TW200741880A - Temperature regulation method - Google Patents
Temperature regulation methodInfo
- Publication number
- TW200741880A TW200741880A TW096107979A TW96107979A TW200741880A TW 200741880 A TW200741880 A TW 200741880A TW 096107979 A TW096107979 A TW 096107979A TW 96107979 A TW96107979 A TW 96107979A TW 200741880 A TW200741880 A TW 200741880A
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- regulation method
- heat quantity
- setting conditions
- control pattern
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 3
- 238000001514 detection method Methods 0.000 abstract 2
- 230000004069 differentiation Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Control Of Temperature (AREA)
- Feedback Control In General (AREA)
- Control Of Heat Treatment Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006063684 | 2006-03-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200741880A true TW200741880A (en) | 2007-11-01 |
TWI348738B TWI348738B (zh) | 2011-09-11 |
Family
ID=38474882
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096107979A TW200741880A (en) | 2006-03-09 | 2007-03-08 | Temperature regulation method |
Country Status (4)
Country | Link |
---|---|
US (1) | US8367975B2 (zh) |
JP (1) | JP4891987B2 (zh) |
TW (1) | TW200741880A (zh) |
WO (1) | WO2007102454A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI779008B (zh) * | 2017-01-30 | 2022-10-01 | 日商東京威力科創股份有限公司 | 加熱裝置及基板處理裝置 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5734081B2 (ja) * | 2010-10-18 | 2015-06-10 | 株式会社日立国際電気 | 基板処理装置、基板処理装置の温度制御方法、及び基板処理装置の加熱方法 |
JP5901276B2 (ja) * | 2011-12-20 | 2016-04-06 | 株式会社Kelk | 流体温度調整装置 |
JP5901275B2 (ja) * | 2011-12-20 | 2016-04-06 | 株式会社Kelk | 流体温度調整装置 |
US9089005B2 (en) * | 2012-02-21 | 2015-07-21 | General Electric Company | Cooking oven control system |
KR102335473B1 (ko) * | 2019-10-31 | 2021-12-07 | 세메스 주식회사 | 기판 처리 장치 및 그의 온도 제어 방법 |
JP7461490B2 (ja) | 2020-09-28 | 2024-04-03 | 株式会社Kokusai Electric | 温度制御方法、半導体装置の製造方法、プログラム及び基板処理装置 |
CN114047275B (zh) * | 2022-01-17 | 2022-04-08 | 华谱科仪(北京)科技有限公司 | 一种色谱仪温度控制方法及装置 |
CN114617438A (zh) * | 2022-03-18 | 2022-06-14 | 合肥美菱物联科技有限公司 | 一种即热式饮水机的控制系统及方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH097963A (ja) * | 1995-06-19 | 1997-01-10 | Kokusai Electric Co Ltd | 電気炉のデータ処理方法 |
JP4551515B2 (ja) | 1998-10-07 | 2010-09-29 | 株式会社日立国際電気 | 半導体製造装置およびその温度制御方法 |
WO2001079943A1 (fr) * | 2000-04-14 | 2001-10-25 | Omron Corporation | Unite de commande, regulateur de temperature et appareil de traitement thermique |
JP3834216B2 (ja) * | 2000-09-29 | 2006-10-18 | 株式会社日立国際電気 | 温度制御方法 |
JP3784337B2 (ja) * | 2001-03-05 | 2006-06-07 | 東京エレクトロン株式会社 | 熱処理方法及び熱処理装置 |
JP4362282B2 (ja) * | 2002-12-09 | 2009-11-11 | 株式会社ジェイテクト | 熱処理装置およびそれに用いられる温度制御方法 |
JP4978001B2 (ja) * | 2005-01-17 | 2012-07-18 | オムロン株式会社 | 温度制御方法、温度制御装置および熱処理装置 |
-
2007
- 2007-03-05 WO PCT/JP2007/054158 patent/WO2007102454A1/ja active Application Filing
- 2007-03-05 US US12/224,436 patent/US8367975B2/en active Active
- 2007-03-05 JP JP2008503840A patent/JP4891987B2/ja active Active
- 2007-03-08 TW TW096107979A patent/TW200741880A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI779008B (zh) * | 2017-01-30 | 2022-10-01 | 日商東京威力科創股份有限公司 | 加熱裝置及基板處理裝置 |
Also Published As
Publication number | Publication date |
---|---|
US8367975B2 (en) | 2013-02-05 |
TWI348738B (zh) | 2011-09-11 |
WO2007102454A1 (ja) | 2007-09-13 |
JP4891987B2 (ja) | 2012-03-07 |
JPWO2007102454A1 (ja) | 2009-07-23 |
US20090107978A1 (en) | 2009-04-30 |
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