TW200745285A - Method of manufacturing film-forming material - Google Patents

Method of manufacturing film-forming material

Info

Publication number
TW200745285A
TW200745285A TW096104495A TW96104495A TW200745285A TW 200745285 A TW200745285 A TW 200745285A TW 096104495 A TW096104495 A TW 096104495A TW 96104495 A TW96104495 A TW 96104495A TW 200745285 A TW200745285 A TW 200745285A
Authority
TW
Taiwan
Prior art keywords
forming material
solvent
manufacturing film
film
solution
Prior art date
Application number
TW096104495A
Other languages
English (en)
Inventor
Syogo Matsumaru
Takahrio Dazai
Hideo Hada
Shigenori Fujikawa
Toyoki Kunitake
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Riken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Riken filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200745285A publication Critical patent/TW200745285A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/778—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D185/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G03F7/405—Treatment with inorganic or organometallic reagents after imagewise removal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Power Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Materials For Photolithography (AREA)
TW096104495A 2006-02-10 2007-02-07 Method of manufacturing film-forming material TW200745285A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006033571A JP4970803B2 (ja) 2006-02-10 2006-02-10 膜形成用材料の製造方法

Publications (1)

Publication Number Publication Date
TW200745285A true TW200745285A (en) 2007-12-16

Family

ID=38345165

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096104495A TW200745285A (en) 2006-02-10 2007-02-07 Method of manufacturing film-forming material

Country Status (3)

Country Link
JP (1) JP4970803B2 (zh)
TW (1) TW200745285A (zh)
WO (1) WO2007091569A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015052101A (ja) 2013-08-06 2015-03-19 東京応化工業株式会社 膜形成用材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3122014A1 (de) * 1981-06-03 1982-12-23 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von silylisocyanaten
JP2000144056A (ja) * 1998-11-10 2000-05-26 Ikuo Narisawa 水滴滑落性に優れた表面処理基材及びその製造方法
JP2001259509A (ja) * 2000-03-15 2001-09-25 Nissan Motor Co Ltd 水滴滑落性に優れた膜形成用表面処理材および表面処理膜の形成方法
JP3883366B2 (ja) * 2000-06-28 2007-02-21 セントラル硝子株式会社 高滑水性基板およびその製造方法
JP2002062667A (ja) * 2000-08-23 2002-02-28 Sumitomo Chem Co Ltd 微粒子量の低減されたフォトレジスト組成物の製造方法
JP4876424B2 (ja) * 2005-04-06 2012-02-15 セントラル硝子株式会社 滑水性物品の製法
JP4530980B2 (ja) * 2005-08-26 2010-08-25 東京応化工業株式会社 膜形成用材料およびパターン形成方法

Also Published As

Publication number Publication date
WO2007091569A1 (ja) 2007-08-16
JP4970803B2 (ja) 2012-07-11
JP2007211160A (ja) 2007-08-23

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