TW200746320A - Multiple-stage pressure collet - Google Patents

Multiple-stage pressure collet

Info

Publication number
TW200746320A
TW200746320A TW096112265A TW96112265A TW200746320A TW 200746320 A TW200746320 A TW 200746320A TW 096112265 A TW096112265 A TW 096112265A TW 96112265 A TW96112265 A TW 96112265A TW 200746320 A TW200746320 A TW 200746320A
Authority
TW
Taiwan
Prior art keywords
collet
springs
die
pressurizing
semiconductor die
Prior art date
Application number
TW096112265A
Other languages
Chinese (zh)
Other versions
TWI345274B (en
Inventor
Yasushi Sato
Noboru Fujino
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200746320A publication Critical patent/TW200746320A/en
Application granted granted Critical
Publication of TWI345274B publication Critical patent/TWI345274B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To effectively prevent a void from occurring between a semiconductor die and a circuit board corresponding to a shape and a structure of the semiconductor die in a pressure collet for pressurizing the semiconductor die of a die bonder. A multiple-stage pressure collet 11 consists of a plurality of pressure collet elements 13, 15 and 17 each pressurizing part of the semiconductor die 33, and springs 23 and 25 arranged among the respective collet elements which are combined in series in the pressurizing direction. While pressurizing, the respective springs 23 and 25 press the pressure collet elements 13 and 15 located toward the die 33 from the spring against the die 33 by their urging force. The collet elements 13, 15 and 17 are combined with the springs 23 and 25 in the respective stages, so that tips of the respective collet elements have differences in height h1 and h2 by contraction of the springs 23 and 25 under initial conditions.
TW096112265A 2006-05-17 2007-04-09 Multiple-stage pressure collet TW200746320A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006137517A JP4616793B2 (en) 2006-05-17 2006-05-17 Multi-stage pressure collet

Publications (2)

Publication Number Publication Date
TW200746320A true TW200746320A (en) 2007-12-16
TWI345274B TWI345274B (en) 2011-07-11

Family

ID=38844072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096112265A TW200746320A (en) 2006-05-17 2007-04-09 Multiple-stage pressure collet

Country Status (3)

Country Link
JP (1) JP4616793B2 (en)
KR (1) KR100838190B1 (en)
TW (1) TW200746320A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106068061A (en) * 2015-04-22 2016-11-02 松下知识产权经营株式会社 Electronic unit engaging head

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5005403B2 (en) * 2007-03-27 2012-08-22 芝浦メカトロニクス株式会社 Electronic component mounting tools and mounting equipment
JP5018455B2 (en) * 2007-12-20 2012-09-05 富士通株式会社 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
JP2009289959A (en) * 2008-05-29 2009-12-10 Elpida Memory Inc Bonder and bonding method
JP5663764B2 (en) * 2010-06-14 2015-02-04 株式会社アドウェルズ Joining device
EP3590130A1 (en) 2017-03-02 2020-01-08 EV Group E. Thallner GmbH Method and device for bonding chips
JP6696036B1 (en) * 2019-08-01 2020-05-20 信越エンジニアリング株式会社 Work transfer device, work transfer chuck, and work transfer method
KR102423731B1 (en) * 2019-08-29 2022-07-21 주식회사 디플랫 transfer apparatus of micro LED
WO2024000285A1 (en) * 2022-06-29 2024-01-04 沈阳芯源微电子设备股份有限公司 Semiconductor substrate heating apparatus, semiconductor device, and temperature control method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59197143A (en) * 1983-04-22 1984-11-08 Tokyo Sokuhan Kk Mounting device for parts
JPH0327046U (en) * 1989-07-26 1991-03-19
JPH05235594A (en) * 1992-02-19 1993-09-10 Fujitsu Ltd Attracting head for electronic component
JPH11219964A (en) * 1998-01-30 1999-08-10 Toshiba Microelectronics Corp Semiconductor mount device
JP4064808B2 (en) * 2001-12-25 2008-03-19 東芝松下ディスプレイテクノロジー株式会社 Thermocompression bonding apparatus and thermocompression bonding method
JP3848606B2 (en) * 2002-08-26 2006-11-22 日東電工株式会社 Collet and method for picking up chip parts using the same
JP2005150311A (en) 2003-11-13 2005-06-09 Nec Machinery Corp Chip mounting method and apparatus thereof
JP2005322815A (en) 2004-05-11 2005-11-17 Matsushita Electric Ind Co Ltd Manufacturing apparatus and manufacturing method of semiconductor apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106068061A (en) * 2015-04-22 2016-11-02 松下知识产权经营株式会社 Electronic unit engaging head
TWI617228B (en) * 2015-04-22 2018-03-01 Panasonic Ip Man Co Ltd Electronic component bonding head
CN106068061B (en) * 2015-04-22 2018-11-20 松下知识产权经营株式会社 Electronic component engaging head

Also Published As

Publication number Publication date
KR100838190B1 (en) 2008-06-16
KR20070111344A (en) 2007-11-21
JP2007311465A (en) 2007-11-29
JP4616793B2 (en) 2011-01-19
TWI345274B (en) 2011-07-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees