CN215379637U

CN215379637U - Heat radiation structure and electronic equipment

Info

Publication number: CN215379637U
Application number: CN202121537872.3U
Authority: CN
Inventors: 刘定波; 吴小伟
Original assignee: Shenzhen Sensetime Technology Co Ltd
Current assignee: Shenzhen Sensetime Technology Co Ltd
Priority date: 2021-07-07
Filing date: 2021-07-07
Publication date: 2021-12-31
Anticipated expiration: 2031-07-07

Abstract

The utility model relates to a heat radiation structure and an electronic device, wherein the heat radiation structure comprises: at least two heat dissipating elements; the heat dissipation device comprises at least one first connecting piece, wherein each first connecting piece is connected with at least two heat dissipation elements, and the at least two heat dissipation elements are connected into a whole through the at least one first connecting piece. According to the above embodiment, at least two heat dissipation elements and at least one first connecting member are provided, and each first connecting member is connected with at least two heat dissipation elements, so that at least two heat dissipation elements are connected into a whole by the at least one first connecting member. The heat dissipation structure is assembled into a whole by at least two heat dissipation elements, and each electronic device only needs to be assembled with one heat dissipation structure, so that the consistency of the heat dissipation elements is improved, the assembly difficulty of the heat dissipation device and the electronic device is reduced, and the assembly efficiency and the heat dissipation effect are improved.

Description

Heat radiation structure and electronic equipment

Technical Field

The present invention relates to the field of electronic devices, and in particular, to a heat dissipation structure and an electronic device.

Background

With the development of artificial intelligence technology, data services are continuously expanded, and the performance requirements on the server are also continuously improved. When the performance of the server is improved, the power consumption and the heat productivity are synchronously improved, and if the heat generated by the server cannot be timely dissipated, the performance of the server is affected, so that the heat dissipation effect of the server is very important to the performance of the server. In the related art, a plurality of different heat dissipation elements are arranged outside the server to dissipate heat, the consistency among the different heat dissipation elements is poor, the difficulty of assembling the heat dissipation elements on the server is high, the efficiency is low, and the final heat dissipation effect is also influenced to a certain extent.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat dissipation structure and an electronic device, which aim to overcome the defects in the related art.

According to a first aspect of the embodiments of the present invention, there is provided a heat dissipation structure applied to an electronic device, including:

at least two heat dissipating elements;

the heat dissipation device comprises at least one first connecting piece, wherein each first connecting piece is connected with at least two heat dissipation elements, and the at least two heat dissipation elements are connected into a whole through the at least one first connecting piece.

In one embodiment, the electronic device further comprises at least one second connector, wherein the second connector is connected with the heat dissipation element and is used for connecting the heat dissipation element to the electronic device.

In one embodiment, each of the heat dissipating elements of the at least two heat dissipating elements is identical in shape.

In one embodiment, different ones of the at least two heat dissipating elements are different in shape.

In one embodiment, the heat dissipating element comprises a heat spreader tube or plate.

In one embodiment, the heat dissipation element is made of metal; and/or the first connecting piece is made of metal.

In one embodiment, the heat dissipation element is connected with the first connecting piece in a welding manner.

In one embodiment, the at least two heat dissipating elements comprise two of the heat dissipating elements;

the first connecting piece is respectively connected with the two heat dissipation elements, and the two heat dissipation elements are symmetrically arranged on two sides of the first connecting piece.

According to a second aspect of the embodiments of the present invention, there is provided an electronic device, including a housing, an electronic component disposed in the housing, and a heat dissipation structure disposed outside the housing, where the heat dissipation structure is the heat dissipation structure of the first aspect.

In one embodiment, the electronic component includes a first component, the first component generates heat more than other components, and the first connection member is disposed corresponding to a position of the first component; and/or the presence of a gas in the gas,

the second connecting piece and the shell are connected by a fixing piece penetrating through the second connecting piece and the shell.

According to the above embodiment, at least two heat dissipation elements and at least one first connecting member are provided, and each first connecting member is connected with at least two heat dissipation elements, so that at least two heat dissipation elements are connected into a whole by the at least one first connecting member. The heat dissipation structure is assembled into a whole by at least two heat dissipation elements, and each electronic device only needs to be assembled with one heat dissipation structure, so that the consistency of the heat dissipation elements is improved, the assembly difficulty of the heat dissipation device and the electronic device is reduced, and the assembly efficiency and the heat dissipation effect are improved.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model, as claimed.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

Fig. 1 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of a soaking tube according to an embodiment of the present invention;

fig. 3 is a schematic view illustrating the heat dissipation structure mounted on the electronic device according to the embodiment of the present invention.

101-a heat dissipation element, 102-a first connecting piece, 103-a second connecting piece, 200-an electronic device, 300-a fixing piece.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the utility model, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present invention. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

Particularly, the surface of the electronic equipment is welded or bonded, and radiating elements of different shapes and specifications are fixed, so that more materials need to be controlled, the assembly efficiency is lower, the reliability is poorer, the maintenance difficulty is high, and the maintenance cost is higher.

Accordingly, referring to fig. 1 to fig. 3, in a first aspect, at least one embodiment of the present invention provides a heat dissipation structure applied to an electronic device 200, including: at least two heat dissipating elements 101; at least one first connector 102, each first connector 102 is connected to at least two heat dissipation elements 101, and the at least one first connector 102 connects the at least two heat dissipation elements 101 into a whole.

The heat dissipation element 101 may be a soaking plate or a soaking tube as shown in fig. 2. The principle of the heat dissipating element 101 may be such that: the heat medium is arranged in the heat dissipation element 101, after the heat dissipation element 101 receives heat emitted by the electronic equipment 200, the internal heat medium is heated and evaporated to form a gaseous state, the gaseous heat medium moves towards a direction far away from a heat source, namely, the gaseous heat medium moves towards a region with lower temperature in the heat dissipation element 101, when the gaseous heat medium reaches the region with lower temperature, the gaseous heat medium is cooled and liquefied and is recovered to be a liquid heat medium, the liquid heat medium moves towards the heat source under the capillary action to reach the region where the heat source is located, and the heat medium moves to and fro between the region where the heat source is located and the low-temperature region according to the process, so that the heat of the heat source is continuously emitted.

Different heat dissipation elements 101 in at least two heat dissipation elements 101 may be the same in type or different in type, for example, different heat dissipation elements 101 may all be vapor chambers or all be vapor pipes, and for example, one of the different heat dissipation elements 101 is a vapor chamber and the other is a vapor pipe. The different heat dissipating elements 101 of the at least two heat dissipating elements 101 may have the same or different shapes, for example, the different soaking pipes may have the same shape, both are linear or both are U-shaped, and for example, the different soaking pipes may have different shapes, one of which may be linear and the other one may be U-shaped.

It should be noted that the type, shape and number of the heat dissipation elements 101 selected by the heat dissipation structure may be determined by combining the heat dissipation requirement of the electronic device 200, so that the heat dissipation structure can adapt to the heat dissipation requirement of the electronic device 200, thereby improving the heat dissipation effect and saving the heat dissipation elements 101.

The heat dissipation structure may be soldered or glued to the surface of the electronic device 200 when connected to the electronic device 200.

According to the above embodiment, at least two heat dissipation elements 101 and at least one first connector 102 are provided, and each first connector 102 is connected with at least two heat dissipation elements 101, so that at least one first connector 102 connects at least two heat dissipation elements 101 as a whole. The heat dissipation structure is assembled into a whole by at least two heat dissipation elements 101, and each electronic device 200 only needs to be assembled with one heat dissipation structure, so that the consistency of the heat dissipation elements 101 is improved, the assembly difficulty of the heat dissipation device and the electronic device 200 is reduced, and the assembly efficiency and the heat dissipation effect are improved.

In some embodiments of the present disclosure, the heat dissipation structure further includes at least one second connector 103, and the second connector 103 is connected to the heat dissipation element 101, for connecting the heat dissipation element 101 to the electronic device 200.

The second connector 103 may be connected to the housing of the electronic device 200 by using a fixing member 300 penetrating through the second connector 103 and the housing. The second connecting member 103 may be a connecting lug, a connecting hole is formed on the connecting lug, and a fixing hole matched with the connecting hole may be formed on the housing of the electronic device 200, so that when the heat dissipation structure is installed, the connecting hole and the corresponding fixing hole may be aligned and fixed by a fixing member 300 such as a screw penetrating through the connecting hole and the fixing hole. The fixing member 300 connects the heat dissipation structure with the electronic device 200, thereby avoiding the inaccurate or infirm fixing position caused by bonding or welding, and the fixing effect is not affected by the temperature of the surface of the housing of the electronic device 200.

In addition, the second connector 103 may be connected to one heat dissipation element 101, or may be connected to two or more connectors, that is, the second connector 103 may be used only for fixing the heat dissipation structure to the electronic device 200, or may be used for connecting different heat dissipation elements 101 while being used for fixing the heat dissipation structure to the electronic device 200. The second connectors 103 may all be of the same type and shape, or may be of different types and shapes, for example, part of the second connectors 103 are only used for fixing the heat dissipation structure to the electronic device 200, and part of the second connectors 103 are also used for connecting different heat dissipation elements 101 while being used for fixing the heat dissipation structure to the electronic device 200.

In this embodiment, the second connecting member 103 is further disposed to complete the fixing of the heat dissipation structure and the electronic device 200, so that the heat dissipation structure has a better fixing condition, and the assembly convenience and stability of the heat dissipation structure are improved.

In some embodiments of the present disclosure, the heat dissipation element 101 is made of metal; and/or the first connecting member 102 is made of a metal material. When the heat dissipation element 101 is a heat spreader or a heat spreader, the heat dissipation element 101 is made of a metal material, and the first connecting member 102 can be used as a heat transfer medium between the electronic device 200 and the heat dissipation element 101 while connecting different heat dissipation elements 101, so that the heat transfer efficiency can be improved by setting the first connecting member 102 to be made of a metal material.

When the heat dissipation element 101 and the first connecting piece 102 are made of metal, the heat dissipation element 101 and the first connecting piece 102 can be connected in a welding manner, so that the connection firmness between the heat dissipation element 101 and the first connecting piece 102 is further improved, and the structural stability of the heat dissipation structure is improved.

In one example, the first connecting member 102 may be a copper plate having high heat conduction efficiency, the heat dissipation structure includes two soaking pipes, the copper plate as the first connecting member 102 is connected to the two soaking pipes as the heat dissipation element 101, respectively, and the two soaking pipes may be symmetrically disposed at both sides of the copper plate. The radiating pipe can be U-shaped. In this example, the copper plate can conduct the heat that electronic equipment 200 produced to the soaking pipe fast to make the heat dispel the heat through the soaking pipe, improved the radiating efficiency.

Note that the electronic apparatus 200 includes a plurality of electronic components, and different electronic components generate different amounts of heat, and the electronic component with the largest amount of heat may be the first component, for example, a Central Processing Unit (CPU) with the largest amount of heat. Therefore, the first connecting member 102 can be disposed at a position corresponding to the first component, so that heat can be rapidly conducted to the soaking pipe, and the heat accumulation is avoided, thereby affecting the performance of the electronic apparatus 200. For example, the copper plate as the first connector 102 mentioned in the above example may be attached outside the housing of the electronic device 200, and the attaching position is the position of the cpu.

According to a second aspect of the embodiments of the present invention, an electronic device 200 is provided, which includes a housing, an electronic component disposed in the housing, and a heat dissipation structure disposed outside the housing, where the heat dissipation structure is the heat dissipation structure of the first aspect.

The electronic device 200 may be a server or a terminal.

In one example, the electronic component includes a first component, the heat generation amount of the first component is larger than that of other components, and the first connection member 102 is disposed corresponding to a position of the first component; and/or, the second connecting piece 103 is connected with the shell by a fixing piece 300 penetrating through the second connecting piece 103 and the shell.

While this specification contains many specific implementation details, these should not be construed as limitations on the scope of any invention or of what may be claimed, but rather as descriptions of features specific to particular embodiments of particular inventions. Certain features that are described in this specification in the context of separate embodiments can also be implemented in combination in a single embodiment. In other instances, features described in connection with one embodiment may be implemented as discrete components or in any suitable subcombination. Moreover, although features may be described above as acting in certain combinations and even initially claimed as such, one or more features from a claimed combination can in some cases be excised from the combination, and the claimed combination may be directed to a subcombination or variation of a subcombination.

The above description is only for the purpose of illustrating the preferred embodiments of the one or more embodiments of the present disclosure, and is not intended to limit the scope of the one or more embodiments of the present disclosure, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the one or more embodiments of the present disclosure should be included in the scope of the one or more embodiments of the present disclosure.

In the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise.

Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.

It will be understood that the utility model is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.

Claims

1. A heat dissipation structure, applied to an electronic device, includes:

at least two heat dissipating elements;

2. The heat dissipating structure of claim 1, further comprising at least one second connector coupled to the heat dissipating element for connecting the heat dissipating element to the electronic device.

3. The heat dissipation structure of claim 1, wherein each of the heat dissipation elements of the at least two heat dissipation elements is identical in shape.

4. The heat dissipation structure of claim 1, wherein different ones of the at least two heat dissipation elements are different in shape.

5. The heat dissipation structure of claim 1, wherein the heat dissipation element comprises a heat spreader pipe or a heat spreader plate.

6. The heat dissipating structure of claim 1, wherein the heat dissipating element is made of metal; and/or the first connecting piece is made of metal.

7. The heat dissipating structure of claim 1 or 6, wherein the heat dissipating element is connected to the first connecting member by welding.

8. The heat dissipation structure of claim 1, wherein the at least two heat dissipation elements comprise two of the heat dissipation elements;

9. An electronic device, comprising a housing, an electronic component disposed in the housing, and a heat dissipation structure disposed outside the housing, wherein the heat dissipation structure is the heat dissipation structure according to any one of claims 1 to 8.

10. The electronic device according to claim 9, wherein the electronic device includes a first component that generates heat more than other components, and the first connection member is provided corresponding to a position of the first component; and/or the presence of a gas in the gas,