M276349 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種多媒體卡，尤指一種針對如1^- MMC(Reduced-Sized MultiMedia Card)、Mini SD Card(Mini Secure Digital Card)、…等微型多媒體卡之構裝結構所 提出之設計。 【先前技術】M276349 8. Description of the new model: [Technical field to which the new model belongs] This creation is about a multimedia card, especially one targeted at, for example, 1 ^-MMC (Reduced-Sized MultiMedia Card), Mini SD Card (Mini Secure Digital Card), etc. The proposed design of the structure of the micro multimedia card. [Prior art]
Ik著行動多媒體世代的來臨，消費性電子產品的需求 曰盈提升，對於該些電子產品功能以及擴充性也越來越講 究，而為能夠廣泛應用於可攜式電子產品（手機、pDA、數 位相機、數位攝影機···等）的記憶多媒體儲存裝置 、波更新風潮的發展主力。隨著物品越來越講究「精緻化 的：時，「輕、薄、短、小」的趨勢也是挑選產品的主垄 考量因素之-’基於這樣的條件下，❹具備體積更小、 更薄的微型多媒體卡（如· Μ 戈·以-MMC、Mini SD Card、…等 已成為未來電子產品趨勢。 目則已知的微型多媒㈣丰 ^ 夕螺體卡之構裝結構，如第五、六 所示，主要係將一晶片 e, p ^ ^ ^ ^ 者於一基板，再封膠構裝成一: 疋尺寸的積體電路元件（ 丰扔制、止山从 、b ◦)，另使用模具以模塑成: 手奴製造出符合標準規格 兮上 的卡片外殼（7 〇 )，之後，： 遠卡片外殼（7 0 )的置入槽 再將該積體電路元以“人川中塗膠或黏貼膝帶 的置入槽（71)中定位，二置入:該卡片外殼（7〇 惟前述之多媒體卡結構設;媒體卡祕^ 又°十雖可達成符合多媒體卡 d M276349 形及功能上之基本要炎，妙^ ^ Α μ 不要求然而，该多媒體卡結構設計尚存 在有若干缺點有待改進，其中： 製ie方面·鏽多媒體卡於製造時，除分別模塑 成t卡片外咸’以及於基板上黏著晶片再封膠成形一積體 電路τΜΟ卜’需再以機器依序於卡片外殼的置人槽中塗膠 (或貼附膠帶），將該積體電路元件透過機器精確對位地置 入卡片外殼的置人槽膠著固其製程步驟較繁複、耗時， 以致有產能少、成本偏高等缺點。 2·在產品使用方面：該多媒體卡之積 被膠著結合於卡片外兮中，电路兀件係 中因黏者於該積體電路元件與卡 片外破間之黏性膠材可能因你 何J此因使用裱境因素（如溫度、溼产 荨）的變化，而導致苴獻松 又·· “ 彼此結合穩固性減弱， 使该積體電路元件易自k ^ , 双中剝離，因而降低該多媒 體卡的產品使用壽命。 干 【新型内容】 本創作之主要目的方於担# 燼备朴^ 勺在於k供一種微型多媒體卡構裝結 ，希精此設計，改善前述微 „ 主夕嫘體卡製程步驟繁珀， 以及黏著組合式構裝椹止层、☆ ’、貞 w構&易叉被境因素影響等缺點。 為達成前揭目的，本創作所提 多媒體卡構裝結構包括一基板、：方案係^型 ^ t 日日片以及一封膠駚，分 土板上具有圖案化線路，並延 / 外邱i Et „ 暴板下表面一側形成數 邛接，基板郇近外部接點之_ 之另端設有缺槽，且兮A柄下矣而/、有對位缺角，相對 溢脒娣兮曰 亥基板下表面鄰近缺槽處設有一道防 溢蜃槽，该晶片黏著於基板上，並與 防 /、/、上的線路電性連接， M276349 該封膠體係-體模塑成形於基板具晶片之側面i，將晶片 匕復於内，並於基板的缺槽處形成產品接合槽，於基板的 對位缺角處形成對應之對位缺部。 本創作藉由前揭技術方案之設計，相較於先前技術所 揭示之組合式多媒體卡，其特點至少包括有： 1·在製造方面：本創作之多媒體卡藉其一體成型封 膠體之構裝構造’ &製造時，可在基板黏著晶片及電性連 接後直接使用模具予以成形封膠體，使其整個製程步驟 更為精簡化，並縮短製造時間，提高產能，並降低成本。 此外本創作更藉其基板下表面之防溢膠槽設計，使該多 媒體卡於模塑成形封膠體時，可以有效防止膠體污染基板 下表面之外部接點。 2 ·在產品使用方面：本創作多媒體卡係採取一體成 型封膠體之構裝構造設計，在使用過程中，即可免除先前 技術之組合式多媒體卡構件間易因環境因素而剝離之問 題。 【實施方式】 ^本創作微型多媒體卡可為RS-MMC、Mini SD card、… 等徵型多媒體卡，前述各式微型多媒體卡之構裝構造僅係 寸對位缺角以及接腳多寡差異，為便於本創作多 媒體卡構裝構造之說明，以下以RS-MMC型多媒體卡作為 說明主體’如第—、二圖所示，該多媒體卡包括—基板（工 〇 ) 日日片（2 0 )及一模塑成形之封膠體（3 〇 )， 其中： M276349With the advent of the mobile multimedia generation, the demand for consumer electronics products has increased, and the functions and scalability of these electronic products have become more and more particular. They are widely used in portable electronic products (mobile phones, pDA, digital Cameras, digital video cameras, etc.), the main force in the development of the wave of multimedia storage. As the items become more and more refined, the trend of "light, thin, short, and small" is also one of the main considerations in selecting products-based on these conditions, I have smaller and thinner Micro multimedia cards (such as MG, I-MMC, Mini SD Card,… etc.) have become the trend of electronic products in the future. The known micro-multimedia ㈣ ^ Xi spiral card structure, such as the fifth As shown in Figures 6 and 6, it mainly consists of a chip e, p ^ ^ ^ ^ ^ on a substrate, and then encapsulated to form one: 疋 -sized integrated circuit components (Feng throw, Zhishan Cong, b ◦), and Use a mold to mold into: a card case (70) that meets the standard specifications is manufactured by a slave, and then: the remote card case (70) is placed in the slot, and the integrated circuit element is labeled "Renchuanzhongtu It is positioned in the insertion slot (71) of the adhesive or adhesive knee strap, and two are inserted: the card shell (70), but the above-mentioned multimedia card structure is set; the secret of the media card ^ and ° 10 can meet the shape of the multimedia card d M276349 and The basic function is essential, wonderful ^ ^ Α μ is not required. However, the structure design of the multimedia card still exists There are several shortcomings that need to be improved, among which: when manufacturing rusty multimedia cards, in addition to moulding them separately into t-cards, and sticking wafers on the substrate and then sealing to form a integrated circuit τΜΟΟ The machine sequentially applies glue (or attaches tape) to the insertion groove of the card case, and accurately places the integrated circuit component into the insertion groove of the card case through the machine to glue and fix it. The manufacturing steps are complicated and time-consuming. As a result, there are shortcomings such as low production capacity and high cost. 2. In terms of product use: the product of the multimedia card is glued to the outside of the card, and the circuit components are stuck between the integrated circuit components and the card. Due to the changes in the use of mounting factors (such as temperature, wet netting), the adhesive material may cause the loss of the stability of the integrated circuit components. k ^, peeling off the middle and the middle, thus reducing the product life of the multimedia card. Dry [new content] The main purpose of this creation is Yu Dan # 备 备 朴 ^ The spoon is for k to build a micro multimedia card. Assume To improve the above-mentioned micro-steps of the main card production process, and the combination of the combined structure of the stop layer, ☆ ', the structure and the impact of environmental factors and other shortcomings. In order to achieve the purpose of the previous disclosure, this creation The proposed multimedia card structure includes a substrate, a solution system, a ^ type, a day-to-day film, and an adhesive tape, with patterned lines on the dividing plate, and extending / outside Qiu i Et „side of the lower surface of the storm plate A number of contacts are formed, and the other end of the substrate near the outer contact is provided with a notch, and the A handle is lower and / or has an opposite notch, and the lower surface of the substrate is relatively adjacent to the notch. An anti-overflow groove is provided. The chip is adhered to the substrate and is electrically connected to the circuit on ////. M276349 The sealing system body is molded on the side of the substrate with the wafer i. It is compounded inside, and a product bonding groove is formed at the notch of the substrate, and a corresponding notch is formed at the notch of the substrate. Compared with the combined multimedia cards disclosed in the previous technology, the characteristics of this creation are based on the design of the previous technical solution. At least: 1. In terms of manufacturing: the multimedia card of this creation is constructed by its integral molding gel. In the structure 'manufacturing, the mold can be directly used to form the sealing compound after the substrate is bonded to the wafer and electrically connected, which makes the entire process steps more streamlined, shortens the manufacturing time, increases production capacity, and reduces costs. In addition, this creation also uses the anti-overflow groove design on the lower surface of the substrate, so that the multimedia card can effectively prevent the gel from contaminating the external contacts on the lower surface of the substrate when the gel is sealed. 2 · In terms of product use: This creative multimedia card is designed with a one-piece sealing gel structure. In the process of use, the problem of easy peeling due to environmental factors between the components of the combined multimedia card of the prior art can be avoided. [Embodiment] ^ The creative micro multimedia card can be an RS-MMC, Mini SD card, ... and other characteristic multimedia cards. The structure of the aforementioned various types of micro multimedia cards is only due to the misalignment of the corners and the number of pins. In order to facilitate the explanation of the creative construction of the multimedia card, the following description is based on the RS-MMC multimedia card as shown in the first and second figures. And a molding sealant (30), where: M276349
該線路延伸至基板（i ο)下表面一側形成數個外部接點 下表面相對於外 ’且該下表面鄰 (1 1 )呈間隔排列地’該基板（1〇） 部接點（1 1 )之另端設有缺槽（1 2 ) 近缺槽（1 2 )處設一防溢膠槽（i 3 )，該基板（i 〇 ) 相對於缺槽（1 2 )之另側端一角隅處設有一對位缺角（丄 馨 該晶片（2 0 )係一包括有資料儲存功能之物件，其 上具有數接點，該晶片（2 0 )係黏著固定於基板（1 〇 ) 上，該數接點與基板（；L 〇 )上相對應之内部接點以金屬 導線（2 1 )連接或覆晶接合等方式構成電性連接。 該封膠體（3 〇 )係模塑成形於基板（丄〇 )具有晶 片（2 0 )之側面上，將晶片（2 〇 )包覆於内，並於基 板（1 0 )的缺槽（丄2 )處形成產品接合槽（3丄）， 於基板（1 0 )的對位缺角（i 4 )處形成對應之對位缺 •部（3 2 )。 該栽件（4 〇 )於幸 外部接點（4 2 )及 〜本創作藉由前揭之構裝構造設計構裝製造時，如 弟二圖A〜C所示，係使用-長條狀之載件（4 〇 )，該 栽件（4 0 )上包括數單元具有圖案化線路的基板（4 1 )， 及该載件（4 〇 ) 貫穿孔（4 4 )， 於每一單元之基板（4 1 )下表面形成數 )及防溢膠槽（4 3)(如第四圖所示）， )並於鄰近防溢膠槽（4 3 )預宕# #古 備中，依序於其每一 前述載件（4 0 )係被輸送至一構装設 單元基板（41)上各黏著一晶片（2 M276349 第四圖係本創作微型多媒體卡於構裝時，使用之載件 底視平面示意圖。 第五、六圖係公知微型多媒體卡的立體分解示意圖及 組合外觀示意圖。 【主要元件符號說明】 (1 0 )基板 (1 2 )缺槽 (1 4 )對位缺角 (2 0 )晶片 (3 0 )封膠體 (3 2 )對位缺部 (4 0 )載件 (4 2 )外部接點 (4 4 )貫穿孔 (5 0 )多媒體卡 (1 1)外部接點 (1 3 )防溢膠槽 (2 1 )金屬導線 (31)產品接合槽 (4 1 )基板 (4 3 )防溢膠槽 (60)積體電路元件 (7 0 )卡片外殼 (7 1 )置入槽 (ίThe line extends to one side of the lower surface of the substrate (i ο) to form a plurality of external contacts. The lower surface is relatively outward, and the lower surface is adjacently arranged (1 1) at intervals. The substrate (10) contacts (1) 1) The other end is provided with a notch (1 2). Near the notch (1 2), an anti-overflow glue trough (i3) is provided. The base plate (i 〇) is opposite to the other end of the notch (1 2). There is a pair of missing corners at one corner (the chip (2 0) of Xin Xin is an object including a data storage function, which has a plurality of contacts, and the chip (2 0) is adhesively fixed to the substrate (1 0) In the above, the number of contacts and the corresponding internal contacts on the substrate (; L 〇) are electrically connected by metal wires (2 1) connection or flip-chip bonding. The sealing compound (3 〇) is molded. On the side surface of the substrate (丄 〇) having the wafer (20), the wafer (20) is covered inside, and a product bonding groove (3 丄) is formed at the notch (丄 2) of the substrate (1 0). A corresponding missing part (3 2) is formed at the opposite missing corner (i 4) of the substrate (1 0). The supporting piece (40) is located at the outer contact (4 2) and ~ this creation By When the structure is designed and manufactured, as shown in Figures A to C of the second figure, a long-shaped carrier (40) is used, and the plant (40) includes several units with patterned lines. The substrate (4 1), and the carrier (40) through-holes (4 4), forming a number on the lower surface of the substrate (4 1) of each unit) and the anti-overflow groove (4 3) (such as the fourth (Shown in the figure), and) and in the vicinity of the spill-proof glue tank (4 3) pre-down # # 古 备 中, in order to each of its aforementioned loading parts (4 0) are transported to a configuration unit substrate (41) Each chip is attached to a chip (2 M276349. The fourth picture is a bottom plan view of the carrier used in the creation of the micro multimedia card during construction. The fifth and sixth pictures are a three-dimensional exploded view and a combined appearance diagram of a known micro multimedia card. [Description of main component symbols] (1 0) Substrate (1 2) Notch (1 4) Opposite notch (2 0) Wafer (3 0) Sealant (3 2) Opposite missing part (4 0) (4 2) External contact (4 4) Through hole (50) Multimedia card (1 1) External contact (1 3) Anti-overflow adhesive groove (2 1) Metal wire (31) Product joint groove (4 1) Base plate (4 3) Anti-overflow glue tank (60) Integrated circuit components (7 0) card housing (7 1)