JP2006007752A - Tacking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To softly place a sheet an neatly tack the sheet to a substrate even if the substrate and the sheet are not suitable for pressing. <P>SOLUTION: The tacking device 1 for tacking a cover film F having a solder resist on an electronic substrate W comprises an adhesion unit 20 capable of holding, by a suction mechanism, the cover film F with the tip end thereof being protruded and causing the tip end to approach the rear end in the downstream side of the substrate W, adhering the film to the substrate and returning to a retreat position and a chuck 23 capable of being moved to the downstream side in the condition of holding only the rear end in the downstream side of the electronic substrate W or the tip end of the cover film F adhering to the rear end, and is not provided with a pair of rotation mechanisms which send the electronic substrate W or the cover film F with holding between the pair. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a temporary attachment device for temporarily attaching a sheet such as a film to a substrate.

  As a conventional tacking device, those disclosed in Patent Documents 1 and 2 shown below are known. Among these, the former temporarily attaches the leading end of the film immediately before the laminating roll for pressure bonding. In the latter case, the suction means for sucking the sheet is rotated and brought close to the substrate, the leading edge of the sheet is aligned with the leading edge of the substrate, and the substrate on which the sheet is placed is sandwiched between the conveying roller and the conveying belt. Thus, the entire sheet is temporarily attached.

JP 2003-25448 A Japanese Patent No. 3065293

  In the former tacking apparatus, the film is eventually pressed against the substrate, and it is not possible to place the film without pressing it. Further, even in the latter tacking device, since the transport roll and the transport belt press the sheet against the film, the film cannot be placed softly.

  Accordingly, an object of the present invention is to make it possible to place a sheet softly and to temporarily attach the sheet to the substrate even if the substrate or sheet is not suitable for pressing. It is.

  In order to achieve the above object, the invention described in claim 1 is a temporary attachment device for temporarily attaching a sheet to a substrate, and is capable of holding the sheet in a state in which the leading edge protrudes. An adhesion unit that attaches close to the downstream edge of the substrate and returns to the retracted position, and a chuck that can move downstream while holding only the downstream edge of the substrate or the leading edge of the adhered sheet are provided. And a pair of rotation mechanisms for feeding while sandwiching the substrate or sheet is not provided.

  According to a second aspect of the present invention, in the above invention, the adhering unit holds the sheet with the leading edge protruding vertically in the retracted position.

  The invention according to claim 3 is characterized in that, in the above invention, a heating mechanism is arranged in a gripping portion of the chuck.

  According to a fourth aspect of the present invention, in the above invention, the adhering unit can guide the sheet from the sheet roll and can retract while relatively guiding the sheet by adhering or gripping the leading edge of the sheet. A cutter is provided in the vicinity of the adhering unit at the retracted position to cut a sheet derived by a specified amount at the blade portion.

  The invention according to claim 5 is characterized in that, in the above invention, a receiving portion for receiving the blade portion of the cutter is provided, and a heating mechanism is arranged in the receiving portion.

  The invention described in claim 6 is characterized in that, in the above invention, an air blower for blowing air toward the downstream side is installed on the upstream side of the chuck.

  According to a seventh aspect of the present invention, in the above invention, the air blower includes a static elimination mechanism that removes static electricity from the air.

  According to an eighth aspect of the present invention, in the above invention, an elastic body extending in the width direction of the sheet or the substrate is disposed in the gripping portion of the chuck, and the elastic body has protrusions protruding inward at at least both end edges. It is characterized by being formed in a pulse wave shape.

  The invention according to claim 9 is characterized in that, in the above invention, the elastic body is formed of rubber having a hardness of 50 degrees or more and 80 degrees or less.

  According to a tenth aspect of the present invention, in the above invention, a shuttle unit is provided on the downstream side of the chuck to transport the substrate with the sheet temporarily attached to the downstream side, and the shuttle unit is movable in the width direction. In addition, the substrate on which the sheet is temporarily attached can be discharged to the downstream side so as to form a plurality of rows in the width direction.

  According to the first aspect of the present invention, the sheet or the substrate is simply pulled by the chuck and is not sandwiched between the pair of rollers or the like. Therefore, the sheet can be placed softly on the substrate, and even if the substrate or sheet is not suitable for pressing, the effect of preventing the generation of bubbles, deviations, wrinkles and the like can be achieved.

  According to the second aspect of the invention, by holding the sheet vertically, in addition to the above effects, there is an effect that the setting of the sheet inside the tacking apparatus is extremely easy.

  According to the third aspect of the present invention, since the gripping portion of the chuck generates heat, in addition to the above effects, there is an effect that it is possible to provide a tacking device that can prevent the occurrence of deviation.

  According to the fourth aspect of the present invention, the sheet can be guided from the sheet roll with respect to the adhesion unit, and further provided with a cutter. Play.

  According to the fifth aspect of the present invention, since the receiving part of the cutter generates heat, in addition to the above effects, the occurrence of dust is prevented, and the quality of temporary attachment can be maintained at a high level.

  According to the sixth aspect of the invention, by providing the air blower, in addition to the above effects, it is possible to prevent the film from curling in the direction opposite to the chuck side, and to improve the quality of temporary attachment. The effect is that it can be maintained at a level.

  According to the invention described in claim 7, by blowing the neutralized air, in addition to the above effects, the film can be prevented from being rounded by static electricity, and the quality of temporary attachment can be maintained at a high level. .

  According to the invention described in claim 8, by making the gripping portion of the chuck a pulse wave-like elastic body, in addition to the above effects, the film can be placed on the substrate while preventing the generation of bubbles. There is an effect that the quality of the tack can be maintained at a high level.

  According to the invention described in claim 9, by making the elastic body of the gripping portion of the chuck a relatively hard rubber having a hardness of 50 degrees or more and 80 degrees or less, in addition to the above effects, the followability to the film is normal. It can be pressed more than in the case of a laminate roll, and has an effect that the quality of the tack can be maintained at a high level, especially when tacking a thin film.

  According to the tenth aspect of the present invention, it is possible to contribute to the improvement of the efficiency of the process in addition to the above-described effect by making it possible to pay out the substrates in a plurality of rows by the shuttle unit.

  Hereinafter, a temporary attachment device for temporarily attaching a cover film with a solder resist as a sheet to an electronic substrate according to an embodiment of the present invention will be described based on the drawings as appropriate.

[First Embodiment]
FIG. 1 is an internal side view of the tacking device 1 according to the first embodiment, and the tacking device 1 includes a substrate receiving portion 2, a main body portion 4, and a payout portion 6. A plurality of rollers 10 for transporting the electronic substrate W to the main body unit 4 are installed in the substrate receiving unit 2. In the dispensing unit 6, a conveyor 11 that dispenses the electronic substrate W is installed. The substrate receiving part 2, the main body part 4 or the dispensing part 6 can be evacuated by a vacuum pump (not shown).

  On the other hand, the main body 4 includes a roller 12 that receives the electronic substrate W from the roller 10 of the substrate receiving unit 2, a film roll shaft 14 that is installed above and below the roller 12, a turning shaft 16 of the release paper R, and a release paper R. Winding shaft 18, attachment unit 20 installed above and below roller 12, cutter 21 installed on the upstream side of each attachment unit 20, and receiving unit installed on the downstream side of cutter 21. The receiving plate 22, a chuck 23 installed downstream of the roller 12, a rail 24 on which the chuck 23 is mounted and extending downstream, and a guide roller 26 adjacent to the roller 12 side of each adhesion unit 20 are provided. .

  A cover film F with a solder resist covered with a release paper R is wound around each film roll.

  Each adhering unit 20 is a member having a C-shaped side surface and elongated in the width direction, and is rotatable about a rotation shaft 30 disposed on the base end edge on the downstream side of the roller 12. Connected to the upstream side of the adhesion unit 20 is a cylinder 31 that pushes the adhesion unit 20 by operation and rotates it. The tip edge of the adhesion unit 20 can move forward and backward with respect to the edge on the downstream side of the electronic substrate W slightly protruding from the roller 12 by rotating from the upper side (lower side) of the chuck 23 to the vicinity of the upstream side of the roller 12. is there.

  Further, at the leading edge of the adhesion unit 20, an introduction roller 32 that introduces the cover film F with the release paper R, a discharge roller 34 that separates the release paper R and the cover film F, and a roller 12 project. A guide portion 36 for guiding the cover film F from the lead-out roller 34 is provided. Further, an adsorption mechanism (not shown) that adsorbs the cover film F is built in the upper part of the adhesion unit, and an adsorption hole is extended to the guide part 36 so that the cover film F can be adsorbed to the guide part 36. Note that when the retraction unit 20 is retracted, the guide portion 36 is provided with a vertical suction surface, and the cover film F can be held on the vertical surface.

  Each cutter 21 includes a rail 37 that does not interfere with the attachment unit 20, a blade portion 38 that travels on the rail 37, and a stepping motor (not shown). The blade portion 38 travels in the width direction on the lower side (upper side) of the guide unit 36 in the attached unit 20 in the retracted state, and cuts the cover film F adsorbed by the guide unit 36. Note that the cutter 21 is located on the outer side in the width direction of the adhesion unit 20 except during cutting. Further, the front end of the cover film F after being cut is slightly protruded from the guide portion 36 toward the electronic substrate W side.

  Each receiving plate 22 is a member that is long in the width direction and has a receiving groove 39 for the blade portion 38 on which the corresponding cutter 21 travels, and incorporates a heating mechanism (not shown). In addition, since the adhesion unit 20 rotates so as to hold the receiving plate 22, the receiving plate 22 does not interfere with the adhesion unit 20 (see FIG. 2B).

  The chuck 23 includes upper and lower claws 40 as gripping portions on the downstream side, and a stepping motor 42 and a gripping portion 44 of the rail 24 on the upstream side. The chuck 23 incorporates a heating mechanism (not shown), and a heating portion is disposed at the tip of the claw 40 so that the tip can be heated. On the other hand, a rack is attached to a rotating shaft (not shown) of the stepping motor 42 and meshes with a pinion (not shown) provided on the rail 24 so that the chuck 23 can move downstream.

  The guide roller 26 is a roller that is long in the width direction, and is connected to a cylinder (not shown) via an arm (not shown) and can move up and down. The range in which the vertical movement is possible is from a standby position on the roller 12 side of the receiving plate 22 that does not interfere with the rotation of the adhesion unit 20 to an introduction position close to the electronic substrate W on the roller 12.

  The tacking device 1 includes a control device (not shown). The control device can grasp the operation amounts of the rollers 10 and 12, the conveyor 11, the cylinders of the guide roller 26, the cylinder 31, the stepping motor 42, and the like, and can control them.

  The operation of such a tacking device 1 will be described mainly with reference to FIGS. First, a film roll having a width corresponding to the electronic substrate W is set on the shaft 14 of the tacking apparatus 1, and the cover film with release paper R from the film roll is placed on the introduction roller 32 or the lead-out roller 34 in the adhesion unit 20 in the retracted state. Through F, only the release paper R is guided from the lead-out roller 34 to the turning shaft 16 or the winding shaft 18, and only the cover film F is attracted to the vertical guide portion 36 in a state where the front end coincides with the cutting position. In addition, in the cover film F on the guide part 36, a solder resist is arrange | positioned on the outer side. Further, the inside of the tacking apparatus 1 is set to a vacuum atmosphere.

  Then, when the electronic substrate W is placed on the roller 10, the control device controls the roller 10 to operate so that the electronic substrate W is carried downstream and passed to the roller 12. Subsequently, the control device controls the roller 12 so that the electronic substrate W is temporarily stopped in a state where the downstream edge is extended from the downstream end of the roller 12 (FIG. 2A). The control device arranges the chuck 23 immediately downstream of the electronic substrate W. Moreover, the control apparatus has arrange | positioned the guide roller 26 in the standby position.

  Next, the control device extends the cylinder 31 and brings the tip edge of the adhesion unit 20 closer to the electronic substrate W by rotational movement. Then, the front edge of the cover film F slightly protruding from the guide portion 36 at the front edge of the attachment unit 20 is lightly attached to the downstream edge of the electronic substrate W with the solder resist inside (FIG. 2B). )). At this time, the front end of the cover film F may coincide with the downstream side of the electronic substrate W, or may be disposed slightly inside (downstream) from the side of the electronic substrate W. Can be adjusted by changing the setting of the transport amount of the electronic substrate W to the temporary stop position by the roller 12.

  Thereafter, the control device returns the cylinder 31 and retracts the adhesion unit 20. At this time, the leading edge of the cover film F remains attached to the electronic substrate W, so that the lead-out roller 34 of the attachment unit 20 relatively guides the cover film F. Further, the cover film F passes through the downstream side or the lower side of the guide roller 26. Further, the control device operates the claw 40 of the chuck 23 to grip the downstream edge of the electronic substrate W together with the front edge of the cover film F (FIG. 3A). At this time, heat from the claw 40 is applied to the leading edge of the cover film F by the heating mechanism, and the leading edge of the cover film F is fixed to the electronic substrate W.

  Further, the control device raises (lowers) the guide roller 26 at the standby position to the introduction position. Thereby, the cover film F is introduced with a small angle with respect to the electronic substrate W.

  Then, the control device drives the stepping motor 42 to move the chuck 23 downstream. By this movement above the conveyor 11, the cover film F is lightly placed on the electronic substrate W. Since the inside of the tacking apparatus 1 is in a vacuum atmosphere, the lower cover film F is also placed on the upper electronic substrate W.

  When the stepping motor 42 indicates that the movement position of the chuck 23 has reached the position where the cover film F is pulled out from the cut position by a specified amount, the control device temporarily stops the movement of the chuck 23 and runs the cutter 21. Then, the cover film F is cut on the heat receiving groove 39 of the receiving plate 22 (FIG. 3B). The prescribed amount here is an amount that covers the electronic substrate W to the end (edge) on the downstream side.

  Thereafter, the control device pulls the electronic substrate W further downstream, and when the entire cut cover film F is placed on the electronic substrate W and the entire electronic substrate W reaches above the conveyor 11, the pawl of the chuck 23 is opened. Then, the electronic substrate W on which the solder resist is lightly temporarily attached is transferred to the conveyor 11. The cover film F itself is peeled off in the subsequent steps.

  In such a temporary attachment by the temporary attachment device 1, there is no rotating mechanism such as a pair of laminating rollers and a conveying roller that feeds the electronic substrate W and the solder resist while being sandwiched from the roller 10 to the conveyor 11.

  Then, while returning the chuck 23 to the upstream and returning the guide roller 26 to the standby position, the control device supplies the next electronic substrate W to the stop position by the rollers 10 and 12 and repeats the above operation. A solder resist is temporarily attached on the electronic substrate W.

  In the tacking apparatus 1 according to the first embodiment for temporarily tacking the above-described cover film F with solder resist on the electronic substrate W, the cover film F can be held with the leading edge protruding by the suction mechanism, and the leading edge thereof. Is attached to the downstream edge of the electronic substrate W and returns to the retracted position, and only the downstream edge of the electronic substrate W or the front edge of the cover film F attached thereto is gripped. And a chuck 23 that can be moved to the downstream side, and a pair of rotation mechanisms that feed while sandwiching the electronic substrate W or the cover film F are not provided, so that the cover film F is placed softly without being pressed against the electronic substrate W. Can continue. Accordingly, non-uniformity of solder resist (generation of wrinkles and shifts) caused by a step formed by the element mounting portion and the non-mounting portion of the electronic substrate W, which occurs when the cover film F is pressure-bonded on the electronic substrate W, or It is possible to prevent the occurrence of bubbles or the occurrence of problems due to application of excessive pressure to the elements of the electronic substrate W.

  Further, since the adhesion unit 20 holds the sheet with the leading edge protruding vertically at the retracted position, it is necessary to tilt the cover film F inside when setting the cover film F with solder resist from the film roll. Therefore, the setting of the cover film F can be performed very easily in the tacking apparatus 1.

  Furthermore, since the heating mechanism is arranged at the tip of the upper and lower claws 40 of the chuck 23, the tip edge of the cover film F can be fixed to the downstream edge of the electronic substrate W. The cover film F can be prevented from shifting with respect to the quality of the tack.

  In addition, the adhering unit 20 can guide the cover film F from the film roll, and can retract while deriving the cover film F relatively by adhering the leading edge of the cover film F, and adheres at the retracted position. In the vicinity of the unit 20, the cutter 21 that cuts the cover film F derived by a specified amount at the blade portion 38 is provided, so that light tacking without pressure bonding can be continuously performed in the tacking device 1.

  Moreover, since the receiving plate 22 which receives the blade part 38 of the cutter 21 is provided, and the heating mechanism is arrange | positioned at the receiving plate 22, the cutting by the cutter 21 can be performed reliably and generation | occurrence | production of the dust at the time of cutting by heating is carried out. Therefore, it is possible to prevent the quality of the temporary attachment from being deteriorated due to dust mixed into the electronic substrate W.

[Second Embodiment]
Next, a second embodiment of the present invention obtained by modifying the first embodiment will be described focusing on differences from the first embodiment. In addition, the same code | symbol is attached | subjected about the same member, and it is the same below.

  The tacking device of the second embodiment includes an air blower (not shown) on the upstream side of the chuck 23. The air blower can take in air from the outside of the tacking apparatus and can spray air in the downstream direction in a state along the transport direction of the electronic substrate W. The air blower also includes a static elimination mechanism that removes static electricity from the air taken in. Further, the air blower is electrically connected to the control device.

  In the tacking device according to the second embodiment, the control device makes the inside of the tacking device 1 in a vacuum atmosphere, and then operates the air blower to blow the discharged air. Therefore, since air flows along the conveyance direction of the electronic substrate W, the temporary attachment of the cover film F to the entire electronic substrate W is completed by the movement of the chuck 23 after the cover film F is attached to the electronic substrate W. Until the cover film F can be made to follow the electronic substrate W, the cover film F can be prevented from being bent or warped during the temporary attachment process. It can be prevented from occurring. Moreover, the cover film F can be gently placed on the electronic substrate W by the flow of air, and lighter tacking can be performed.

  Further, since the air is neutralized, static electricity is not generated by blowing air, and even if static electricity is generated due to other causes, it can be removed, and the cover film F is bent or warped due to static electricity. And, in turn, the generation of bubbles, wrinkles and slippage can be prevented.

[Third Embodiment]
Subsequently, a third embodiment of the present invention obtained by changing the first embodiment will be described focusing on differences from the first embodiment. In addition, the same code | symbol is attached | subjected about the same member.

  In the tacking device of the third embodiment, any one of the rubbers 50 to 52 as elastic bodies elongated in the width direction is detachably installed on the gripping portion (upper and lower ends of the upstream end edge) of the chuck 23. Yes.

  The rubber 50 shown in FIG. 4A has a prismatic shape and is relatively soft with a hardness of 40 to 50 degrees. These rubbers 50 are suitably used when the thickness of the electronic substrate W is relatively thick at 2.0 to 0.8 mm. The hardness is based on JIS old K6301 and is measured by a spring type A type, and so on.

  That is, when the electronic substrate W is relatively thick, in consideration of easiness to grasp and followability, the area of the elastic body disposed on the gripping portion of the chuck 23 that is in contact with the electronic substrate W and the cover film F is increased. Adopt a relatively soft one.

  The rubber 51 shown in FIG. 4 (b) is notched in a concave shape at substantially equal intervals, thereby forming a pulse wave shape having flying protrusions 54, and the hardness is made relatively hard at 50 to 80 degrees. Yes. These rubbers 51 are suitably used when the thickness of the electronic substrate W is relatively thin, 0.8 to 0.4 mm. The protrusion 54 protrudes to the inside of the chuck 23 (downward if it is related to the upper gripping portion, and upward if it is related to the lower gripping portion).

  The rubber 52 shown in FIG. 4C has a pulse wave shape having convex protrusions 55 only at both end edges, and has a relatively hard hardness of 50 to 80 degrees. These rubbers 52 are suitably used when the thickness of the electronic substrate W is relatively thin, 0.8 to 0.4 mm. The protrusion 55 protrudes to the inside of the chuck 23.

  That is, when the electronic substrate W is relatively thin, the contact area of the elastic body is usually increased or made softer in order to further improve the followability and ease of gripping. In the attaching machine, an elastic body is formed in a pulse wave shape so as not to be partially pressed, or a hard material is adopted. This is because if the part that does not hold down to the extent that it does not impair the followability and ease of gripping, even if the film is slightly displaced in the tacking machine on which the cover film F is placed lightly, Air and misalignment can be removed from the unpressed part, and such slight misalignment occurs relatively frequently when the electronic substrate W is thin, and provides a high quality temporary attachment when the electronic substrate W is thin. Because it can be done. Further, by making the elastic body relatively hard so as not to impair followability and ease of gripping, the electronic substrate W can be gripped in a less sticky state, and the above-described displacement can be effectively removed at the correct position. Because it can.

[Fourth Embodiment]
Subsequently, a fourth embodiment of the present invention obtained by changing the first embodiment will be described focusing on differences from the first embodiment. In addition, the same code | symbol is attached | subjected about the same member.

  In the tacking device 61 of the fourth embodiment shown in FIGS. 5 and 6, a shuttle unit 62 is installed on the downstream side of the chuck 23.

  The shuttle unit 62 is composed of two rollers 64 passed so as to be coaxial with each other in the width direction in the upstream portion, a roller 65 installed in the same manner as the roller 64 in the downstream portion, and two sets applied to the rollers 64 and 65. The transfer belt 66, the two drive belts 68 and the two clutches 70, one transfer motor 72 that drives each roller 64 via the two clutches 70, and the movement belt 74 moved in the width direction Motor 76.

  The moving belt 74 is hung on rollers 78 provided at both edges in the width direction of the shuttle unit 62 (FIG. 6). Further, the conveyor 11 is shorter than the first embodiment by the amount of the shuttle unit 62, and the electronic substrate W can be supplied to the transport belt 66. Further, the clutch 70, the transport motor 72, and the movement motor 76 of the shuttle unit 62 are electrically connected to a control device (not shown).

  In such a tacking device 61 according to the fourth embodiment, as shown in FIG. 7 corresponding to a plan view of the vicinity of the shuttle unit 62, the electronic substrates W can be discharged downstream so as to form two rows in the width direction. .

  That is, as shown in FIG. 7A, the control device drives the moving motor 76 before receiving the odd-numbered electronic substrates W, thereby moving the shuttle unit 62 in one side in the width direction (lower side in the figure). The electronic substrate W is received on the other side (upper half in the figure) of the shuttle unit 62. At this time, the conveyor belt 66 corresponding to one side (the lower half in the figure) of the shuttle unit 62 does not operate when the corresponding clutch 70 is disconnected by the control device, and is conveyed on the other side (the upper half in the figure). Only the belt 66 operates.

  Then, as shown in FIG. 7 (b), the control device, after the entire electronic substrate W is placed on the other side (upper side in the figure) of the shuttle unit 62, before receiving the even-numbered electronic substrate W, Driving the movement motor 76 moves the shuttle unit 62 to the other side (upper side in the figure) in the width direction.

  Further, as shown in FIG. 7C, the control device receives the electronic substrate W on one side (the lower half in the figure) of the shuttle unit 62. At this time, the conveyor belt 66 on the other side (upper half in the figure) of the shuttle unit 62 does not operate when the corresponding clutch 70 is disconnected by the control device, and the conveyor belt 66 corresponds to one side (lower half in the figure). Since only the belt 66 operates, the electronic substrate W on the other side (the upper half in the figure) is not transported.

  Subsequently, as shown in FIG. 7D, when the electronic substrates W are arranged on both sides (upper side in the drawing) of the shuttle unit 62, the control device drives the moving motor 76 to move the shuttle unit 62 to the center in the width direction. , The both clutches 70 are connected, the transport motor 72 is driven, and the electronic substrates W arranged in the width direction are simultaneously dispensed.

  In the tacking device 61 according to the fourth embodiment, by arranging the shuttle unit 62 on the downstream side of the chuck 23, the electronic substrates W on which the cover film F with solder resist is temporarily tacked are arranged in two rows in the width direction. Thus, for example, when a vacuum laminator is installed on the downstream side of the tacking device 61, two electronic substrates W after the tacking can be simultaneously supplied to the vacuum laminator. Thus, it is possible to contribute to improving the efficiency of the next process. Further, this improvement in efficiency does not require the adhering unit 20, the chuck 23, the guide roller 26 and the like to be arranged in parallel, and thus can be easily performed at low cost.

  In addition, in the tacking device 61 according to the fourth embodiment, since the conveyance belt 66 is driven by the common conveyance motor 72 and the individual clutch 70, it is possible to switch between operation / non-operation on each side, Synchronizing the operation during both-side operation can be realized with a simple configuration.

  In addition, embodiments of the present invention that are mainly modified from the above-described embodiments will be exemplified.

  The electronic substrate or the cover film is gripped in a state where the adhesion unit is rotated, and then the adhesion unit is retracted. If it does in this way, since an adhesion unit retreats in the state where a cover film was grasped by a chuck, a shift of an adhesion location by this retreat can be prevented.

  In addition, a bar whose tip can generate heat and can be moved up and down is installed on the side of the chuck (rail), and heat is applied to the side of the electronic substrate or cover film pulled by the chuck to apply heat to the cover film. Or fix with multiple spots. In this case, it is possible to further prevent the cover film from being displaced with respect to the electronic substrate while maintaining light tacking at the center.

  Further, the static eliminator is omitted in the air blower, or the air blower and the attachment / detachment of the (pulse wave) elastic body are provided. Further, in the pulse wave-like elastic body, the number of protrusions is increased or decreased, the interval is narrower, wider, or various intervals are mixed. Or it fixes so that a pulse-wave-like elastic body cannot be removed. In addition, a heating mechanism for heating the removable elastic body is provided.

  Further, by increasing the number of rollers of the shuttle unit in the width direction or changing the control method, the electronic substrates after the temporary attachment can be simultaneously paid out in three or more rows in the width direction. Alternatively, two or more transport motors for the shuttle unit are provided, the clutch is omitted, or the moving motor and the moving belt are a motor with a pinion and a rack, a stepping motor and a ball screw, or a cylinder.

  On the other hand, instead of the amount of movement of the chuck stepping motor, the amount of film derived from the adhesion unit after cutting (the amount of rotation of the introduction roller or the extraction roller) and the number of shaft rotations of the film roll (the rotation of the shaft related to the release paper) The control method is changed by grasping the specified amount for cutting the cover film. Also, the conveyor is a roller, the roller is a conveyor, the pinion or rack of the stepping motor is replaced with a ball screw, one sticking unit, cutter, film roll, etc. are omitted, and each heating mechanism and suction mechanism are omitted. In addition, various mechanisms and their operations are changed, such as approaching or retreating the substrate by means other than rotational movement such as vertical movement of the adhesion unit. The present invention can be applied to a tacking apparatus for a sheet other than a cover film with a solder resist or a substrate other than an electronic substrate.

It is an internal side view of the tacking device concerning a 1st embodiment of the present invention. (A)-(b) is operation | movement explanatory drawing of the tacking apparatus in FIG. (A)-(b) is operation | movement explanatory drawing (continuation of FIG. 2) of the tacking apparatus in FIG. (A)-(c) is explanatory drawing of the rubber | gum of the tacking apparatus which concerns on 3rd Embodiment of this invention. It is an internal side view of the tacking apparatus which concerns on 4th Embodiment of this invention. It is explanatory drawing seen from the downstream of the tacking apparatus in FIG. (A)-(d) is operation | movement explanatory drawing of the shuttle unit of the tacking apparatus in FIG.

Explanation of symbols

1,61 Tacking device 20 Adhering unit 21 Cutter 22 Receiving plate (cutter receiving portion)
23 Chuck 38 Blade 40 Claw (gripping part)
50-52 Rubber (elastic body)
62 Shuttle unit F Cover film (with solder resist, sheet)
W Electronic substrate (substrate)

Claims (10)

A temporary attachment device for temporarily attaching a sheet to a substrate,
An attachment unit that can hold the sheet with the leading edge protruding, attach the leading edge close to the downstream edge of the substrate, and return to the retracted position;
A chuck is provided that can move to the downstream side in a state where only the edge on the downstream side of the substrate or the leading edge of the attached sheet is gripped,
A tacking device characterized in that a pair of rotating mechanisms for feeding while sandwiching a substrate or sheet is not provided. The tacking device according to claim 1, wherein the adhesion unit vertically holds the sheet with the leading edge protruding at the retracted position. The temporary attachment device according to claim 1, wherein a heating mechanism is disposed in a grip portion of the chuck. The adhesion unit can guide the sheet from the sheet roll, and can retract while relatively guiding the sheet by adhesion or gripping of the leading edge of the sheet,
The tacking device according to any one of claims 1 to 3, wherein a cutter is provided in the vicinity of the adhering unit at the retracted position to cut a sheet derived by a specified amount at the blade portion. A receiving part for receiving the blade part of the cutter is provided,
The temporary attachment apparatus according to claim 4, wherein a heating mechanism is disposed in the receiving portion. The temporary attachment apparatus according to any one of claims 1 to 5, wherein an air blower for blowing air toward the downstream side is installed on the upstream side of the chuck. The temporary attachment apparatus according to claim 6, wherein the air blower includes a static elimination mechanism that removes static electricity from the air. An elastic body extending in the width direction of the sheet or substrate is arranged in the gripping portion of the chuck,
The temporary attachment device according to any one of claims 1 to 7, wherein the elastic body is formed in a pulse wave shape having protrusions protruding inward at at least both end edges. The temporary attachment apparatus according to claim 8, wherein the elastic body is made of rubber having a hardness of 50 degrees or more and 80 degrees or less. A shuttle unit is provided on the downstream side of the chuck to convey the substrate on which the sheet is temporarily attached to the downstream side,
The shuttle unit is movable in the width direction,
The temporary attachment device according to any one of claims 1 to 9, wherein the substrate on which the sheet is temporarily attached can be discharged downstream so as to form a plurality of rows in the width direction.

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