M294074 八、新型說明： 【新型所屬之技術領域】 本創作係有關-種封裝結構改良，特別是有關—種不需殼體組農、防水/火 姓強的記憶卡成型結構改良。 【先前技術】 按，隨著數位相機、行動電話、個人數位助數理器等消費性電子產品普及 大幅增加’加上伴隨著數位影音多媒體的興起，使得小型快閃（Fiash)記憶卡的 須求量大幅增加’銷售量也跟著水漲船高。全球軸無不爭相投入積極研發， 期待5己fe卡等相關產品能為其帶來極大的侧。就目前市場上常見的快閃記憶 卡產品主要分為快閃記憶卡（Canpact Flash㈣，cf)、化啦μ. Card(SMC)、多媒體卡(Multi Media Card ’ MM〇、數位安全卡⑸⑽峋制 Card ’ SD)、Memory Stick Card，MS)等五種規格。 傳、、先義卡結構’如第―圖所示，此結構係為目前卡及卡的結構分 解圖，主要包括上殼體10、下殼體12及一電路基板14，此電路基板14上設有 已封裝完成的控制“及儲存晶"，並已完成蝴之雛連接，且在此電路 基板14表面上另設有複數電性接點16(虛線部分），提供與外界電性連接，組裝 時再將上殼體1G、τ殼體12覆蓋於電路基板14頂部及底側，使電路基板14被 包_内部’僅使電性接點16外露，而形成—小型的記憶卡結構。但此種結構 的^大缺點則是因殼體1G、12僅以上下殼體1G、12包覆電路基板14，在組裝 之製程中因有塗膠黏合，在高溫輯時容易因高溫變形而使組裝不易，並且此 上下吸體10、12包覆的結構並不穩固’在長時間多次抽換使用後容級兩者分 M294074 離脫洛’進而使產品指揀. 損奴，另外，此種以黏貼的固定方式，防水性差，水容易 浸透於内部，造成產品故障。 有4^於此’本創作係針對上述之問題，提出一種記憶卡成型結構改良，以 -有效克服傳統記憶卡結構之缺點。 【新型内容】 本創作之主要目的，係在提供—種記憶卡成型結構改良，藉_用一體成 _型方式進行膠體封裝，使製程簡化，進而使經濟效益增加。 本創作之另-目的，係在提供_種記憶卡成型結構，彻雌膠體一體成 型壓模技術，使記憶卡結構本妓無_結合，使記針有更好的防水 '效果。 本創作之#目的’係在提供—種記針細結構，藉由顧方式形成敕 體的記憶卡，有別於傳統記憶卡製造方式，免除蓋體組裝(H〇using)的製程^ 使製造成本降低。 隊«摘作，-種記憶卡成麵構改良，包括_電路基板，在轉基板上 表面設有至少-電路層，且在電路基板下表面設有至少二溝槽，錢路基板下 表面且位於二溝槽之間設有複數電性接點，此電路層係電連接至電性接點，且 在基板之上表面設置至少―晶片，此晶片與電路輕連接，再由—熱固性膠體 將上述元件包覆，使基板下表面之電性接點露出。 —底下藉由具體實施·合__鱗加綱，當更料瞭解本創作之目 的、技術内容、特點及其所達成之功效。 M294074 【實施方式】 種峨卡成型結構改良，此記憶卡結構制賴財式將熱固 ‘膠體在進行壓模步驟時，使 、 .膠體，並且使記憶卡的外觀形狀能-體 成型’免除了傳統記憶卡製程巾的殼體組裝。 ，是在半導體結構上進行硬化，可使記憶卡製裎時間及成本大幅降低， -另外本創倾非是單純進行麵轉，是在封裝） 電路基板對外的電性接點不沾黏到封裝j 以下就本創作結構各細部予以解說，請參閱第二圖及第三圖所示，本創作 之、、σ構包括電路基板18，此電路基板18内層設有複數導電線路，而在此 電路基板18上下表面分_ —_ 22紅溝_，而在魏基㈣下表 面且在一赫24之間設有複數電性接點26，*電闕22藉由導電線路别電連 接至每一電性接點26上。 在電路基板18上表面則設有-記憶晶片28、一控制晶片3〇及複數電子元 件32，此記憶晶片28及-控制晶片3G利用打線(Wire B〇nding)方式與電路層 22電連接，其中除了打線(WireBQnding)方式也可制㈣⑻方錢 行電性連接，而此電子元件32可選自電阻、電容、電感或變壓器，且此電子元 件32係利用表面安裝技術(Surface M〇unt細⑽卿，SMT)設置在電路基板 18上’再由一熱固性膝體34將_基板18、_記憶晶片28、一控制晶片洲及 複數電子元件32予以包覆，僅使電路紐18下表_躲接點％露出，所露 '出之電性接點26可供外界電連接之用。 接續再解說本創作之製程部分，首先如第四A圖所示，在電路基板18的上 表面及下表面分別設置電路層22及複數電性接點26，此電性接點26可提供外 界電連接之用，接著如第四B圖所示，在電路基板18之上表面利用上片（DieM294074 VIII. New description: [New technical field] This creation is related to the improvement of the package structure, especially the improvement of the memory card forming structure that does not require the housing group, the waterproof/fire name. [Prior Art] Press, with the popularity of digital electronic devices such as digital cameras, mobile phones, and personal digital assistants increased dramatically', coupled with the rise of digital audio and video multimedia, the need for small flash memory cards The volume has increased dramatically' sales volume has also risen. The global axis has invested in active research and development, and expects that related products such as 5 fe cards can bring great advantages to them. The flash memory card products commonly found on the market are mainly divided into flash memory cards (Canpact Flash (4), cf), Kay. μ. Card (SMC), multimedia cards (Multi Media Card 'MM〇, digital security card (5) (10). Card "SD", Memory Stick Card, MS) and other five specifications. As shown in the first figure, the structure is an exploded view of the current card and card, and mainly includes an upper casing 10, a lower casing 12 and a circuit substrate 14, on which the circuit substrate 14 is mounted. The packaged control "and storage crystal" is provided, and the connection of the butterfly is completed, and a plurality of electrical contacts 16 (dashed line portions) are additionally provided on the surface of the circuit substrate 14 to provide electrical connection with the outside. When assembling, the upper case 1G and the τ case 12 are covered on the top and bottom sides of the circuit board 14, so that the circuit board 14 is exposed by the package_internal only to expose the electrical contacts 16 to form a small memory card structure. However, the major disadvantage of this type of structure is that the casings 1G and 12 cover only the circuit board 14 with the upper and lower casings 1G and 12, and are glued by the glue in the assembly process, and are easily deformed by high temperature during high temperature assembly. However, the assembly is not easy, and the structure of the upper and lower suction bodies 10, 12 is not stable. After a long time of repeated use and replacement, the capacity is divided into two parts, M294074, and the product is sorted. This kind of adhesive fixing method is poor in water repellency and water is easily penetrated inside. This caused the product to malfunction. There are 4^This's creative system proposes a memory card molding structure improvement to effectively overcome the shortcomings of the traditional memory card structure. [New content] The main purpose of this creation is Providing a kind of improvement of the memory card forming structure, and using the integrated _ type to carry out the colloidal packaging, so that the process is simplified, thereby increasing the economic benefit. The other purpose of the creation is to provide a memory card forming structure, the female The colloidal integrated molding die technology makes the structure of the memory card _ _ _, which makes the stylus better waterproof. The purpose of this creation is to provide a fine structure of the needle, which is formed by the method. The memory card is different from the traditional memory card manufacturing method, eliminating the manufacturing process of the cover assembly and reducing the manufacturing cost. The team «extracted, - the memory card is improved in surface structure, including _ circuit substrate, At least a circuit layer is disposed on the upper surface of the rotating substrate, and at least two grooves are disposed on the lower surface of the circuit substrate, and a plurality of electrical contacts are disposed on the lower surface of the money substrate and between the two trenches, and the circuit layer is Connected to the electrical contact, and at least the wafer is disposed on the upper surface of the substrate, the wafer is lightly connected to the circuit, and the component is covered by the thermosetting colloid to expose the electrical contact on the lower surface of the substrate. From the specific implementation, the combination of __ scales, when it is better to understand the purpose, technical content, characteristics and the effects achieved by this creation. M294074 [Embodiment] The improvement of the structure of the Leica, the structure of this memory card The thermosetting 'colloid' is used to perform the molding step, to make the colloid, and to make the appearance of the memory card capable of forming - the body assembly of the conventional memory card manufacturing process is eliminated. It can greatly reduce the time and cost of the memory card, and - in addition, the singularity is simply a face-turn, which is in the package). The external electrical contacts of the circuit board are not adhered to the package j. Illustrated in the second and third figures, the sigma structure of the present invention includes a circuit substrate 18, and the inner layer of the circuit substrate 18 is provided with a plurality of conductive lines on the circuit substrate 18. The surface is divided into ___22 red groove_, and a plurality of electrical contacts 26 are disposed on the lower surface of the Weiji (4) and between one Hz 24, and the electric cymbal 22 is electrically connected to each electrical connection by a conductive line. Point 26 on. On the upper surface of the circuit board 18, a memory chip 28, a control chip 3, and a plurality of electronic components 32 are provided. The memory chip 28 and the control chip 3G are electrically connected to the circuit layer 22 by wire bonding. In addition to the wire (WireBQnding) method can also be made (four) (8) square money line electrical connection, and the electronic component 32 can be selected from a resistor, capacitor, inductor or transformer, and the electronic component 32 is based on surface mounting technology (Surface M〇unt fine (10) Qing, SMT) is disposed on the circuit substrate 18 'and then a thermoset knee 34 to wrap the substrate 18, the memory chip 28, a control wafer, and the plurality of electronic components 32, and only the circuit board 18 is as follows _ The hiding point is exposed, and the exposed electrical contact 26 is available for external electrical connection. Continuing to explain the process part of the creation, first, as shown in FIG. 4A, a circuit layer 22 and a plurality of electrical contacts 26 are respectively disposed on the upper surface and the lower surface of the circuit substrate 18, and the electrical contacts 26 can provide the outside world. For electrical connection, as shown in FIG. 4B, the upper surface is used on the upper surface of the circuit substrate 18 (Die
7 M2940747 M294074
Bonding)技術設置記憶晶片28及控制晶片3〇，並利用撕技術設置複數電子 元件32，接著利用打線(Wire B〇nding)方式使記憶晶片28及控制晶片3〇與電 ，路層22電連接。 -接著如第四c圖所示，將上述電路基板18放入在一模具36之下模表面上， 此模具36之下模表面設有二防溢溝槽38 ,而此二防溢溝槽38也正位於電路基 板18下表面二溝槽24之外側邊，接著糊壓模灌膠方式將熱固性膠體34注入 包覆電路基板18、記憶晶片28、控制晶片30及電子元件32，僅露出電路基板 18下表面的電性接點26，而此熱固性雜34可選自紐樹脂、尿素樹脂、美 耐皿樹脂或環氧樹脂’其巾進行賴轉時，熱雖膠體34會因重力及灌模的 壓力而往下流動而形成擠壓’此時因擠壓之壓力使模具36之下模表面的防溢溝 槽38内填人熱固性賴34，但也因此防溢溝槽38產生部分阻撞作用，使熱固 性膠體34的流動速度減緩，並且有電路基板18下表面二溝槽％做二次的阻播， 且此二溝槽24也同樣被熱固性膠體34所填滿，如此二次的_使熱固性膠體 34不易溢人電性接點26之區域而產生沾帅見象，最後將己麵完成的半成品 進行硬化步驟’此硬化步驟的操作温度係為12_度α)，硬化完成後從模 具中取出’如細D W所示，取出後的成品在電路基板18下表面呈現小型凹槽 形狀，如此即完成本創作之半導體結構的製程。 本創作藉由湘—體成型方式進行賴封裝，使製程簡化，進而使經濟效 益增加’並且此壓模技術，使記憶卡結構本身是無縫隙結合，使記憶卡有 更好的防水、防塵效果’糾齡壓财式形成整體的記憶卡，㈣於傳統記 憶卡製造方式，免除蓋體(HQUSlng)組裝的製程，而使製造成本降低。 惟以上所述之實施例僅為本創作之較佳實施例，藉由實施例說明本創作之 ⑧ 8 M294074 特點’其目的在使熟習該技術者能暸解本創作之内容並據以實施，並非用以局 限本創作實施之額。軌朝本_巾料纖騎述之構造、形狀、特徵 及精神所為之均㈣化及修飾’皆應包括於本創作巾請專利之範圍内。1 【圖式簡單說明】 第一圖為傳統記憶卡組裝殼體之立體分解圖。 第二圖為本創作之結構剖面示意圖。 春第三圖為本創作之底側立體示意圖。 第四A圖至第四D W為賴作之記憶卡結構製作流程圖 【主要元件符號說明】 1〇上殼體 14電路基板 18電路基板 U電路層 26 電性接點 30控制晶片 34熱固性膠體 38防溢溝槽 12 下殼體 16電性接點 20導電線路 24溝槽 28記憶晶片 %電子元件 36模具Bonding technology sets the memory chip 28 and the control chip 3, and uses the tearing technology to set the plurality of electronic components 32, and then electrically connects the memory chip 28 and the control chip 3 to the electricity and the circuit layer 22 by wire bonding. . - then, as shown in the fourth c-picture, the above-mentioned circuit substrate 18 is placed on the surface of a mold 36, and the surface of the lower surface of the mold 36 is provided with two overflow-proof grooves 38, and the two overflow-proof grooves 38 is also located on the outer side of the lower surface of the circuit board 18 and the other side of the trench 24, and then the paste molding method is used to inject the thermosetting colloid 34 into the covered circuit substrate 18, the memory wafer 28, the control wafer 30 and the electronic component 32, and only exposed. The electrical contact 26 on the lower surface of the circuit board 18, and the thermosetting impurities 34 may be selected from the group consisting of neo-resin, urea resin, melamine resin or epoxy resin. The pressure of the filling die flows downward to form an extrusion. At this time, the pressure of the pressing causes the overflow preventing groove 38 of the lower surface of the mold 36 to be filled with the thermosetting property 34, but also the portion of the overflow preventing groove 38 is generated. The collision preventing effect slows down the flow speed of the thermosetting colloid 34, and the second groove of the lower surface of the circuit board 18 is twice hindered, and the two grooves 24 are also filled by the thermosetting colloid 34, so twice. _ such that the thermosetting colloid 34 does not easily spill over the area of the electrical contact 26 Difficult to see the image, and finally the hardened step of the finished semi-finished product 'the operating temperature of this hardening step is 12_degree α), after the hardening is completed, it is taken out from the mold, as shown by fine DW, the finished product is taken out in the circuit. The lower surface of the substrate 18 exhibits a small groove shape, thus completing the process of the semiconductor structure of the present invention. This creation uses the Xiang-body molding method to package, simplify the process, and increase the economic benefits. And this compression molding technology makes the memory card structure itself seamless, so that the memory card has better waterproof and dustproof effect. 'The correction of the age of the pressure form the overall memory card, (d) in the traditional memory card manufacturing method, eliminating the cover assembly (HQUSlng) assembly process, and reducing manufacturing costs. However, the embodiments described above are only preferred embodiments of the present invention, and the 8 8 M294074 feature of the present invention is described by way of example. The purpose of the present invention is to enable the skilled person to understand the contents of the present invention and implement it accordingly. Used to limit the amount of this creation. The structure, shape, characteristics and spirit of the track-to-materials are all included in the scope of the patent. 1 [Simple description of the drawing] The first figure is an exploded view of the assembled chassis of the traditional memory card. The second picture is a schematic cross-sectional view of the structure of the creation. The third picture of spring is a three-dimensional diagram of the bottom side of the creation. 4A to 4DW are the flow chart of the memory card structure. [Main component symbol description] 1〇Upper casing 14 Circuit board 18 Circuit board U Circuit layer 26 Electrical contact 30 Control wafer 34 Thermosetting colloid 38 Overflow trench 12 lower case 16 electrical contact 20 conductive line 24 trench 28 memory wafer % electronic component 36 mold