TW200744283A - Electrostatic discharge circuit and method for reducing input capacitance of semiconductor chip including same - Google Patents
Electrostatic discharge circuit and method for reducing input capacitance of semiconductor chip including sameInfo
- Publication number
- TW200744283A TW200744283A TW096101806A TW96101806A TW200744283A TW 200744283 A TW200744283 A TW 200744283A TW 096101806 A TW096101806 A TW 096101806A TW 96101806 A TW96101806 A TW 96101806A TW 200744283 A TW200744283 A TW 200744283A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor chip
- electrostatic discharge
- discharge circuit
- input capacitance
- chip including
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0266—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using field effect transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060045614A KR100725103B1 (ko) | 2006-05-22 | 2006-05-22 | 정전기 방전회로 및 이를 갖는 반도체 칩의 입력커패시턴스 감소 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200744283A true TW200744283A (en) | 2007-12-01 |
Family
ID=38358368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096101806A TW200744283A (en) | 2006-05-22 | 2007-01-17 | Electrostatic discharge circuit and method for reducing input capacitance of semiconductor chip including same |
Country Status (5)
Country | Link |
---|---|
US (1) | US7764475B2 (zh) |
KR (1) | KR100725103B1 (zh) |
CN (1) | CN101079418A (zh) |
DE (1) | DE102007025775B4 (zh) |
TW (1) | TW200744283A (zh) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100876894B1 (ko) * | 2007-07-03 | 2009-01-07 | 주식회사 하이닉스반도체 | 반도체 장치의 내부 회로 보호 장치 |
US8749930B2 (en) * | 2009-02-09 | 2014-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Protection circuit, semiconductor device, photoelectric conversion device, and electronic device |
WO2013013035A1 (en) * | 2011-07-21 | 2013-01-24 | Microchip Technology Incorporated | Multi-channel homogenous path for enhanced mutual triggering of electrostatic discharge fingers |
US9171834B2 (en) * | 2012-11-30 | 2015-10-27 | Freescale Semiconductor, Inc. | Over voltage protection for a thin oxide load circuit |
US10476263B2 (en) * | 2015-12-31 | 2019-11-12 | Novatek Microelectronics Corp. | Device and operation method for electrostatic discharge protection |
US10734806B2 (en) | 2016-07-21 | 2020-08-04 | Analog Devices, Inc. | High voltage clamps with transient activation and activation release control |
US10134725B2 (en) * | 2016-09-26 | 2018-11-20 | Shenzhen GOODIX Technology Co., Ltd. | Electrostatic discharge protection circuit applied in integrated circuit |
US10861845B2 (en) * | 2016-12-06 | 2020-12-08 | Analog Devices, Inc. | Active interface resistance modulation switch |
DK3343763T3 (da) * | 2016-12-29 | 2020-01-27 | Gn Hearing As | Udgangsdriver, der omfatter mos-kontakter med justerbar back gate-forspænding |
US10756613B2 (en) * | 2018-02-01 | 2020-08-25 | Marvell Asia Pte, Ltd. | Controlling current flow between nodes with adjustable back-gate voltage |
US11387648B2 (en) | 2019-01-10 | 2022-07-12 | Analog Devices International Unlimited Company | Electrical overstress protection with low leakage current for high voltage tolerant high speed interfaces |
KR102161796B1 (ko) * | 2020-03-02 | 2020-10-05 | 주식회사 아나패스 | 전기적 스트레스 보호회로 및 이를 포함하는 전자 장치 |
CN113364445B (zh) * | 2020-03-03 | 2024-06-18 | 瑞昱半导体股份有限公司 | 控制芯片及其相关的耐高压输出电路 |
KR20220128040A (ko) * | 2021-03-12 | 2022-09-20 | 삼성전자주식회사 | 반도체 장치 |
US11689014B2 (en) | 2021-06-24 | 2023-06-27 | Qualcomm Incorporated | Electrostatic discharge circuit for multi-voltage rail thin-gate output driver |
US11575259B2 (en) | 2021-07-08 | 2023-02-07 | Qualcomm Incorporated | Interface circuit with robust electrostatic discharge |
US11699900B2 (en) * | 2021-07-30 | 2023-07-11 | Nanya Technology Corporation | Semiconductor chip, electronic device and electrostatic discharge protection method for electronic device thereof |
JP2023062715A (ja) * | 2021-10-22 | 2023-05-09 | 株式会社東芝 | 集積回路 |
US11955796B2 (en) * | 2022-04-29 | 2024-04-09 | Apple Inc. | Electrostatic discharge network for driver gate protection |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6057998A (en) * | 1996-12-25 | 2000-05-02 | Hitachi, Ltd. | Insulated gate type semiconductor apparatus with a control circuit |
US6404269B1 (en) * | 1999-09-17 | 2002-06-11 | International Business Machines Corporation | Low power SOI ESD buffer driver networks having dynamic threshold MOSFETS |
JP2001274265A (ja) | 2000-03-28 | 2001-10-05 | Mitsubishi Electric Corp | 半導体装置 |
TW486804B (en) * | 2001-04-24 | 2002-05-11 | United Microelectronics Corp | Double-triggered electrostatic discharge protection circuit |
US6747501B2 (en) * | 2001-07-13 | 2004-06-08 | Industrial Technology Research Institute | Dual-triggered electrostatic discharge protection circuit |
TW502428B (en) * | 2001-09-03 | 2002-09-11 | Faraday Tech Corp | Electrostatic discharge protection circuit for power source terminal with dual trigger voltages |
US6639772B2 (en) * | 2002-01-07 | 2003-10-28 | Faraday Technology Corp. | Electrostatic discharge protection circuit for protecting input and output buffer |
US6704180B2 (en) * | 2002-04-25 | 2004-03-09 | Medtronic, Inc. | Low input capacitance electrostatic discharge protection circuit utilizing feedback |
DE60307293T2 (de) * | 2002-08-28 | 2007-10-11 | Koninklijke Philips Electronics N.V. | Verfahren zur verringerung der stromaufnahme in einer zustandshalteschaltung, zustandshalteschaltung und elektronische einrichtung |
KR100557643B1 (ko) * | 2003-10-13 | 2006-03-10 | 매그나칩 반도체 유한회사 | 이에스디 보호회로 |
TWI241010B (en) * | 2004-03-12 | 2005-10-01 | Admtek Inc | Electrostatic discharge clamping circuit for interface circuit of the mixed voltage source |
US7450357B2 (en) * | 2005-06-03 | 2008-11-11 | United Microelectronics Corp. | Electrostatic discharge protection circuit and semiconductor structure for electrostatic discharge |
US7705404B2 (en) * | 2006-12-20 | 2010-04-27 | Amazing Microelectronic Corporation | Electrostatic discharge protection device and layout thereof |
-
2006
- 2006-05-22 KR KR1020060045614A patent/KR100725103B1/ko active IP Right Grant
- 2006-12-27 US US11/645,528 patent/US7764475B2/en not_active Expired - Fee Related
-
2007
- 2007-01-17 TW TW096101806A patent/TW200744283A/zh unknown
- 2007-03-08 CN CNA200710085885XA patent/CN101079418A/zh active Pending
- 2007-05-22 DE DE102007025775A patent/DE102007025775B4/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102007025775A1 (de) | 2007-12-06 |
US7764475B2 (en) | 2010-07-27 |
US20070267701A1 (en) | 2007-11-22 |
KR100725103B1 (ko) | 2007-06-04 |
CN101079418A (zh) | 2007-11-28 |
DE102007025775B4 (de) | 2010-05-06 |
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