TW200802534A - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
TW200802534A
TW200802534A TW96107285A TW96107285A TW200802534A TW 200802534 A TW200802534 A TW 200802534A TW 96107285 A TW96107285 A TW 96107285A TW 96107285 A TW96107285 A TW 96107285A TW 200802534 A TW200802534 A TW 200802534A
Authority
TW
Taiwan
Prior art keywords
drying
substrate
substrate processing
remove
rinse liquid
Prior art date
Application number
TW96107285A
Other languages
Chinese (zh)
Other versions
TWI346973B (en
Inventor
Yutaka Asou
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200802534A publication Critical patent/TW200802534A/en
Application granted granted Critical
Publication of TWI346973B publication Critical patent/TWI346973B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Abstract

The substrate processing apparatus provides the first processing solvent supply means 12 to supply the etchant because of peel as for the changing in quality layer 207, and the second processing solvent supply means 13 that supplies the solution for removal from the resist pattern 206 as for the unnecessary resist, and the third processing solvent supply means 15 in which the rinse liquid to remove the etchant or the solution supplied on the substrate is supplied, and the drying means 11 to process drying to remove the rinse liquid on the substrate, and the control means 17 that does motion control of the drying means 11. When the drying means 11 processes the drying to remove the rinse liquid for which is used to remove the etchant from the substrate, the control means 17 stops the drying process with the rinse liquid remains at least in all aspects of the substrate.
TW096107285A 2006-03-03 2007-03-02 Substrate processing apparatus and substrate processing method TWI346973B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006057516A JP4674904B2 (en) 2006-03-03 2006-03-03 Substrate processing apparatus and substrate processing method

Publications (2)

Publication Number Publication Date
TW200802534A true TW200802534A (en) 2008-01-01
TWI346973B TWI346973B (en) 2011-08-11

Family

ID=38459194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107285A TWI346973B (en) 2006-03-03 2007-03-02 Substrate processing apparatus and substrate processing method

Country Status (3)

Country Link
JP (1) JP4674904B2 (en)
TW (1) TWI346973B (en)
WO (1) WO2007100099A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9601358B2 (en) 2014-08-15 2017-03-21 SCREEN Holdings Co., Ltd. Substrate treatment apparatus, and substrate treatment method
TWI587928B (en) * 2010-10-13 2017-06-21 東京應化工業股份有限公司 Coating apparatus and coating method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007273826A (en) * 2006-03-31 2007-10-18 Tokyo Electron Ltd Reflow method, pattern formation method, and manufacturing method of tft element for liquid crystal display
JP2010103551A (en) * 2009-12-17 2010-05-06 Tokyo Electron Ltd Substrate processing device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3616584B2 (en) * 2000-06-12 2005-02-02 鹿児島日本電気株式会社 Pattern forming method and display device manufacturing method using the same
JP4410951B2 (en) * 2001-02-27 2010-02-10 Ｎｅｃ液晶テクノロジー株式会社 Pattern forming method and manufacturing method of liquid crystal display device
JP3810056B2 (en) * 2001-03-22 2006-08-16 東京エレクトロン株式会社 Substrate processing method, development processing method, and substrate processing apparatus
JP3741655B2 (en) * 2002-03-04 2006-02-01 東京エレクトロン株式会社 Liquid processing method and liquid processing apparatus
JP2004134627A (en) * 2002-10-11 2004-04-30 Seiko Epson Corp Process for removing organic layer
JP2005159293A (en) * 2003-09-18 2005-06-16 Nec Kagoshima Ltd Device and method for treating substrate
JP2005251989A (en) * 2004-03-04 2005-09-15 Sharp Corp Substrate processing apparatus
JP2006013228A (en) * 2004-06-28 2006-01-12 Toshiba Corp Substrate processing method and substrate processor
JP4524744B2 (en) * 2004-04-14 2010-08-18 日本電気株式会社 Method for forming organic mask and pattern forming method using the organic mask

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587928B (en) * 2010-10-13 2017-06-21 東京應化工業股份有限公司 Coating apparatus and coating method
US9601358B2 (en) 2014-08-15 2017-03-21 SCREEN Holdings Co., Ltd. Substrate treatment apparatus, and substrate treatment method
US10096493B2 (en) 2014-08-15 2018-10-09 SCREEN Holdings Co., Ltd. Substrate treatment apparatus, and substrate treatment method

Also Published As

Publication number Publication date
JP4674904B2 (en) 2011-04-20
WO2007100099A1 (en) 2007-09-07
TWI346973B (en) 2011-08-11
JP2007235025A (en) 2007-09-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees