TW200806967A - Apparatus for inspecting fine structure and method for inspecting fine structure - Google Patents
Apparatus for inspecting fine structure and method for inspecting fine structure Download PDFInfo
- Publication number
- TW200806967A TW200806967A TW096113039A TW96113039A TW200806967A TW 200806967 A TW200806967 A TW 200806967A TW 096113039 A TW096113039 A TW 096113039A TW 96113039 A TW96113039 A TW 96113039A TW 200806967 A TW200806967 A TW 200806967A
- Authority
- TW
- Taiwan
- Prior art keywords
- nozzles
- movable portion
- inspection
- gas
- probe
- Prior art date
Links
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
- B81C99/005—Test apparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
- G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
- G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2829—Testing of circuits in sensor or actuator systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006122160 | 2006-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806967A true TW200806967A (en) | 2008-02-01 |
| TWI331676B TWI331676B (enExample) | 2010-10-11 |
Family
ID=38655289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096113039A TW200806967A (en) | 2006-04-26 | 2007-04-13 | Apparatus for inspecting fine structure and method for inspecting fine structure |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20090039908A1 (enExample) |
| JP (1) | JPWO2007125756A1 (enExample) |
| KR (1) | KR101019080B1 (enExample) |
| TW (1) | TW200806967A (enExample) |
| WO (1) | WO2007125756A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI460402B (zh) * | 2011-08-17 | 2014-11-11 | Hon Tech Inc | Electronic unit testing machine |
| TWI490477B (zh) * | 2008-03-04 | 2015-07-01 | Kyodo Design & Planning Corp | 電子零件檢查方法及用於該方法中之裝置 |
| US11047880B2 (en) | 2019-01-16 | 2021-06-29 | Star Technologies, Inc. | Probing device |
| CN114460437A (zh) * | 2021-12-23 | 2022-05-10 | 苏州伊欧陆系统集成有限公司 | 一种应用于探针台的自动喷液保护测试系统 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007059279B3 (de) * | 2007-12-08 | 2010-01-21 | X-Fab Semiconductor Foundries Ag | Vorrichtung zum Testen der mechanisch-elektrischen Eigenschaften von mikroelektromechanischen Sensoren (MEMS) |
| CN102301462A (zh) * | 2009-02-12 | 2011-12-28 | 株式会社爱德万测试 | 半导体晶片测试装置 |
| US20130283914A1 (en) * | 2011-01-20 | 2013-10-31 | Panasonic Corporation | Acceleration sensor |
| EP2977811A1 (de) * | 2014-07-25 | 2016-01-27 | Trumpf Laser Marking Systems AG | System mit einem piezoresistiven Positionssensor |
| US9527731B2 (en) * | 2014-10-15 | 2016-12-27 | Nxp Usa, Inc. | Methodology and system for wafer-level testing of MEMS pressure sensors |
| US10605831B2 (en) * | 2017-10-05 | 2020-03-31 | International Business Machines Corporation | Tool for automatically replacing defective pogo pins |
| JP6827509B1 (ja) * | 2019-10-11 | 2021-02-10 | 浜松ホトニクス株式会社 | ミラーデバイスの製造方法、及び、ミラーユニットの製造方法 |
| JP7520356B2 (ja) * | 2020-10-16 | 2024-07-23 | 株式会社昭和真空 | 測定装置 |
| DE102021212327A1 (de) * | 2021-11-02 | 2023-05-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren und Einrichtung zum Ermitteln dynamischer Parameter einer MEMS-Vorrichtung, und MEMS-Vorrichtung |
| US12216140B2 (en) * | 2022-10-17 | 2025-02-04 | The Boeing Company | Tilt calibration for probe systems |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6232332A (ja) * | 1985-08-05 | 1987-02-12 | Toyota Central Res & Dev Lab Inc | 圧力検出素子の検定方法及び装置 |
| JPH0439555Y2 (enExample) * | 1986-04-21 | 1992-09-16 | ||
| JPH0534371A (ja) * | 1991-07-31 | 1993-02-09 | Tokai Rika Co Ltd | 半導体加速度センサの感度測定装置 |
| JPH0774219A (ja) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | プローブ基板およびその製造方法並びにプローブ装置 |
| JPH0933567A (ja) * | 1995-07-21 | 1997-02-07 | Akebono Brake Ind Co Ltd | 半導体加速度センサのセンサチップ検査方法及び検査装置 |
| JP3279488B2 (ja) * | 1996-10-21 | 2002-04-30 | 富士電機株式会社 | 物理量センサの校正方法と校正装置 |
| JPH11218548A (ja) * | 1998-02-03 | 1999-08-10 | Mitsubishi Electric Corp | プローブカード |
| US6232790B1 (en) * | 1999-03-08 | 2001-05-15 | Honeywell Inc. | Method and apparatus for amplifying electrical test signals from a micromechanical device |
| JP2001033506A (ja) * | 1999-07-27 | 2001-02-09 | Hioki Ee Corp | 基板検査装置 |
| JP2001264185A (ja) * | 2000-03-21 | 2001-09-26 | Nikon Corp | レチクルのメンブレンの内部応力測定方法及び装置、並びに半導体デバイスの製造方法 |
| JP2003273174A (ja) * | 2002-03-12 | 2003-09-26 | Seiko Instruments Inc | 半導体検査装置 |
| JP4456325B2 (ja) * | 2002-12-12 | 2010-04-28 | 東京エレクトロン株式会社 | 検査方法及び検査装置 |
| JP2005286050A (ja) * | 2004-03-29 | 2005-10-13 | Sharp Corp | 半導体ウエハの検査方法および検査装置 |
| JP4573794B2 (ja) * | 2005-03-31 | 2010-11-04 | 東京エレクトロン株式会社 | プローブカードおよび微小構造体の検査装置 |
-
2006
- 2006-04-12 US US12/282,744 patent/US20090039908A1/en not_active Abandoned
-
2007
- 2007-04-12 KR KR1020087020119A patent/KR101019080B1/ko not_active Expired - Fee Related
- 2007-04-12 JP JP2008513136A patent/JPWO2007125756A1/ja active Pending
- 2007-04-12 WO PCT/JP2007/058069 patent/WO2007125756A1/ja not_active Ceased
- 2007-04-13 TW TW096113039A patent/TW200806967A/zh not_active IP Right Cessation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI490477B (zh) * | 2008-03-04 | 2015-07-01 | Kyodo Design & Planning Corp | 電子零件檢查方法及用於該方法中之裝置 |
| TWI460402B (zh) * | 2011-08-17 | 2014-11-11 | Hon Tech Inc | Electronic unit testing machine |
| US11047880B2 (en) | 2019-01-16 | 2021-06-29 | Star Technologies, Inc. | Probing device |
| CN114460437A (zh) * | 2021-12-23 | 2022-05-10 | 苏州伊欧陆系统集成有限公司 | 一种应用于探针台的自动喷液保护测试系统 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080088638A (ko) | 2008-10-02 |
| WO2007125756A1 (ja) | 2007-11-08 |
| TWI331676B (enExample) | 2010-10-11 |
| KR101019080B1 (ko) | 2011-03-07 |
| US20090039908A1 (en) | 2009-02-12 |
| JPWO2007125756A1 (ja) | 2009-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |