200800561 九、發明說明： 【發明所屬之技術領域】 本發明係有關於轉移模製（transfer molding)技 術，特別係有關於一種轉移模製之真空模具。 【先前技術】 在半導體封裝領域中通常是使用轉移模。製 (transfer molding)技術在一晶片載體上製作一能密封 晶片之封膠物。譬如我國專利公告第5 8 4 9 2 2號有揭示 相關的技術。 在轉移模製的過程中，封膠物的先驅材料（在擠壓 前可稱膠餅pellet)是包含熱固性樹脂，經加熱加壓並 注入至一模穴内，持續加熱（一般稱之為pre_curing) 使其熟化定型，再脫模以供進行「後固化」（p〇st curing)。然最後製成的封膠物容易有氣泡生出，且晶 片載體（或基板）製程中受熱會產生翹曲變形。200800561 IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to transfer molding techniques, and more particularly to a transfer molded vacuum mold. [Prior Art] A transfer mode is generally used in the field of semiconductor packaging. Transfer molding technology produces a sealant that seals the wafer on a wafer carrier. For example, China Patent Publication No. 5 8 4 9 2 2 discloses related technologies. In the process of transfer molding, the precursor material of the sealant (which can be called a pellet before extrusion) is a thermosetting resin which is heated and pressurized and injected into a cavity for continuous heating (generally called pre_curing). It is aged and shaped, and then demolded for "p〇st curing". However, the final sealant is easily bubbled, and the wafer carrier (or substrate) process undergoes warping deformation due to heat.
流道 1 1 2，以供封膠物之注入 請參閱第1圖，一種習知的轉移模製模具丨〇〇包含 有一上模具110與一下模具120。該上模具11〇對應於 每一模穴1 1 1係具有複數個抽氣孔i i 3，其係連接至談 模穴ill之穴頂凹面，該模&⑴之一侧係連通有二 在轉移模製過程中， 背板30固定，再放 該上模具1 1 〇下壓 模穴1 1 1内。作動 進行抽氣，可以加 已設置有晶片2 0之基板1 〇係以一 置在該下模具120上。在合模時， 該基板10並使該晶片20密封在該 一真空閥1 1 4，經由該些抽氣孔n 3 5 200800561 速封膠物之充填。然而該些抽氣孔1 1 3是共同連通至 該真空閥1 1 5，無法調控局部的抽氣壓力，因此當有 封裝氣泡（p a c k a g e v 〇 i d )發生時無法以製程參數調整 改善之，僅能選用具優異流度的封膠物，但相對會有 溢膠污染（£!115]1(：01113111111&1^011)的問題。此外，在注膠 (filling)之開始，在先加熱上下模具110與12〇，又該 模穴1 1 1必須保持在真空，故該基板1 0在未注膠前已 經有翹曲現象，導致封膠後產品變形。The flow path 1 1 2 is for the injection of the sealant. Referring to Fig. 1, a conventional transfer molding die 丨〇〇 includes an upper mold 110 and a lower mold 120. The upper mold 11 〇 corresponds to each cavity 11 1 1 has a plurality of suction holes ii 3 , which are connected to the concave surface of the cavity of the sculpt hole ill, one of the sides of the die & (1) is connected During the molding process, the backing plate 30 is fixed, and then the upper mold 1 1 is pressed down into the mold hole 1 1 1 . To perform the pumping, the substrate 1 on which the wafer 20 has been placed may be attached to the lower mold 120. When the mold is closed, the substrate 10 is sealed to the vacuum valve 1 14 by the filling of the quick sealant through the suction holes n 3 5 200800561. However, the air vents 1 1 3 are connected to the vacuum valve 1 15 5, and the local pumping pressure cannot be adjusted. Therefore, when the package buffer pack id occurs, the process parameters cannot be adjusted and improved, and only the selection can be made. The sealing material with excellent fluidity, but there is a problem of overflowing rubber contamination (£!115]1 (:01113111111 & 1^011). In addition, at the beginning of filling, the upper and lower molds 110 are heated first. With 12 〇, the cavity 1 1 1 must be kept in a vacuum, so that the substrate 10 has warped before the glue is injected, resulting in deformation of the product after sealing.
【發明内容】 / 為了解決上述之問題，本發明之主要目的係在於提 供一種轉移模製之真空模具，能製程參數的調整來解 決封裝氣泡的問題，且利用上下壓差平衡防止基板在 注膠產生翹曲，另具有在封膠後容易脫模之功效。 本發明的目的及解決其技術問題是採用以下技術 方案來實現的。本發明揭示一種轉移模製之真空模 ^主要包含一上模具以及一下模具。該上模具係具有一 換八連通至該模穴之流道 ' —第_中央抽氣孔以及複數 個第胃邊抽虱孔’其中每一第一周邊抽氣孔係設置有一真 空閥’以供獨立調節抽氣。該下模具係具有複數個抽氣孔、。 、本發明另揭示一種使用真空模具之轉移模製方法，該 方法包a ·提供-基板，其表面設置有晶片且被一背板支 撐；經由該下模具之抽氣孔進行第-次減，以使該背板及 :f板疋位於該下模具上;經由該上模具之第-中央抽 〃第周邊抽虱孔進行第二次抽氣，並令一封膠物注入 6 200800561 至該模穴内；停止上述之第二次抽氣，同時持續進行第一次 抽氣.以固定該基板，以使該上模具脫離該已形成有封膠物之 基板。 本發明的目的及解決其技術問題還可採用以下技 術措施進*步實現。 前述的轉移模製之真空模具，另包含有一緩衝件，其 係放置於該下模具之上，該緩衝件係具有複數個通孔，其係 對應於該下模具之該些抽氣孔。 前述的轉移模製之真空模具，另包含有一真空分散 板，其係放置於該緩衝件之上，該真空分散板係具有複數個 分散孔。 前述的轉移模製之真空模具，其中該下模具之該些抽 氣孔係包含一第二中央抽氣孔以及複數個第二周邊抽氣孔。 前述的轉移模製之真空模具，其中每一第二周邊抽氣 孔亦設置有一真空閥。SUMMARY OF THE INVENTION In order to solve the above problems, the main object of the present invention is to provide a transfer molding vacuum mold, which can adjust the process parameters to solve the problem of packaging bubbles, and utilize the upper and lower differential pressure balance to prevent the substrate from being injected. Warp is produced, and it has the effect of being easily released after sealing. The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a transfer molding vacuum mold which mainly comprises an upper mold and a lower mold. The upper mold has a flow passage connected to the mold cavity - a central air suction hole and a plurality of first stomach suction holes, wherein each of the first peripheral air suction holes is provided with a vacuum valve for independent Adjust the pumping. The lower mold has a plurality of suction holes. The present invention further discloses a transfer molding method using a vacuum mold, the method comprising: providing a substrate having a surface provided with a wafer and supported by a backing plate; performing a first subtraction through the evacuation hole of the lower mold to Locating the back plate and the :f plate on the lower mold; performing a second pumping through the first central pumping of the upper mold, and injecting a glue into the 6 200800561 into the cavity Stopping the second pumping as described above while continuing the first pumping to fix the substrate to disengage the upper mold from the substrate on which the sealant has been formed. The object of the present invention and solving the technical problems thereof can also be achieved by the following technical measures. The aforementioned transfer molded vacuum mold further includes a cushioning member placed on the lower mold, the cushioning member having a plurality of through holes corresponding to the suction holes of the lower mold. The aforementioned transfer molded vacuum mold further includes a vacuum dispersion plate placed on the cushion member, the vacuum dispersion plate having a plurality of dispersion holes. In the above-described transfer molded vacuum mold, the vent holes of the lower mold include a second central bleed hole and a plurality of second peripheral bleed holes. In the above-described transfer molded vacuum mold, each of the second peripheral suction holes is also provided with a vacuum valve.
【實施方式】 請參閱第2圖，在本發明之一具體實施例中揭示 一種轉移模製之真空模具200主要包含一上模具21〇以 及一下模具220 ^該上模具210係具有一模穴2ιι、一連通 Y夭抽氣孔213以及複數 至該模穴211之流道 ㈣1㈣中每—第―周邊抽氣孔214係設 置有-真空閥215,以供獨立調節抽氣。在本實施例中，該 模穴在該流道212之相對向側可連通有一排氣流道 2 i 6，以在填料密實步驟（packing step)中排出内藏於該模穴 7 200800561 2 1 1的氣體。 5亥下模具220係具有複數個抽氣孔。如第2圖所示，該 下模具220之遠些抽氣孔係包含一第二中央抽氣孔22丨以及 複數個第二周邊抽氣孔222，在注膠前平衡該模穴211内的 上下壓差，以防止該基板10纽曲。較佳地，每一第二周邊 抽氣孔222亦設置有一真空閥223，以獨立式抽氣達到抽氣 調節之功效。 «玄轉移模製之真空模具2〇〇可另包含有一緩衝件 230，其係放置於該下模具22〇之上。如第$圖所示，該緩 衝件230係具有複數個通孔231 ,其係對應於該下模具22〇 之該第二中央抽氣孔221與該些第二周邊抽氣孔222。藉由 該緩衝件230可以達到對該背板3〇及該基板1〇較佳之吸附 此外，該轉移模製之真空模具2 〇〇另包含有一真空 分散板240,其係放置於該緩衝件23〇之上。如第5圖所示， _ 該真空分散板240係具有複數個分散孔24丨，用以平均吸附 該背板3 0。 ’本發明另揭示一種使用前述 請參閱第3A至3C圖 真空模具200之轉移模製方法。如第3A圖所示，提供一基 板10，其表面設置有晶片20且被一背板30支撐，該背板 3〇係放置於該下模具220之」 可以經由該下模具220之該第 之上。在合模時，作動該些真空閥 贫第一中央抽氣孔221與該些第二 周邊抽氣孔222進行第一次抽氣，以使該背板3〇及其上方[Embodiment] Referring to Figure 2, in one embodiment of the present invention, a transfer molded vacuum mold 200 mainly includes an upper mold 21 and a lower mold 220. The upper mold 210 has a cavity 2 Each of the first and second peripheral air vents 214 is provided with a vacuum valve 215 for the independent adjustment of the air pumping 213 and a plurality of flow passages 213 and a plurality of flow passages (4) 1 (4). In this embodiment, the cavity is connected to an opposite side of the flow path 212 with an exhaust flow path 2 i 6 to be discharged into the cavity 7 in a packing step. 200800561 2 1 1 gas. The 5 Hai lower mold 220 has a plurality of suction holes. As shown in FIG. 2, the farthing holes of the lower mold 220 include a second central exhausting hole 22丨 and a plurality of second peripheral exhausting holes 222, and the upper and lower differential pressures in the cavity 211 are balanced before the injection. To prevent the substrate 10 from being bent. Preferably, each of the second peripheral air vents 222 is also provided with a vacuum valve 223 for independent pumping to achieve the effect of pumping adjustment. The vacuum mold 2 of the meta-transfer molding may further include a cushioning member 230 placed on the lower mold 22'. As shown in Fig. $, the buffer member 230 has a plurality of through holes 231 corresponding to the second central air venting holes 221 of the lower mold 22 and the second peripheral air venting holes 222. The buffer plate 230 can achieve better adsorption of the back plate 3 and the substrate 1 . Further, the transfer molded vacuum mold 2 further includes a vacuum dispersion plate 240 disposed on the buffer member 23 . Above. As shown in Fig. 5, the vacuum dispersion plate 240 has a plurality of dispersion holes 24A for absorbing the back plate 30 on average. The present invention further discloses a transfer molding method using the foregoing vacuum mold 200 of Figs. 3A to 3C. As shown in FIG. 3A, a substrate 10 is provided, the surface of which is provided with a wafer 20 and supported by a backing plate 30, and the backing plate 3 is placed on the lower mold 220. on. When the mold is closed, the first central exhausting holes 221 and the second peripheral exhausting holes 222 are operated for the first pumping to make the backing plate 3 and above.
以避免該背板或該基板1 〇 200800561 產生位移或翹曲。在本實施例中，在第一次抽氣之前，該緩 衝件230與該真空分散板240可預先放置在該下模具22〇 上，該背板30則貼附在該真空分散板240。 如第3B圖所示，經由該上模具2丨〇之第一中央抽氣孔 213與第一周邊抽氣孔214進行第二次抽氣，使該模穴 為真空或近真空狀態。由於該模穴211内上下壓差平衡，即 使有注膠的加熱溫度，該背板30與該基板1〇並不會往上翹 _ 曲變形。在注膠步驟（filling step)中，令一封膠物4〇之前驅 材料經由該流道212注入至該模穴211内，並在填料密實 (packing step)步驟中，持續加壓加熱，使前驅物熟化成該封 膠物40，多餘的氣體可由該氣體流道216排出。在第一次抽 氣之步驟中，可以針對容易該封膠體4〇產生封裝氣泡的部 位，調整其中一在該封膠體40上方對應之第一周邊抽氣孔 214至較大的抽氣能力，可使該封膠體4〇之前驅材料快速充 填原易於產生封裝氣泡的部位，故能以製程參數的調整來解 • 決封裝氣泡的問題，不需要改變封膠體的材料成份或特性。 々如第3C圖所示，停止上述之第二次抽氣，同時持續進行 第—次抽氣以固定該基板1〇,以使該上模具21〇脫離該已形 成有封膠物40之基板10。因此，在該封膠體4〇形成之 後具有容易脫模之功效。 上述之製程只疋用以說明本發明之真空模具2⑽其 中一較佳具體實施例的使用方法，本發明真空模具2〇〇 ^ 同的半導體封裝製程中可以調整各種適當轉移模製參數與 步驟順序，以形成良好之封膠物。 9 200800561 以上所述，僅是本發明的 本發明作任何形式上的限制 施例揭露如上，然而並非用 本項技術者，在不脫離本發 任何簡單修改、等效性變化 的技術範圍内。 車又佳實施例而已，並非對 ’雖然本發明已以較佳實 以限定本發明，任何熟悉 明之技術範圍内，所作的 與修飾，均仍屬於本發明 圖式簡單說明】To avoid displacement or warpage of the back plate or the substrate 1 〇 200800561. In the present embodiment, the buffer member 230 and the vacuum dispersion plate 240 may be previously placed on the lower mold 22A before the first pumping, and the back sheet 30 is attached to the vacuum dispersion sheet 240. As shown in Fig. 3B, the first central air vent 213 and the first peripheral air vent 214 are evacuated through the upper mold 2, so that the cavity is in a vacuum or near vacuum state. Since the pressure difference between the upper and lower sides of the cavity 211 is balanced, even if the heating temperature of the glue is applied, the back plate 30 and the substrate 1 are not bent upward. In a filling step, a gel 4 〇 precursor material is injected into the cavity 211 via the flow path 212, and in a packing step, continuous pressurization heating is performed. The precursor is matured into the sealant 40, and excess gas can be discharged from the gas flow path 216. In the step of the first pumping, the first peripheral air venting hole 214 corresponding to the sealing body 40 can be adjusted to a larger suction capacity for the portion where the sealing bubble is easily generated. The sealing material of the encapsulant 4 is quickly filled with a portion which is easy to produce a bubble, so that the problem of encapsulating the bubble can be solved by adjusting the process parameters without changing the material composition or characteristics of the encapsulant. For example, as shown in FIG. 3C, the second pumping is stopped, and the first pumping is continued to fix the substrate 1 to remove the upper mold 21 from the substrate on which the sealant 40 has been formed. 10. Therefore, the sealant 4 has an effect of being easily released after being formed. The above process is only used to illustrate the use of a preferred embodiment of the vacuum mold 2 (10) of the present invention. In the vacuum package of the present invention, various suitable transfer molding parameters and sequence of steps can be adjusted. To form a good sealant. 9 200800561 The above description of the present invention is merely a limitation of any form of the present invention. The present invention is not limited to the technical scope of any simple modification or equivalent change of the present invention. It is to be understood that the present invention is not limited thereto, and that the present invention has been described in its preferred embodiments.
第1圖： 第2圖 第3 A圖 f知轉移模製模具之截面示意j。 也』 依據本發明之_具體實施例〆種轉移模表 之真空模具之戴 隹乂 ¢3不意圖。 :依據本發明之— #耄空模具由 具體實施例，該真 ^ ~ 一 面不Figure 1: Figure 2 Figure 3A Figure f shows the cross-section of the transfer molding die j. Also, according to the present invention, the vacuum mold of the transfer mold is not intended. : according to the present invention - #耄空模具 by the specific embodiment, the true ^ ~ one side is not
下模具之抽氣$ & 立 孔進行第一次抽氣狀愁 .¾圖。 :依據本發明之—θ 具體實施例 行灌膠狀態之截 - 隹X面不意圖。 ••依據本發明之一具體實施例，該真空 脫模狀態之幾面示意圖。 依據本發明之1體實施例 緩衝件示意圖。 依據本發明之-具體實施例 真空分散板示意圖。 It要元件符號說明】 1〇基板 20晶）ί 3❶背板4。封:物 第3C圖 第4圖 第 圖 該 該 之 截 真空 模具進 模具於 真空 模具 該 真空模具 之 10 200800561 100 轉移模製模 具 1 10 上模具 111 模穴 112 流道 113 抽氣孔 114 真空閥 120 下模具 2 00 真空模具 2 10 上模具 211 模穴 212 流道 213 第一中央抽氣孔 214 第一周邊抽氣孔 215 真空閥 216 排氣流道 220 下模具 221 第二中央抽氣孔 222 第'二周邊抽氣孔 223 真空閥 230 緩衝件 231 通孔 240 真空分散板 241 分散孔 11The lower mold pumping $ & the vertical hole for the first pumping 愁 .3⁄4 map. : θ according to the present invention. A specific embodiment of the pouring state is not intended. • A schematic representation of several aspects of the vacuum stripping state in accordance with an embodiment of the present invention. A schematic view of a cushioning member according to a first embodiment of the present invention. A schematic representation of a vacuum dispersion plate in accordance with the present invention. It requires component symbol description] 1 〇 substrate 20 crystal) ί 3 ❶ back plate 4. Seal: Object 3C Figure 4 Figure 1 The vacuum mold is inserted into the vacuum mold. The vacuum mold 10 200800561 100 Transfer molding mold 1 10 Upper mold 111 Cavity 112 Flow path 113 Air vent 114 Vacuum valve 120 Lower mold 2 00 Vacuum mold 2 10 Upper mold 211 Cavity 212 Flow path 213 First central exhaust hole 214 First peripheral exhaust hole 215 Vacuum valve 216 Exhaust flow path 220 Lower mold 221 Second central exhaust hole 222 Exhaust hole 223 Vacuum valve 230 Buffer member 231 Through hole 240 Vacuum dispersion plate 241 Dispersion hole 11