TW200806967A - Apparatus for inspecting fine structure and method for inspecting fine structure - Google Patents

Apparatus for inspecting fine structure and method for inspecting fine structure Download PDF

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Publication number
TW200806967A
TW200806967A TW096113039A TW96113039A TW200806967A TW 200806967 A TW200806967 A TW 200806967A TW 096113039 A TW096113039 A TW 096113039A TW 96113039 A TW96113039 A TW 96113039A TW 200806967 A TW200806967 A TW 200806967A
Authority
TW
Taiwan
Prior art keywords
nozzles
movable portion
inspection
gas
probe
Prior art date
Application number
TW096113039A
Other languages
English (en)
Chinese (zh)
Other versions
TWI331676B (https=
Inventor
Naoki Ikeuchi
Masami Yakabe
Akiko Kamigori
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200806967A publication Critical patent/TW200806967A/zh
Application granted granted Critical
Publication of TWI331676B publication Critical patent/TWI331676B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2829—Testing of circuits in sensor or actuator systems

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
TW096113039A 2006-04-26 2007-04-13 Apparatus for inspecting fine structure and method for inspecting fine structure TW200806967A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006122160 2006-04-26

Publications (2)

Publication Number Publication Date
TW200806967A true TW200806967A (en) 2008-02-01
TWI331676B TWI331676B (https=) 2010-10-11

Family

ID=38655289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113039A TW200806967A (en) 2006-04-26 2007-04-13 Apparatus for inspecting fine structure and method for inspecting fine structure

Country Status (5)

Country Link
US (1) US20090039908A1 (https=)
JP (1) JPWO2007125756A1 (https=)
KR (1) KR101019080B1 (https=)
TW (1) TW200806967A (https=)
WO (1) WO2007125756A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460402B (zh) * 2011-08-17 2014-11-11 Hon Tech Inc Electronic unit testing machine
TWI490477B (zh) * 2008-03-04 2015-07-01 Kyodo Design & Planning Corp 電子零件檢查方法及用於該方法中之裝置
US11047880B2 (en) 2019-01-16 2021-06-29 Star Technologies, Inc. Probing device
CN114460437A (zh) * 2021-12-23 2022-05-10 苏州伊欧陆系统集成有限公司 一种应用于探针台的自动喷液保护测试系统

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DE102007059279B3 (de) * 2007-12-08 2010-01-21 X-Fab Semiconductor Foundries Ag Vorrichtung zum Testen der mechanisch-elektrischen Eigenschaften von mikroelektromechanischen Sensoren (MEMS)
CN102301462A (zh) * 2009-02-12 2011-12-28 株式会社爱德万测试 半导体晶片测试装置
WO2012098901A1 (ja) * 2011-01-20 2012-07-26 パナソニック株式会社 加速度センサ
EP2977811A1 (de) * 2014-07-25 2016-01-27 Trumpf Laser Marking Systems AG System mit einem piezoresistiven Positionssensor
US9527731B2 (en) * 2014-10-15 2016-12-27 Nxp Usa, Inc. Methodology and system for wafer-level testing of MEMS pressure sensors
US10605831B2 (en) 2017-10-05 2020-03-31 International Business Machines Corporation Tool for automatically replacing defective pogo pins
JP6827509B1 (ja) 2019-10-11 2021-02-10 浜松ホトニクス株式会社 ミラーデバイスの製造方法、及び、ミラーユニットの製造方法
JP7520356B2 (ja) * 2020-10-16 2024-07-23 株式会社昭和真空 測定装置
DE102021212327A1 (de) 2021-11-02 2023-05-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Einrichtung zum Ermitteln dynamischer Parameter einer MEMS-Vorrichtung, und MEMS-Vorrichtung
US12216140B2 (en) * 2022-10-17 2025-02-04 The Boeing Company Tilt calibration for probe systems

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JPS6232332A (ja) * 1985-08-05 1987-02-12 Toyota Central Res & Dev Lab Inc 圧力検出素子の検定方法及び装置
JPH0439555Y2 (https=) * 1986-04-21 1992-09-16
JPH0534371A (ja) * 1991-07-31 1993-02-09 Tokai Rika Co Ltd 半導体加速度センサの感度測定装置
JPH0774219A (ja) * 1993-08-31 1995-03-17 Kurisutaru Device:Kk プローブ基板およびその製造方法並びにプローブ装置
JPH0933567A (ja) * 1995-07-21 1997-02-07 Akebono Brake Ind Co Ltd 半導体加速度センサのセンサチップ検査方法及び検査装置
JP3279488B2 (ja) * 1996-10-21 2002-04-30 富士電機株式会社 物理量センサの校正方法と校正装置
JPH11218548A (ja) * 1998-02-03 1999-08-10 Mitsubishi Electric Corp プローブカード
US6232790B1 (en) * 1999-03-08 2001-05-15 Honeywell Inc. Method and apparatus for amplifying electrical test signals from a micromechanical device
JP2001033506A (ja) * 1999-07-27 2001-02-09 Hioki Ee Corp 基板検査装置
JP2001264185A (ja) * 2000-03-21 2001-09-26 Nikon Corp レチクルのメンブレンの内部応力測定方法及び装置、並びに半導体デバイスの製造方法
JP2003273174A (ja) * 2002-03-12 2003-09-26 Seiko Instruments Inc 半導体検査装置
JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP2005286050A (ja) * 2004-03-29 2005-10-13 Sharp Corp 半導体ウエハの検査方法および検査装置
JP4573794B2 (ja) * 2005-03-31 2010-11-04 東京エレクトロン株式会社 プローブカードおよび微小構造体の検査装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI490477B (zh) * 2008-03-04 2015-07-01 Kyodo Design & Planning Corp 電子零件檢查方法及用於該方法中之裝置
TWI460402B (zh) * 2011-08-17 2014-11-11 Hon Tech Inc Electronic unit testing machine
US11047880B2 (en) 2019-01-16 2021-06-29 Star Technologies, Inc. Probing device
CN114460437A (zh) * 2021-12-23 2022-05-10 苏州伊欧陆系统集成有限公司 一种应用于探针台的自动喷液保护测试系统

Also Published As

Publication number Publication date
JPWO2007125756A1 (ja) 2009-09-10
KR20080088638A (ko) 2008-10-02
KR101019080B1 (ko) 2011-03-07
WO2007125756A1 (ja) 2007-11-08
TWI331676B (https=) 2010-10-11
US20090039908A1 (en) 2009-02-12

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