TW200740591A - Film pasting-up method and film pasting-up apparatus - Google Patents

Film pasting-up method and film pasting-up apparatus

Info

Publication number
TW200740591A
TW200740591A TW096102100A TW96102100A TW200740591A TW 200740591 A TW200740591 A TW 200740591A TW 096102100 A TW096102100 A TW 096102100A TW 96102100 A TW96102100 A TW 96102100A TW 200740591 A TW200740591 A TW 200740591A
Authority
TW
Taiwan
Prior art keywords
substrate
film
laminated film
pasting
film pasting
Prior art date
Application number
TW096102100A
Other languages
Chinese (zh)
Other versions
TWI315254B (en
Inventor
Ryou Oonishi
Katsuyoshi Watanabe
Takeshi Fujii
Shigeru Harada
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200740591A publication Critical patent/TW200740591A/en
Application granted granted Critical
Publication of TWI315254B publication Critical patent/TWI315254B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
    • B29C65/7888—Means for handling of moving sheets or webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/03—After-treatments in the joint area
    • B29C66/032—Mechanical after-treatments
    • B29C66/0326—Cutting, e.g. by using waterjets, or perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

To prevent the occurrence of wrinkles caused by the expansion and contraction of a film at the time of cutting of the film even if the film having flexibility is used and to also prevent the occurrence of air bubbles between a substrate and the pasted-up film. After a laminated film 3 delivered from a film supply roll 15 is temporarily applied to the substrate 2 in a temporary applying part 10, the leading end part of the substrate 2 is set as the front to be moved toward a main pasting-up part 50 for pasting up the substrate 2 and the laminated film 3 under pressure. At this time, the laminated film 3 is supplied toward the substrate 2 in a state that the laminated film 3 is not brought into contact with the substrate 2 by the guide roller 13 positioned at a place separated from the main surface of the substrate 2 and cut at a place where the laminated film 3 becomes a desired length sufficient to be pasted up on the substrate 2 to paste up the laminated film 3 with a desired length cut in the main pasting-up part 50.
TW096102100A 2006-03-15 2007-01-19 Film pasting-up method and film pasting-up apparatus TW200740591A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006070134A JP2007245438A (en) 2006-03-15 2006-03-15 Film pasting-up method and film pasting-up apparatus

Publications (2)

Publication Number Publication Date
TW200740591A true TW200740591A (en) 2007-11-01
TWI315254B TWI315254B (en) 2009-10-01

Family

ID=38590229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102100A TW200740591A (en) 2006-03-15 2007-01-19 Film pasting-up method and film pasting-up apparatus

Country Status (4)

Country Link
JP (1) JP2007245438A (en)
KR (1) KR100846749B1 (en)
CN (1) CN101037031B (en)
TW (1) TW200740591A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412883B (en) * 2009-06-04 2013-10-21 Matsushita Seiki Co Ltd Pressure body and pellicle mounting apparatus

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200816888A (en) * 2006-09-22 2008-04-01 C Sun Mfg Ltd Clamping mechanism for film pre-pasting machine
CN103068172B (en) * 2012-12-26 2015-04-22 华映视讯（吴江）有限公司 Orthobaric pressing printed circuit board support device
JP6062880B2 (en) * 2014-03-24 2017-01-18 Ckd株式会社 Winding device
CN106332465B (en) * 2016-08-15 2018-08-14 重庆安洁电子有限公司 The processing method of circuit board protective film
JP7020189B2 (en) * 2018-03-02 2022-02-16 トヨタ自動車株式会社 Film transfer device, film transfer method, and film pasting device
CN108682646A (en) * 2018-07-11 2018-10-19 苏州焜原光电有限公司 InSb film-transferring devices
CN110576593B (en) * 2018-08-01 2021-07-06 蓝思科技（长沙）有限公司 Film pasting method and application thereof and glass panel
CN111331860B (en) * 2018-11-02 2021-10-01 北部湾大学 Edge covering method for plate-shaped workpiece
CN109774167A (en) * 2018-12-11 2019-05-21 邵林龙 Hot melt adhesive machine
CN110053246A (en) * 2019-03-18 2019-07-26 苏州领裕电子科技有限公司 A kind of ultra-thin PI film automatic attaching equipment
CN110154099A (en) * 2019-06-21 2019-08-23 广东暖丰电热科技有限公司 Automatic cutter
CN110370613B (en) * 2019-08-02 2023-09-22 江苏帝浦拓普智能装备有限公司 Nut gasket film sticking machine
KR102205137B1 (en) * 2019-12-12 2021-01-19 손명식 Substrate fixing device for lamination and lamination method using the same
KR20210094785A (en) * 2020-01-22 2021-07-30 주식회사 두산 Laminator
CN111716699A (en) * 2020-06-30 2020-09-29 冯浩 Automatic cutting and flattening machine for iron plate film
TWI819316B (en) * 2021-01-22 2023-10-21 日商日興材料股份有限公司 laminated device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5951759B2 (en) * 1979-02-14 1984-12-15 株式会社フジクラ Continuous film lamination device
JPS6026555A (en) * 1983-07-20 1985-02-09 Hakutou Kk Film tension releasing device
DE3787197T2 (en) 1986-05-07 1993-12-16 Somar Corp Device for the production of laminates.
JPH05154918A (en) * 1991-12-03 1993-06-22 Hakutou Kk Method for laminting film to substrate and laminator
JPH08332646A (en) * 1995-06-06 1996-12-17 Meiki Co Ltd Vacuum lamination apparatus and method
KR100263553B1 (en) * 1997-03-21 2000-08-01 안민혁 Laminating machine for printed circuit board
JP3525211B2 (en) * 2000-03-16 2004-05-10 株式会社名機製作所 Vacuum laminating equipment
KR100347857B1 (en) * 2000-09-04 2002-08-09 오티에스테크놀러지 주식회사 Method for laminating printed circuit board and apparatus thereof
JP3803820B2 (en) * 2000-10-16 2006-08-02 株式会社名機製作所 Laminating equipment
KR200232698Y1 (en) 2001-02-23 2001-09-28 오티에스테크놀러지 주식회사 Apparatus cutting film for laminating machine
JP3774701B2 (en) * 2003-02-07 2006-05-17 株式会社 日立インダストリイズ Film sticking method and apparatus
JP4525180B2 (en) * 2004-05-28 2010-08-18 凸版印刷株式会社 Vacuum lamination apparatus and method for forming insulating layer using the same
JP2006007752A (en) * 2004-05-28 2006-01-12 Mck:Kk Tacking device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI412883B (en) * 2009-06-04 2013-10-21 Matsushita Seiki Co Ltd Pressure body and pellicle mounting apparatus

Also Published As

Publication number Publication date
TWI315254B (en) 2009-10-01
JP2007245438A (en) 2007-09-27
KR20070093803A (en) 2007-09-19
CN101037031B (en) 2010-09-08
CN101037031A (en) 2007-09-19
KR100846749B1 (en) 2008-07-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees