile; a guanamine-containing polymerizable compound such as acrylamide or methacrylamide; or an aliphatic vinyl such as vinyl acetate. Among them, preferred are dicyclopentanyl (meth) acrylate, methyl (meth) acrylate, η-butyl (meth) acrylate, styrene, α-methyl styrene and the like. The compound (b) may be used alone or in combination of two or more. The content of the compound (b) in the component (A) is preferably from 15 to 92% by mass, more preferably from 25 to 84% by mass, particularly preferably from 35 to 78% by mass. When the content is less than 15% by mass, it is difficult to adjust the refractive index. When the content is more than 92% by mass, the hardening is likely to be insufficient. Compound (c) (isocyanate having (meth) propylene oxime) such as 2-methacryloxyethyl isocyanate, N-methyl propylene decyl isocyanate, methacryloxymethyl isocyanate, 2 - Propylene oxyethyl isocyanate, N-propylene decyl isocyanate, propylene oxymethyl isocyanate, etc. -16- (12) (12) 200809286 The content of the compound (c) in the component (A) is preferably from 5 to 80 %, more preferably from 9 to 60% by mass, particularly preferably from 12 to 45% by mass. When the content is less than 5% by mass, the hardening is insufficient. When the content exceeds 80% by mass, it is difficult to adjust the refractive index. The component (A) may further contain constituent units not described in the general formulas (1) and (2). a compound in which such a constituent unit is introduced (hereinafter referred to as a compound (d)), such as dicarboxylic acid diesters such as diethyl amenodiate, diethyl avulmonate or diethyl itaconate; vinyl chloride, partial A chlorine-containing polymerizable compound such as vinyl chloride. The content of the compound (d) in the component (A) is preferably from 0 to 20% by mass, more preferably from 10% to 10% by mass. In the production process of the component (A), various additives such as a thermal polymerization inhibiting agent, a storage stabilizer, and a curing catalyst may be added during the addition reaction of the compound (C). The purpose of the addition of the thermal polymerization inhibitor is to suppress the heat generation polymerization reaction. Thermal polymerization inhibitors such as pyrolysis, benzoquinone, hydrogen@1, methyl blue, tert-butylcatechol, monobenzyl ether, methoxyphenol, amyloid, pentyloxyhydroquinone, n-butyl Phenolic, phenol, hydroquinone-propyl ether and the like. The stabilizer is preserved, for example, 2,6-di-b-butyl-P-cresol, benzoquinone, p-toluene, p-xylene, phenyl-α-naphthylamine and the like. The curing catalyst is, for example, dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin dioleate, dibutyltin diacetate, titanium tetramethoxide, titanium tetraethoxide, and the like. The total amount of the various additives added to the total amount of the compounds (a) to (c) is usually 1 part by mass or less, preferably 5 parts by mass or less, -17-(13) (13) 200809286 or less. . When the component (A) is produced, a solvent which can be used in the radical polymerization of the compound (a), the compound (b) and, if necessary, the compound (d), such as methanol, ethanol, ethylene glycol, diethylene glycol or propylene glycol And other alcohols; cyclic ethers such as tetrahydrofuran and dioxane; ethylene glycol-methyl ether, ethylene glycol-diethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol-methyl ether, two Alkenyl ethers of polyvalent alcohols such as ethylene glycol, diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, propylene glycol methyl ether, propylene glycol-ethyl ether; Alkenyl ether acetates of polyvalent alcohols such as diethyl ether acetate, diethylene glycol diethyl ether acetate, propylene glycol diethyl ether acetate, propylene glycol-methyl ether acetate; aromatic hydrocarbons such as toluene and xylene; acetone; Ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, diacetone alcohol; ethyl acetate, butyl acetate, ethyl lactate, Ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropanoate, ethyl 2-hydroxy-2-methylpropanoate, ethyl ethoxyacetate, ethyl hydroxyacetate, 2- Methyl 3-methylbutanoate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate Esters. Among them, preferred are cyclic ethers, alkyl ethers of polyvalent alcohols, alkyl ether acetates of polyvalent alcohols, ketones, esters and the like. When the component (A) is produced, when the solvent for the addition reaction of the compound (c) is a compound having a hydroxyl group in the molecule, the compound (c) is not preferred to react with the solvent. Therefore, the solvent for the addition reaction of the compound (c) is preferably a compound having no hydroxyl group. The solvent having no hydroxyl group is, for example, a solvent having no hydroxyl group in the solvent for radical polymerization. -18- (14) 200809286 A catalyst-free radical polymerization initiator for radical polymerization for (A) component. Radical polymerization initiators such as 2,2' butyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-isomethoxy-2,4-dimethyl An azo compound such as valeronitrile; an organic peroxide such as oxidized laurel, butyl peroxytrimethylacetate or 1,1'-peroxy)cyclohexane; and a peroxide hydroxide In the case of a radical polymerization initiator, a reducing agent-reducing initiator may be used in combination. The glass transition temperature of the component (A) obtained by the above method is lower than the above 150 °C. The glass transition temperature at this time is defined by a general scanning calorimeter (DSC). When the glass of the component (A) is 2 CTC, it is difficult to form a photosensitive resin group or a photosensitive resin composition layer on the base film, and it is not preferable to make the laminate work on the substrate poor in workability. On the other hand, when the glass of the component (A) exceeds 150 °C, the photosensitive resin composition of the dry film is embrittled, and the adhesion of the substrate to the dry film is deteriorated. [(B) component] The component (B) is a polyol compound and a polyisocyanate, and contains a compound having a linear structure having a urethane bond to 6 (meth) fluorenyl groups. (B) A component such as a polyol compound or a polyisocyanate containing a hydroxyl group (meth) acrylate is obtained by a reaction. (B) The manufacturing method of the component is as follows, the following Processes 1 to 4. The use of general-azobisisoindole nitrogen double (4-benzene benzene, over-double (t-butyl, etc.) is used as a poor temperature for the oxidation of 20 ° C, the thickness of the film, the film The temperature layer is hardened and the reaction is formed and has a compound of 2, and -19-(15) (15) 200809286 Process 1 : a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate are added to react. a method in which a polyol compound is reacted with a polyisocyanate compound and then reacted with a hydroxyl group-containing (meth) acrylate. Process 3: a polyisocyanate compound is reacted with a hydroxyl group-containing (meth) acrylate, and then reacted with a polyol compound. Method 4: A method in which a polyisocyanate compound is reacted with a hydroxyl group-containing (meth) acrylate, then reacted with a polyol compound, and finally reacted with a hydroxyl group-containing (meth) acrylate. The molecular weight distribution is preferably controlled to 4. (1) Polyol Compound The polyol compound of the component (B) of the present invention is a compound having two or more hydroxyl groups in the molecule. The compound is, for example, an aromatic polyether polyol, an aliphatic polyether polyol, an alicyclic polyether polyol, a polyester polyol, a polycarbonate polyol, a polycaprolactone polyol, or the like. The epoxy structure of the polyether polyol compound can further improve the adhesion between the substrate and the optical waveguide. Aromatic polyether polyol such as bisphenol A ethylene oxide additional diol, bisphenol A propylene oxide Additional diol, butyl phenol A butylene oxide addition diol, bisphenol F ethylene oxide addition diol, bisphenol F propylene oxide addition diol, bisphenol F propylene oxide addition diol, Hydroquinone epoxide added diol, naphthoquinone epoxide added diol, etc. Commercial products such as Unio DA700, DA1000 (manufactured by Nippon Oil & Fats Co., Ltd.), etc. -20- (16) (16) 200809286 Aliphatic polyether polyols such as ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran, 2-methyltetrahydrofuran, 3-methyltetrahydrofuran, substituted tetrahydrofuran, oxetane, substituted oxygen heterocycle At least one of the selected ones of butane, tetrahydropyran and oxepane The compound obtained by ring-opening (co)polymerization, etc. Specifically, for example, polyethylene glycol, 1,2-polypropylene glycol, 1,3-polypropylene glycol, polytetramethylene glycol, 1,2-polybutylene glycol, Polyisobutylene glycol, copolymer polyol of propylene oxide and tetrahydrofuran, copolymer polyol of ethylene oxide and tetrahydrofuran, copolymer polyol of ethylene oxide and propylene oxide, tetrahydrofuran and 3-methyltetrahydrofuran Copolymer polyol, copolymer copolymer of ethylene oxide and 1,2-butylene oxide, etc. Cycloaliphatic polyether polyol, such as hydrogenated bisphenol A, ethylene oxide additional diol, hydrogenation double Propylene oxide propylene diol, hydrogenated bisphenol A butylene oxide addition diol, hydrogenated bisphenol F ethylene oxide addition diol, hydrogenated bisphenol F propylene oxide addition diol, hydrogenation double A butylene oxide addition diol of phenol F, a dihydroxymethyl compound of dicyclopentadiene, tricyclodecane dimethanol, or the like. Commercial products such as eugenyl DC1100, unicorn DC 1 800, unicorn DCB1100, and unicorn DCB 1 800 (such as sakamoto oil company) are commercially available as aliphatic polyether polyols and alicyclic polyether polyols. System); PPTG4000, PPTG2000, PPTG1000, PTG2000, PTG3000, PTG650, PTGL2000, PTGL 1 000 (above is Baotu Valley Chemical Co., Ltd.); EXENOL4020, EXENOL3 020, EXENOL2020, EXENOL 1 020 (above is Asahi Glass Co., Ltd.); PBG3 000 , PBG2000, PBG1000, Z3001 (above is the first industrial pharmaceutical company); ACCLAIM 2200, 3201, 4200, 6300, 8200 (above - 21 - (17) (17) 200809286 by the Bayer company); NPML-2002 , 3002, 4002, 8002 (above is manufactured by Asahi Glass Co., Ltd.). Polyester polyols such as ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, tetramethyl glycol, polytetramethylene glycol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexane Polyvalent alcohols such as alkyl dimethanol, 3-methyl-1,5-pentanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, and the like, and citric acid, isophthalic acid A polyester polyol obtained by reacting a polyvalent acid such as terephthalic acid, maleic acid, fumaric acid, adipic acid or sebacic acid. Commercial products such as, Clappo? -2010,? PCT 1? VIII? 〖八-Α, ΡΚΑ-Α2, ΡΝΑ-2 0 0 0, etc. (above is Claret). Polycarbonate polyols such as 1,6-hexane polycarbonate and the like. Commercial products such as DN-980, 981, 982, 983 (above are manufactured by Japan Polyurethane Co., Ltd.), PLACCEL-CD205, CD-983, CD220 (above, manufactured by Taychel Chemical Industry Co., Ltd.), PC -8000 (made by PPG, USA). Polycaprolactone polyols such as ε-caprolactone and ethylene glycol, polyethylene glycol, propylene glycol, polypropylene glycol, tetramethyl glycol, polytetramethylene glycol, U·polybutylene glycol, 1,6- A polycaprolactone diol obtained by reacting a diol such as hexanediol, neopentyl glycol, 1,4-cyclohexanedimethanol or butanediol. Commercial products such as PLACCCEL205, 205AL, 212, 212AL, 220, and 220AL (manufactured by Tachel Chemical Industry Co., Ltd.) and the like. Other polyol compounds usable in the present invention, such as hexanediol, propylene glycol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, neopentyl glycol, 1,4- End of cyclohexanedimethanol, poly/3-methyl-3-valerolactone, hydroxyl terminated polytetramethylene glycol, hydroxyl terminated hydrogenated polybutanediol, castor oil modified polyol, polydimethyloxane The diol compound, polydimethyl siloxane carbitol, -22-(18) (18) 200809286 polyhydric alcohol, and the like. Preferred among the above polyol compounds are polypropylene glycol, ethylene oxide/propylene oxide copolymerized diol, ethylene oxide/1,2-butylene oxide copolymerized diol, and propylene oxide/tetrahydrofuran copolymerization. The diol is more preferably an ethylene oxide/1,2-butylene oxide copolymerized diol. The number average molecular weight of the polyol compound is preferably from 4 (10) to 1 Torr, more preferably from 1,000 to 8,000, most preferably from 1,500 to 5,000. When the number average molecular weight is less than 400, the Young's ratio of the hardened material at normal temperature and low temperature is increased, and it is difficult to obtain sufficient bending resistance. When the average molecular weight exceeds 10,000, the viscosity of the composition is increased, and the coating property when the substrate is coated with the composition is deteriorated. (2) Polyisocyanate compound The polyisocyanate compound which is one of the raw materials of the component (B) of the present invention is a compound having two or more isocyanate groups in the molecule. Such compounds are, for example, 2,4-tolyl diisocyanate, 2,6-tolyl diisocyanate, 1,3-extended xylylene diisocyanate, 1,4-extended xylylene diisocyanate, 1,5-naphthalene Diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 3,3'-dimethyl-4,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane Isocyanate, 3,3'-dimethylphenylene diisocyanate, 4,4'-extended biphenyl diisocyanate, 1,6 hexane diisocyanate, isophorone diisocyanate, methyl bis (4 -cyclohexyl isocyanate), 2,2,4·trimethylhexamethylene diisocyanate, 1,4-hexamethylene diisocyanate, bis(2-isocyanateethyl)fumarate, 6·isopropyl Base-1,3-phenyldiisocyanate, 4-diphenylpropane diisocyanate, lysine diisocyanate-23-(19) 200809286 ester, hydrogenated diphenylmethane diisocyanate, hydrogenated dicarboxylate, Diisocyanide such as tetramethylxylylene diisocyanate. Among them, hydrogenated xylylene diisocyanate diisocyanate and 2,2,4 trimethylhexamethylene diisocyanate isocyanate compounds are preferably used singly or in combination of two or more. (3) Hydroxy-containing (meth) acrylate One of the raw materials of the component (B) of the present invention contains a hydroxyl group (the methyl ester is a compound having a hydroxyl group and a (meth) acrylonitrile group in the molecule, for example, a 2-hydroxyethyl group. (Meth) acrylate, (meth) acrylate, 2-hydroxybutyl (meth) propylene-3-phenoxypropyl (meth) acrylate, 4-hydroxybutyracrylate, 2-hydroxyl Alkyl (meth) propylene decyl phosphate cyclohexyl (meth) acrylate, 6-hydroxyhexyl (methyl, neopentyl glycol - (meth) acrylate, trimethylol propyl) acrylate, trihydroxyl Methyl ethane di(meth)acrylic acid alcohol tri(meth) acrylate, dipentaerythritol penta (methyl group, etc., such as alkyl glycidyl ether, allyl glycidyl ether (meth) acrylate, etc. A compound obtained by an addition reaction of a glycidyl compound with an olefinic acid, preferably a 2-hydroxyethyl (meth) acrylate (meth) acrylate or the like. Addition of a raw material to a phenyl diisocyanate compound, isophorone, etc. Acrylic compound. 2-hydroxypropyl acid ester, 2-hydroxy (methyl) ester, 4-hydroxy) acrylate alkane (methyl ester, pentaerythritol) acrylate, glycidyl (meth) propyl ester , 2-hydroxyl ratio, for example, -24- (20) (20) 200809286 containing a trans (meth) propionate 1 mol polyol compound is 0. 5 to 2 moles, polyisocyanate compound is 1 to 2. 5 moles. The number average molecular weight of the component (B) of the present invention (polystyrene equivalent enthalpy measured by gel permeation chromatography) is preferably from 1,0 0 0 to 1,0 0,0 0, more preferably from 3,000 to 60,000. Good for 5,000 to 30,000. When the number average molecular weight is less than 1,000, it is difficult to obtain sufficient bending resistance of a cured product (e.g., a coating layer) of the photosensitive resin composition layer. When the average molecular weight exceeds 1,000,000, the viscosity of the photosensitive resin composition is too high, and the coating property when the photosensitive resin composition is coated on the base film to form a composition layer is deteriorated. The amount of the component (B) to be added in the composition of the present invention is preferably 10 to 100 parts by mass, more preferably 20 to 80 parts by mass, particularly preferably 30 to 70 parts by mass, per 100 parts by weight of the component (A). When the amount is less than 10 parts by mass, the cured product (for example, the coating layer) of the photosensitive resin composition may not have sufficient bending resistance, and when the amount exceeds 100 parts by weight, the compatibility with the component (A) may be deteriorated. Further, a rough film is formed on the surface of the cured product (for example, the coating layer) of the photosensitive resin composition layer, so that sufficient transparency cannot be obtained. [(C) component] The component (C) is a compound having one or more ethylenically unsaturated groups in the molecule. The ethylenically unsaturated group, such as a (meth) propyl sulfhydryl group, a vinyl group, etc., has a molecular weight of preferably less than 2,000 Å and more preferably less than -25 - (21) (21) 200809286 1,000. And (C) component O. The boiling point of IMPa is preferably 130 ° C or more. The component (C) having two or more ethylenically unsaturated groups in the molecule is preferably a compound having two or more (meth)acryl fluorenyl groups and/or a vinyl group in the molecule and having a molecular weight of less than 1, fluorene. At this time, the ethylenically unsaturated group in the molecule may be all of propylene fluorenyl group, methacryl fluorenyl group, vinyl group, or propylene fluorenyl group and propylene fluorenyl group, acryl fluorenyl group and vinyl group, methacryl fluorene group. a combination of any two of a base and a vinyl group, or a combination of an acryloyl group, a methacryloyl group and a vinyl group. a (meth) acrylate having two (meth) acrylonitrile groups in the molecule, such as ethylene glycol di(meth) acrylate, tetraethylene glycol di(meth) acrylate, polyethylene glycol bis ( Methyl) acrylate, 1,4-butanediol di(meth) acrylate, 1,6-hexanediol di(meth) acrylate, neopentyl glycol di(meth) acrylate, three ( 2-hydroxyethyl)trimeric isocyanate di(meth)acrylate, bis(hydroxymethyl)tricyclodecane di(meth)acrylate, bisphenol A ethylene oxide or propylene oxide adduct Di(meth)acrylate of diol, hydrogenated bisphenol A, ethylene oxide or propylene oxide adduct, di(meth)acrylate of diol, bisphenol A diglycidyl ether addition ( Epoxy (meth) acrylate of methyl) acrylate, diacrylate of polyoxyalkylene bisphenol A, 9,9-bis[4-(2-propionyloxyethoxy)phenyl] Hey. a (meth) acrylate having three or more (meth) acrylonitrile groups in the molecule, such as a compound having three or more hydroxyl groups, and a compound having 3 mol or more (meth)acrylic acid ester bonded thereto, for example, trihydroxyl Methylpropane tris(methyl) -26- (22) (22) 200809286 acrylate, pentaerythritol tri(meth) acrylate, trimethylolpropane triethyl methacrylate, tris(2 - Hydroxyethyl)trimeric isocyanate tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like. Further, a polyether propylene ester oligomer having a polyether, a polyester, a polyester acrylate oligomer or a polyoxypropylene acrylate oligomer may be used. a (meth) acrylate having one (meth) acrylonitrile group in the molecule, such as dimethylaminoethyl (meth) acrylate, propylene morpholine, dimethyl methacrylate, diethyl Acrylamide, diisopropylacrylamide, diacetone acrylamide, dibutoxymethyl (meth) acrylamide, N-vinyl pyrrolidone, N-vinyl caprolactam, isobornyl (Meth) acrylate, dicyclopentadienyl acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, 3-hydroxy-1-adamantyl (Meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, η-butyl (meth) acrylate, isobutyl (meth) acrylate, cyclohexyl (A Acrylate, isoamyl (meth) acrylate, isooctyl (meth) acrylate, lauryl (meth) acrylate, stearin (meth) acrylate, benzyl (methyl) Acrylate, dicyclopentadienyl (meth) acrylate, tricyclodecyl (meth) acrylate, 2-propene Mercaptocyclohexyl succinic acid, tetrahydroindenyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, butoxyethyl (meth) acrylate, alkanol Alcohol (meth) acrylate of ethylene oxide adduct (carbon number 1 to 8), alcohol (meth) acrylate of phenol ethylene oxide adduct, ρ-cumylphenol Ethylene Oxide Addition -27- (23) (23) 200809286 Alcohol (meth) acrylate, nonyl phenol ethylene oxide adduct alcohol (meth) acrylate, hydrazine - Phenylphenol glycidyl ether (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2 -methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 2-phenoxyethyl (methyl) Acrylate, ethyl carbitol (meth) acrylate, 2-ethylhexyl (meth) acrylate, 3-hydroxycyclohexyl acrylate, tribromophenol ethoxy (methyl) propyl Ethyl ester, 2,2,2-trifluoromethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, ih, 1H, 5H - octafluoropentyl (Meth) acrylate, perfluorooctylethyl (meth) acrylate, and the like. Such commercially available products are, for example, Uppiman-UV SA1002, SA2007 (above is Mitsubishi Chemical Corporation), Bisko #150, #155, #160, #190, #192, #195, #23 0, #215,#260,#295,#3 00,#3 3 5 HP, #3 60, #400, #65 0, #700, 3F, 3FM, 4F, 8F, 8FM, 2-MTA, 2-ETA , V-MTG, 3PA, GPT, HEA, ΗΡΑ, 4-ΗΒΑ, ΑΙΒ, ΙΟΑΑ, LA, STA, (above is Osaka Organic Chemical Industry Co., Ltd.), photo ester M, E, NB, IB, EH, ID, L, L-7, TD, L-8, S, 1 30MA, 04 IMA, CH, THF, BZ, PO, IB-X, HO, HOP, HOA, HOP-A, HOB, DM, DE, HO- MS, EG, 2EG, 1. 4BG, 1. 6HX, 1. 9ND, 1. 10DC, TMP, G-101P, G-201P, BP-2EM, BP-4EM, BP-6EM, MTG, BO, BC, 3EG, 4EG, 9EG, 14EG, NP, FM-108, G-201P, light C -28- (24) (24)200809286 Authinates IO-A, HOB-A, TMP-3EO-A, FA-108, ΙΑΑ, LA, SA, BO-A, EC-A, MTG-A, 130A , DPM-A, PO-A, P-200A, NP-4EA, NP-8EA, THF-A, IB-XA, HOA, HOP-A, M-600A, Η OA - MS, 3 EG - A, 4 EG - A, 9 EG - A, 14EG-A, NP-A, MPD-A, 1 · 6 Η X - A, BEPG - A, 1 · 9 ND - A, MOD-A, DCP-A, BP- 4EA, BP-4PA, BP-10EA, TMP-A, TMP-6EO-3A, PE-3A, PE-4A, DPE-6A, BA-104, BA-134 (above is produced by Kyoeisha Chemical Co., Ltd.), KAYARAD MANADA, HX-220, HX-620, R-551, R - 7 1 2, R _ 6 0 4, R · 6 8 4, PET-30, GPO- 3 03, TMPTA, DPHA, D-310, D-3 3 0, DPCA-20, -30, -60, -120 (above is manufactured by Nippon Chemical Co., Ltd.), Iloni M208, M210 > M215, M220, M240 > M305, M309, M310, M3 1 5, M3 2 5, M400, M 1 200, M6100, M6200, M6250, M7100, M8 03 0, M8 060, M8100, M8 5 3 0, M8560, M90 50 (above is made by East Asia Synthetic Co., Ltd.), NK Ester #401P, NK Ester A-BPEF, NK Ester A-CMP-1E (above is New Nakamura Chemical Industry Co., Ltd.), and Newflon BR-31 (above the first) Industrial pharmaceutical company), Liboji VR-77, -60, -90 (made by Showa Polymer Co., Ltd.), Ebecryl81, 83, 600, 629, 645, 745, 754, 767, 701, 75 5, 705 , 770, 800, 8 05, 810, 83 0, 450, 1 83 0, 1870 (above is the Taischer UCB system), beam group 575, 551B, 5 20H, 102 (above is Arakawa Chemical Co., Ltd.), Akuman HA, HM (above is produced by Idemitsu Kosan Co., Ltd.). The components (C) may be used alone or in combination of two or more. -29- (25) (25)200809286 (C) The amount of the component added is preferably 5 to 1 part by mass, more preferably 10 to 70 parts by mass, even more preferably 15 to 100 parts by mass of the component (A). 50 parts by mass. When the amount is less than 5 parts by mass, the shape of the optical waveguide of the object is deteriorated when the optical waveguide is formed. When the amount exceeds 100 parts by mass, the compatibility with the component (A) is deteriorated, and the surface of the cured product is deteriorated. A rough film is produced. [(D) component] The component (D) is a photoradical polymerization initiator which generates an active species (radical species) capable of polymerizing an ethylenically unsaturated group by irradiation with light. The light refers to, for example, infrared rays, visible light, ultraviolet rays, and X-rays, electron rays, alpha rays, ridge wires, and r-line ionizing radiation. Photoradical polymerization initiators such as acetophenone, acetophenone ketal, 1-hydroxycyclohexyl phenyl ketone, 2,2-dimethoxy-2-phenyl acetophenone, xanthone, hydrazine Ketone, benzaldehyde, hydrazine, hydrazine, triphenylamine, carbazole, 3-methylethyl benzene, 4-chlorobenzophenone, 4,4'-dimethoxybenzophenone, 4, 4'-Diaminobenzophenone, Michler's ketone, Benzene isopropyl ether, Benzene ether, Benzyl dimethyl ketal, 1-(4-isopropylphenyl)-2-hydroxy-2 -methylpropan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, thioxanthone, diethylthioxanthone, 2-isopropylthioxanthone, 2- Chlorothenoxone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinyl-propan-1-one, 2,4,6-trimethylbenzoquinone A phosphine oxide, bis(2,6-dimethoxybenzoquinone) 2,4,4-trimethylpentylphosphine oxide or the like. Commercial products of photoradical polymerization initiators such as Irgacurel 84, 369, 651, 5 00, 819, 907, 784, 295 9 , CGI 1 700, CGI 1750 -30- (26) (26) 200809286, CGI 11850, CG24- 61. Darocurlll6, 1173 (above is Gibbs Co., Ltd.), Luc irin TPO, TPO-L (above, BASF), and Yubeku P36 (made by UCB). The photoradical polymerization initiator may be used singly or in combination of two or more. The content of the component (D) in the photosensitive resin composition of the present invention is preferably 0. 1 to 10% by mass, more preferably 0. 2 to 5 mass%. The content rate is less than 0. When it is 1% by mass, it will not be sufficiently hardened, and the transmission characteristics of the optical waveguide will be problematic. Further, when the content exceeds 10% by mass, the long-term transport characteristics of the photopolymerization initiator may be adversely affected. The photopolymerization initiator of the present invention may be added with a photosensitizer. When using a light sensitizer, it can absorb energy lines such as light more effectively. Photosensitizers such as thioxanthone, diethylthioxanthone and thioxanthone derivatives; derivatives of ruthenium, bromine ruthenium and osmium; ruthenium, bromine ruthenium and osmium derivatives: ruthenium and osmium derivatives a derivative of xanthone, thioxanthone and thioxanthone; coumarin and coumarinone. The kind of the photosensitizer can be selected depending on the kind of the photopolymerization initiator. The resin composition of the present invention may contain, in addition to the above components (A) to (D), the properties of the resin composition of the present invention, for example, a compound having a polymerizable reactive group in the molecule, and a polymer. Resins (such as epoxy resin, acrylic resin, polyamide resin, polyamide amide resin, urethane resin, polybutadiene resin, polychloroprene resin, polyether resin, polyester resin) , styrene-butadiene block copolymer, petroleum resin, xylene resin, ketone resin, cellulose resin, fluorine-31 - (27) (27) 200809286 polymer, polyoxyalkylene polymer) . If necessary, various additives such as an antioxidant, a UV absorber, a light stabilizer, a decane coupling agent, a coating surface modifier, a thermal polymerization inhibiting agent, a coating agent, a surfactant, a coloring agent, a preservation stabilizer, and a plasticizer may be added. Agents, slip agents, tanning materials, inorganic particles, anti-aging agents, improved wettability, antistatic agents, and the like. The antioxidants are, for example, IrganoxlOlO, 1035, 1076, 1222 (manufactured by Gibbs Co., Ltd.), Antigene P, 3C, FR, Smithica (manufactured by Sumitomo Chemical Co., Ltd.), and the like. UV absorbers such as Tiniivin P, 234, 320, 326, 327, 328, 329, 213 (above made by Gibbs), Seesorbl02, 103, 110, 501, 202, 712, 704 (above the above) Company system) and so on. Light stabilizers such as Tinuvin 292, 144, 62 2 1^ (above made by Gibbs Co., Ltd.), Sanur 1^770 (made by Sankyo Co., Ltd.), 8\1111丨5〇1:13 D]\/[- 061 (manufactured by Sumitomo Chemical Industries, Ltd.). A decane coupling agent such as r-aminopropane triethoxy decane, r-mercaptopropyltrimethoxydecane, 7-methacryloxypropyltrimethoxydecane, etc., and commercially available products such as SH6062, SZ6030 ( The above are manufactured by Toray Island Co., Ltd., KBE903, 60 3, 403 (above, Shin-Etsu Chemical Co., Ltd.). A coating modifier such as a polyoxyxane additive such as dimethyloxane polyether, and a commercially available product such as DC-57, DC-190 (above, manufactured by Shico Co., Ltd.), SH-28PA > SH-29A &gt ; SH-30PA, SH-190 (above is made by Toray Island), KF351, KF352, KF353, KF354 (above, Shin-Etsu Chemical Co., Ltd.), L-700, L-7002, L-7500, FK-024 -90 (The above is manufactured by Sakamoto Unika Co., Ltd.). -32- (28) (28) 200809286 When the photosensitive resin composition is prepared, the above components can be mixed and stirred in a usual manner. The dry film of the present invention will be described below with reference to the drawings. Figure! Fig. 2 is a schematic cross-sectional view showing an example of a dry film of the present invention, and Fig. 2 is a flow chart showing an example of a method for producing an optical waveguide using the dry film of the present invention. In Fig. 1, the dry film 1 of the present invention is obtained by sequentially laminating a base film 2, a photosensitive resin composition layer 3, and a cover film 4. The material of the base film 2 is, for example, polyethylene terephthalate, polyethylene naphthalate or the like. The base film 2 is preferably a transparent material from the viewpoint of light transmittance. The thickness of the base film 2 is preferably from 5 to 50,000 / m, more preferably from 10 to 300 / / m, as the mechanical strength for the support of the photosensitive resin composition layer 3, and the material cost saving. , especially good for 12 to 100 / / m. When the dry film 1 is used as the base film 2, the surface of the photosensitive resin composition layer 3 may be surface-treated in order to be easily peeled off from the cured product of the photosensitive resin composition layer 3. The surface treatment method is, for example, coating a polyoxyalkylene-based release agent. The thickness of the photosensitive resin composition layer 3 is a thickness of the core portion and the cladding layer which are formed corresponding to the composition layer 3, and is generally from 1 to 200 / / m. The photosensitive resin composition layer 3 is an uncured photosensitive resin composition. The photosensitive resin composition layer 3 is a layer formed on the base film 2 to have a certain thickness and having plasticity that can be press-deformed. The cover film 4 is a part that is provided as necessary. Therefore, the dry film of the present invention can be formed only of the base film and the photosensitive resin composition layer. -33- (29) (29) 200809286 The material of the cover film 4 is, for example, polypropylene, polyethylene, polyethylene terephthalate or the like. The thickness of the cover film 4 is not particularly limited and is generally 5 to 1 〇〇 #m. When the cover film 4 is used for a dry film, it is easily peeled off from the cured product of the photosensitive resin composition layer 3, and if necessary, the surface of the photosensitive resin composition layer 3 may be surface-treated. The surface treatment method is, for example, coating a polyoxyalkylene-based release agent. A method of forming the photosensitive resin composition layer 3 on the base film 2, for example, a method of directly applying a photosensitive resin composition onto the base film 2, or dissolving the photosensitive resin composition in an organic solvent to spin coating After coating by a method such as a method, a dipping method, a spray method, a bar coating method, a roll coating method, a curtain coating method, a gravure printing method, a screen printing method, or an inkjet method, a method of scattering a solvent using a dryer or the like is used. In the organic solvent at this time, the organic solvent used in the preparation of the copolymer of the component (A) may be used, and it is particularly preferable to uniformly dissolve the components in the range of from 80 to 160 °C. These organic solvents may be used singly or in combination of two or more kinds. The temperature condition in the case of dispersing the organic solvent is preferably from 30 to 15 (TC, more preferably from 50 to 140 ° C. The amount of the organic solvent added is the total amount of the above components (A) to (D). The amount of the solvent is preferably from 10 to 150 parts by mass, and the amount of the solvent remaining after drying is preferably 20 parts by mass or less based on 100 parts by mass of the total amount of the photosensitive resin composition and the organic solvent after the scattering of the organic solvent. In the dry film of the present invention, two or more layers of the photosensitive resin composition layer may be laminated on the base film. -34- (30) (30) 200809286 Next, the production of an optical waveguide using the dry film of the present invention will be described with reference to FIG. An example of the method of manufacturing the optical waveguide 37 of the present invention comprises the steps of forming the bottom cladding layer 16 on the substrate 10 ((a) to (e) in Fig. 2), and the step of forming the core portion 27 ( (f) to (i) of Fig. 2, and the step of forming the upper cladding layer 36 ((j) to (m) in Fig. 2). In the third step of the present invention, the bottom cladding layer is formed. The step of forming a core portion 27 and the step of forming the upper cladding layer 36 are at least one step of using The dry film of the photosensitive resin composition forms a step of forming a cured product (bottom cladding layer 16, etc.), and other portions formed by the aforementioned dry film are not used at this time (bottom cladding layer 16, core portion 27 or upper package) The coating layer 36) is preferably formed of a photosensitive resin composition containing the above components (A) to (D) in liquid form. However, Fig. 2 shows the bottom cladding layer 16, the core portion 27, and the upper cladding layer 36. An example of the formation of a dry film is used. The photosensitive resin composition prepared by forming each of the bottom cladding layer 16, the core portion 27, and the upper cladding layer 36 can be simply referred to as a composition for the underlayer, The core composition and the composition for the upper layer. The dry film of the photosensitive resin composition layer formed of the composition for the bottom layer, the composition for the core, and the composition for the upper layer may be referred to as a dry film for the bottom layer or a core. Dry film and dry film for upper layer. (1) Preparation of photosensitive resin composition and composition for dry film lower layer composition, core composition and composition for upper layer -35- (31) (31) 200809286 Based on the bottom cladding layer 16, The refractive index relationship of each portion of the core portion 27 and the upper cladding layer 36 is determined by the conditions required for the optical waveguide. Specifically, after preparing two or three kinds of photosensitive resin compositions having appropriate refractive index differences, The photosensitive resin composition capable of imparting the highest refractive index film is a core composition, and the other photosensitive resin composition is a composition for the underlayer and a composition for the upper layer. The composition for the underlayer and the composition for the upper layer are economical. Preferably, the same photosensitive resin composition is used for the upper layer and the manufacturing management. At least one of the composition for the bottom layer, the composition for the core, and the composition for the upper layer is applied to the base film by the above method as a photosensitive composition of the dry film. Used for the layer. That is, (i) a method of forming a core portion using only the above-mentioned film, and forming a bottom cladding layer and an upper cladding layer with a liquid photosensitive resin composition, (Π) forming a bottom cladding layer and a core using a dry film a method of forming an upper cladding layer with a liquid photosensitive resin composition, (iii) a method of forming a bottom cladding layer, a core portion, and an upper cladding layer using a dry film, and (iv) forming a bottom package using a dry film. A method of forming a core portion by a liquid photosensitive resin composition, a coating layer and an upper cladding layer. (2) Preparation of substrate First, a substrate 10 having a flat surface was prepared as shown in Fig. 2(a). The type of the substrate 1 is not particularly limited, and for example, a ruthenium substrate, a glass substrate, a glass epoxy resin, a polyimide substrate, or the like can be used. (3) Step of forming a bottom cladding layer - 36 - (32) (32) 200809286 This is a step of forming a bottom cladding layer 16 on the substrate 10. Specifically, as shown in FIG. 2(b), after the dry film 11 for the bottom layer (the basic film 1 2, the photosensitive resin composition layer 13 and the cover film 14 are formed), the dry film 1 for the bottom layer is used. 1. The cover film 14 is peeled off, and the laminate formed of the base film 12 and the photosensitive resin composition 13 is laminated in a state in which the side of the photosensitive resin composition layer 13 is downward and the surface faces the upper surface of the substrate 1 ( (c)) of Figure 2. Thereafter, it may be pre-baked as necessary to form a film for the underlayer. Light (ultraviolet) 15 is irradiated onto the film for the underlayer, and after hardening, a bottom cladding layer 16 of a cured product of the photosensitive resin composition layer 13 is formed on the substrate 1 (Fig. 2 (d)). After the bottom cladding layer 16 is formed, heat treatment (post-baking) may be performed as necessary, and then the base film 12 is peeled off to form a laminate of the bottom cladding layer 16 on the substrate 1 (Fig. 2(e)). At this time, the lamination method (copying method) of the dry film 11 is performed by using a normal pressure hot roll pressing method, a vacuum hot roll pressing method, a vacuum hot pressing method, or the like, and applying appropriate heat and pressure to copy to The method on the substrate 10 . The laminate formed of the base film 12 and the photosensitive resin composition layer 13 (Fig. 2(c)) is prebaked for the purpose of promoting hardening and removing residual solvent, so that it is 50 to 150 °C. The temperature is carried out. The irradiation amount of the light 15 when the bottom cladding layer 16 is formed is not particularly limited, but an irradiation dose of 10 to 5,000 mJW/cm 2 is used with light having a wavelength of 200 to 3 90 nm and a luminance of 1 to 50,000 mW/cm 2 . Irradiation exposure is preferred. The type of the light for illumination 15 can be visible light, ultraviolet light, infrared light, X-ray, alpha line, or 5-line and r-line, and particularly preferably ultraviolet light. Further, the light irradiation device used is preferably a high pressure mercury lamp, a low pressure mercury lamp, a halogen lamp, a -37-(33) (33) 200809286 plasma lamp, or the like. Further, the step of forming the bottom cladding layer 16 is preferably such that the film is entirely irradiated with light to harden the whole. After the exposure, it is preferable to carry out a heat treatment (post-bake) which can fully cure the coating film. The heating condition varies depending on the composition of the photosensitive resin composition, the type of the additive, and the like, but it can be generally 30 to 200 ° C, preferably 50 to 150 ° C, for example, 5 minutes to 3 hours. . Further, the pre-baking condition, the amount of light irradiation, the type, and the light irradiation means in the step of forming the bottom cladding layer may be the same as the step of forming the core portion and the step of forming the upper cladding layer. (4) Step of forming a core portion This is a step of forming a core portion 27 on the bottom cladding layer 16. Specifically, as shown in FIG. 2(f), after preparing the core dry film 21 (the base film 22, the photosensitive resin composition layer 23, and the cover film 24), the core dry film 21 is peeled off and covered. The film 24 is laminated with the base film 22 and the photosensitive resin composition layer 23 in a state in which the side of the photosensitive resin composition layer 23 is downward and faces the upper surface of the bottom cladding layer 16 (Fig. 2 (g)). Thereafter, it may be pre-baked as necessary to form a film for a core. Next, the upper surface of the film for the core is irradiated with light (ultraviolet rays) 2 5 (Fig. 2 (h)) by means of a pattern forming means (for example, a photomask 6 6 having a certain pattern). As a result, only the photosensitive resin composition layer 23 constituting the core film is hardened to the portion where the light is irradiated, and the other portions are not cured. Thereafter, the base film 22 is peeled off, and the self-developing treatment is performed to remove the uncured portion, and the core portion 27 formed by the post-pattern hardened film can be formed on the bottom cladding layer 16 (Fig. 2 - 38 - (34) (34) 200809286 (i)) ° When pre-baking, light irradiation, etc. are the same as forming the bottom cladding layer. Next, in order to further harden the core portion 27, a heating means such as a hot plate or an oven may be used, for example, from 30 to 150. (: The temperature is baked for 5 to 180 minutes. In (h) of Fig. 2, the method of irradiating light according to a certain pattern is not limited to the method of using the light-transmitting portion and the non-light-transmitting portion, for example, For the methods shown in a to c below. a. By the principle of a liquid crystal display device, a method of forming a mask image in a light-transmitting field and an opaque field by means of electro-optical forming means according to a certain pattern is formed. b. A method of using a plurality of light-converging light-guiding parts to illuminate the light-guiding parts with a corresponding pattern. c. A method of simultaneously irradiating the collected light of the laser light, or a condensing optical system such as a lens or a mirror. This type of film which is selectively hardened by pattern exposure according to a certain pattern can be subjected to development processing by utilizing the difference in solubility between the hardened portion and the unhardened portion. Therefore, as a result of removing the unhardened portion after the pattern exposure and remaining the hardened portion, the core portion 27 can be formed. An organic solvent can be used as the developing solution for the development processing. The organic solvent is, for example, acetone, ketone, ethyl ketone, isopropanone, ethyl lactate, propylene glycol-methyl ether acetate, methyl amyl ketone, methyl ethyl ketone, cyclohexanone, propylene glycol-methyl ether or the like. The development time is generally 30 to 600 seconds. The development method to be employed may be a known method such as a liquid filling method, a dipping method, or a shower developing method. After the image is developed, it can be straight-39- (35) 200809286 to remove the organic solvent to form a patterned film. (5) Forming the upper cladding layer The step of forming the undercoat layer 36 on the bottom cladding layer 16 and the core portion 27 to complete the optical waveguide 37. Specifically, as shown in Fig. 2 (j, after the dry film 31 for the upper layer (the material formed by the base film 32, the photosensitive resin layer 3 3 and the cover film 34) is prepared, the cover film 3 4 is peeled off from the upper layer by dry thin film. The laminate formed by the laminated film 32 and the photosensitive resin composition layer 33 in a state in which the side of the photosensitive resin composition layer 3 3 faces the bottom cladding layer 16 and the core portion 27 (k)). Thereafter, it may be pre-baked to form a film for the upper layer. The film for the upper layer is irradiated with ultraviolet rays 3 5, and after hardening, a photosensitive resin composition layer 3 is formed on the surface of the bottom cladding core portion 27. The cured portion coating layer 36 (Fig. 2 (1)). After the upper cladding layer 36 is formed, it is necessary to carry out heat treatment (post-baking), and then peel off the base film 3 2 to obtain a guide 37 ((m) of Fig. 2). Further, conditions such as pre-baking, light irradiation, and post-baking are the same as forming the bottom coating layer. Further, a liquid photosensitive resin composition having the composition of the photosensitive resin group for the dry film of the present invention may be provided instead of FIG. Any one or two of the dry film 1 1 , 2 1 , and 3 1 . In this case, it is preferred to apply the composition for the underlayer or the core by any method such as spin coating, dipping, spraying, bar, roll coating, curtain coating, gravure printing, screen printing, or the like. After the composition or the upper layer is formed, it is 'dried or pre-baked to form a film, and then irradiated with light, and must be packaged.) The light of the film formed under the film 3 1 is substantially 3 2 (16 and the upper time wave method is applied by spraying) The ink set is required to be -40-(36) (36)200809286 and then baked. When using a liquid photosensitive resin composition, the method of irradiating light is preferably a wavelength of 200 to 450 nm and a brightness of 1 to 500 mW/ The light of cm2 is irradiated with an exposure amount of 1 〇 to 5,0 0 m J / c m2. The type of light and the irradiation device are as described above in the step of forming the bottom cladding layer. Composition using liquid photosensitive resin In the case of the material, the post-baking conditions in the step of forming the bottom and the upper cladding layer may vary depending on the composition of the photosensitive resin composition, and may generally be 30 to 200 ° C, preferably 50 to 170 ° C. More preferably, it is 80 to 150 ° C, for example, heating for 5 minutes to 3 hours. The post-baking condition in the step may be 30 to 200 ° C, preferably 5 to 180 minutes at 50 to 150 ° C. After the baking, a hardened material having excellent hardness and heat resistance (bottom cladding layer, core portion) can be obtained. The upper cladding layer. The optical waveguide 37 shown in (m) of FIG. 2 is a sectional cross section of the film-shaped optical waveguide (waveguide film), which is obtained by fixing the bottom cladding layer 6 on the substrate 1 A core portion 27 having a specific width is formed on the bottom cladding layer 16, and the upper cladding layer 36 is laminated on the core portion 27 and the bottom cladding layer 16. The core portion 27 is embedded in the optical waveguide 37. The thickness of the bottom cladding layer 16, the core portion 27 and the upper cladding layer 36 is not particularly limited. For example, the thickness of the bottom cladding layer 16 may be set to be 1 to 200 // m, the thickness of the core portion 27 is 3 to 200 / / m, and the thickness of the upper cladding layer 36 (the distance between the upper surface of the upper cladding layer 36 and the upper surface of the core portion 27) is 1 to 20 0 / / m The width of the core portion 27 is not particularly limited, and may be, for example, 1 to 200 // m -41 - (37) (37) 200809286 Refraction of the core portion 27 Must be greater than the refractive index of the bottom cladding layer 16 and the upper cladding layer 36. For example a wavelength of 400 to 1,600 nm is preferably light, the refractive index of the core portion 27 1. 420 to 1. 650, the bottom cladding layer 16 and the upper cladding layer 36 have a refractive index of 1. 400 to 1. 648, and the refractive index of the core portion 27 is at least greater than the refractive index of the two cladding layers 16 and 36. 1 %. [Embodiment] Hereinafter, the present invention will be more specifically described by way of examples. [1 . Preparation Materials] Prepare the following materials as (A) to (D). [(A) component] Preparation Example 1 After replacing the flask with dry ice/methanol reflux with nitrogen, 3 g of a polymerization initiator 2,2-azobisisobutyronitrile and an organic solvent propylene glycol-methyl ether acetate 1 15 g were added. Stir until the polymerization initiator dissolves. Next, 20 g of hydroxyethyl methacrylate, 3 g of cyclopentyl methacrylate, 25 g of styrene and 25 g of η-butyl propionate vinegar were added, and stirring was started slowly. Then, the temperature of the solution was raised to 80 C β. After polymerization for 6 hours, di-n-butyltin dilaurate 0'13g 2'6_- + butyl cresine was added. 〇 5 § Add to the obtained solution, stir the day to ensure that 'square, below 60 C while dropping 2 · methacryloxyethyl isocyanate. 7 g after the mouth drops are 6 〇. The reaction was carried out for 5 hours, and a polymer solution having a methyl propyl-42-(38) (38) 200809286 alkenyl group was obtained. Thereafter, the reaction product was dropped into a large amount of hexane to solidify the reaction product. After the coagulum was redissolved in tetrahydrofuran of the same mass, it was coagulated again with a large amount of hexane. After repeating the re-dissolution-solidification operation three times, the obtained coagulum was dried under vacuum at 40 ° C for 48 hours to obtain a target copolymer preparation example 2, and a flask in which a dry ice/methanol reflux vessel was replaced with nitrogen, and a polymerization initiator was added thereto. 3 g of 2,2'-azobisisobutyronitrile and 150 g of an organic solvent ethyl lactate were stirred until the polymerization initiator dissolved. Next, 20 g of methacrylic acid, 30 g of dicyclopentanyl methacrylate, 25 g of styrene, and 25 g of n-butyl acrylate were added, and stirring was started slowly. Then, the temperature of the solution was raised to 8 (TC, and after polymerization at this temperature for 6 hours, 3,4-epoxycyclohexyl methacrylate was added. 5g, tetrabutylammonium bromide. 8g, p-methoxyphenol O. After lg was added to the resulting solution and stirred at 80 ° C for 7 hours, a polymer solution having a propylene group branched was obtained. Thereafter, the reaction product was dropped into a large amount of hexane to solidify the reaction product. After the coagulum was redissolved in the same amount of tetrahydrofuran, it was coagulated again with a large amount of hexane. After repeating the re-dissolution-solidification operation three times, the obtained solid was dried under vacuum at 40 ° C for 48 hours to obtain a target copolymer A-2. Preparation Example 3 After replacing the flask with a dry ice/methanol reflux vessel with nitrogen, a polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was added. 5 §, organic solvent propylene glycol-methyl ether acetate 11 5 g, stirred until the polymerization initiator dissolved. Next, add -43- (39) 200809286 into the base ethyl methacrylate 20g, dicyclopentanyl methyl propionate 25g, methyl methacrylate 4〇§ and n-butyl acrylate L5g, start stirring slowly. Then, the temperature of the solution was raised to 70 ° C, and after polymerization for 6 hours, the di-n-butyltin dilaurate was 0. 12g, 2,6-di+butyl-p-formate. 5 g of ruthenium was added to the obtained solution, and while stirring, it was kept at a temperature of 60 ° C or less and dropped into a catalyst of 3.7 mmol of methoxyethyl isocyanate. After the completion of the dropping, 6 (reaction at rc for 5 hours), a polymer solution having a methacryl group was branched. Next, the reaction product was dropped into a large amount of hexane to solidify the reaction product. The coagulum was redissolved in the same mass. After the tetrahydrofuran, the mixture was re-solidified with a large amount of hexane. The redissolution was repeated three times. After the coagulation operation, the coagulum was dried under vacuum at 4 ° C for 48 hours to obtain the target copolymer VIII-3. After replacing the flask with a dry ice/methanol refluxer with nitrogen, a polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) lg, an organic solvent ethyl lactate 150g was added, and the mixture was stirred until the polymerization initiator was added. Dissolved. Next, add 20 g of methacrylate, 25 g of dicyclopentanyl methacrylate, 35 g of methyl methacrylate and 20 g of η-butyl acrylate, and start stirring slowly. Then the temperature of the solution was raised to After polymerization at 70 ° C for 6 hours at this temperature, 3,4-epoxycyclohexyl methacrylate 31. 4g, tetrabutylammonium bromide 2. 2g, p-methoxyphenol O. After lg was added to the resulting solution and stirred at 80 ° C for 7 hours, a polymer solution having a propylene group branched was obtained. Thereafter, the reaction product was dropped into a large amount of hexane, and the amount of the solid solution was the same as that of the solution, and the re-solidification was repeated. Coagulation will solidify and re-condense the condensate. The amount of the condensate will be reversed. After the solution is dissolved, the solution will be dissolved again. -44- (40) 200809286 After drying, the coagulum is dried under vacuum at 40 °C for 48 hours. Total A #4. The above-mentioned raw material names and addition amounts for the production of the copolymers A-1 to A-4 are shown in Table 1. Table 1 Unit: g Α-1 Α-2 Α-3 Α-4 One gb am Monomer hydroxyethyl methacrylate 20 20 - Methacrylic acid 20 - 20__ Dicyclopentanyl acrylate 30 30 25 Styrene 25 25 - -1 η-butyl acrylate 25 25 15 20 _ methyl methacrylate hit 40 35 2-methacryloxyethyl isocyanate 23. 7 female 23. 7 - Reactive component 3,4-epoxycyclohexyl methacrylate - 10. 5 - 31. 4 [(B) ingredient] Isophorone diisocyanate 13. 6 parts by mass, number average molecular weight 2,000 polypropylene glycol 81. 7 parts by mass of 2,6-di-t-butyl-ρ·cresol 〇·〇1 parts by mass is placed in a reaction vessel equipped with a stirrer, cooled to 5 to 10 ° C, and then added with lauric acid under stirring Di-η-butyltin 0. 05 parts by mass. Adjust the heat to stir at 30 ° C for 2 hours, then raise the temperature to 5 (TC stir for 2 hours. Then add 2-hydroxyethyl acrylate 4. 7 parts by mass (100 parts by mass or more in total) was reacted at 50 to 70 ° C for 1 hour after the completion of the dropping. When the residual isocyanate is 0. When the amount is 1% by mass or less, the reaction is terminated to obtain a compound B-1. [(C) ingredients] -45- (41) (41)200809286 Trimethylolpropane triacrylate (O. The boiling point of IMPa: 315 ° C 'Osaka Organic Chemical Industry Co., Ltd.') Tribromophenol ethoxy acrylate (melting point: about 50 ° C, manufactured by Daiichi Kogyo Co., Ltd., Newfoundland BR-31) Tetrafluoropropyl acrylate Ester (boiling point: l〇6°C / 21 kPa, made by Osaka Organic Chemical Industry Co., Ltd., Biske 4F)

[(D) component] Photoradical polymerization initiator (trade name "Irgacure 3 69", manufactured by Gibbs Co., Ltd.) [(E) component (organic solvent)] Ethyl lactate propylene glycol-methyl ether acetate [2· Making a dry film] The above components (a) (copolymers A -1 to A - 4 ) and (B) to (E ) were mixed at a ratio shown in Table 2 to obtain a homogeneous solution. Next, the obtained solution was spin-coated on a polyethylene terephthalate film (film thickness: 50 // m) of a basic film, and dried at 110 ° C for 10 minutes, and then pressed at a normal temperature and normal temperature. A polyethylene terephthalate film (film thickness: 25 / / m) covered with a thin film is pressed on the surface of the dried coating film to obtain a photosensitive resin composition layer 5 〇 # m heart dry film J - 1 to J - 4. Further, in the same manner, a photosensitive resin composition layer having a layer thickness of 20 // m and 70 // m and a dry film for the upper layer were produced. -46- (42)200809286 ο τ *—ϊ For the cladding layer 1 1 ο rH 1 1 1 1 卜 inch 1 S Ί—Η 258 Ω\ 1 >—S 1 1 ο τ—Η 1 Bu 1 1 1 Inch 1 S 258 00 1 5 1 1 1 ο Η o 1 1 1 m I 406 Bu 1 *—s 1 1 ο rH 1 1 沄1 1 1 m 1 OS 228 VO 1 1 1 Ο 1 1 1 1 m 1 s H 1 h 1 1 Ο τ-Η 1 1 1 1 m 1 tn C\ 284 inch 1 core part 1 ο 1 1 rH 1 1 1 m 200 1 tH m 1 〇1 1 1 1 1 1 1 m 1 m 1 -H (N <N 1 ►—5 〇1 1 1 1 1 1 cn 1 279 f—H 1 1—5 ο ▼—Η 1 1 1 1 1 1 cn 1 279 Unit: mass τ—Η 1 &lt ; Α-2 Α-3 inch 1 < 1 CQ trimethylolpropane triacrylate Nexon BR-31 Bisko 4F dipentaerythritol hexaacrylate cn E? ethyl lactate propylene glycol monomethyl ether acetate component A Component B Component c Component D Component E _ί life -47- (43) (43) 200809286 [3 · Formation of optical waveguide] [Example 1] (a) Formation of a bottom coating layer from the bottom layer for dry film J-5 (sensitization) Resin composition layer thickness: 20 // m) After peeling off the film-coated polyethylene terephthalate film, using a laminate at normal temperature and normal pressure hot rolling The dry film J-5 was copied onto the surface of the ruthenium substrate, and then the film formed by the dry film J-5 was irradiated with ultraviolet rays having a wavelength of 356 nm and a luminance of 10 mW/cm 2 for 10 seconds, and then hardened. The polyethylene terephthalate film was baked at a temperature of 1 5 (TC for 1 hour to obtain a bottom cladding layer having a thickness of 20 // m. (b) forming a core portion and then using a laminate to Normal temperature and normal pressure hot roll pressing method, the core of the polyethylene terephthalate film which is previously stripped of the cover film is used for copying the dry film J-1 (thickness of the photosensitive resin composition layer: 50 // m) On the bottom cladding layer, a mask with a line width of 50# m is introduced, and the film formed by the dry film J-1 is irradiated with ultraviolet rays having a wavelength of 365 nm and a brightness of 10 mW/cm 2 for 1 second. Film hardening. Secondly, the base film of the polyethylene terephthalate film is peeled off, and the substrate having the film of the portion of the photosensitive resin composition layer is immersed in the developing solution formed by acetone to dissolve the film. Exposure section. Thereafter, it was post-baked at 150 ° C for 1 hour to form a core portion having a line shape of 50 / m in width. (c) Forming the upper cladding layer -48- (44) (44) 200809286 Next, the polyethylene terephthalate film of the cover film is peeled off in advance by a normal pressure hot rolling method (temperature: 80 ° C) The upper layer is dried with a dry film J-5 (thickness of the photosensitive resin composition layer: 70 // m), onto the bottom cladding layer having the core portion, and irradiated with ultraviolet rays having a wavelength of 3 65 nm and a luminance of 10 mW/cm 2 . The film formed by the film J-5 was dried for 100 seconds, and then the base film of the polyethylene terephthalate film was peeled off to form a thickness of 70/m (the upper surface of the bottom cladding layer and the upper cladding layer). Pitch) upper cladding. [Examples 2 to 6, Comparative Examples 1 to 2] The optical waveguides were formed in the same manner as in Example 1 except that the dry film was changed according to Table 3 [4. Evaluation optical waveguide] The optical waveguides were evaluated in the following manners (Examples 1 to 6, Comparative Examples 1 to 2) (1) The shape accuracy of the optical waveguide is the core shape of the design (height 50 / m X line width 50 / m), and the height and width of the core portion actually formed are 50 ± 5 //m size is "〇" and the others are "X". (2) Waveguide loss From the end of the optical waveguide, the light of the wavelength of 850 nm is determined to determine the other -49- (45) 200809286 in the light of the bribe. Then the loss of the waveguide per unit length is obtained by the subtraction method. When the waveguide loss is 〇·5 dB/cm or less, it is “〇”, and when it exceeds 〇5 dB/cm, it is “V. 〇(3) The bending resistance is 20//m, and the core height is 50//m, the optical waveguide with a height of 20 // m above the core portion to the upper cladding layer is peeled off the substrate, and a waveguide film having a width of lcin, a length of 10 cm and a thickness of 90/m is obtained. The temperature is 23 t: The waveguide film was wound into a metal rod having a radius of 2 mm under the condition of a humidity of 50%. At this time, no crack or break was caused to be "°", and when it was produced, it was "x". The above results are as shown in Table 3. -50- 200809286 £ Comparative Example 2 ηη rH Ο 〇X Comparative Example 1 Γ Η; rn 5 Γ γ Ο X Example 6 Ο Ο rH Η; Ο 〇〇 Example 5 Q\ A > - Ϊ ! ηΛ Ο 〇〇|Example 4 〇〇00 Η; Ο 〇〇 Example 3 ►—a νο From Ο 〇〇 Example 2 VO (NH; Ό Λ 〇〇 〇〇 Example 1 A ^Τ) A 〇〇 Honey s hair core part upper cladding layer side 2J. 4W1 meal δ ^ Τ) key i S ^ waveguide loss bending resistance -51 - (47) (47)200809286 It is known from Table 3 that the use of the specific sensitization of the present invention The optical waveguide (Examples 1 to 6) formed by the dry film of the layer formed of the resin composition can have high shape accuracy, good optical characteristics (less waveguide loss), and excellent bending resistance. However, the optical waveguide (Comparative Examples 1 to 2) formed as a whole of the optical waveguide or the cladding layer material having a dry film which is not a layer formed of the photosensitive resin composition of the present invention is cracked when bent. Or broken, so the resistance to bending is poor. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an example of a dry film of the present invention. Fig. 2 is a flow chart showing an example of a method of manufacturing an optical waveguide of the present invention. [Description of main components] 1 : Dry film 2 : Basic film 3 : Photosensitive resin composition layer 4 : Cover film 10 : Substrate Π : Dry film for underlayer 1 2 : Basic film 1 3 : Photosensitive resin composition layer : cover film 15 : light (ultraviolet light) 1 6 : bottom cover layer - 52 - (48) (48) 200809286 21 : dry film 22 : base film 23 : photosensitive resin composition layer 24 : cover film 25 : light (ultraviolet rays) 26: photomask 27: core portion 3 1 : dry film for upper layer 32: base film 3 3 : photosensitive resin composition layer 34: cover film 3 6 : upper cladding layer 3 7 : optical waveguide - 53-

Claims (1)

(1) 200809286 X. Patent Application No. 1. A dry film for forming an optical waveguide, which is a dry film for forming an optical waveguide, which is obtained by laminating a base film and an uncured photosensitive resin composition layer, characterized in that The photosensitive resin composition layer contains the following components (A) to (D): (A) a polymer having a repeating unit represented by the following general formulas (1) and (2), R1 I - ch2 - C —— | (1) XI R3 R2 -CH2—C—— (2) IY (wherein R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, and R3 is a (meth) acrylonitrile group. X is a single bond or a divalent organic group; Y is an organic group having no polymerizability), (B) a polyol structure formed by reacting a polyhydric alcohol compound with a polyisocyanate compound, and having a linear structure having a repeating urethane bond, a compound having 2 to 6 (meth)acrylinyl groups, (C) a compound having one or more ethylenically unsaturated groups in the molecule, and -54-200809286 (2) (D) photoradical polymerization initiator The photosensitive resin composition is formed. 2. The dry film for forming an optical waveguide according to claim 1, wherein the above general formula (1) is a structure represented by the following general formula (3), R1 - CH2 - CW (3) I 〇 c = o N —Η Ζ—R3 (wherein R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms; R3 is a (meth)acryloyl group; and W and fluorene are each independently a single bond or a divalent organic group). 3. The dry film for forming an optical waveguide according to claim 1 or 2, wherein the number average molecular weight of the above (Β) component in terms of polystyrene measured by gel permeation chromatography is 1,000 to 100,000. 4. The dry film for forming an optical waveguide according to any one of items 1 to 3, wherein the (Β) component is a polyol compound, a polyisocyanate compound, and a hydroxyl group-containing (meth) acrylate. Reaction product. The dry film for forming an optical waveguide of any one of the above claims 1 to 4 wherein the photosensitive resin composition layer has a thickness of 1 to 2 μm. [6] The optical waveguide is formed as in any one of the first to fifth aspects of the patent application. -55-200809286 (3) A film is laminated on the opposite side surface of the photosensitive resin composition layer. 7. An optical waveguide characterized in that, in an optical waveguide comprising a bottom package and an upper cladding layer, at least the bottom cladding layer is sensitized by a dry film according to any one of claims 1 to 6 The optical waveguide of the resin composition layer is characterized in that, in the optical waveguide including the bottom package and the upper cladding layer, at least one of the bottom cladding layer and the core cladding layer is used as a patent application. In the first aspect, the photosensitive resin composition for forming the dry film for an optical waveguide is formed, and the portion other than the portion formed of the cured product is composed of the component (A) of the photosensitive resin composition layer to the liquid photosensitive resin. The hardened matter of the object is formed. An optical waveguide characterized in that the bottom package and the upper cladding layer are formed of a photosensitive resin composition for forming a dry film for an optical waveguide according to Patent Application No. 1 to the refractive index of the core portion. Both are greater than the refractive index of the bottom cladding layer by more than 0.1%. 10. A method of manufacturing an optical waveguide, characterized in that the manufacturing of the optical waveguide of the cladding, the core portion and the upper cladding layer comprises the steps of forming a bottom cladding layer, forming a step coating layer of the core portion, and at least The step of forming the step coating layer of the bottom cladding layer is a photosensitive resin group comprising the dry film for forming an optical waveguide according to the first aspect of the patent application, the basic film coating layer, the core portion and the upper cladding layer. An optical waveguide is formed. The coating, the core portion, and the hardened component of the upper portion of any of the six layers are composed of: a coating of (D) component, and a coating of a cured layer of any one of the core portions. And the upper portion, in the method comprising the bottom package, the step of forming the upper portion and forming any of the bottom layers 1 to 6 to perform the light-56-200809286 (4) irradiation and hardening step. 11. A method of manufacturing an optical waveguide, characterized in that the method for manufacturing an optical waveguide including a bottom cladding layer, a core portion, and an upper cladding layer includes a step of forming a bottom cladding layer, a step of forming a core portion, and The step of forming an upper cladding layer, and the step of forming a bottom cladding layer, the step of forming a core portion and the step of forming an upper cladding layer are at least one step, including any one of items 1 to 6 of the patent application scope The step of forming the photosensitive resin composition layer of the dry film for the optical waveguide by light irradiation and curing, and forming a portion other than the portion obtained by curing the photosensitive resin composition layer after light irradiation, includes The liquid photosensitive resin composition of the component (A) to the component (D) of the photosensitive resin composition layer is subjected to light irradiation to be cured. -57-