M321606 八、新型說明： 【新型所屬之技術領域】 本創作涉及-種SIM卡連接器，尤其是指—種以聚㈣膜貼片 取代絕緣本體的超薄型幻Μ卡連接器。 、 【先前技術】M321606 VIII. New Description: [New Technology Field] This creation involves a SIM card connector, especially an ultra-thin illusion card connector that replaces the insulating body with a poly (tetra) film patch. [Prior Art]
隨著科技的不斷進步，人們的日常生活水準的不斷提高，人們 對各種電子設#的_縣是朝㈣則、發展；產品 小’那麼對於其所使用的零件也會要求越來越小，尤其是日=活 中使用最多的移動電話，外觀造型更是以輕薄小為訴求，其内部使 用的SIM卡連接ϋ結構就必須配合外觀的需求，結構須越來越輕 薄。目前市面上所使用的SIM卡連接器一般都是由絕緣本體及接觸 端子成’耻結構都是由各料餘料成的成品，时慮到絕緣 本體的成财為了__軒與絕緣本體之間奸涉力等一系 列的因素，絕緣本體的高度都會設計得比較厚，使得成品的整體厚 度皆有一定的厚度。 為了減少SIM卡連接器愧緣本體所佔的厚度空間，有採用嵌 射成型(InsertMdding)的方式生產，但此法的厚度仍然存在一定的人 厚度’保持在0.5mm左右，仍佔據手機内部相當的空間。所以一般 由絕緣本體和接觸端子成的SIM卡連接器無法_超薄親構，來 滿足㈣短小產品的設計f求，故圖卡連接器結構有進—步改進 的必要。 【新型内容】 5 M321606 為了克服了現有技術中的不足，本創作的主要目的在於提供了 薄型SIM卡連接器，該SIM卡連接器的結絲將接觸端子 固定於上下層聚㈣膜貼片之間，如此將可降低連接器的厚度。 本創作的另—目的在於提供了-種超薄型SIM卡連接器，該 SIM卡連接n的結構是將接觸端子固定於上下層聚㈣膜貼片之 間’可以簡化製造過程’顿開製模具，以降低生產成本。 …為了實現上述的目的，本創作可以通過以下的技術方案加以實 β „亥超;|型SIM卡連接器、的結構是由麵馳貼片和接觸端子 成·’其是將接觸端子黏貼於附有黏性的聚酉旨薄膜貼片上，以達到定 ==聚酿薄膜貼片上設置與接觸端子的接觸部份及焊腳部份相 對:、空槽，然後將接觸端子的各部位與聚醋薄膜貼片上的空槽相 合來固定^觸囉構的聚醋薄膜貼片，利用兩層聚醋薄膜貼片的黏 酉旨薄膜貼片上=’、而接觸端子的接觸部份與焊腳部份都裸露在聚 層的，盘SIM + 成型好的空槽中’接觸部份伸出聚酿薄膜貼片上 W 聚酯_貼片下層的空槽中 ”私&進仃焊接，而達成使用狀態。 ，二創作不採用絕緣本趙固定，且因聚醋薄膜貼片的厚度报 度。王固連接器的厚度只有兩層聚酷薄膜貼片加接觸端子的厚 相車父於以前的技術，本 薄膜貼片結構，使整體厚声^乍▲下優點：本創作利用簡單的 體尽度’·且無需歸本體，節省了料件成 6 M321606 本及模具費用；為目前結構最簡單，厚度最薄的圖卡連接哭。 為了使本創作的創作目的和結構特徵能進一步讓熟悉此項技 藝的人員明白，將配合所附圖式，以—具體實施例對本創 一步的說明。 進 【實施方式】 請參閱第！圖所示，為本創作超薄型咖卡連接器的一具體每 施例；該SIM卡連接器是由上層聚轉膜貼片1()、接觸端子^ 下層聚酯薄膜貼片30組成。 上、下層聚醋薄膜貼片10、3〇為薄片式的聚酉旨薄膜，皆包括 有一頂面11，32、一底面1231、垃鑣加 ，接觸部空槽13,33以及焊腳部而柚 ㈣。該等__ 1G、3G上所開設的接觸部钱助^ 知腳I槽14,34均與接觸端子2()的接觸部2卜焊腳μ相配合· 在上層聚㈣膜貼片1G的底面12與下層__ ° ’ 32塗佈了有一層黏膠。 貝曲 觸端子20疋由金屬板衝製成型，在料㈣的前端部位連接 著接觸^_转22，此峡部22為—平板赋，袖定 ^立 3，固疋部22的前端成型有接觸部 此接觸部21呈-彈片狀，前端為-弧形結構。 本創作的組裝方式為：首先將接觸端子如連同定位 -起黏貼在下層聚吻貼片3G上，使接觸端子㈣下表面= 層聚酉曰_片30的頂面32結合，此時接觸端子％的接觸⑽ 與下_缚膜貼片30的接觸部空槽％對齊，接觸端子加的焊 7 M321606 腳23則與下層聚醋薄膜貼片3〇的焊腳空位％對齊；然後，再將 上層聚醋薄膜貼片10黏貼於接觸端子2〇的上表面上，接觸端子如 上的接觸。卩21通過上層聚g旨薄膜貼片1()的接觸部空槽η伸出上 層聚醋薄膜貼片1〇的頂面11，接觸端子20的焊腳23則與上層聚 酉旨薄膜貼片30的焊腳空位14對齊；待其相互貼合牢固後，最後再 去除其料帶24。㈣上層糊_#1()訂_薄膜貼片％ =個具有黏性的表面對黏在一起，將接觸端子20夾在中間並固 疋牢固’即可完成超薄型SIM卡連接器(如第3圖所示）。 依上述製程所得的超薄型_卡連接器，其接觸端子如的接 =21伸出上層聚S旨薄膜貼片ω的頂面u，以便與壞卡接觸； d腳23則稞露於下層聚醋薄膜貼片3〇的焊腳空槽对，以方 便與電路板焊接(如第2圖所示）。 下兩=圖所示，為本創作的第二實施例，咖 3〇 為—塊大的下層編膜貼片 …κ醋溥膜貼片30上同樣設有接觸部空㈣及焊腳空槽 34，/、不過數量是前實施 , 「層♦酉曰潯Μ貼片的總和；此時， 將接觸^子20 _於雜性的 v 卸32接觸端子20的接觸部21 及知腳23分別與聚酯薄膜貼片3 #34#+^ 側的接觸部空槽33及焊腳空 才曰34對”，然後再將聚酯 端子2()^主 巧的另一邊折彎過來貼合於接觸 鸲子2〇的上表面，接觸端子2 貼片m m W要觸口P 21通過黏貼聚醋薄膜 、占片30上層的接觸部空槽33 __片3〇_n34fir^20的焊腳23則與下 子a ’伸出於聚酯薄膜貼片3〇 、M321606 下層的底面3卜待聚醋薄膜貼片3〇相互黏合好後即完成本實施例 的起薄型SIM卡連接器(如第5圖所示）。 如第6 ®所示’為本翁的第三實施例，其包括有兩塊上層聚 酯薄膜貼片10 ’兩塊下層聚醋薄膜貼片3〇及兩個接觸端子t其 結構與第-實施例相同，其最大的特點在於，其可以將每個接觸端 . 子20與一個上層聚醋薄膜貼片10及-個下層聚酯薄膜貼片30組 成-個早獨的連接器’因此可以隨意的調出所需要的兩個獨立的連 • 接器之間的距離，組裝也比有兩個接觸端子簡單了很多，方便了客 戶，也大大的提高了產品的靈活性。 由上述的說明可知，本創作採用新的結構設計，更利用聚醋薄 膜貼片的特性，以聚㈣膜貼片取代絕緣本體，僅需預先將聚醋薄 膜貼片的尺寸規格製好’ 聚酯薄醜片上黏膠的特性，把接觸 端子定置於所設定的位置，讀層黏合的方式將接觸端子固定，即 可完成-超薄型觀卡連接器；本創作在製造上相當簡易，且可大 ^ 量降低成本支出。 本創作所舉的實施例及附圖，僅供做對本創作加以說明，在於 使熟悉該徽術者能如實瞭解本創作之目的與功效，但並不對本創 作加以任何條，本創作還尚可有其他雜化實施方式，所以凡熟 悉此項技術者在不脫離本案創作精神下進行其他樣式實施，均應視 為本案申請專利範圍的等效實施。 【圖式簡單說明】 第1圖為習知技術立體分解透視圖； 9 M321606 第2圖為本創作具體實施例之立體分解圖； 第3圖為本創作具體實施例之後蓋的立體圖； 第4圖為本創作具體實施例之底視圖； 第5圖為本創作具體實施例之立體組合圖；及 第6圖為本創作具體實施例之立體組合圖的後視圖。 【主要元件符號說明】 100 SIM卡連接器 10—上層聚酯薄膜貼片 11，32—頂面 12,31 —底面 13,33—接觸部空槽 14,34—焊腳空槽 20接觸端子 21—接觸部 22 —固定部 23—焊腳 24—料帶 30—下層聚酯薄膜貼片 10With the continuous advancement of science and technology, people's daily life standards continue to improve. People's _ county for various electronic devices is developing (four), and the products are small, so the parts used for them will be smaller and smaller. In particular, the mobile phone that is most used in the day = the appearance is more light and small, and the internal structure of the SIM card connection structure must match the appearance of the structure, and the structure must be thinner and lighter. At present, the SIM card connectors used in the market generally consist of an insulating body and a contact terminal, and the shame structure is a finished product made of various materials. When considering the wealth of the insulating body, it is for the __xuan and the insulating body. A series of factors, such as the involvement of the rape, the height of the insulating body will be designed to be thicker, so that the overall thickness of the finished product has a certain thickness. In order to reduce the thickness space occupied by the edge of the SIM card connector, there is a method of insert molding (InsertMdding), but the thickness of this method still has a certain thickness, which is kept at about 0.5 mm, still occupies the inside of the mobile phone. Space. Therefore, the SIM card connector formed by the insulating body and the contact terminal cannot be ultra-thin, and the design of the short product is satisfied, so that the structure of the card connector has the necessity of further improvement. [New content] 5 M321606 In order to overcome the deficiencies in the prior art, the main purpose of the present invention is to provide a thin SIM card connector, the wire of the SIM card connector is fixed to the upper and lower layer poly (four) film patch This will reduce the thickness of the connector. Another object of the present invention is to provide an ultra-thin SIM card connector. The structure of the SIM card connection n is to fix the contact terminals between the upper and lower layer (four) film patches, which can simplify the manufacturing process. Mold to reduce production costs. ...in order to achieve the above purpose, the present invention can be realized by the following technical solutions: the type of SIM card connector, the structure is formed by the surface mount patch and the contact terminal, which is to stick the contact terminal to Attached to the viscous polysilicon film patch to achieve the setting == the glazed film patch is placed on the contact portion of the contact terminal and the solderet portion: the empty groove, and then the parts of the contact terminal The polyacetal film patch is fixed with the vacant groove on the polyester film patch, and the contact portion of the contact terminal is replaced by the adhesive film of the two-layer polyester film patch. The part of the soldering leg is exposed in the poly layer, and the contact part of the SIM + formed cavity is extended in the empty groove of the lower layer of the polyester film _ patch. Soldering and reaching the state of use. The second creation is not fixed by the insulation, and the thickness of the polyester film is reported. The thickness of the Wanggu connector is only two layers of cool film patch plus the contact terminal thick phase of the father in the previous technology, the film patch structure, making the overall thick sound ^ ▲ ▲ advantages: this creation uses a simple body '·Without the need to return to the body, saving the material into 6 M321606 and mold costs; for the current structure is the simplest, the thinnest picture card connection cry. In order to further clarify the creative purpose and structural features of the present invention, those skilled in the art will appreciate that the present invention will be described in detail with reference to the accompanying drawings. [Embodiment] Please refer to the first! The figure shows a specific embodiment of the ultra-thin coffee card connector of the present invention; the SIM card connector is composed of an upper layer transfer film patch 1 (), a contact terminal ^ lower layer polyester film patch 30. The upper and lower layers of the polyester film patch 10, 3 are a sheet-type polyfilm, each of which comprises a top surface 11, 32, a bottom surface 1231, a ridge, a contact groove 13, 33 and a solder joint. Pomelo (four). The contact parts of the __1G, 3G, and the I-slots 14, 34 are all matched with the contact portion 2 of the contact terminal 2 () with the soldering foot μ. In the upper layer (4) film patch 1G The bottom surface 12 and the lower layer __ ° '32 are coated with a layer of glue. The bell-shaped contact terminal 20疋 is made of a metal plate, and the contact portion is connected to the front end portion of the material (4). The isthmus portion 22 is a flat plate, the sleeve is fixed, and the front end of the solid portion 22 is formed. Contact portion This contact portion 21 has a - elastic shape and a front end has an arc-shaped structure. The assembly method of the present invention is as follows: firstly, the contact terminal is adhered to the lower layer kiss patch 3G together with the positioning-position, so that the lower surface of the contact terminal (4) = the top surface 32 of the layer gathers the sheet 30, and the contact terminal is assembled at this time. The % contact (10) is aligned with the contact groove of the lower-bond film patch 30, and the soldering of the contact terminal 7 M321606 pin 23 is aligned with the solder fillet % of the lower layer of the polyester film patch 3; The upper polyester film patch 10 is adhered to the upper surface of the contact terminal 2, and the contact terminal is in contact with the above. The top surface 11 of the upper layer of the polyester film patch 1 is extended by the contact groove η of the upper layer of the film patch 1 (), and the solder tail 23 of the contact terminal 20 is bonded to the upper layer of the film. The solder fillet spaces 14 of 30 are aligned; after they are adhered to each other, the strips 24 are finally removed. (4) Upper layer paste _#1 () order _ film patch % = a sticky surface pair is stuck together, the contact terminal 20 is sandwiched in the middle and firmly fixed 'to complete the ultra-thin SIM card connector (such as Figure 3). According to the above process, the ultra-thin card connector has a contact terminal such as a connection 21 extending from the top surface u of the upper layer of the film patch ω to contact the bad card; and the d-foot 23 is exposed on the lower layer. Polyester film patch 3〇 solder fillet pair to facilitate soldering to the board (as shown in Figure 2). The next two = the figure shows that, in the second embodiment of the present invention, the coffee cake is a large under-layer film patch... The κ vinegar film patch 30 is also provided with a contact portion (4) and a solder fillet slot. 34, /, but the number is the pre-implementation, "the sum of the layers 酉曰浔Μ 酉曰浔Μ patch; at this time, the contact portion 20 _ the heterojunous v unloading 32 contact terminal 20 contact portion 21 and the leg 23 respectively And the polyester film patch 3 #34#+^ side contact groove 33 and the solder fillet empty 34 pairs", and then the other side of the polyester terminal 2 () ^ is bent and attached to Contact the upper surface of the tweezers 2〇, contact terminal 2 patch mm W to contact the port P 21 by bonding the polyester film, the contact portion of the upper layer 30 of the sheet 30 __ 3 3 _n34fir ^ 20 soldering feet 23 Then, the thin-type SIM card connector of the present embodiment is completed after the lower sub-a' protrudes from the polyester film patch 3, the bottom surface of the lower layer of the M321606, and the polyacetal film patch 3 is adhered to each other. Figure shows). As shown in Fig. 6 'the third embodiment of the present invention, which comprises two upper polyester film patches 10', two lower polyester film patches 3 〇 and two contact terminals t, the structure and the first The same as the embodiment, the biggest feature is that it can form each contact end. The sub-20 is composed of an upper polyester film patch 10 and an underlying polyester film patch 30 - an early connector - so Randomly recalling the distance between the two independent connectors required, the assembly is also much simpler than having two contact terminals, which is convenient for the customer and greatly increases the flexibility of the product. It can be seen from the above description that the creation adopts a new structural design, and further utilizes the characteristics of the polyester film patch to replace the insulating body with the poly (tetra) film patch, and only needs to prepare the size specifications of the polyester film patch in advance. The characteristics of the adhesive on the thin film of the ester, the contact terminal is placed at the set position, and the contact layer is fixed by the read layer bonding, which can be completed - the ultra-thin view card connector; the creation is quite simple in manufacturing, and Can reduce costs and expenses. The embodiments and drawings of the present invention are only for explaining the creation of the present invention, so that the person familiar with the emblem can understand the purpose and effect of the creation truthfully, but does not add any article to the creation, and the creation is still acceptable. There are other hybrid implementation methods, so those who are familiar with this technology will not be divorced from the spirit of the case to carry out other styles of implementation, should be regarded as the equivalent implementation of the patent application scope of this case. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded perspective view of a conventional technique; 9 M321606 FIG. 2 is an exploded perspective view of a specific embodiment of the present invention; FIG. 3 is a perspective view of a cover after the specific embodiment of the present invention; Figure 5 is a bottom view of a specific embodiment of the present invention; Figure 5 is a perspective view of a three-dimensional combination of the specific embodiments of the present invention; and Figure 6 is a rear view of the three-dimensional combination of the specific embodiment of the present invention. [Main component symbol description] 100 SIM card connector 10 - upper polyester film patch 11, 32 - top surface 12, 31 - bottom surface 13, 33 - contact recess 14, 34 - solder fillet 20 contact terminal 21 - Contact portion 22 - Fixing portion 23 - Solder foot 24 - Tape 30 - Lower polyester film patch 10