200807227 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種散熱模組，特別係關於一種用於發 熱電子元件散熱之散熱模組。 【先前技術】 隨著中央處理器（CPU)等發熱電子元件功率之不斷 提高’散熱問題越來越受到人們重視，在電腦中更是如此， 為了在有限之空間内高效地帶走系統產生之熱量，目前業 界主要採用由散熱片、熱管及風扇組成之散熱模組，並通 過彈片等固定元件將散熱模組裝設於電路板上，借彈片之 力量使散熱模組與CPU良好接觸。 目前散熱模組所使用彈片之外形多採用直線片狀設 叶’如圖5所示即係常見之直型彈片，該彈片整體呈“τ’， 开>，包括一連接部42c和一裝配部44c。連接部42c上開 有兩個固定孔421c，通過該等固定孔421c將該連接部42c 與散熱模組鉚合連接，當然也可通過螺合等方式相連接。 裝配部44c從連接部42c之末端向兩邊縱向延伸。裝配部 44c之兩端各開一裝配孔441c，供裝配該裝配部4如至電 路板之螺絲穿設之用。組裝時，通過彈片上之固定孔42k 將彈片與散熱模組固定連接在一起，然後用螺絲等固定件 通過兩裝配孔441c將彈片與電路板鎖合，將散熱模组 於電路板之發熱電子元件上，使散熱模組能及時有效地對 其散熱。 散熱模組與電子元件之間接觸之優劣直接影響兩元件 200807227 之間之接觸熱阻值，即直接影響散熱模組之效率。而散熱 模組主要係借助於施加在彈片兩端之裝配孔441c之鎖合 力來固定，礙於空間限制，固定孔421(：與裝配孔441(：之 間彈性臂之長度較短，彈性臂會隨著施力產生變形，其壓 縮位移行程之變化會產生彈力上極劇之變化，彈力設計控 制不易，因而影響到散熱模組與發熱電子元件接觸之穩定 性’進而影響到散熱模組之散熱性能。 【發明内容】 有鑒於此，有必要提供一種具有能提供穩定壓力之彈 片之散熱模組。 該散熱模組用於對發熱電子元件散熱，包括一底座及 將該底座固定至發熱電子元件之至少一彈片，該彈片包括 與底座相結合之一結合部及用於將底座鎖固於發熱電子元 件上之至少一鎖合部，其中該鎖合部由該結合部延伸形成 彎曲形。 與習知技術相比，該彈片之鎖合部呈彎曲形，可以在 既有之空間，減缓彈片因行程些微變動即引發彈力極劇之 變化，使發熱電子元件接觸面和散熱模組產生穩定之接觸 壓力，從而使散熱模組能與發熱電子元件緊密相連，提高 散熱模組之散熱效率。 【實施方式】 如圖1和圖2所示為本發明散熱模組之一較佳實施 例，該散熱模組包括一風扇10、一鰭片組20、一熱管3〇 及一對將該散熱核組鎖合在電路板（圖未示）上之彈片4〇。 200807227 風扇10包括一殼體102,殼體102内設有一扇輪50，殼體 102侧形成出風口 60，供風扇10產生之氣流通過。殼體 102另一侧向外延伸形成一底座1〇4，底座1〇4中央形成一 通孔108，通孔1〇8兩侧分別形成一板體1〇7，每一板體 107上叹有二個大小相同、等距排列之銷釘，用於固定 彈片40。通孔158呈方形，其大小與熱管3〇之外殼大小 相當，且該通孔1〇8下方設有一吸熱塊7〇。底座1〇4之上 侧形成一凹槽1〇6,該凹槽1〇6用於定位熱管3〇且與通孔 108相連通。 兩個彈片40結構形狀相同，均為平面彎曲型結構，且 相對於底座104對稱設置，如圖3所示，每一彈片4〇包括 一結合部42和第一、第二鎖合部44、46，結合部42呈縱 長直線狀’於其中間部位沿縱向設有三個大小相同、等距 排列之固定孔，分別為第一固定孔421、第二固定孔422、 第二固定孔423，其大小與風扇1〇之底座104上之銷釘109 大小相應。第二固定孔422處在直線部42之正中間，第一 固定孔421和第三固定孔423分別在第二固定孔422之兩 側並相對第二固定孔422呈對稱分佈，各固定孔421、422、 423之間之間距與各銷釘1〇9之間之間距相同。第一鎖合 部44和第二鎖合部46分別從結合部42之兩端反向彎曲延 伸形成，其形狀貌似字母“L” ，且呈相向設置。在第一 鎖合部44之末端設有一裝配孔441，該裝配孔441呈圓 形。在第二鎖合部46之末端設有另一裝配孔461，該裝配 孔461呈腰圓形。兩個裝配孔441、461呈不同形態，主要 200807227 - 係考慮到散熱模組與電路板組裝時之配合公差問題，在滿 • 足公差之前提下，兩個裝配孔441、461亦可以為相同形狀。 鰭片組20設置在風扇模組1〇之出風口 6〇處，由複數 平行相間排列之鰭片22組成，相鄰之兩鰭片22之間形成 供氣流通過之流道24。熱管30包括一蒸發端3〇2和一冷 凝5¾ 304。熱管30之蒸發端302放置在底座1〇4之凹槽1〇6 中，吸熱塊70收容于通孔108内並與熱管3〇之蒸發端3〇2 _ 相接觸，從而將發熱電子元件（圖未示）產生之熱量傳遞 至熱管30。熱管30之冷凝端3〇4呈彎曲延伸與鰭片組2〇 熱連接。 該散熱模組組裝時，將兩個彈片4〇與風扇1〇之底座 104固定，本實施例中，彈片4〇上之三個固定孔421、422、 423刀別與底座1〇4上之二個銷釘相結合，其可通過 干涉配合相固定，該結合部42亦可借由螺鎖或卡扣等方式 與底座104相固接。而彈片4〇之鎖合部料、牝則通過其 _ 裝配孔441、461，用螺絲等固定件固定連接於電路板上， k而將該散熱模組與電路板鎖合固定，使散熱模組置於發 熱電子元件上以吸收並散發其產生之熱量。該散熱模組與 發熱電子元件接觸之穩定性及緊密度主要由加在平面彎曲 型彈片40上之作用力來保證，每一裝配孔441 (或邾丄） 與第二固定孔422之間相當於形成一彈性臂，根據懸臂梁 原理，施加於每一彈性臂上之載荷： ⑴ 4L3 200807227 其中^為载荷’亦即等效於該彈性臂 彈力，E為彈性模量，γΑ 屋生 程，WA㈣_ 卩轉性臂之壓縮行 為該彈性#之寬度]為該彈性 性臂之有效長度。由公T I L為該彈 而γ愈”一.式與？呈三次方關係， 人方_ ’因而當其侧素確定之情況下， L值增大-定程度後，γ之相應變化對？值之影響則變小。 彈片40由於鎖合部44、46呈彎曲形，增加曰了分擔彈 片4〇形變壓力之長度，亦即實質上增大了公式⑴中之L 值’因而幫曲型彈片40麗縮行程上之微小變化（即γ值 之微小變化）不會導致彈力（即極劇之波動，因而 能使散熱模組與發熱電子元件讀縣力變得穩定，有利 於熱量之傳遞，提高散熱模組之散熱效率。 如下表1為直型彈片與彎曲型彈片一系列對比實驗所 得之資料，其中彈片採用之材料為不銹鋼（SUS301)，分 1/2H、3/4H兩種硬度，彈片之厚度為〇 3mm和〇.4mm兩 種規格’彈片之寬度為6mm和4.5mm兩種規格。200807227 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module for heat dissipation of an electronic component. [Prior Art] With the continuous improvement of the power of heat-generating electronic components such as a central processing unit (CPU), the problem of heat dissipation has been paid more and more attention, especially in computers, in order to efficiently take away the system in a limited space. At present, the heat sink module consisting of a heat sink, a heat pipe and a fan is mainly used in the industry, and the heat sink module is assembled on the circuit board through a fixing component such as a shrapnel, and the heat sink module is in good contact with the CPU by the force of the shrapnel. At present, the shape of the shrapnel used in the heat dissipating module is mostly a straight sheet-shaped blade. As shown in FIG. 5, it is a common straight shrapnel, and the shrapnel is generally "τ', open, including a connecting portion 42c and an assembly. The connecting portion 42c has two fixing holes 421c, and the connecting portion 42c is connected to the heat dissipating module by the fixing holes 421c, and of course, it can be connected by screwing or the like. The mounting portion 44c is connected. The end of the portion 42c extends longitudinally to both sides. A mounting hole 441c is formed at each end of the mounting portion 44c for fitting the mounting portion 4 such as a screw to the circuit board. When assembled, the fixing hole 42k on the elastic piece is adopted. The elastic piece and the heat dissipation module are fixedly connected together, and then the elastic piece is locked with the circuit board through the two assembly holes 441c by screws and the like, and the heat dissipation module is mounted on the heat-generating electronic component of the circuit board, so that the heat dissipation module can be timely and effectively Heat dissipation. The contact between the thermal module and the electronic component directly affects the contact thermal resistance between the two components 200807227, which directly affects the efficiency of the thermal module. The thermal module is mainly applied by the application of the thermal module. The locking force of the mounting holes 441c at both ends is fixed. Due to the space limitation, the fixing holes 421 (the length of the elastic arm between the fixing holes 421 and the mounting holes 441 (the length of the elastic arm is deformed according to the applied force, and the compression displacement thereof) The change of the stroke will result in a change in the elastic force, and the elastic design control is not easy, thus affecting the stability of the contact between the heat dissipation module and the heat-generating electronic component, thereby affecting the heat dissipation performance of the heat dissipation module. [Invention] It is necessary to provide a heat dissipation module having a spring piece capable of providing a stable pressure. The heat dissipation module is configured to dissipate heat from a heat-generating electronic component, and includes a base and at least one elastic piece fixing the base to the heat-generating electronic component, the elastic piece including the base In combination with a joint portion and at least one locking portion for locking the base to the heat-generating electronic component, wherein the latch portion is extended by the joint portion to form a curved shape. Compared with the prior art, the spring clip is locked. The joint is curved and can be used in the existing space to slow down the change of the elastic piece due to the slight change of the stroke, so as to cause the elastic electronic component contact surface and The thermal module generates a stable contact pressure, so that the heat dissipation module can be closely connected with the heat-generating electronic components, thereby improving the heat dissipation efficiency of the heat dissipation module. [Embodiment] FIG. 1 and FIG. 2 show one of the heat dissipation modules of the present invention. In a preferred embodiment, the heat dissipation module includes a fan 10, a fin set 20, a heat pipe 3〇, and a pair of elastic pieces 4 that lock the heat dissipation core group on a circuit board (not shown). 10 includes a casing 102. The casing 102 is provided with a fan wheel 50. The casing 102 side forms an air outlet 60 for airflow generated by the fan 10. The other side of the casing 102 extends outward to form a base 1? A through hole 108 is formed in the center of the base 1〇4, and a plate body 1〇7 is formed on each side of the through hole 1〇8, and two pins of the same size and equidistant arrangement are slanted on each plate body 107 for fixing the elastic piece 40. . The through hole 158 has a square shape, and has the same size as the outer casing of the heat pipe 3〇, and a heat absorbing block 7〇 is disposed under the through hole 1〇8. A groove 1〇6 is formed on the upper side of the base 1〇4 for positioning the heat pipe 3〇 and communicating with the through hole 108. The two elastic pieces 40 have the same shape and are flat and curved, and are symmetrically disposed with respect to the base 104. As shown in FIG. 3, each of the elastic pieces 4 includes a joint portion 42 and first and second locking portions 44. 46, the joint portion 42 is in the form of a longitudinally long straight line. In the middle portion, three fixed holes of the same size and equidistant arrangement are arranged in the longitudinal direction, respectively being the first fixing hole 421, the second fixing hole 422, and the second fixing hole 423. The size corresponds to the size of the pin 109 on the base 104 of the fan. The second fixing hole 422 is located in the middle of the straight portion 42 . The first fixing hole 421 and the third fixing hole 423 are respectively symmetrically distributed on the two sides of the second fixing hole 422 and opposite to the second fixing hole 422 . The distance between 422 and 423 is the same as the distance between each pin 1〇9. The first lock portion 44 and the second lock portion 46 are respectively formed by inversely bending and extending from both ends of the joint portion 42, and have a shape resembling the letter "L" and disposed in opposite directions. An assembly hole 441 is provided at the end of the first lock portion 44, and the assembly hole 441 has a circular shape. At the end of the second lock portion 46, another fitting hole 461 is provided, which is rounded in a waist shape. The two mounting holes 441, 461 have different shapes, mainly 200807227 - taking into account the tolerance problem of the assembly of the heat dissipation module and the circuit board, and the two assembly holes 441, 461 can be the same before the full tolerance shape. The fin assembly 20 is disposed at the air outlet 6 of the fan module 1 and is composed of a plurality of fins 22 arranged in parallel, and a flow passage 24 through which air flows is formed between the adjacent fins 22. The heat pipe 30 includes an evaporation end 3〇2 and a condensation 53⁄4 304. The evaporation end 302 of the heat pipe 30 is placed in the groove 1〇6 of the base 1〇4, and the heat absorption block 70 is received in the through hole 108 and is in contact with the evaporation end 3〇2_ of the heat pipe 3〇, thereby heating the electronic component ( The heat generated is not transmitted to the heat pipe 30. The condensation end 3〇4 of the heat pipe 30 is bent and extended to be thermally connected to the fin group 2〇. When the heat dissipation module is assembled, the two elastic pieces 4〇 are fixed to the base 104 of the fan 1〇. In this embodiment, the three fixing holes 421, 422, and 423 on the elastic piece 4 are connected to the base 1〇4. The two pins are combined, and they can be fixed by an interference fit. The joint portion 42 can also be fixed to the base 104 by means of a screw lock or a buckle. The locking piece and the cymbal of the elastic piece 4 are fixedly connected to the circuit board through the fixing holes 441 and 461, and are fixed by screws and the like, and the heat dissipation module and the circuit board are locked and fixed to make the heat dissipation mode. The set is placed on a hot electronic component to absorb and dissipate the heat it generates. The stability and tightness of the contact between the heat dissipation module and the heat-generating electronic component are mainly ensured by the force applied to the planar curved elastic piece 40, and each assembly hole 441 (or 邾丄) is equivalent to the second fixed hole 422. To form a resilient arm, according to the cantilever beam principle, the load applied to each elastic arm: (1) 4L3 200807227 where ^ is the load 'is equivalent to the elastic arm elastic force, E is the elastic modulus, γ Α housing life, WA (4) _ The compression behavior of the twirling arm The width of the elastic # is the effective length of the elastic arm. From the public TIL to the bomb, the gamma is more than one. The formula has a cubic relationship with the square, and the human side _ 'and thus, when its side is determined, the L value increases - after the degree, the corresponding change of γ is The effect of the shrapnel 40 is reduced. Since the locking portions 44 and 46 are curved, the length of the deformation pressure of the shrapnel 4 is increased, that is, the L value in the formula (1) is substantially increased. The slight change in the 40-thick stroke (ie, the small change in the gamma value) does not cause the elastic force (that is, the fluctuation of the extreme drama, so that the heat-dissipating module and the heat-emitting electronic component can be stabilized, and the heat transfer is facilitated. Improve the heat dissipation efficiency of the heat dissipation module. Table 1 below shows the data obtained from a series of comparison experiments between the straight elastic piece and the curved elastic piece. The material used for the elastic piece is stainless steel (SUS301), which is divided into two hardnesses: 1/2H and 3/4H. The thickness of the shrapnel is 〇3mm and 〇.4mm. The width of the shrapnel is 6mm and 4.5mm.
No· 彈片 厚度 彈片 寬度 材質 壓縮 行程 彈力 型式 1 0.3mm 6mm SUS301，1/2H 1mm 9.2KG 直型 2 0.3mm 6mm SUS301，3/4H 1mm 7.7KG 直型 3 0.4mm 4.5mm SUS301，1/2H 1mm 10.2KG 直型 4 0.4mm 4.5mm SUS301，3/4H 1mm 10.8KG 直型 5 0.4mm 6mm SUS301，1/2H 1mm 5.8KG 彎曲型 200807227 lSUS301，3/^mmh 曲^ 由表1中之No.5與No.l之對比和N〇 6與N〇 2之對 比可知，在彈片寬度、材質相同之情況下，作相同之堡縮 行程變化，相對較厚之彎曲型彈片產生之彈力之變化反而 要小，由表1中之No.5與No.3之對比和N〇 6與N〇 4之 對比可知在彈片厚度、材質相同之情況下，作相同之壓 •射程變化’相對較寬之平面彎曲型彈片產生之彈力之變 化反而較小（由公式⑴得知，在其他因素確定之情況下， : P值隨著w值或t值之增大而增大）。由此可見，該散敎 模組採用彎曲型彈片，與採用直型彈片相比，可以在既有 之空間，減缓彈片因行程些微變動即引發彈力極劇之變 化’使發熱電子元件接觸面和散熱模組產生穩定之接觸屢 力，從而使散熱模組能與發熱電子元件緊密相連，提高散 熱模組之散熱效率。 籲如圖4所示為本發明另—實施例中之平面彎曲型彈片 40a之俯視圖。該實施例中，除了料術作形狀上之改 變外，散熱模組之其他元件都與前述實施例中基本相同， 在此不再贅述。彈片40a亦包括一結合部42a和第一、第 二鎖合部44a、46a，結合部42a呈“τ”型，其上沿橫向 設有兩個大小相同之固定孔421a ’這些固定孔42J :二 將彈片40a固定至底座1〇4上，底座 ' 低厘丄U4上之銷釘1〇9隨 疋孔421a之位置、數量之變化亦作相應調整，卷麸 以螺鎖或卡扣等方式將彈片術與底座腦固^ς’。、第 11 200807227 、 一鎖合部44a和第二鎖合部46a分別從結合部42a之兩侧 • 彎曲延伸形成，其形狀貌似字母“c” ，且其開口朝相同 方向。在第一鎖合部44a、第二鎖合部46&遠離結合部42公 之末端上分別設有一裝配孔441a、461a，都呈腰圓形，當 然亦可為圓形等其他不同形狀。每一裝配孔4化（或461a) 與固定孔421a之間相當於形成一彎曲形彈性臂，該等裝配 孔441a、461a用於裝配該裝配部4如、46a至電路板上。 着 以上實施例中，每一彈片4〇或4〇a上形成相互對稱設 £之兩彈性臂，本發明亦可以以其他方式來實現，如彎曲 型彈片40、40a在形狀上可作進一步之等效變換，並非僅 限於上述實施例所描述之形狀。 綜上所述，本發明符合發明專利之要件，爰依法提出 專利申明。惟以上所述者僅為本發明之較佳實施例，舉凡 热悉本案技藝之人士，在爰依本發明精神所作之等效修飾 或嫒化，皆應涵蓋於以下之申請專利範圍内。 • 【圖式簡單說明】 圖1為本發明散熱模組一實施例之分解圖。 圖2為該散熱模組之組合立體圖。 圖3為該實施例中平面彎曲型彈片之俯視圖。 圖4為本發明另一實施例中平面彎曲型彈片之俯視 圖。 圖5為習知技術中直型彈片之結構示意圖。 【主要元件符號說明】 〈本發明〉 12 200807227No· Shrapnel thickness Shrapnel width Material Compression stroke Elastic type 1 0.3mm 6mm SUS301, 1/2H 1mm 9.2KG Straight 2 0.3mm 6mm SUS301, 3/4H 1mm 7.7KG Straight 3 0.4mm 4.5mm SUS301, 1/2H 1mm 10.2KG Straight type 4 0.4mm 4.5mm SUS301,3/4H 1mm 10.8KG Straight type 5 0.4mm 6mm SUS301, 1/2H 1mm 5.8KG Curved type 200807227 lSUS301,3/^mmh Song ^ No.5 in Table 1 Compared with No.l and N〇6 and N〇2, it can be seen that when the width and material of the shrapnel are the same, the same contraction stroke changes, and the change of the elastic force generated by the relatively thick curved shrapnel is Small, from the comparison of No. 5 and No. 3 in Table 1 and the comparison between N〇6 and N〇4, it can be seen that the same pressure/range variation is relatively wide in the case of the same thickness and material of the shrapnel. The change in the elastic force produced by the curved shrapnel is relatively small (it is known from equation (1) that, in the case where other factors are determined, the P value increases as the value of w or t increases). It can be seen that the diverging module adopts a curved elastic piece, which can reduce the change of the elastic piece due to slight fluctuation of the elastic piece in the existing space compared with the straight elastic piece. The heat-dissipating module generates stable contact force, so that the heat-dissipating module can be closely connected with the heat-generating electronic component, thereby improving the heat-dissipating efficiency of the heat-dissipating module. Referring to Fig. 4, there is shown a plan view of a flat curved elastic piece 40a in another embodiment of the present invention. In this embodiment, the other components of the heat dissipation module are substantially the same as those in the foregoing embodiment except for the shape change of the material, and details are not described herein again. The elastic piece 40a also includes a joint portion 42a and first and second locking portions 44a, 46a. The joint portion 42a has a "τ" shape, and two fixing holes 421a' having the same size are disposed on the upper side in the lateral direction: the fixing holes 42J are: Secondly, the elastic piece 40a is fixed to the base 1〇4, and the pin 1〇9 of the base 'low centimeter U4 is adjusted correspondingly with the position and quantity of the hole 421a, and the rolled bran is screwed or buckled. The shrapnel and the base brain are fixed. The 11th 200807227, a locking portion 44a and the second locking portion 46a are respectively formed by bending from both sides of the joint portion 42a, and have a shape similar to the letter "c" and the openings thereof are oriented in the same direction. Mounting holes 441a, 461a are respectively provided at the ends of the first engaging portion 44a, the second engaging portion 46', and the distal end of the engaging portion 42, and are all rounded, and may of course be circular or the like. A fitting elastic hole is formed between each of the fitting holes 4 (or 461a) and the fixing holes 421a, and the fitting holes 441a, 461a are used to mount the fitting portions 4 such as 46a to the circuit board. In the above embodiment, each of the elastic pieces 4〇 or 4〇a forms two elastic arms symmetrically disposed with each other, and the present invention can also be implemented in other manners, for example, the curved elastic pieces 40, 40a can be further shaped in shape. The equivalent transformation is not limited to the shape described in the above embodiment. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent declaration according to law. The above is only the preferred embodiment of the present invention, and those skilled in the art will be able to cover the equivalents of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded view of an embodiment of a heat dissipation module of the present invention. 2 is a combined perspective view of the heat dissipation module. Figure 3 is a plan view of the planar curved elastic piece in this embodiment. Fig. 4 is a plan view showing a planar curved elastic piece according to another embodiment of the present invention. FIG. 5 is a schematic structural view of a straight elastic piece in the prior art. [Explanation of main component symbols] <Invention> 12 200807227
風扇 10 殼體 102 底座 104 凹槽 106 板體 107 通孔 108 銷釘 109 鰭片組 20 鰭片 22 流道 24 熱管 30 蒸發端 302 冷凝端 304 彈片 40、 40a 結合部 42、42a 固定孔 421a 第一固定孔 421 第二固定孔 422 第三固定孔 423 第一鎖合部 44 〜44a 裝配孔 441、441a、 .461 、 461a 第二鎖合部 46、46a 扇輪 50 出風口 60 吸熱塊 70 〈習知〉 連接部 42c 固定孔 421c 裝配部 44 c 裝配孔 441c 13Fan 10 housing 102 base 104 groove 106 plate 107 through hole 108 pin 109 fin group 20 fin 22 flow channel 24 heat pipe 30 evaporation end 302 condensation end 304 spring 40, 40a joint portion 42, 42a fixing hole 421a first Fixing hole 421 second fixing hole 422 third fixing hole 423 first locking portion 44 to 44a fitting hole 441, 441a, .461, 461a second locking portion 46, 46a fan wheel 50 air outlet 60 heat absorbing block 70知〉 Connection portion 42c fixing hole 421c fitting portion 44 c fitting hole 441c 13