TWM321590U - Miniaturized balanced filter - Google Patents

Description

M321590 VIII. New Description: [New Technology Area] This creation is to provide a miniaturized balanced unbalanced impedance conversion bandpass filter, especially for the reduction with multi-layer technology, including the use of low temperature co-fired ceramic technology. Balanced unbalanced impedance-switching band-pass filter can be fabricated into a surface-adhesive mode; this new type of balanced unbalanced impedance converter, which is traditionally required to use separate components, is integrated with band-pass filter and wave n into a single-element, and the size is also From the traditional 2·5χ2·〇驰 to a large reduction of 1. 6x0·8, not only the area is reduced, but also the manufacturing cost is reduced. [Prior Art] Today's integrated circuit (1C) input and output shirts use balanced or differential mode design to reduce noise interference and improve system characteristics, but some components _ people and lose (four) is difficult The single ended design, and therefore the components to be connected to this _ input residual peak meter must be balanced - the end of the balanced design, the other end of the unbalanced design of the impedance conversion component. In addition, in order to comply with the radio wave radiation specification of the communication system and improve the sensitive sound of the system, a filter (filter) is often connected in the communication module, and the chopper and the impedance ^ change the piece become a _ important _ key component; With the trend of high-speed addition and module reduction, there is no such thing as a little empty = so the 'integration of the Wei-transfer impedance component becomes [material; the balance impedance conversion band will solve the space.] Hengfei+balance is 2. 5x2· 0mm 'The circuit design size adopted by this new model is only H0. The balanced unbalanced impedance conversion bandpass chopper designed by the prior art has a size of 8mm and the area M321590 is about four points. -, non-f is suitable for Lin now shrinking the model. Therefore, the first technical summary has the following disadvantages: 1. The wave filter of the prior art does not integrate the impedance conversion component, so that the balanced or differential integrated circuit (ic) can not be used with the input and output terminals. 2. The filter and wave filter in the communication module of the prior art are separated from the series impedance conversion components, which cannot meet the trend of increasing the high-speed signal line and the downsizing of the module, and cannot solve the problem of insufficient space. 3. The balance of Xi Zhilin is not normal. It is too large in size and is not suitable for use in today's reduced communication modules. In view of this, how to eliminate the above-mentioned deficiencies, that is, the technical difficulties that the creators of this case want to solve, is that the creator of this case is improving and innovating, and after years of painstaking research, finally Successfully developed and completed the creation of this case. 0 [New content] The purpose of this creation is to provide a miniature balanced unbalanced impedance conversion bandpass ship for this creation, especially for the technology with fine multilayering, including the use of The materialized balanced non-Pinna anti-conversion bandpass filter made by Singer Lin can be made into a surface adhesion method. The other purpose of this creation is to integrate the balanced non-equilibrium impedance conversion H scale_wave device that is traditionally required to use separate components into a single-element, and the size is also greatly reduced from the conventional 2·5x2·Gmm to I _, Not only is the area reduced, but the manufacturing cost is also reduced. The purpose of this creation is to: use the electric _ board integrated ship and the impedance to M321590 η as the first to reduce the components, the end of the wheel and the input uses the unbalanced output and the output time balance material, the whole The size is used as the wire turning method, which has a small amount of product and convenient use of noise, and is not included in the current communication module. The technical injection case is a small-balanced balanced non-equilibrium impedance conversion band-pass filter. It has a plurality of layers and structures, which are sequentially arranged from top to bottom: a top electrode is printed on the first dielectric substrate by a metal mesh. There are a total of eight:: upper surface electrodes distributed around the first dielectric layer substrate, formed by a terminal electrode fabrication process; a first-capacitor layer 'printed by a metal mesh on the second dielectric layer substrate, a total of three metal 'Each piece of metal is connected to the external terminal electrode by a terminal electrode fabrication procedure'. The intermediate metal end is electrically connected to the first ground layer via the through hole; a first ground layer is printed by the metal mesh on the third dielectric layer On the substrate, there are a plurality of metal and a through hole, and the metal end is connected to the external terminal electrode through a terminal electrode manufacturing process, and the through hole is electrically connected to the first capacitor layer and the first inductor layer; a first inductive layer, The metal mesh is printed on the fourth dielectric layer substrate, and there are two metal coils, one end of each metal coil is electrically connected to the second inductor layer via the through hole, and the second inductor layer is printed by the metal mesh on the fifth layer. There are 4 metal coils on the substrate. The end of each metal coil is electrically connected to the _inductive layer via the through hole. The other end is also electrically connected to the first inductor layer and the second capacitor layer through the through hole. The second capacitor layer is printed by the metal mesh. On the six dielectric layer substrate, there are two metal and four through holes, one end of each metal is connected to the outer two end electrodes through a terminal electrode making process, and the through holes are electrically connected to the second inductor layer and the third capacitor layer; M321590 - The third capacitor layer is printed on the seventh dielectric layer substrate by a metal mesh. There are two metal and four through holes. Each metal end is fabricated by a terminal electrode and the external electrode of the disk is connected. The second capacitor layer and the fourth capacitor layer are electrically connected; the fourth capacitor layer is printed on the eighth dielectric layer substrate by a metal mesh, and a total of two metal and two through holes are electrically connected to the third capacitor layer; The second ground layer is printed on the ninth (four) substrate by a metal mesh, and is commonly connected to the external terminal electrode by a metal piece: a metal end-end end preparation process; a third electric button is printed on the metal mesh On the substrate, there are == 2 through holes, and one end of the metal coil passes through And the fourth inductor layer, the inductor layer, is printed on the tenth dielectric layer substrate by a metal mesh, and has two strips and two through holes 'metal lines _-ends through the through holes and minus==峨(four)-side The wheel (4) program and the lining of the grounding layer ' _ screen printed on the twelfth dielectric layer substrate, a total of one - external electricity: (four) electrode fabrication procedure and connected to the external terminal electrode; [Embodiment] M321590 for the examiner Convenient and simple to understand the characteristics of the creation of the content and advantages of the creation and the effect achieved can be more obvious, and then this creation is to achieve its creative purpose ^ overall structure on the SX 3 10, with the drawings and examples, for further details The description is as follows. First, please refer to the first figure, which is a schematic diagram of the creation of this creation. The creation of this kind of mini-balanced unbalanced impedance conversion with occupational wave machine is based on the use of multi-layer technology, including but not limited to the use of low temperature. The micro-balanced unbalanced impedance-switching band-pass filter produced by the ceramic technology can be made into a surface-adhesive method. # The miniaturized balanced unbalanced impedance conversion bandpass filter 100 is a multi-media layer substrate body whose internal metal passes through the terminal and the external terminal electrodes 101, 1〇2, 103, 1〇5, 1〇6, 1〇7,1〇8 are connected, the above-mentioned terminal electrode can be used as the input/transmission grounding of the wave H after the general electric forging procedure, the _ terminal electrode (10) is the unbalanced input mountain input end, and the one end electrode 101 and One end electrode 1〇3 is a balanced output/input terminal, and the terminal electrode 105 is used as a DC voltage input end. The internal electrode is connected via an internal connection. This voltage can output the terminal electrode 1G1 and the terminal electrode (10) of the output/input terminal. 〇2 and Lu electrode and terminal electrode 108 are used for grounding, one end electrode is not connected in the application-2 peripheral circuit (10), ncDt fiber (6), and the mark (10) can be used as the foot, the luxury use 'The ^S own (10) The shape is not limited to the moment opening, and may be circular. The size of the overall encoder 100 is 1.6 mm in length and 8 mm in width. Referring to the first to fifth figures, the first to fourth medium diagrams of the present invention are shown in the internal structure diagram, and the fifth to the first dielectric layer substrate internal structure is schematically shown & nine to twelfth dielectric layers. The domain structure of the substrate is fine and the base of the thirteenth dielectric layer, the 働, - 妨 赫 赫 赫 赫 赫 赫 赫 赫 赫 赫 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺 贺The metal mesh is printed on the surface of the first dielectric layer: :^2H, distributed around the substrate of the first dielectric layer, and formed by an electric program; a first-capacitor layer is printed on the second dielectric layer substrate by a metal mesh. The upper and the mounds have three pieces of 'metal'-end-end electrode fabrication procedure and are connected to the external terminal electrode'. The intermediate metal-end is connected to the first ground layer 2 through the through-hole 204A; > _ The first ground layer 201C is printed on the third dielectric layer substrate by a metal mesh, and has a metal plate and a through hole 204B. One end of the metal is connected to the external terminal electrode through the terminal electrode fabrication process, and the through hole 2G4B and the first capacitor are connected. Layer 2 (10), first; 201D electrically connected; 曰 first-inductive layer 201D 'by gold The screen is printed on the fourth dielectric layer substrate, and has two metal coils. One end of the mother metal coil is electrically connected to the second inductor layer 2〇1E via the through hole, the other poles, 206A, 207A, and 208A; Li, printed by a metal mesh on the fifth substrate, has a total of four metal coils, one end of the mother metal coil is electrically connected to the first inductor layer 201D via the through holes, 2〇6b, 207B, 208B, and the other end is also The through holes 209A, 210A, 211A, and 212A are electrically connected to the first inductive layer 2〇id and the second capacitor layer 2〇if; a second capacitor layer 201F is printed on the sixth dielectric layer substrate by a metal mesh, and has two pieces. Metal and four through holes 209B, 210B, 211B, and 212B, one end of each metal is connected to the external terminal electrode through a terminal electrode fabrication process, and the through holes 2〇9β, 2i〇b, 211B, 212B and the second inductance layer 201E The third capacitor layer 2〇lG is electrically connected; M321590. The second grid layer 201G′ is printed on the seventh dielectric layer substrate by a metal mesh, and has a total of 2 1 metal and 4 through holes 2〇9C, 210C, 211C, 212C , each piece of metal, one end of the red end electrode is programmed to be connected to the external end electrode, the through hole 209C 210C, 11C 212C are electrically connected to the second capacitor layer 201F and the fourth capacitor layer 201H; a fourth capacitor layer 201H is printed on the eighth dielectric layer substrate by a metal mesh, and has two metal and two through holes. 9D, 210D, the through holes 209D, 210D are electrically connected to the [!] capacitor layer 201G;

The φ 帛-ground layer 2G1I is printed on the ninth dielectric layer substrate by a metal mesh, and one end of the J metal metal is connected to the external terminal electrode through a terminal electrode fabrication process; a second inductance layer 2G1J is printed by the metal mesh On the tenth dielectric layer substrate, there are a plurality of metal coils and two through holes 213A and 214A, and a hetero-hole 213A, 214A of the metal coil is electrically connected to the fourth inductive layer 2〇ικ; - a fourth inductive layer 2G1K ' The metal mesh is printed on the tenth dielectric layer substrate, and two metal coils and two through holes 213B are formed. One end of the difficult metal coil is electrically connected to the third inductor layer 201J via the through holes 213B and 214B. The other end is connected to the external terminal electrode via a terminal electrode fabrication process; - the second ground layer 201L is printed on the twelfth dielectric layer substrate by a metal mesh, and has one metal, one end of the metal is fabricated by the terminal electrode and externally The terminal electrode is connected; the outer electrode layer 2G1M is printed on the lower surface of the thirteenth dielectric layer substrate by a metal mesh, and there are 8 external lower surface electrodes 2〇3A, 203B, 203C, 203D, 203E, 203F, 203G, 203H, distributed In the tenth Around the surface, the end of the production process to form the lower electrode layer dielectric substrate, and connected to the outer upper electrode 2〇1A. Therefore, the structure of the creation is composed of a plurality of dielectric layer substrates 2〇1A, 2〇1B, 2〇lc, 11 M321590.

201D, 201E, 201F, 201G, 201H, 2011, 201J, 201K, 201L, 201M and metal mesh are formed on the dielectric layer substrate, and the dielectric layer substrates 201A and 201M of the outermost layer are respectively the bottom layer of the creation and In the uppermost layer, an external terminal electrode can be formed on the surface thereof through a terminal electrode fabrication process, and the dielectric layer substrate 2 〇 1β of the inner layer

201C, 201D, 201E, 201F, 201G, 201H, 2011, 201J, 201K, and 201L can be printed on the surface of each layer with a metal mesh to become a required capacitor and inductance unit.该[The external terminal electrode, 1〇2, 1〇3, 1〇4, 1〇5, 1〇6, 1〇7, 108 are formed by the external electrode upper layer 2〇1A upper surface electrode 2〇2Α, 2 〇2β, 2〇2c, 202D, 202E, 202F, 202G, 202H and external electrode lower layer 201M are composed of surface electrodes 203A, 203B, 203C, 203D, 203E, 203F, 203G, 203H, wherein an upper surface electrode 2〇 2A and the lower surface electrode 2〇3A constitute one end electrode 1〇4, one upper surface electrode 2〇2B and the lower surface electrode 2〇3B constitute one end electrode 1〇5, one upper surface electrode 202C and − lower surface electrode 203C constitute one end electrode 1〇6, an upper surface electrode 202D and a lower surface electrode 2〇3D constitute a terminal electrode 1〇8, an upper surface electrode 202E and a lower surface electrode 2〇3E constitute an end electrode 1〇3, an upper surface electrode 2〇 2F and the lower surface electrode 203F constitute an end electrode 1〇2, an upper surface electrode 202G and a lower surface electrode 203G constitute an end electrode 101 and an upper surface electrode 2〇2H and a lower surface electrode 203H constitute a terminal electrode ίο?, which constitute the above One of the terminal electrodes is connected together via an external terminal electrode fabrication process.

Moreover, the metal on the substrate of different dielectric layers can be connected by up and down through different vias, and the through-holes can be electrically connected by the through holes 204A and the through holes 204B and the through holes 204C, respectively. The through hole and the through hole are combined to be turned on, the through hole 206A and the through hole 206B are combined to be turned on, the through hole 207A and the through hole 207B are connected, and the port V is connected, the through hole 208A and the through hole 208B are combined to be turned on, the through hole 209A and the through hole are 209B 12 M321590 is combined with the through hole 209C and the through hole 209D, the through hole 210A and the through hole 210B and the through hole 210C are combined with the through hole 210D, the through hole 211A and the through hole 211B and the through hole 211C are combined to be turned on, the through hole 212A and The through hole 212B is combined with the through hole 212C, the through hole 213A and the through hole 213B are combined to be turned on, and the through hole 214A and the through hole 214B are combined to be turned on. Further, the terminal electrode 1 (U, 103) for the balanced output/input terminal is printed on the metal via the first inductor layer 201D, the second inductor layer 201E, the second capacitor layer 201F, and the third capacitor layer 201G of the inner layer. It is connected to the through holes of the following individual compositions, which are through holes 207A and through holes 207B, through holes 208A and through holes 208B, through holes 211A and through holes 211B and through holes 211C, and through holes 212A and through holes 212B. The through hole 212C and the like. The terminal electrode 105 for the DC voltage input terminal is connected to the balanced output through the metal screen printing on the first capacitor layer 201B of the inner layer and the through hole 204A and the through hole 204B and the through hole 204C. / Terminal electrode 1〇1,1〇3 at the input end, the number of dielectric layers required to form the chopper and its dielectric constant are adjusted according to the actual design. Another 'for the unbalanced output/input The second electrode layer 201J of the X-electrode 33 and the metal screen printing on the fourth inductive layer 201 and the through hole 213 and the through hole 213 and the through hole 214 and the through hole 214 are connected to The terminal electrode is 1〇4. Please also refer to the sixth to seventh figures, which is the amplitude and (4) balance diagram of the creation and the original creation. The fresh response and the balance of amplitude and phase angle are not effective in overcoming the problem of reducing noise interference and improving system characteristics. At the same time, it also meets the requirements of communication new wave radiation specifications and improving the sensitivity of the secret. One of the preferred and feasible examples of the creation is that the scope of the patent that is not tn is the same as the one in which the application of the creation specification and the schema is directly or fa1 is connected to other contact areas. Included in the spirit of this creation is Fan _ _ _ _ 13 M321590 In order to highlight the characteristics of this creation, this book is briefly described as follows: 1. The balanced unbalanced impedance conversion bandpass filter of this creation, fusion impedance The conversion component 'can be used with the current integrated circuit (1C) input and output terminals with balanced or differential type "again, ten, effectively overcome the problem of reducing noise interference and improving system characteristics. 2. Balanced unbalanced impedance of this creation The conversion bandpass filter can solve the problem of insufficient space by increasing the speed of the high-speed signal line and reducing the size of the module. 3. The balanced unbalanced impedance conversion bandpass filter of the creation Single reduction, small size is suitable for use in today's reduced communication modules. , , , ', 'T, touch up' extracts in the breakthrough of the previous technology, really want to enhance the Wei, and also know _ (4) The application requirements of the § 利, 纽法提崎财. i seeking [schematic description] The first picture is the appearance of the creation. The second picture of the picture is the first to fourth dielectric layer of the creation Substrate m The third picture is the fifth picture of the fifth to the subsiliary layer substrate of the present invention. The nine figures are: Xie = meaning: The fifth picture is the internal structure of the thirteenth dielectric layer substrate of the present creation, the sixth figure The frequency response diagram of the original creation. The seventh diagram of the intent is the amplitude and phase balance diagram of the creation. [Description of main component symbols] Filter............. 100 14 M321590 Terminal electrode..................1 (U, 102, 103, 104, 105, 106, 107, 108 The words have been.................................... .....................................109

Upper electrode upper layer ............................................... .............201A

Upper surface electrodes 202A, 202B, 202C, 202D, 202E, 202F, 202G, 202H

The first capacitor layer .............................................. .................201B

H................................................. .......................204A

First ground plane.............................................. ...........................201C

Hungry.............. 204B

The first inductor layer .............................................. .................201D

Through hole..............................204C, 205A, 206A, 207A, 208A

Second Inductive Layer.............................................. .................201E

Through hole..........................................205B, 206B , 207B, 208B

Through hole..........................................209A, 210A 211A, 212A

Second capacitor layer.............................................. .................201F

Through hole................................................209B, 210B , 211B, 212B

The third capacitive layer .............................................. ...........................201G

Through hole.............................. 209C, 210C, 211C, 212C

Fourth capacitor layer................................................ .................201H

Through hole................................................ ...............209D, 210D Second ground plane.............................. ...................................2011

The third inductive layer .............................................. .................201J

Through hole................................................ ...............213A, 214A

The fourth inductance layer .............................................. .................201K

Through hole................................................ ...............213B, 214B 15 M321590 ❿

Third ground layer.............................................. ..................201L

Lower layer of external electrodes............................................ ..............201M

Lower surface electrodes 203A, 203B, 203C, 203D, 203E, 203F, 203G, 203H 16

Claims (1)

M321590 IX. Application for Patent Park: L—a kind of miniaturized balanced unbalanced impedance conversion bandpass filter, structure, from top to bottom in order _: ~, with multiple layers, one = electricity = upper layer, printed by metal mesh On the first dielectric layer substrate, there are _ outside. The upper surface electrode is formed in the first dielectric layer fabrication process; l around the substrate, through the terminal electrode==capacitor layer, printed by the metal mesh on the second dielectric substrate, an L!: The ground layer is electrically connected; the first ground layer is printed on the third dielectric layer substrate by a metal mesh, and is connected to a through hole, and one end of the metal is fabricated through a terminal electrode and is connected to one pole, the through hole and the first capacitor layer The first inductor layer is electrically connected; the electric first-inductive layer is printed on the fourth dielectric layer substrate by a metal mesh, and a total of 1 coil 'each gold secret end is electrically connected to the second domain layer via the through hole; The metal mesh is printed on the fifth dielectric layer substrate, and there are four metal coils, and the end of each metal coil is electrically connected to the first inductor layer via the through hole. The other end is also connected by the through hole and the first inductor layer. The second capacitor layer is electrically connected; the second capacitor layer is printed on the sixth dielectric layer substrate by a metal mesh, and has two metal and four through holes, one end of each metal is fabricated through the terminal electrode and the external one end electrode 1 mesh connection, through hole and second electricity, the first The capacitor layer is electrically connected to a third capacitor layer, and the metal film is on the seventh dielectric layer substrate. There are two metal and four through holes, and the metal end of each metal is connected to the external terminal electrode through a terminal electrode fabrication procedure. The through hole is electrically connected to the second layer and the first layer; the 17 M321590 m layer is printed on the eighth substrate by a metal mesh, and has two gold one and two through holes, a through hole and a third The capacitor layer is electrically connected; one or two ground planes are printed on the ninth dielectric layer substrate by a metal mesh, and there is a common one: one end of the genus is connected to the external terminal electrode through a terminal electrode fabrication procedure; Griffin on the tenth (four) substrate = one through hole 'the end of the metal coil through the through hole and the fourth inductive layer m sense layer 'printed by metal mesh on the tenth - dielectric layer substrate, a total of two, One end of the two through-hole 'metal coils is connected to the twelfth dielectric substrate through a through-hole, third sense, one ground layer, and is printed on the twelfth dielectric substrate by a metal mesh. The electrode fabrication process is connected to the external terminal electrode; = the lower electrode layer is printed by the metal mesh on the thirteenth dielectric layer The lower surface of the plate, the two outer lower surface electrodes of the mound, are distributed on the thirteenth dielectric layer substrate in the following table: four = simple electrode fabrication process is formed, and the upper electrode with the external electrode = = 1 = _ small office flat her _ The bandpass is connected to the wave device, and the via is connected to the upper and lower adjacent inductor layer metal coil layers for electrical connection.