200803450 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種嵌入式相機鏡頭模組及其製造方 法；更明確而言’本發明係更微型化之相機鏡頭模組。 【先前技術】 近代的電子產業持續地蓬勃發展，各式各樣的電子 產品使人們的生活更加舒適與便捷，許多電子產品皆面 臨需要挑我更小的尺寸以符合消費者的需求。 請參閱第四圖，係習知相機鏡頭模組剖面示意圖， 其高度關鍵在於底部之硬質印刷電路板25、習知鏡頭座 41、黏膠26以及鏡頭多且50四者高度之和。對於現在相 機模組的應用範圍講求越來越輕薄的情況下，相機 = 辦法來降低其高度’使其應用在現代潮 綜上述而言，欲將相機鏡頭模 硬質印刷電路板25、習知鏡頭膠化： =二;;:維，力能性心^ 連-系列複雜之程序與時；組’此亦牽 之高度則因生產中的工差會影;習，鏡頭座41 動甚至干涉，加上硬質印刷電路板25^=像模組作 固定麥數，故目前的確需要—個本身亦是-化之簡易生產且成本低廉之方法謂相機鏡頭模組薄型 5 200803450 【發明内容】 / —有鑒於先前技術其缺點在於欲開發薄形鏡頭組，則 須花費大量金錢去開發研究新型鏡頭組，此亦牽連一系 列複雜之程序與時間，此外，更動鏡頭座之高度則在生 產時工差影響會使下方之習知影像模組之作動受到影響 甚至干涉，加上硬質印刷電路板之厚度本身亦是一固定 參數，故無法將相機鏡頭模組薄型化。為此，本發明之 =的在於提供一種嵌入式相機鏡頭模組及其製造方法， ，由改善印^刷電路板材質及製程方法，以降低鏡頭座之 巧度’達成薄型化之嵌入式相機鏡頭模組及其製造方法。 本發明之另一目的在於提供一種嵌入式 組及其製造方法，彻充填物來降低鏡頭座之 達到薄型化之嵌入式相機鏡頭模組及其製造方法。 …為解決上述缺點，達到薄形相機鏡頭模組薄型化的 政果’本發明提供-種嵌人式相機鏡頭模組製造方法， 至少包括·提供-印刷電路板，該印刷電路板之第一表 面’該印刷電路板之第二表面形成第 :電軋Ϊ.，、、占之佈局’且該第-電氣接點連通該第二電氣 ί點*一積體電路元件，將該積體電路元件之接腳 該印刷電路板第一表面之第一電氣接點；令 該ϊ刷電，板-邊以上之邊緣向該第-表面彎折，俾藉 氣ί點？成一巧面接觸之影像模組半成品；‘ s體ί::入杈具；提供一充填物至該模具内 之積體電路70件及印刷電路板之間，以將該模且 電路70件與印刷電路板間之氣體排出並界定及形成嵌入 6 200803450 ίΐϊί組；令一鏡頭座置於該嵌人式影像模組上，藉 =物將該鏡頭座與該喪入式影像模組結合；及卸； 該杈具，以形成該嵌入式相機鏡頭模組。 較佳地，其中該印刷電路板係軟性基材。 較佳地，其中該充填物係黏膠。 像晶，佳地’其中該舰電路元件可為―影像科或影 ^發明亦提供-種相機鏡頭模組製造方法， ^^供―印刷電路板；提供—積體電路元件，將 =半成品；令該影像模組半成 Π 模具:之積體電路元件及印刷電路 I ^ ^ 蜆頌座置於該影傻握έΒ t =該充填物將該鏡頭座與該影像模組結合；及却除 “杈/、，以形成該相機鏡頭模組。 ’、 杈佳地，其中該印刷電路板係軟性基材。 較佳地，其中該充填物係黏膠。 像晶=地’其㈣積㈣路元件可為—影像元件或影 法，的i供本r亦提供一種電子模組製造方 電:板並置入模具』= 以界定_體電路模印及其形咖 供、、且形體，及卸除該模具，以形成該 7 200803450 電子模組。 較佳地，該積體電路模組製造方法，係於充填物未 固化之狀組接一承载體。 較佳地，其中該充填物係黏膠。 較佳地’其巾該碰電路元件可為—影像元件或影 像晶片。 ^值得一提的是，本發明亦提供一種嵌入式相機鏡頭 板組’包含·-印㈣路板；—積體電路元件，係電氣 連接於該印刷電路板上；—鏡頭座，係具有—腔室，該 鏡頭座配置於相對該積體電路元件表面之上方；及一充 填物’係連接該印刷電路板、該影像晶片及該鏡頭 一體。 較佳地，其中該印刷電路板係軟性基材。 較佳地，其中該充填物係黏膠。 較佳地’該嵌入式相機鏡頭模組係配置鏡頭組於該 鏡頭座之腔室内。 較佳地，其中該積體電路元件可為一影像元件或影 像晶片。 本發明嵌入式相機鏡頭模組及其製造方法藉改善印 刷電路板材質及製程方法，來降低其厚度，亦利用充填 物來降低及取代習知鏡頭座之高度，對於將相機鏡頭模 組薄型化有明顯之具體功效。 【實施方式】 雖然本發明將參閱含有本發明較佳實施例之所附圖 8 200803450 充份描述，但在此描述之前應瞭解熟悉本行之人 效改在本文中所描述之發明，同時獲致本發明之功 今Q此須瞭解以下之描述對熟悉本行技藝之人士而 Q…、二廣泛之揭示，且其内容不在於限制本發明。 施例凊參ΐ第一A圖至第一£圖，係顯示本發明第一實 電路^示思圖。本發明相機鏡頭模組1，係包含··一印刷 路柄^ 2〇 ;·一積體電路元件10，係電氣連接於該印刷電 配署上；一鏡頭座40，係具有一腔室，該鏡頭座40 30, /相對該積體電路元件10表面之上方；及一充填物 頭座該印刷電路板2G、該積體電路1G及該鏡 件1(^=續參考第-A®至第—E圖，前述積體電路元 積!^接腳21電氣連接_印刷電路板2G上，成為-成2路組紅電子模組半成品，而將前述電子模組半 充^入—形體已經過設計之模具6G中，接著，提供一 填物如30至該模具6〇内之積體電路與電路板間，該充 it ’使躲雜具⑼㈣㈣路元件 形體，之亂體排出並界定岐形成電子模組 ς曰另片’本發明之積體電路w㈣可為—影像元 造/二 =相:rf组所實行之相機鏡頭模組製 路元件10 =拉 刷電路板20 ;提供—積體電 牛’將該積體電路元件10電氣連接於 板以形成-影像模組半成品24;令該影像 9 200803450 品24置入一模具6〇;提供一充填物3〇至該模具⑼内之 積體電路元件10及印刷電路板20之間，以將該模具6〇 ^積體電路元件10與印刷電路板20間之氣體排出/並界 定及形成一影像模組27;令一鏡頭座40置於該影像模組 27上，藉該充填物3〇將該鏡頭座4〇與該影像模組、27 結合，及卸除該模具6〇，以形成該相機鏡頭模組^。 本發明相機鏡頭模組製造方法，首先提供一軟性質 材之印刷電路板20，其優點係較硬f之電路板薄，*提 =積體電路元件，將該频電路元件1G藉接腳21 :ΓΡ刷電路板20上，成為一積體電路組成之200803450 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to an embedded camera lens module and a method of manufacturing the same; more specifically, the present invention is a more miniaturized camera lens module. [Prior Art] The modern electronics industry continues to flourish. A wide range of electronic products make people's lives more comfortable and convenient. Many electronic products are faced with the need to pick my smaller size to meet the needs of consumers. Please refer to the fourth figure, which is a schematic cross-sectional view of a conventional camera lens module, the height of which is the sum of the hard printed circuit board 25 at the bottom, the conventional lens mount 41, the adhesive 26, and the height of the lens and the height of 50. In the case where the application range of the camera module is now becoming more and more thin, the camera = method to lower its height' makes it applied in the modern tide. In the above, the camera lens is to be hard printed circuit board 25, the conventional lens Glue: = 2;;: Dimensions, force and energy ^ Lian - series of complicated procedures and time; group 'this height is also due to the production of the work difference; Xi, lens seat 41 movement or even interference, In addition, the hard printed circuit board 25^= is like a fixed number of chips, so it is really necessary to use a method that is simple in production and low in cost. The method is a camera lens module thin type 5 200803450 [Invention content] / In view of the shortcomings of the prior art, in order to develop a thin lens group, it takes a lot of money to develop a new lens group, which also involves a series of complicated procedures and time. In addition, the height of the lens holder is in the production time. The effect will affect or even interfere with the operation of the conventional image module below, and the thickness of the rigid printed circuit board itself is a fixed parameter, so the camera lens module cannot be thinned. To this end, the present invention provides an embedded camera lens module and a method of manufacturing the same, which improves the size and process of the printed circuit board to reduce the complexity of the lens mount. Lens module and its manufacturing method. Another object of the present invention is to provide an embedded set and a method of manufacturing the same, which is capable of reducing the size of the lens mount to achieve a thinned lens mount module and a method of manufacturing the same. In order to solve the above disadvantages, the thinner camera lens module is thinned. The present invention provides a method for manufacturing a built-in camera lens module, comprising at least a printed circuit board, the first of which is a second surface of the printed circuit board forming a first: electrical rolling, a layout, and the first electrical contact is connected to the second electrical circuit, the integrated circuit component The pin of the component is the first electrical contact of the first surface of the printed circuit board; so that the edge of the board is bent toward the first surface, and the edge of the board is bent. a semi-finished image module that is in contact with the image; ' s body ί:: into the cookware; provides a filling to the 70 pieces of the integrated circuit in the mold and the printed circuit board, to 70 pieces of the mold and the circuit The gas between the printed circuit boards is discharged and defined and formed into a group of 6 200803450 ίΐϊ; a lens holder is placed on the embedded image module, and the lens holder is combined with the immersive image module; Unloading; the cookware to form the embedded camera lens module. Preferably, wherein the printed circuit board is a flexible substrate. Preferably, wherein the filling is a glue. Like Crystal, Jiadi's circuit components of the ship can be provided as "Image Division or Shadow ^ invention" - a camera lens module manufacturing method, ^^ for "printed circuit board; provide - integrated circuit components, will = semi-finished products; The image module is semi-finished: the integrated circuit component and the printed circuit I ^ ^ 置于 seat is placed in the shadow έΒ = t = the filling combines the lens mount with the image module; "杈/, to form the camera lens module. ', preferably, the printed circuit board is a soft substrate. Preferably, wherein the filling is a glue. Like crystal = ground 'its (four) product (four) The circuit component can be an image component or a shadow method, and the i is also provided with an electronic module manufacturing power: the board is placed in the mold 』 = to define the body circuit and its shape, and the shape, And removing the mold to form the 7 200803450 electronic module. Preferably, the integrated circuit module manufacturing method is to assemble a carrier in the form of uncured filling. Preferably, the filling is Adhesive. Preferably, the surface of the device can be an image component or image. It is worth mentioning that the present invention also provides an embedded camera lens board group 'including · printing (four) circuit board; - integrated circuit components, electrically connected to the printed circuit board; - lens holder, system Having a chamber, the lens holder is disposed above the surface of the integrated circuit component; and a filler is connected to the printed circuit board, the image wafer and the lens. Preferably, the printed circuit board is Preferably, the filling material is a glue. Preferably, the embedded camera lens module is configured to have a lens group in a chamber of the lens holder. Preferably, the integrated circuit component can be The invention is an image sensor or an image wafer. The embedded camera lens module and the manufacturing method thereof have the advantages of improving the thickness of the printed circuit board and the manufacturing method, and also using the filling material to reduce and replace the height of the conventional lens holder. The invention has obvious specific effects for thinning the camera lens module. [Embodiment] The present invention will be fully described with reference to FIG. 8 200803450, which contains a preferred embodiment of the present invention. However, before the description, it should be understood that the inventions described in this document have been modified, and at the same time, the invention has been achieved. It is necessary to understand that the following description is for those who are familiar with the skill of the art. The disclosure of the present invention is not intended to limit the present invention. The first embodiment of the present invention is shown in the first embodiment of the present invention. The camera lens module 1 of the present invention includes a printed circuit handle ^ 2〇; an integrated circuit component 10 is electrically connected to the printed electrical distribution department; a lens mount 40 has a chamber, the lens mount 40 30, / relative to the integrated body Above the surface of the circuit component 10; and a filling head holder of the printed circuit board 2G, the integrated circuit 1G and the mirror member 1 (^= continued to refer to the -A® to the -E diagram, the aforementioned integrated circuit element product ^^ Pin 21 electrical connection _ printed circuit board 2G, become a 2-way red electronic module semi-finished product, and the above-mentioned electronic module half-filled into the shape of the mold 6G, and then provide a Filling such as 30 to the integrated circuit between the integrated circuit and the circuit board of the mold, the charge is made to make the hiding device (9) (four) The circuit component body, the disordered body is discharged and defined to form an electronic module, and the other piece 'the integrated circuit w (four) of the present invention can be - image element manufacturing / two = phase: camera lens module circuit component implemented by the rf group 10 = pull the brush circuit board 20; provide - the integrated electric vehicle 'electrically connect the integrated circuit component 10 to the board to form the image module semi-finished product 24; and place the image 9 200803450 product 24 into a mold 6; A filler 3 is interposed between the integrated circuit component 10 and the printed circuit board 20 in the mold (9) to discharge and define and form a gas between the mold 6 and the printed circuit board 20. An image module 27; a lens mount 40 is placed on the image module 27, the lens mount 4 is coupled to the image module 27, and the mold 6 is removed by the filler 3 Form the camera lens module ^. The manufacturing method of the camera lens module of the present invention firstly provides a printed circuit board 20 of a soft material, the advantage of which is thinner than the hard circuit board, and the integrated circuit component 1G is borrowed from the foot 21 : brushing the circuit board 20, forming an integrated circuit
計之模具㈣，接著，提供成—充填S 水積Γ路與電路板間，該充填物可為膠 20 吏將板具内積體電路元件10與印刷電路板 氣體排出並衫出及形成影像模組2/電: —D及第一 Ε ^ 5〇裝置入鏡頭座40中即完成如第 來取代-般額外殼：，利用充填物30 進心Γ工1:, 亦可利用充填物尚未固化前， H V 欲與該積體電路模έ且έ士人之复仙- 件，將其黏結成形後，在银、、且π 口之其他兀 值得-提較，該_取代合之效果。 路板間之空間，此外私組中影像元件及電 其直接結合影像模組*鏡組的形體，同時因 /、、兄碩座達到鈿小相機鏡頭模組高 200803450 度之功效。 請參閱第二A圖至第二F圖，係顯示本發明第二實 施例之不意圖。本發明嵌入式相機鏡頭模組丨，，係包含： -印刷電路板-積體電路元件1G，係電氣連接於該 印刷電路板20上；一鏡頭座4〇，係具有一腔室該鏡頭 座40配置於相對該積體電路元件1〇表面之上方；及一 充填物30,係用以連接該印刷電路板2〇、該積體電路1〇 及該鏡頭座40為一體。 _ /請繼續參考第二A·第二FK!，前述印刷電路板 20係-軟性材質之印刷電路板且係—十字形，該印刷電 路板20具有第-表面23及第二表面22，且前述印刷電 路板20之第一表面23具有第一電氣接點（圖未示），該 印刷電路板20之第二表面22形成第二電氣接點28之佈 局，且該第-電氣接點連通該第二電氣接點28，而前述 積體電路元件10之接腳21電氣連接於該印刷電路板2〇 第一表S 23之第一電氣接.點，如第二a圖所示，而前述 鲁 印刷電路板2〇 一邊以上之邊緣向該第一表面23彎折， 俾藉該第二電氣接點28形成-侧面接觸之影像模組半成 ^ 24,在本實施例中係四邊彎折，如第圖所示，將 前述影像模組半成品24置入一形體已經過設計之模具 6〇中，接著，提供一充填物30至該模具60内之積體電 • 路與電路朗，該紐物30可騎水，使得㈣模具60 · 2龍電路元件1G與印刷板2G .氣體排出並界 -- =出及形成影像模組27形體，最後將模具60與該影像 拉組27分離，形成嵌入式鏡頭模組1，。另，本發明之積 200803450 體電路元件ίο可為一影像元件或影像晶片。The mold (4) is then provided between the filling and filling of the S-water circuit and the circuit board, and the filling may be glue 20 排出 discharging the integrated circuit component 10 and the printed circuit board gas in the board and forming the image mold. Group 2 / electricity: - D and the first Ε ^ 5 〇 device into the lens mount 40 is completed as the first replacement - the extra shell:, using the filling 30 into the heart 1 :, can also use the filling has not yet cured Before, the HV wants to emulate the integrated circuit and the gentleman's sacred piece, and after bonding it, it is worthwhile in the silver, and other π mouths, and the _ replaces the effect. The space between the road boards, in addition to the image components and electricity in the private group directly combined with the image module * mirror group shape, at the same time because / /, brothers master to achieve the small camera lens module height of 200803450 degrees. Referring to Figures 2A through 2F, there is shown a second embodiment of the present invention. The embedded camera lens module of the present invention comprises: - a printed circuit board - integrated circuit component 1G electrically connected to the printed circuit board 20; a lens mount 4 〇 having a chamber for the lens mount 40 is disposed above the surface of the integrated circuit component 1; and a filler 30 is used to connect the printed circuit board 2, the integrated circuit 1A and the lens holder 40 are integrated. _ / Please continue to refer to the second A. second FK!, the printed circuit board 20 is a printed circuit board of a soft material and has a cross shape, the printed circuit board 20 has a first surface 23 and a second surface 22, and The first surface 23 of the printed circuit board 20 has a first electrical contact (not shown), the second surface 22 of the printed circuit board 20 forms a layout of the second electrical contact 28, and the first electrical contact is connected. The second electrical contact 28, and the pin 21 of the integrated circuit component 10 is electrically connected to the first electrical connection point of the first circuit board S 23 of the printed circuit board 2, as shown in the second figure a, The edge of the printed circuit board 2 is bent toward the first surface 23, and the image module is formed by the second electrical contact 28 to form a side surface. In this embodiment, the four sides are four sides. Bending, as shown in the figure, the image module semi-finished product 24 is placed in a mold 6 that has been designed, and then a filler 30 is provided to the integrated circuit and circuit in the mold 60. , the button 30 can ride water, so that (four) mold 60 · 2 dragon circuit components 1G and printed board 2G. Gas row And circles - = an image forming module 27 and the body, and finally the mold 60 is separated from the image pull group 27, forming an embedded lens module 1 ,. In addition, the product of the invention 200803450 body circuit component ίο can be an image component or an image wafer.
利用本發明嵌入式相機鏡頭模組i，所實行之嵌入式 相機鏡頭模組製造方法，係包含··提供一印刷電路板20， 該印刷電路板20之第一表面23具有第一電氣接點，該 印刷電路板20之第二表面22形成第二電氣接點28之佈 局，且該第一電氣接點連通該第二電氡接點28 ;提供_ 積體電路兀件ίο，將謗積體電路元件1〇之接腳21 連接於該印刷電路板20第—表面23之第一電氣乳 ，該印刷電路板2G-邊以上之邊緣向該第— 料 折，俾藉該第二電氣接點28形成一 23 % 30至該模具6〇内之積體電路元件 ， Π20之間，以將該模具6〇内積體電路元件電 電路板2G間之氣_出並界定及形絲 ，ς印刷 2充7埴to鏡頭座4〇置於該喪入式影像模組I， 充填物30將該鏡頭座40與該嵌入式與傻# 错讀 及卸除該模具60，以开二=式衫像极組27結合 太八脱二 成該肷入式相機鏡頭模組〗， 本發月肷入式相機鏡頭模組製造方 。 軟性質材之印刷電路板2G，其優 先提供〜 且可以彎折，該_路板μ 硬電路板薄 表面22,該第一表面23且1^表面23及第 雷踗缸on — 具有弟—電氣接點21，誇c 電路板20之弟二表面22形成第二電氣接 该印刷 且該第—電氣接點21連通該第二雷_垃‘，"28之佈局， 一積1#雷效—立 電氣接點28。接基也 積體電路兀件10,將該積體電路元件 赉者鈇供 接於該印刷電路板20第一 表面接：電氣連 €乳接點2ι · 12 200803450 將該印刷電路板20 一邊 折，俾藉該第二電氣接母 邊緣向該第一表面23彎 成品24,將上狀騎模觸之影像模组半 設計之模具60中，接著提/—成二气入-形體已經過 及形成嵌人式影像·27,1黏排出並界定出The embedded camera lens module manufacturing method implemented by the embedded camera lens module i of the present invention comprises: providing a printed circuit board 20, the first surface 23 of the printed circuit board 20 having a first electrical contact The second surface 22 of the printed circuit board 20 forms a layout of the second electrical contact 28, and the first electrical contact is connected to the second electrical contact 28; providing _ integrated circuit components ίο, hoarding The pin 21 of the body circuit component 1 is connected to the first electric milk of the first surface 23 of the printed circuit board 20, and the edge of the printed circuit board 2G-side is folded toward the first material, and the second electrical connection is taken Point 28 forms a 23% 30 to the integrated circuit component in the mold 6〇, between the turns 20, to define and shape the air between the integrated circuit component circuit 2G of the mold 6〇, and print 2 charging 7埴to lens holder 4〇 is placed in the mourning image module I, the filling 30 misreads and unloads the lens holder 40 and the embedded and silly # mold 60 to open the second = shirt Like the pole group 27 combined too eight off two into the intrusive camera lens module〗, this month intrusive camera lens Manufacturing group. A flexible printed circuit board 2G, which is preferably provided and can be bent, the _ road board μ hard circuit board thin surface 22, the first surface 23 and the surface 23 and the thunder cylinder on - have a brother - The electrical contact 21, the second surface 22 of the circuit board 20 forms a second electrical connection to the printing and the first electrical contact 21 communicates with the second Ray_la', "28 layout, a product 1#雷Effect - vertical electrical contact 28. The base is also integrated with the circuit component 10, and the integrated circuit component is connected to the first surface of the printed circuit board 20. The electrical connection is connected to the female contact point 2ι · 12 200803450. And bending the finished product 24 toward the first surface 23 by the edge of the second electrical connector, and touching the upper mold to the half of the mold 60 of the image module, and then lifting the two-into-shaped body has passed Forming an inset image · 27, 1 stick out and define
觸之第二觀接點28蔽^不可將該側面接 砗，蔣昝π — 可木遮蚊且在黏膠30尚未固仆 鏡^座4G置於誠人式影像模組27上，ίΞί 座40與職入式影像模組27結合^ L ’，最後待黏膠固化後將模* 60與該辦 入式相機鏡頭模★且1，公雜廿艘、 肷 40中即刀離並將鏡頭組50裝置入鏡頭座Touch the second point of contact 28 to cover ^ can not be connected to the side, Jiang 昝 π - can be wood-covered mosquitoes and in the adhesive 30 is not yet solid servant mirror 4G placed on the Chengren image module 27, Ξ Ξ 40 seat 40 Combined with the occupational image module 27 ^ L ', finally, after the adhesive is cured, the mold * 60 and the camera lens of the camera type are ★ and 1, the public chowder, the 肷 40 is the knife and the lens group 50 device into the lens mount
疋成如弟—E及第二F圖所示，值得一提H 代了 |人式鏡頭模組中影像元件及電路板ί之 玉間，此外亦界定了嵌入式鏡頭模組的形 縮小相機鏡頭模組的高度之功效。 達到 ㈣=閱第三圖，係顯示本發明嵌入式相機鏡頭模組 之另一實施例，其結構與第一 A圖大致相同，其不同之 處在於連接之接腳21係由積體電路元件1〇上表面引 至電路板20，可達到進一步降低其高度之功效。由於此 貝施例其餘構件與第一 A圖大致相同，故在此不再贅述。 以上所述僅為本發明之實施例而已，並非用以限定 本發明之申請專利範圍；凡其它未脫離本發明所揭 精神下所完成之等效改變或修飾，均應包含在 請專利範圍内。 Ψ 13 200803450 【圖式簡單說明】 第一 A係顯示本發明第一實施例之相機鏡頭模組 衫像模組半成品之立體圖。 =B圖係顯示本發明第一實施例之相機鏡頭模会且 之衫像模組之立體圖。 、、 之旦/ f f係顯示本發明第—實施例之相機鏡頭模組 之Ί她與料錄合之剖面圖。 之剖^ D ^係顯林發明第—實施例之相機鏡頭模組 弟^一 E圖， 之立體圖。恭·、、、員不本發明第一實施例之相機鏡頭模組 弟—A圖4奉為s -丄心 頭槿顯不本發明第二實施例之嵌入式相機鏡 碩像元件與電路板結合示意圖。 弟Β圖^{系為s - 頭模組之旦彡符:·、、、員不本發明第二實施例之喪入式相機鏡 、一 ^異敏半成品之立體圖。 弟-C圖- 頭模纟且之马德^顯示本發明第二實施例之嵌入式相機鏡 、二，&像^且之立體圖。 弟—D圖係—丄 頭模組之影傻h、項示本發明第二實施例之嵌入式相機鏡 楚一 π果級與鏡頭座結合之剖面圖。 ^τ9 —Ε 圖係 g 一 頭模組之剖面圖、項示本發明第二實施例之嵌入式相機鏡 弟—F圖a 一 頭模組之立體圖、·、属示本發明第二實施例之嵌入式相機鏡 第 圖係_ ^ …、不本發明嵌入式相機鏡頭模組之影像模 200803450 組半成品之另一實施例之立體圖。 第四圖係習知相機模組剖面示意圖。 【主要元件符號說明】 1 —^目機鏡頭模組 1 ’ 一-欲入式相機鏡頭模組 10…積體電路元件 20—印刷電路板 21 ^接腳 22- --第二表面 23- --弟一表面 24- --影像模組半成品 25- 硬質印刷電路板 26- 黏膠 27…影像模組 28—第二電氣接點 30-·-充填物 40…鏡頭座 41 —習知鏡頭座 50…鏡頭組 60…模具 15疋成如弟-E and the second F picture, it is worth mentioning the H generation | the human lens module in the image components and the circuit board ί jade, in addition to the embedded lens module shape reduction camera The height of the lens module.达(4)=Reading the third figure, another embodiment of the embedded camera lens module of the present invention is shown, the structure of which is substantially the same as that of the first A picture, except that the connecting pin 21 is composed of integrated circuit components. The upper surface is led to the circuit board 20, and the effect of further reducing the height can be achieved. Since the remaining components of this embodiment are substantially the same as those of the first A diagram, they will not be described herein. The above description is only for the embodiments of the present invention, and is not intended to limit the scope of the claims of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the invention should be included in the scope of the patent. . Ψ 13 200803450 [Simplified description of the drawings] The first A series shows a perspective view of a semi-finished product of the camera lens module of the first embodiment of the present invention. The Fig. B shows a perspective view of the camera lens module of the first embodiment of the present invention. And, dandan/f f is a cross-sectional view showing the camera lens module of the first embodiment of the present invention and the material recording. The cross-section of the camera lens module of the first embodiment of the invention is shown in the figure. Christine, and others do not use the camera lens module of the first embodiment of the present invention. FIG. 4 is a s-丄 丄 槿 槿 槿 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式 嵌入式schematic diagram. The figure ^ is the s - head module : 彡::,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The syllabary-C diagram - the head module and the madness of the head are shown in the perspective view of the second embodiment of the present invention. The D-picture system is the shadow of the head module. The item is shown in the second embodiment of the present invention. The embedded camera lens of the second embodiment of the present invention is a cross-sectional view of the combination of the π fruit level and the lens holder. ^τ9 - Ε Figure g is a cross-sectional view of a module, showing a perspective view of a second embodiment of the embedded camera lens of the second embodiment of the present invention, and a second embodiment of the present invention The camera lens is a perspective view of another embodiment of the semi-finished product of the image mode 200803450 of the embedded camera lens module of the present invention. The fourth figure is a schematic cross-sectional view of a conventional camera module. [Main component symbol description] 1 -^Machine lens module 1 'One-in-the-lens camera lens module 10...Integrated circuit component 20-printed circuit board 21^pin 22--second surface 23- - brother one surface 24 - - image module semi-finished product 25 - hard printed circuit board 26 - adhesive 27 ... image module 28 - second electrical contact 30 - · - filling 40 ... lens mount 41 - conventional lens mount 50...lens group 60...mold 15