TW200742522A - Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein - Google Patents

Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein

Info

Publication number
TW200742522A
TW200742522A TW095140138A TW95140138A TW200742522A TW 200742522 A TW200742522 A TW 200742522A TW 095140138 A TW095140138 A TW 095140138A TW 95140138 A TW95140138 A TW 95140138A TW 200742522 A TW200742522 A TW 200742522A
Authority
TW
Taiwan
Prior art keywords
dielectric composition
polymer
capacitor
ceramic
embedded
Prior art date
Application number
TW095140138A
Other languages
English (en)
Other versions
TWI302816B (en
Inventor
Min-Ji Ko
Eun-Tae Park
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of TW200742522A publication Critical patent/TW200742522A/zh
Application granted granted Critical
Publication of TWI302816B publication Critical patent/TWI302816B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Insulating Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW095140138A 2005-11-02 2006-10-31 Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein TWI302816B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050104336A KR100691437B1 (ko) 2005-11-02 2005-11-02 폴리머-세라믹의 유전체 조성물, 이를 이용하는 내장형캐패시터와 인쇄회로기판

Publications (2)

Publication Number Publication Date
TW200742522A true TW200742522A (en) 2007-11-01
TWI302816B TWI302816B (en) 2008-11-01

Family

ID=37995974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140138A TWI302816B (en) 2005-11-02 2006-10-31 Polymer-ceramic dielectric composition, embedded capacitor using the dielectric composition and printed circuit board having the capacitor embedded therein

Country Status (5)

Country Link
US (1) US7567426B2 (zh)
JP (1) JP4772643B2 (zh)
KR (1) KR100691437B1 (zh)
CN (1) CN1959859B (zh)
TW (1) TWI302816B (zh)

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KR100649633B1 (ko) * 2005-02-15 2006-11-27 삼성전기주식회사 접착력, 내열성 및 난연성이 우수한 임베디드 커패시터용수지 조성물
KR100665261B1 (ko) * 2005-10-13 2007-01-09 삼성전기주식회사 온도변화에 따른 정전용량변화가 작은 복합 유전체 조성물및 이를 이용한 시그널 매칭용 임베디드 캐패시터
CN101583672A (zh) * 2007-01-18 2009-11-18 日本化学工业株式会社 无机填料和使用该无机填料的复合电介质材料
US7672113B2 (en) * 2007-09-14 2010-03-02 Oak-Mitsui, Inc. Polymer-ceramic composites with excellent TCC
CN101423651B (zh) * 2007-11-02 2010-12-15 中国船舶重工集团公司第七二五研究所 低温、高导热、电绝缘环氧树脂纳米复合材料制备工艺
CN102132367B (zh) * 2008-08-26 2012-07-25 Nxp股份有限公司 电容器及其制造方法
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CN102810407A (zh) * 2012-07-31 2012-12-05 中国科学院化学研究所 一种高储能纯固态超级电容器的制备方法
CN102938321B (zh) * 2012-12-03 2016-01-20 济南航医纳科技有限公司 一种大功率超级储能电源的制造方法
US9551744B2 (en) * 2013-02-04 2017-01-24 Hamilton Sundstrand Corporation Detecting early failures in printed wiring boards
CN105086359B (zh) * 2014-05-07 2018-01-05 广东生益科技股份有限公司 一种陶瓷‑聚合物复合材料、制备方法及其用途
CN105140029A (zh) * 2015-09-25 2015-12-09 安捷利（番禺）电子实业有限公司 一种高电容密度的埋入式电容的制备方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
US10832868B2 (en) 2016-04-07 2020-11-10 The Penn State Research Foundation Thin film capacitors
WO2018137051A1 (zh) * 2017-01-24 2018-08-02 周虎 一种离子储能方法及装置
KR102391008B1 (ko) * 2017-08-08 2022-04-26 현대자동차주식회사 파워 모듈 및 그 파워 모듈을 포함하는 전력 변환 시스템
JP7351304B2 (ja) 2018-08-31 2023-09-27 Tdk株式会社 誘電体薄膜、容量素子および電子回路基板
CN110746742A (zh) * 2019-10-10 2020-02-04 深圳市峰泳科技有限公司 一种具有高介电常数的柔性介电材料及其制备方法
WO2021157680A1 (ja) * 2020-02-07 2021-08-12 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、金属箔張積層板、及びプリント配線板
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Also Published As

Publication number Publication date
US7567426B2 (en) 2009-07-28
TWI302816B (en) 2008-11-01
US20070097597A1 (en) 2007-05-03
CN1959859A (zh) 2007-05-09
JP2007126661A (ja) 2007-05-24
JP4772643B2 (ja) 2011-09-14
KR100691437B1 (ko) 2007-03-09
CN1959859B (zh) 2010-12-15

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees