CN201226355Y - Packaging structure for electronic memory device - Google Patents
Packaging structure for electronic memory device Download PDFInfo
- Publication number
- CN201226355Y CN201226355Y CNU2008200094901U CN200820009490U CN201226355Y CN 201226355 Y CN201226355 Y CN 201226355Y CN U2008200094901 U CNU2008200094901 U CN U2008200094901U CN 200820009490 U CN200820009490 U CN 200820009490U CN 201226355 Y CN201226355 Y CN 201226355Y
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- CN
- China
- Prior art keywords
- substrate
- encapsulating structure
- connector
- memory mechanism
- crystalline substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Casings For Electric Apparatus (AREA)
Abstract
The utility model discloses an electronic storage device packaging structure, which comprises a substrate, a plurality of passive electronic components, a controller die, a memory die, a connector and a casing. The electronic components, the controller die and the memory die are adhered to the upper surface of the substrate and electrically connected with a connecting circuit which is arranged on the upper surface. In addition, the electronic components, the controller die and the memory die are coated by insulating material. The terminal of the connector is adhered to the contact electrode which is arranged on the lower surface of the substrate. In particular, the ultrasonic welding processing can be performed on the casing so that the substrate and the connector are fixed in the casing. The utility model can improve the reliability, reduce the packaging cost and realize the fully automated production.
Description
Technical field
The utility model relates to a kind of electric memory mechanism encapsulating structure, the electric memory mechanism encapsulating structure that particularly a kind of reliability improves and packaging cost descends.
Background technology
Because electronic installations such as personal computer, mobile phone, digital camera, digital code camera and personal digital assistant are sold fast and are accompanied by the multimedia rise of digital audio-video, make electric memory mechanism, for example the demand of hard disk and memory card significantly increases.For instance, hard disk can refer to solid state hard disc (Solid State Disk, SSD) or micro hard disk (micro drive).
Memory card is a kind of light and handy portable electronic data storage device, progress and development along with science and technology, according to various demands of applications, memory card has many different sizes, external form and specification, numeric security card (Secure Digital card for example, SD card), mini numeric security card (mini SD card), miniature numeric security card (micro SD card), multimedia card (Multi Media Card, MMC) and flash memory (Compact Flash card, CF card) etc.
In known CF memory card, solid state hard disc and micro hard disk, naked crystalline substance of controller (controller die) and the naked crystalline substance of memory (memory die) are earlier through (surface mounttechnology SMT) is attached on the base plate for packaging with surface mount technology again after the encapsulation.Yet this kind packaged type expends a lot of packaging costs really.After the naked crystalline substance of packaged controller and the naked crystalline substance of memory were attached to base plate for packaging, base plate for packaging was fixed in the containment vessel to be protected.
The known CF memory card and the containment vessel of micro hard disk utilize an iron-clad and assemble in the mode that fastens, so the tightness degree of iron-clad is limited and be subjected to the influence of external environment factor easily.So known CF memory card can't pass through more harsh reliability test (reliability test).For this reason, known CF memory card can't use in the environment of cold or deep-sea, can cause puzzlement for the photographer of specialty.In addition, can expend many man-hours and cost with manual type assembling iron-clad.
Therefore, main purpose of the present utility model is to provide a kind of electric memory mechanism encapsulating structure, to address the above problem.
Summary of the invention
The purpose of this utility model is to provide a kind of electric memory mechanism encapsulating structure, and its reliability improves, packaging cost descends and can realize full automation production.
In a specific embodiment of the present utility model, a kind of electric memory mechanism encapsulating structure comprises: a substrate, this substrate have a upper surface, as a lower surface of the reverse side of this upper surface, be formed at the connecting circuit on this upper surface and be formed on this lower surface and be electrically connected to a plurality of contact electrodes of this connecting circuit; A plurality of passive electronic components, described passive electronic component are attached on this upper surface of this substrate and are electrically connected to this connecting circuit; The naked crystalline substance of one controller, the naked crystalline substance of this controller are attached on this upper surface of this substrate and are electrically connected to this connecting circuit; The naked crystalline substance of at least one memory, the naked crystalline substance of this at least one memory are attached on this upper surface of this substrate and are electrically connected to this connecting circuit, and wherein said passive electronic component, the naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are coated by insulating material; A connector, this connector definition one first side itself and one second side relative with this first side, this connector comprises a plurality of terminals, a contact electrode in the corresponding described contact electrode of each terminal, the end that each terminal is positioned at first side of this connector is adhered to the pairing contact electrode of this terminal, and each terminal is used to connect external circuit towards an end of second side of this connector; And a housing, this substrate and this connector are fixed in this housing, cause this second side of this connector to expose.
Preferably, described passive electronic component is attached on this upper surface of this substrate by a surface mount technology.
Preferably, naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are attached on this upper surface of this substrate by elargol.
Preferably, naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are electrically connected to this connecting circuit by the routing juncture.
Preferably, this housing comprises a upper case portion and to housing parts once that should upper case portion, this upper case portion and this lower house partly interosculate, and cause this substrate and this connector to be fixed in the groove that is partly defined by this upper case portion and this lower house.
Preferably, this upper case portion and this lower house partly are the housings of being made by plastic material.
Preferably, this upper case portion and this lower house part engages one another by the ultrasonic waves welding manner.
Preferably, described passive electronic component is a resistor, a capacitor, an inductor or an oscillator.
Preferably, this insulating material is an epoxy resin.
Preferably, this substrate is a printed circuit board (PCB).
Preferably, this electric memory mechanism is CF memory card or portable hard disk.
Preferably, this portable hard disk is a micro hard disk or a solid state hard disc.
Useful technique effect of the present utility model is: the reliability of electric memory mechanism encapsulating structure improves, packaging cost descends and realize full automation production.
Can be further understood detailed description of the present utility model and accompanying drawing by following about advantage of the present utility model and design.
Description of drawings
Figure 1A illustrates the upward view according to the substrate of electric memory mechanism encapsulating structure of the present utility model.
Figure 1B illustrates the vertical view according to the substrate of electric memory mechanism encapsulating structure of the present utility model.
Fig. 2 illustrates the cross sectional view according to the substrate of electric memory mechanism encapsulating structure of the present utility model.
Fig. 3 A illustrates the upward view after connector and the substrate combination.
Fig. 3 B illustrates the vertical view after connector and the substrate combination.
Fig. 3 C illustrates the end view after connector and the substrate combination.
Fig. 4 A illustrates the vertical view according to electric memory mechanism encapsulating structure of the present utility model.
Fig. 4 B illustrates the front view according to electric memory mechanism encapsulating structure of the present utility model.
Fig. 4 C illustrates the end view according to electric memory mechanism encapsulating structure of the present utility model.
Wherein, description of reference numerals is as follows:
1 electric memory mechanism encapsulating structure, 10 substrates
The naked crystalline substance of 12 electronic components, 14 controllers
Naked brilliant 18 insulating material of 16 memories
20 connectors, 22 housings
100 upper surfaces, 102 lower surfaces
104 contact electrodes, 200 terminals
202 jacks
Embodiment
A purpose of the present utility model is to provide a kind of electric memory mechanism encapsulating structure.In addition, can be CF memory card, solid state hard disc or micro hard disk according to electric memory mechanism of the present utility model.
See also Figure 1A and Figure 1B.Figure 1A illustrates the upward view according to the substrate 10 of electric memory mechanism encapsulating structure of the present utility model.Figure 1B illustrates the vertical view according to the substrate 10 of electric memory mechanism encapsulating structure of the present utility model.
Shown in Figure 1A and Figure 1B, the electric memory mechanism encapsulating structure comprises substrate 10, a plurality of passive electronic component 12, a controller naked brilliant 14 and a memory naked brilliant 16.In actual applications, substrate 10 can be a printed circuit board (PCB).In order to increase the storage capacity of data, can comprise a plurality of memories naked brilliant 16 according to electric memory mechanism encapsulating structure of the present utility model.In one embodiment, the naked crystalline substance of a plurality of memories can form (stack) structure of storehouse and be electrically connected to each other.
Described passive electronic component 12 can comprise resistor, capacitor, inductor and oscillator etc.In one embodiment, a plurality of passive electronic components 12 can be attached on the upper surface 100 of substrate 10 by surface mount technology and be electrically connected to connecting circuit simultaneously.
Controller naked brilliant 14 and memory naked brilliant 16 are attached on the upper surface 100 of substrate 10 and are electrically connected to connecting circuit.In one embodiment, controller naked brilliant 14 and memory naked brilliant 16 can be attached on the upper surface 100 of substrate 10 by elargol, can engage (wire-bonding) mode by routing afterwards, by bonding wire controller naked brilliant 14 and memory naked brilliant 16 are connected to the junction point (bonding pad) that sets in advance on the upper surface 100 of substrate 10 respectively, make controller naked brilliant 14 and memory naked brilliant 16 be electrically connected to connecting circuit.
See also Fig. 2.Fig. 2 illustrates the cross sectional view according to the substrate 10 of electric memory mechanism encapsulating structure of the present utility model.As shown in Figure 2, wherein said passive electronic component 12, controller naked brilliant 14 and memory naked brilliant 16 are coated by an insulating material 18.In actual applications, insulating material 18 can be epoxy resin (epoxy resin).Except the function that insulation is provided, insulating material 18 can also reduce the influence of the suffered external environment factor of electronic component 12, controller naked brilliant 14 and memory naked brilliant 16, and for example intrusion of aqueous vapor or variation of temperature are to keep its normal operation.Because controller naked brilliant 14 and memory naked brilliant 16 do not need can be attached on the upper surface 100 of substrate 10 through encapsulation earlier, therefore can save a lot of packaging costs.Be noted that by packaged type of the present utility model, thereby known solid state hard disc can be made a portable hard disk and has higher mobility.
See also Fig. 3 A to Fig. 3 C.Also comprise a connector 20 according to electric memory mechanism encapsulating structure of the present utility model.Connector 20 itself defines first side and second side relative with first side.Connector 20 comprises a plurality of terminals 200 and a plurality of jack 202 (seeing also Fig. 4 B), and each terminal 200 can be fixed in the jack 202.In addition, each terminal 200 correspondence is formed at a contact electrode 104 in the described contact electrode 104 on the lower surface 102 of substrate 10.As shown in Figure 3A, the end that each terminal 200 is positioned at first side of connector 20 stretches out jack 202 and is adhered to its pairing contact electrode 104, and each terminal 200 is arranged in jack 202 towards an end of second side of connector 20.Thus, the terminal of an external electronic can be inserted in the jack 202 and with the terminal 200 of connector 20 and be electrically connected, to carry out the access of data.Fig. 3 B illustrate connector 20 and substrate 10 in conjunction with after vertical view, and Fig. 3 C illustrate connector 20 and substrate 10 in conjunction with after end view.
Shown in Fig. 3 B, treat that electronic component 12, controller naked brilliant 14 and memory naked brilliant 16 are adhered on the upper surface 100 of substrate 10 and connector 20 is adhered to the contact electrode of substrate 10 after, connector 20 and substrate 10 are packaged in the housing.See also Fig. 4 A.Fig. 4 A illustrates the vertical view according to electric memory mechanism encapsulating structure 1 of the present utility model.
In one embodiment, housing 22 comprises the lower house part of a upper case portion and corresponding upper case portion.Upper case portion and lower house partly interosculate, and cause substrate 10 and connector 20 to be fixed in the groove that is partly defined by upper case portion and lower house.See also Fig. 4 B.Fig. 4 B illustrates the front view according to electric memory mechanism encapsulating structure 1 of the present utility model.Shown in Fig. 4 B, after being fixed in the housing 22, substrate and connector only expose second side of connector, and the jack 202 that promptly exposes connector inserts for external electronic.Fig. 4 C illustrates the end view according to electric memory mechanism encapsulating structure 1 of the present utility model.In actual applications, also has the fool proof design on the housing 22.
Can make by plastic material according to upper case portion of the present utility model and lower house part, therefore compare and to save a lot of costs with iron-clad commonly used.In one embodiment, upper case portion and lower house part engages one another by ultrasonic waves welding (ultrasonic welding) mode.In the actual production, the ultrasonic waves welding can realize automated production fast, therefore can save by artificial assemble case required man-hour and human cost.In addition, the ultrasonic waves welding can make housing 22 have higher adaptation, so electronic component, the naked crystalline substance of controller and the naked crystalline substance of memory are not vulnerable to the influence of external environment, therefore acquisition raising of reliability.For example, housing 22 of the present utility model is difficult for being invaded by aqueous vapor.
Compared to the prior art, generally speaking have following advantage according to electric memory mechanism encapsulating structure of the present utility model: the reliability of product improves, packaging cost descends and realize full automation production.
By above detailed description to preferred specific embodiment, feature of the present utility model and design can be more clearly described in hope, and above disclosed preferred specific embodiment is not to be used for scope of the present utility model is limited.On the contrary, its objective is that hope can and be equal to alternative being covered by in the scope of claims of the present utility model with various modification.Therefore, the scope of the utility model claims should be done the broadest explanation according to above-mentioned description, contains all possible various modification and is equal to alternative to cause it.
Claims (12)
1. an electric memory mechanism encapsulating structure is characterized in that, comprising:
One substrate, this substrate have a upper surface, as a lower surface of the reverse side of this upper surface, be formed at the connecting circuit on this upper surface and be formed on this lower surface and be electrically connected to a plurality of contact electrodes of this connecting circuit;
A plurality of passive electronic components, described passive electronic component are attached on this upper surface of this substrate and are electrically connected to this connecting circuit;
The naked crystalline substance of one controller, the naked crystalline substance of this controller are attached on this upper surface of this substrate and are electrically connected to this connecting circuit;
The naked crystalline substance of at least one memory, the naked crystalline substance of this at least one memory are attached on this upper surface of this substrate and are electrically connected to this connecting circuit, and wherein said passive electronic component, the naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are coated by insulating material;
A connector, this connector definition one first side itself and one second side relative with this first side, this connector comprises a plurality of terminals, a contact electrode in the corresponding described contact electrode of each terminal, an end that is positioned at this connector first side of each terminal is adhered to the pairing contact electrode of this terminal, and each terminal is used to connect external circuit towards an end of second side of this connector; And
One housing, this substrate and this connector are fixed in this housing, cause this second side of this connector to expose.
2. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that, described passive electronic component is attached on this upper surface of this substrate by a surface mount technology.
3. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that, naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are attached on this upper surface of this substrate by elargol.
4. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that, naked crystalline substance of this controller and the naked crystalline substance of this at least one memory are electrically connected to this connecting circuit by the routing juncture.
5. electric memory mechanism encapsulating structure as claimed in claim 1, it is characterized in that, this housing comprises a upper case portion and to housing parts once that should upper case portion, this upper case portion and this lower house partly interosculate, and cause this substrate and this connector to be fixed in the groove that is partly defined by this upper case portion and this lower house.
6. electric memory mechanism encapsulating structure as claimed in claim 5 is characterized in that, this upper case portion and this lower house partly are the housings of being made by plastic material.
7. electric memory mechanism encapsulating structure as claimed in claim 5 is characterized in that, this upper case portion and this lower house part engage one another by the ultrasonic waves welding manner.
8. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that, described passive electronic component be the group that forms of a resistor, a capacitor, an inductor and an oscillator at least one of them.
9. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that this insulating material is an epoxy resin.
10. electric memory mechanism encapsulating structure as claimed in claim 1 is characterized in that this substrate is a printed circuit board (PCB).
11. electric memory mechanism encapsulating structure as claimed in claim 1, this electric memory mechanism are CF memory card or portable hard disk.
12. electric memory mechanism encapsulating structure as claimed in claim 11 is characterized in that, this portable hard disk is a micro hard disk or a solid state hard disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200094901U CN201226355Y (en) | 2008-04-28 | 2008-04-28 | Packaging structure for electronic memory device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200094901U CN201226355Y (en) | 2008-04-28 | 2008-04-28 | Packaging structure for electronic memory device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201226355Y true CN201226355Y (en) | 2009-04-22 |
Family
ID=40599253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200094901U Expired - Lifetime CN201226355Y (en) | 2008-04-28 | 2008-04-28 | Packaging structure for electronic memory device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201226355Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575416A (en) * | 2016-02-26 | 2016-05-11 | 中山市江波龙电子有限公司 | Solid state hard disk storage module, solid state hard disk assembly and solid state hard disk |
-
2008
- 2008-04-28 CN CNU2008200094901U patent/CN201226355Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105575416A (en) * | 2016-02-26 | 2016-05-11 | 中山市江波龙电子有限公司 | Solid state hard disk storage module, solid state hard disk assembly and solid state hard disk |
| CN105575416B (en) * | 2016-02-26 | 2018-04-10 | 中山市江波龙电子有限公司 | Solid state hard disc memory module, solid state hard disc component and solid state hard disc |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090422 |